Multi-layered SP.SUP.2.-bonded carbon tubes
11390527 · 2022-07-19
Assignee
Inventors
- Benjamin Stassen Cook (Addison, TX, US)
- Nazila Dadvand (Richardson, TX, US)
- Luigi Colombo (Dallas, TX)
- Archana Venugopal (Dallas, TX, US)
Cpc classification
Y10T428/30
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
C04B2235/6028
CHEMISTRY; METALLURGY
B82Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B32B9/00
PERFORMING OPERATIONS; TRANSPORTING
C04B35/628
CHEMISTRY; METALLURGY
Abstract
A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice. A ceramic may be deposited on the graphene and another graphene layer may be deposited on top of the ceramic to create a multi-layered sp.sup.2-bonded carbon tube.
Claims
1. A microstructure comprising: interconnected units including at least: a first unit formed of first tubes that comprise a first layer of graphene, a first layer of ceramic having opposite first and second surfaces in which the first surface of the first layer of ceramic is on the first layer of graphene, and a second layer of graphene on the second surface of the first layer of ceramic; and a second unit formed of second tubes that comprise a third layer of graphene, a second layer of ceramic having opposite first and second surfaces in which the first surface of the second layer of ceramic is on the third layer of graphene, and a fourth layer of graphene on the second surface of the second layer of ceramic, wherein at least one of the second tubes is connected to at least one of the first tubes.
2. The microstructure of claim 1, wherein first and second tubes are arranged in an ordered structure and form symmetric patterns that repeat along principal directions of three-dimensional space.
3. The microstructure of claim 1, wherein first and second tubes form a rigid structure.
4. The microstructure of claim 1, wherein the interconnected units form a microlattice.
5. The microstructure of claim 1, wherein the first and second tubes are hollow.
6. The microstructure of claim 1, wherein the first and second tubes comprise graphene tubes interconnected by chemical electronic bonds.
7. A method of forming a multi-layered graphene microstructure, the method comprising: photo-initiating a polymerization of a monomer in a pattern of units to form a polymer microlattice; removing unpolymerized monomer; coating the polymer microlattice with a metal; removing the polymer microlattice to leave a metal microlattice; depositing graphitic carbon on the metal microlattice; converting the graphitic carbon to a first graphene layer; removing the metal microlattice; depositing ceramic on the first graphene layer; depositing graphitic carbon on a surface of the ceramic opposite the first graphene layer; and converting the graphitic carbon to a second graphene layer.
8. The method of claim 7, wherein photo-initiating the polymerization of the monomer comprises passing collimated light through a photomask.
9. The method of claim 7, wherein photo-initiating the polymerization of the monomer comprises multi-photon lithography.
10. The method of claim 7, wherein coating the polymer microlattice with the metal comprises an electroless deposition of copper.
11. The method of claim 7, wherein coating the polymer microlattice with the metal comprises an electroless deposition of nickel.
12. The method of claim 7, wherein the polymer microlattice comprises polystyrene.
13. The method of claim 7, wherein the polymer microlattice comprises poly(methyl methacrylate).
14. A multi-layered graphene microstructure prepared by a process comprising: photo-initiating a polymerization of a monomer in a pattern of units to form a polymer microlattice; removing unpolymerized monomer; coating the polymer microlattice with a metal; removing the polymer microlattice to leave a metal microlattice; depositing graphitic carbon on the metal microlattice; converting the graphitic carbon to a first graphene layer; removing the metal microlattice; depositing ceramic on the first graphene layer; depositing graphitic carbon on a surface of the ceramic opposite the first graphene layer; and converting the graphitic carbon to a second graphene layer.
15. The multi-layered graphene microstructure of claim 14, wherein photo-initiating the polymerization of the monomer comprises passing collimated light through a photomask.
16. The multi-layered graphene microstructure of claim 14, wherein photo-initiating the polymerization of the monomer comprises multi-photon lithography.
17. The multi-layered graphene microstructure of claim 14, wherein coating the polymer microlattice with the metal comprises an electroless deposition of copper.
18. The multi-layered graphene microstructure of claim 14, wherein coating the polymer microlattice with the metal comprises an electroless deposition of nickel.
19. The multi-layered graphene microstructure of claim 14, wherein the polymer microlattice comprises polystyrene.
20. The multi-layered graphene microstructure of claim 14, wherein the polymer microlattice comprises poly(methyl methacrylate).
