Power supply system for a vertical continuous electroplating frame

Abstract

A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail arranged on the vertical continuous electroplating device; and an electrode case, arranged a case body on the top surface of the electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at the bottom of the electrode plate having an elastic unit, the top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, the electroplating current is provided to the object to be plated through the electroplating frame.

Claims

1. A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail extending in a horizontal direction arranged on the vertical continuous electroplating frame; and an electrode case having a case body on a top of the vertical continuous electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at a bottom of the electrode plate having an elastic unit, a top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, an electroplating current is provided to an object to be plated through the vertical continuous electroplating frame.

2. The power supply system for a vertical continuous electroplating frame as claimed in claim 1, wherein the electrode plate extends in a vertical direction with respect to the horizontal direction of the power supply rail.

3. The power supply system for a vertical continuous electroplating frame as claimed in claim 2, wherein the power supply rail is arranged at a bottom edge of a top part of a C shape structure, an inner height of the C shape structure is corresponding to an arrangement height of the electrode case, and at atop edge of a bottom part of the C shape structure has a wear-resistant rail.

4. The power supply system for a vertical continuous electroplating frame as claimed in claim 3, wherein the power supply rail has a positioning rail arranged at the bottom edge of the top part of the C shape structure, then has a pressing rail corresponding to the positioning rail, and the positioning rail and the pressing rail has an elastic unit, so the pressing rail and the electrode plate is electrical contacted.

5. A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail extending in a horizontal direction, arrange a positioning rail on the vertical continuous electroplating frame, arrange a pressing rail corresponding to the positioning rail, and arrange an elastic unit between the positioning rail and the pressing rail; and an electrode case having a case body on a top of the vertical continuous electroplating frame, inside the case body having an electrode plate corresponding to the pressing rail of the power supply rail, atop surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the pressing rail, an electroplating current is provided to an object to be plated through the vertical continuous electroplating frame.

6. The power supply system for a vertical continuous electroplating frame as claimed in claim 5, wherein the electrode plate extends in a vertical direction with respect to the horizontal direction of the power supply rail.

7. The power supply system for a vertical continuous electroplating frame as claimed in claim 6, wherein a positioning rail of the power supply rail is arranged at a bottom edge of a top part of a C shape structure by the power supply rail, an inner height of the C shape structure is corresponding to an arrangement height of the electrode case, and at a top edge of a bottom part of the C shape structure has a wear-resistant rail.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram illustrating the structure of the present invention;

(2) FIG. 2 is a zoom-in of the 2 in the FIG. 1;

(3) FIG. 3 is a perspective view of the electrode case of the present invention;

(4) FIG. 4 is a sectional view of the electrode case of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(5) First, referring to FIG. 1-4, the first embodiment of the present invention including: a power supply rail 10 arranged on the vertical continuous electroplating device; and an electrode case 20, arranged a case body 21 on the top surface of the electroplating frame 30, inside the case body 21 having an electrode plate 22 corresponding to the power supply rail 10, the electrode plate 22 is horizontally arranged relatively to the direction of the power supply rail 10, at the bottom of the electrode plate 22 having an elastic unit 23, the top surface of the case body 21 having a positioning groove 24 corresponding to the electrode plate 22, when the electrode plate 22 is electrical contacted with the power supply rail 10, the electroplating current is provided to the object 31 to be plated through the electroplating frame 30.

(6) The second embodiment of the present invention including: a power supply rail 10, arrange a positioning rail 11 on the vertical continuous electroplating device, arrange a pressing rail 12 corresponding to the positioning rail 11, and arrange an elastic unit 13 between the positioning rail 11 and the pressing rail 12; an electrode case 20, arranged a case body 21 on the top surface of the electroplating frame 30, inside the case body 21 having an electrode plate 22 corresponding to the pressing rail 12 of the power supply rail 10, the electrode plate 22 is horizontally arranged relatively to the direction of the power supply rail 10, the top surface of the case body 21 having a positioning groove 24 corresponding to the electrode plate 22, when the electrode plate 22 is electrical contacted with the pressing rail 12, the electroplating current is provided to the object 31 to be plated through the electroplating frame 30.

(7) The third embodiment of the present invention including: a power supply rail 10, arrange a positioning rail 11 on the vertical continuous electroplating device, arrange a pressing rail 12 corresponding to the positioning rail 11, and arrange an elastic unit 13 between the positioning rail 11 and the pressing rail 12; an electrode case 20, arranged a case body 21 on the top surface of the electroplating frame 30, inside the case body 21 having an electrode plate 22 corresponding to the power supply rail 10, the electrode plate 22 is horizontally arranged relatively to the direction of the power supply rail 10, the bottom of the electrode plate 22 has an elastic unit 23, the top surface of the case body 21 having a positioning groove 24 corresponding to the electrode plate 22, when the electrode plate 22 is electrical contacted with the pressing rail 12, the electroplating current is provided to the object 31 to be plated through the electroplating frame 30.

(8) Also, the above-mentioned second and third embodiments can also enable the power supply rail 10 to set the positioning rail 11 on the bottom edge of the top of a C shape structure 40 of the vertical continuous electroplating equipment, and the inner height of the C shape structure 40 is corresponding with the setting height of the electrode case 20, and a wear-resistant rail 41 is provided on the top edge of the bottom of the C shape structure 40.

(9) With the feature disclosed above, in the first embodiment, the bottom of the electrode plate 22 is provided with an elastic unit 23; in the second embodiment, let the power supply rail 10 include a positioning rail 11 and a pressing rail 12, and an elastic unit 13 is provided between the positioning rail 11 and the pressing rail 12; in the third embodiment, the bottom of the electrode plate 22 is provided with an elastic unit 23, the power supply rail 10 include a positioning rail 11 and a pressing rail 12, and an elastic unit 13 is provided between the positioning rail 11 and the pressing rail 12; whereby let the electroplating frame 30 keep having continuously electrical contacted between the electrode plate 22 and the power supply rail 10/pressing rail 12, even in the situation that electroplating frame 30 has unsmooth conveying.

(10) Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims.