Abstract
The invention relates to a heating system component for a heating system for heating a fluid medium, with a carrier unit, and a heating unit coupled to said carrier unit, wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit. A temperature sensor, in particular an NTC thermistor, positioned to measure a temperature of a fluid medium at the wet side of the carrier unit, wherein the temperature sensor is effectively thermally insulated from the heating unit.
Claims
1. A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit; wherein the heating system component further comprises at least one temperature sensor, in particular an NTC thermistor, wherein said temperature sensor is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit, wherein the part of the upper surface of the carrier unit is in contact with said fluid medium at the opposing wet side, and wherein the part of the upper surface of the carrier unit being in thermal contact with the temperature sensor is effectively thermally insulated from the heating unit; and wherein the heating system component further comprises a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; wherein at least a part of the heat conducting plate is covered with a thermoplastic layer doped with a metal-plastic additive directly sprayed at least at a part of the projecting part and subsequently metalized at respective portions of an upper surface of the thermoplastic layer; wherein the temperature sensor and conductor paths connected to the temperature sensor are formed at the metalized thermoplastic layer by laser cutting.
2. A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit; wherein the heating system component further comprises at least one temperature sensor, in particular an NTC thermistor, wherein said temperature sensor is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit, wherein the part of the upper surface of the carrier unit is in contact with said fluid medium at the opposing wet side, and wherein the part of the upper surface of the carrier unit being in thermal contact with the temperature sensor is effectively thermally insulated from the heating unit; wherein said temperature sensor is provided inside the groove of the carrier unit shielded from the heating unit by a shielding unit; and wherein the heating system component further comprises a second temperature sensor provided inside the groove shielded from the heating unit by the shielding unit, wherein the resulting temperature is derived from an average temperature measured by the first and second temperature sensors.
3. The heating system component according to claim 2, wherein the first and second temperature sensors are NTC thermistor pills cast in epoxy resin between the dry side of the carrier unit and the shielding unit.
4. A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit; wherein the heating system component further comprises at least one temperature sensor, in particular an NTC thermistor, wherein said temperature sensor is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit, wherein the part of the upper surface of the carrier unit is in contact with said fluid medium at the opposing wet side, and wherein the part of the upper surface of the carrier unit being in thermal contact with the temperature sensor is effectively thermally insulated from the heating unit; and wherein the carrier unit comprises an undercut portion which is covered with a thermoplastic layer doped with a metal-plastic additive directly sprayed at the undercut portion and subsequently metalized at respective portions of an upper surface of the thermoplastic layer; wherein the temperature sensor and conductor paths connected to the temperature sensor are formed at the metalized thermoplastic layer by laser cutting.
5. The heating system component according to claim 4, comprising a transparent plug comprising the electrical contacts to be connected with the conductor paths leading to the temperature sensor wherein the transparent plug is coupled with the thermoplastic layer via laser welding.
6. A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit; wherein the heating system component further comprises at least one temperature sensor, in particular an NTC thermistor, wherein said temperature sensor is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit, wherein the part of the upper surface of the carrier unit is in contact with said fluid medium at the opposing wet side, and wherein the part of the upper surface of the carrier unit being in thermal contact with the temperature sensor is effectively thermally insulated from the heating unit; wherein the heating system component further comprises a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; and wherein the temperature sensor is provided at a ceramic pad fixed at a projection part of the carrier unit; and wherein one or more conductor paths are provided along the heat conduction plate to connect the one or more temperature sensors, wherein the conductor paths are insulated from the heat conduction plate by an insulating layer, preferably comprising Kapton.