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
(1)
(2)
(3)
DETAILED DESCRIPTION
(4) It has been found that an organic/inorganic superstructure may be used as a template for the formation of a 3D metal superstructure that may then be used to grow graphitic carbon on the surface of the metal. The template may be fabricated through a self-propagating photopolymer waveguide technique (see, e.g., Xiaoyu Zheng et. al., Ultralight, Ultrastiff Mechanical Metamaterials; Science 344 (2014) 1373-1377 and T. A. Schaedler, et al., Ultralight Metallic Microlattices; Science 334 (2011) 962-965). As illustrated schematically in
(5)
(6) The present disclosure is of a “periodically structured” carbon nanostructure. The carbon nanostructures of the prior art are irregular and have much larger dimensions than those which may be achieved using the methodology disclosed herein.
(7) The present process may be used to create a regular array, and the superstructure dimensions (unit) and structure may be optimized for strength, thermal and other fundamental properties.
(8) There are several aspects of this procedure that are noteworthy: it provides a regular structure with defined dimensions; it can form very thin metal (e.g. Ni, Co, Cu, Ag, Au) microlattices; it enables the formation of graphitic carbon on very thin metals by a surface-limited process for very thin metal wires or tubes.
(9) The present process uses a polymeric structure as a template for such fabrication with the subsequent formation of a metal superstructure that may then be exposed to a hydrocarbon (e.g. methane, ethylene, acetylene, benzene) to form graphitic carbon, followed by etching of the metal from under the graphitic carbon using appropriate etchants such as, for example, FeCl.sub.3 or potassium permanganate.
(10) Collimated UV light 12 through a photomask 14 or multi-photon lithography may be used in a photo-initiated polymerization to produce a polymer microlattice 18 comprised of a plurality of units. Exemplary polymers include polystyrene and poly(methyl methacrylate) (PMMA). Once polymerized in the desired pattern, the remaining un-polymerized monomer may be removed.
(11) The polymer structure (polymer scaffold) may then be plated with a suitable metal using an electroless plating process.
(12) Electroless nickel plating (EN) is an auto-catalytic chemical technique that may be used to deposit a layer of nickel-phosphorus or nickel-boron alloy on a solid workpiece, such as metal, plastic, or ceramic. The process relies on the presence of a reducing agent, for example hydrated sodium hypophosphite (NaPO.sub.2H.sub.2.H.sub.2O) which reacts with the metal ions to deposit metal. Alloys with different percentages of phosphorus, ranging from 2-5 (low phosphorus) to up to 11-14 (high phosphorus) are possible. The metallurgical properties of the alloys depend on the percentage of phosphorus.
(13) Electroless plating has several advantages over electroplating. Free from flux-density and power supply issues, it provides an even deposit regardless of workpiece geometry, and with the proper pre-plate catalyst, may deposit on non-conductive surfaces. In contradistinction, electroplating can only be performed on electrically conductive substrates.
(14) Before performing electroless plating, the material to be plated must be cleaned by a series of chemicals; this is known as the pre-treatment process. Failure to remove unwanted “soils” from the part's surface results in poor plating. Each pre-treatment chemical must be followed by water rinsing (normally two to three times) to remove chemicals that may adhere to the surface. De-greasing removes oils from surfaces, whereas acid cleaning removes scaling.
(15) Activation may be done with an immersion into a sensitizer/activator solution—for example, a mixture of palladium chloride, tin chloride, and hydrochloric acid. In the case of non-metallic substrates, a proprietary solution is often used.
(16) The pre-treatment required for the deposition of metals on a non-conductive surface usually consists of an initial surface preparation to render the substrate hydrophilic. Following this initial step, the surface may be activated by a solution of a noble metal, e.g., palladium chloride. Electroless bath formation varies with the activator. The substrate is then ready for electroless deposition.
(17) The reaction is accomplished when hydrogen is released by a reducing agent, normally sodium hypophosphite (with the hydrogen leaving as a hydride ion) or thiourea, and oxidized, thus producing a negative charge on the surface of the part. The most common electroless plating method is electroless nickel plating, although silver, gold and copper layers can also be applied in this manner.
(18) In principle any hydrogen-based reducing agent can be used although the redox potential of the reducing half-cell must be high enough to overcome the energy barriers inherent in liquid chemistry. Electroless nickel plating most often employs hypophosphite as the reducer while plating of other metals like silver, gold and copper typically makes use of low-molecular-weight aldehydes.
(19) A benefit of this approach is that the technique can be used to plate diverse shapes and types of surfaces.
(20) As illustrated in
(21) Referring now to
(22) Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.