BOND STRIP TECHNOLOGY
20220242056 ยท 2022-08-04
Assignee
Inventors
Cpc classification
B29C66/1312
PERFORMING OPERATIONS; TRANSPORTING
B29C65/20
PERFORMING OPERATIONS; TRANSPORTING
B29C66/712
PERFORMING OPERATIONS; TRANSPORTING
B29C65/06
PERFORMING OPERATIONS; TRANSPORTING
B29C66/54
PERFORMING OPERATIONS; TRANSPORTING
B29C66/83221
PERFORMING OPERATIONS; TRANSPORTING
B29K2077/00
PERFORMING OPERATIONS; TRANSPORTING
B29C66/1122
PERFORMING OPERATIONS; TRANSPORTING
B29C35/0805
PERFORMING OPERATIONS; TRANSPORTING
B29K2077/00
PERFORMING OPERATIONS; TRANSPORTING
B29C66/7212
PERFORMING OPERATIONS; TRANSPORTING
B29C66/71
PERFORMING OPERATIONS; TRANSPORTING
B29C66/71
PERFORMING OPERATIONS; TRANSPORTING
B29C65/5057
PERFORMING OPERATIONS; TRANSPORTING
B29C66/7212
PERFORMING OPERATIONS; TRANSPORTING
B29C65/1467
PERFORMING OPERATIONS; TRANSPORTING
B29C66/73921
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A process for joining polymer molded parts. Providing a first part made from a first material and a second part made from a same or different first material. Attaching an infrared or other thermal bonding material to at least one of the parts in a place for the parts to be joined. Thereafter, heating the at least on infrared bonding material with an infrared heating element and pressing the first part into contact with the second part wherein a bond is formed.
Claims
1. A process for joining polymer molded parts comprising; a. providing a first part made from a first material and a second part made from a same or different second material; b. attaching a thermal bonding material to at least one of the parts in a place for the parts to be joined; and, c. bonding the bonding material with a thermal bonding process and pressing the first part into contact with the second part wherein a bond is formed.
2. The process of claim 1 wherein the thermal bonding material is an infrared heated material thermal bonding process is an infrared heating process.
3. The process for joining polymer molded parts of claim 2 wherein a second infrared bonding material is provided in a corresponding bonding area on said second part.
4. The process for joining polymer molded parts of claim 2 wherein the infrared bonding material and second infrared bonding material are compatible for infrared melt bonding to each other.
5. The process for joining polymer molded parts of claim 3 wherein the infrared bonding material is compatible for bonding to said first material and said second infrared bonding material is compatible for bonding to said second material.
6. The process for joining polymer molded parts of claim 1 wherein the first material and the second material comprise a fiber filled thermoplastic resin.
7. The process for joining polymer molded parts of claim 5 wherein the resin is a carbon fiber or glass filled fiber composition.
8. The process for joining polymer molded parts of claim 6 wherein the polymer is a 10-30% carbon fiber filled nylon composition and a nylon material is overmolded on the surfaces to be joined prior to infrared heat treatment.
9. The process of claim 1 wherein the parts are joined by subjecting the bonding material to a process consisting of hot plate welding, ultrasonic welding, vibration welding and combinations of these.
10. A process for joining polymer molded parts comprising: a. providing a first part made from a first filled material and a second part made from a second filled material; b. attaching an unfilled infrared bonding material which is compatible for melt bonding the first material to the second material to at least one of the parts in a place for the parts to be joined using a two-shot method; and, c. heating the infrared bonding material with an infrared heating element and pressing the first part into contact with the second part wherein a bond is formed.
11. The process of claim 10 wherein said infrared bonding material is a nylon material.
12. The process of claim 10 wherein the infrared bonding material is a thermoplastic.
13. The process of claim 10 wherein the first filled material and the second filled material are the same but having dissimilar levels of fillers and the unfilled bonding material is the same material as a base material of the first filled material and the second material.
14. The process of claim 10 wherein the first filled material and the second filled material are the same but having dissimilar levels of fillers and the unfilled bonding material is a melt bonding compatible unfilled material which is different from a base material of the first filled material and the second material but is compatible for melt bonding one to the other.