7. A heating system component for a heating system for heating a fluid medium, said heating system component comprising: a carrier unit; a heating unit coupled to said carrier unit; wherein said carrier unit comprises a wet side and a dry side, wherein said wet side corresponds to a surface of said carrier unit configured to be in contact with said fluid medium, wherein said dry side is located on a surface opposite to said wet side; and wherein said heating unit is recessed in a groove provided on said dry side of the carrier unit; wherein the heating system component further comprises at least one temperature sensor, in particular an NTC thermistor, wherein said temperature sensor is effectively in thermal contact with at least a part of an upper surface of said dry side of the carrier unit, wherein the part of the upper surface of the carrier unit is in contact with said fluid medium at the opposing wet side, and wherein the part of the upper surface of the carrier unit being in thermal contact with the temperature sensor is effectively thermally insulated from the heating unit; and wherein the heating system component further comprises a heat conducting plate covering at least a part of the groove, wherein the heat conducting plate comprises a projecting part extending beyond the groove of the carrier unit, the projecting part being in direct contact with the dry side of the carrier unit; wherein at least a part of the heat conducting plate is covered with an insulating layer on top of which the temperature sensor and conductor paths connected to the temperature sensor are formed.
8. The heating system component according to claim 6, further comprising a plug with pins to be connected to the conductor paths wherein the plug also provides electric connections for the heating unit.
9. The heating system component according to claim 6, wherein the temperature sensor and the insulating layer are formed at the heat conducting plate by printing or thermal spraying.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In the following drawings:
(2) FIG. 1 shows schematically and exemplarily an embodiment of a heating system component;
(3) FIGS. 2a and 2b show schematically and exemplarily a cross-section view of the heating system component according to FIG. 1;
(4) FIGS. 3a and 3b show schematically and exemplarily a further embodiment of a heating system component;
(5) FIG. 4 shows schematically and exemplarily a further embodiment of a heating system component;
(6) FIGS. 5a and 5b show schematically and exemplarily a further embodiment of a heating system component;
(7) FIGS. 6a and 6b show schematically and exemplarily a further embodiment of a heating system component;
(8) FIG. 7 shows schematically and exemplarily a further embodiment of a heating system component.
DETAILED DESCRIPTION OF EMBODIMENTS
(9) FIG. 1 shows schematically and exemplarily an embodiment of a heating system component 100. Heating system component 100 comprises a carrier unit 110 and a heating unit 120.
(10) Heating system component 100 may be connected to, e.g., a conveyor pump of a domestic appliance such as—but not limited to—a dishwashing machine. Heating system component 100 can be attached to the conveyor pump or to a conveyor pump housing during assembly of the domestic appliance. In another example, heating system component 100 can form a pre-assembled structural unit together with the conveyor pump.
(11) As can be seen from FIG. 1, carrier unit 110 is a circular disc. In concentric relationship with its central axis (not shown), carrier unit 110 has a circular hole 111, through which a suction pipe of the conveyor pump is passed in sealing integrity in relation to the medium. At its outer peripheral edge, carrier unit 110 may engage over the edge of the conveyor pump's housing in sealing integrity in relation to the medium. That backside of carrier unit 110 as shown in FIG. 1, is in direct contact with the medium to be heated in the installed condition of the pump and can therefore be referred to as the wet side 101 whereas the side of carrier unit 110 shown in FIG. 1, does not come into contact with the medium and can thus be referred to as the dry side 102.
(12) Heating unit 120 is arranged on the dry side 102 of carrier unit 110 as shown in FIG. 2a illustrating the cross sectional view along line A-A in FIG. 1. Heating unit 120 is coupled to carrier unit 110 by means of a coupling step. The coupling step may comprise any one of a soldering step, a laser welding step, a gluing step, an ultrasonic welding step, and/or a friction welding step.
(13) Carrier unit 110 may comprise a composite material. The composite material comprises at least an aluminum layer and a stainless steel layer. The stainless steel layer is arranged on the wet side 101 of carrier unit 110. The aluminum layer is arranged on the dry side 102 of carrier unit 110. In an example, the composite material may be produced by means of a cold roll bonding process.
