PERMANENT, SELF-ADHERING, SELF-LUBRICATING, ANTI-WEAR COMPOSITE SYSTEM
20220195261 · 2022-06-23
Assignee
Inventors
Cpc classification
B32B2405/00
PERFORMING OPERATIONS; TRANSPORTING
B32B2262/12
PERFORMING OPERATIONS; TRANSPORTING
B32B37/10
PERFORMING OPERATIONS; TRANSPORTING
B32B27/12
PERFORMING OPERATIONS; TRANSPORTING
B32B2327/18
PERFORMING OPERATIONS; TRANSPORTING
C09J7/405
CHEMISTRY; METALLURGY
B32B2581/00
PERFORMING OPERATIONS; TRANSPORTING
B32B37/06
PERFORMING OPERATIONS; TRANSPORTING
Y10T428/1471
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B32B2260/021
PERFORMING OPERATIONS; TRANSPORTING
Y10T428/14
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B32B2367/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B32B5/02
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An anti-wear composite structure includes an anti-wear layer that has a wear surface opposite an adhesive receiving surface and a thermosetting resin applied to the adhesive receiving surface. The thermosetting resin includes a reactive adhesive configured to bond the anti-wear composite structure to a substrate at an ambient temperature band via pressure-sensitive adhesion. The thermosetting resin has an onset to cure in the ambient temperature band and has a peak cure temperature greater than the ambient temperature band to mechanically and chemically bond the anti-wear composite structure to a substrate.
Claims
1. A method of applying an anti-wear composite structure to a substrate, the method comprising; providing an anti-wear composite structure comprising an anti-wear layer having a layer of thermosetting resin applied to an adhesive receiving surface of the anti-wear layer; and a wear surface opposite the adhesive receiving surface, the wear surface being configured for sliding engagement with a mating surface; maintaining the anti-wear composite structure at a temperature below ambient temperature before installation to prevent premature curing of the thermosetting resin; adhering the thermosetting resin portion of the anti-wear structure to the substrate via pressure-sensitive adhesion at ambient temperature; applying pressure to the anti-wear composite structure; and heating the anti-wear composite structure to a temperature sufficient to cure the thermosetting resin and mechanically and chemically bond the thermosetting resin to the substrate.
2. The method of claim 1, wherein the anti-wear layer further comprises a protective layer removably adhered to the wear surface.
3. The method of claim 2, further comprising removing the protective layer from the anti-wear layer.
4. The method of claim 1, wherein the anti-wear layer further comprises a release layer removably adhered to a surface of the thermosetting resin; and the method further comprising, before the adhering step, removing the release layer from the thermosetting resin.
5. The method of claim 1, wherein the maintaining step comprises maintaining the anti-wear composite structure at a temperature below zero degrees Celsius (32 degrees Fahrenheit) before installation to prevent premature curing of the thermosetting resin.
6. The method of claim 2, wherein the applying pressure step comprises applying pressure to the anti-wear composite structure via the protective layer disposed on the anti-wear layer.
7. The method of claim 6, wherein the applying pressure step comprises applying pressure in the range of 2.06843 Bar (30 pounds per square inch) to 6.89476 Bar (100 pounds per square inch) to the anti-wear composite structure via the protective layer disposed on the anti-wear layer.
8. The method of claim 1, wherein the heating step comprising heating the anti-wear composite structure to a temperature above ambient temperature.
9. The method of claim 1, wherein the heating step comprising heating the anti-wear composite structure to a temperature in the range of 148.89 degrees Celsius (300 degrees Fahrenheit) to 204.444 degrees Celsius (400 degrees Fahrenheit) to cure the thermosetting resin and mechanically and chemically bond the thermosetting resin to the substrate.
10. The method of claim 1, wherein the anti-wear layer comprises a woven structure.
11. The method of claim 10, wherein the woven structure comprises a thermally-consolidated, fabric reinforced-polymer matrix with self-lubricating components being at least one of integral to a weave and as an additive to the matrix.
12. The method of claim 10, wherein the woven structure comprises woven fabric comprising a plurality of fibers interwoven with one another and polytetrafluoroethylene interwoven therewith.
13. The method of claim 12, wherein the fibers comprise at least one of a polyester material, a stainless steel material, polytetrafluoroethylene, and glass material.
14. The method of claim 1, wherein the anti-wear layer is a thermally-consolidated, machinable, moldable, or non-woven fabric comprising a reinforced polymer matrix composite with self-lubricating materials integral to the non-woven fabric and/or as an additive to the matrix.
15. The method of claim 1, wherein the layer of thermosetting resin is in the form of a tape calendered, or laminated, to one side of the anti-wear layer.
16. The method of claim 14, wherein the layer of thermosetting resin tape is configured to removably bond the anti-wear composite structure to the substrate at a temperature of about 138 degrees Celsius (280 degrees Fahrenheit) to about 160 degrees Celsius (320 degrees Fahrenheit).
17. The method of claim 1, wherein the layer of thermosetting resin is configured to be applied to the anti-wear layer in viscous form via resin application techniques comprising at least one of painting, brushing, rolling, and squeezing.
18. The method of claim 1, wherein the layer of thermosetting resin is configured to be dried to increase room temperature viscosity to allow for pressure sensitive adhesion without resin flowing from the bond line during application to the substrate.