15. The process of claim 10 wherein the first filled material and the second filled material are the same but having dissimilar levels of fillers and the unfilled bonding material is the same material as a base material of the first filled material and the second material and said second unfilled material is deposited on each of the first part and second part at respective first and second joining surfaces prior to infrared bonding of the first part to the second part.
16. The process of claim 15 wherein the first unfilled infrared bonding material is compatible with bonding to the first filled material and the second unfilled infrared bonding material is compatible with bonding to the second filled material of the second part and wherein the first unfilled material and the second unfilled infrared bonding materials are compatible for bonding to each other.
17. The process of claim 10 wherein the parts are joined by subjecting the bonding material to a process consisting of hot plate welding, ultrasonic welding, vibration welding and combinations of these.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The present invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] The following description of the preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
[0024] In order to overcome the problem of bonding both the 20% carbon fiber filled and 60% glass filled resins, we conceived the idea to overmold a strip of secondary resin molded locally on the part, where the IR welded bond is needed to take place. This secondary resin strip is typically be made of the same base resin as the structural resin used, but without fillers to disrupt the IR welding process. In the case of our nylon filled resins, we would use a nylon resin with no glass or carbon fiber fillers.
[0025] These strips of secondary resin could be applied to one or both halves of the components being joined. The width and thickness of the strip would vary depending on the bond needed and the resins effectiveness to be joined.
[0026] Other methods of joining besides IR welding may be applicable to using this secondary strip of resin to enable bonding such as hot plate welding, ultrasonic welding or vibration welding.
[0027] In an alternate embodiment, the process is also used to allow dissimilar plastics to be joined together. The secondary strips made of compatible resins are added to one or both dissimilar plastics to enable their joining.
[0028] In an additional embodiment, this method could be used with adhesives if the base resin in a part is unable to be dissolved by an adhesive to create a sufficient bond to another part. A secondary strip of resin can also be added to make a joint between them compatible if necessary.
[0029] The process of adding this secondary strip of material to a primary plastic part is typically done through the process of two-shot injection molding or insert molding. The two-shot injection molding process enables the overmolding of the secondary strip resin because it is done immediately after the primary part resin is injected into the mold. While the primary part is still hot but sufficiently solid to manipulate, it can be presented to another cavity and injected with the secondary plastic resin, forming the strip of material to be bonded. Because this secondary injection of plastic occurs while the primary part is still very hot and is being done with plastics that have common base resin, a strong molecular bond occurs between the two resins. Once this occurs, the two parts can be bonded together by the joining process required.
[0030] Referring now to the drawings, and in particular to
[0031] When two bonding materials are used the first infrared bonding material and second infrared bonding material are compatible for infrared melt bonding to each other and also to the respective surfaces 16 and 18 on the parts 12 and 14. Preferably parts 12 and 14 comprise thermoplastic fiber filled thermoplastic resins.
[0032] While Nylon and glass filled, or graphite filled polypropylene are preferred polymers. However, the present process is used with any filled resin with a high filler content that makes joining difficult. Generally, this process would be used with fiber filled materials having above about 20% fillers. Typically, the amount of fillers are about 40% and above fiber content, preferably the filler content is from about 40% to about 60% all fiber fillers are by weight. For carbon fiber filled resins it would be useful for amounts of 20% and above filler. This process when other fillers are present in a resin that makes joining difficult. The present process is also useful to bond two parts with differing levels of filler together, if one half needed some special properties or as a cost saving measure.
[0033] As an example, the polymer is a 10-30% carbon fiber filled nylon composition and a nylon material is overmolded on the surfaces to be joined prior to infrared heat treatment for joining the parts. Highly filled 30-60% filled long glass fiber compositions are also joinable using the process of the present invention. Typically, the resin is a carbon fiber or glass filled fiber composition.
[0034] The description of the invention is merely exemplary in nature and, thus, variations that do not depart from the essence of the invention are intended to be within the scope of the invention. Such variations are not to be regarded as a departure from the spirit and scope of the invention.