19. The method of claim 2, wherein the protective layer comprises indicia configured as advertising and/or instructions for installation and use.
20. The method of claim 4, wherein the release layer comprises a siliconized paper or polymer film.
21. The method of claim 1, further comprising forming the anti-wear composite structure to specific shapes via at least one of cutting, shaping, die stamping, computer numerical controlled machining, and hand trimming.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0034]
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
DETAILED DESCRIPTION
[0043] As shown in
[0044] In some embodiments, the thermosetting resin 40 (i.e., adhesive) is applied only to the adhesive receiving surface 34. In some embodiments, the thermosetting resin 40 is applied to the entire adhesive receiving surface 34. In one embodiment, the thermosetting resin 40 is applied to portions of the adhesive receiving surface 34, for example, in a pattern. The thermosetting resin 40 is applied uniformly (i.e., a predetermined thickness) to the adhesive receiving surface 34 of the anti-wear layer 30.
[0045] While the thermosetting resin 40 is shown and described as being applied uniformly (i.e., a predetermined thickness) to the adhesive receiving surface 34 of the anti-wear layer 30, the present invention is not limited in this regard as the thermosetting resin 40 may be applied in non-uniform and various thicknesses to the adhesive receiving surface 34 of the anti-wear layer 30 to comport with non-uniform shape, contour, or irregularities in the surface of a substrate 60 that the anti-wear composite structure 10 is applied to.
[0046] While
[0047] The thermosetting resin 40 includes a reactive adhesive that has a first bonding step and a second bonding step. During the first bonding step the reactive adhesive is configured to initially bond (e.g., temporarily bond or a precursor bond) the anti-wear composite structure 10 to a substrate 60 (see
[0048] During the second bonding step, the reactive adhesive in thermosetting resin 40 of the anti-wear composite structure 10 is cured at a pressure of 2.06843 Bar to 6.89476 Bar (30 to 100 pounds per square inch), a temperature of 148.89 degrees Celsius to 204.444 degrees Celsius (300 to 400 degrees Fahrenheit) with a range of time from 30 to 90 minutes. In one embodiment, during the second bonding step the reactive adhesive in thermosetting resin 40 of the anti-wear composite structure 10 is cured at a pressure of 3.44738 Bar (50 pounds per square inch) and a temperature of 176.667 degrees Celsius (350 degrees Fahrenheit) for 60 minutes.
[0049] As shown in
[0050] In some embodiments, the anti-wear layer 30 is a thermally-consolidated, machinable, moldable or non-woven fabric that has a reinforced polymer matrix composite with self-lubricating materials integral to the non-woven fabric and/or as an additive to the matrix.
[0051] In some embodiments, the thermosetting resin 40 is in the form of a tape calendered, or laminated, to one side of the anti-wear layer 30. In some embodiments, the thermosetting resin 40 is configured to be applied to the anti-wear layer in viscous form via resin application techniques comprising at least one of painting, brushing, rolling, and squeezing.
[0052] In some embodiments, the thermosetting resin 40 is configured to be dried to increase room temperature viscosity to allow for pressure sensitive adhesion without resin flowing from the bond line during application to a substrate 60.
[0053] As shown in
[0054] As shown in
[0055] The protective layer 20 has a thickness T1 in the range of 0.00508 cm to 0.03048 cm (0.002 inches to 0.012 inches). The anti-wear layer 30 has a thickness T2 in the range of 0.00508 cm to 0.3048 cm (0.002 inches to 0.120 inches). The thermosetting resin 40 has a thickness T3 in the range of 0.00508 cm to 0.0254 cm (0.002 inches to 0.010 inches). The release layer 50 has a thickness T4 in the range of 0.00508 cm to 0.03048 cm (0.002 inches to 0.012 inches).
[0056] As shown in
[0057] While
[0058] The anti-wear composite structure 110 shown in
[0059] The substrate 60 has a service temperature of −54 degrees Celsius to 52 degrees Celsius (−65 degrees Fahrenheit to 125 degrees Fahrenheit). The overall advantage of the thermoplastic adhesive tape 140 is ease (and speed) of installation and cleanup at the sacrifice of a permanent chemical bond (which imparts creep resistance, temperature resistance, modulus, strength, and chemical resistance). If for some reason, the substrate 60 reached the melting temperature of the thermoplastic adhesive tape 140, the thermoplastic adhesive tape 140 would lose structure, but would this be inconsequential due to the mechanical fixation of the substrate 60 to the component 70.
[0060] The present invention also includes a method of applying an anti-wear composite structure 10 to a substrate 60. The method includes providing the anti-wear composite structure 10 illustrated in
[0061] The method further includes removing the protective layer 20 from the anti-wear layer 30.
[0062] There is disclosed herein a method of manufacturing the anti-wear composite structure 10 that includes forming the anti-wear composite structure 10 to specific shapes via at least one of cutting, shaping, die stamping, computer numerical controlled machining (CNC), and hand trimming.
[0063] Although this invention has been shown and described with respect to the detailed embodiments thereof, it will be understood by those of skill in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed in the above detailed description, but that the invention will include all embodiments falling within the scope of the appended claims.