(14) In the embodiment illustrated in FIG. 1, carrier unit 110 further comprises groove 112. Groove 112 is configured to receive heating unit 120. Heating unit 120 comprises a first cross section which is perpendicular to an axial direction of heating unit 120. The first cross section may have a rectangular shape, a hat-like trapezoid with rounded edges, a bell-like trapezoid with rounded edges.
(15) In the embodiment illustrated in FIG. 1, a cross section of groove 112 corresponds to said first cross section of heating unit 120. In particular, heating unit 120 is arranged in groove 112 as shown in FIG. 2a. The cross section of groove 112 and the cross section of heating unit 120 are chosen such that at least a part of a surface of heating unit 120 and a part of said dry side 102 form a flat face. In FIG. 2a all three sides of heating unit 120 are welded to the surfaces of the groove 112 of the carrier unit 110. The necessary close contact between the surfaces of heating unit 120 and carrier unit 110 may be achieved by applying a press preload to heating unit 120 during the coupling step. Optionally, a thermally conducting paste 122 may be applied to one or both of the surfaces of carrier unit 110 and heating unit 120. By employing a thermally conducting paste, problems associated with an occurrence of voids between carrier unit 110 and heating unit 120 may be avoided.
(16) Another possibility for addressing problems associated with an occurrence of voids between carrier unit 110 and heating unit 120 is to arrange a phase change compound between carrier unit 110 and heating unit 120. Such a compound changes its phase state above its phase change temperature and is thereby able to fill cracks, voids, slits, etc. In an embodiment, the phase change compound is applied to the surfaces of carrier unit 110 and/or heating unit 120 by means of a dispensing step. Dispensing typically implies that the phase change compound dries within a short period of time.
(17) In the embodiment illustrated in FIG. 1, heating system component 100 further comprises a temperature sensor 170a, preferably an NTC (Negative Temperature Coefficient) thermistor, connectable to a processing unit of the domestic appliance in order to measure the temperature of the fluid circulating on the wet side of the heating system component 100. NTC thermistors provide a cost effective way of determining the temperature. However, such common inexpensive NTC thermistors only sustain continuous operation in a temperature regime of up to 100° C. Since heating unit 120 usually reaches temperatures above 100° C., the NTC thermistor 170a must be thermally shielded from the heating unit 120 in order to ensure a certain durability while avoiding to use more expensive NTC thermistors which sustain higher temperatures. Therefore, the heating unit 120 is covered by a heat conducting plate 140 at an outer circumferential part of the carrier unit 110 covering the groove 112. The heat conducting plate 140 may comprise a projecting part 141 extending towards an inner circumferential part 113 of the carrier unit 110. This projecting part 141 is in direct contact with the dry side 102 of the carrier unit 110. Since at the opposite side of the carrier unit 110, the wet side 101, the fluid is circulated in operation, the temperature of the carrier unit 110 and thus the temperature of the projecting part 141 of the heat conducting plate 140 approximately reflects the temperature of the fluid. In order to measure the fluid temperature, the NTC thermistors 170a is thus mounted at the projecting part 141 of the heat conducting plate 140. In order to control the heat transfer from the heating unit 120 to the projecting part 141 on which the NTC is mounted, the heat conducting plate 140 may provide a detached portion 142 at an outer circumferential part above the heating unit 120 under the same angle as the projecting part 141 extends towards the centre. FIG. 2b shows a cross sectional view along the line B-B in FIG. 1. FIG. 2b shows that there is a space between detached portion 142 of the heat conducting plate 140 and the heating unit 120. The projecting part 141 is in contact with the detached portion 142, but is declined towards the upper surface of the carrier unit 110. Preferably, the angular expansion of the detached portion 142 is slightly broader than the angular expansion projection part 141. The heat conducting plate 140 may additionally be provided with trenches 143 at the detached portion 142 provided towards both sides of the angular expansion of the detached portion 142 wherein the length of the trenches 143 influences the amount of heat conducted from the non-detached portion 144 of the heat conducting plate 140 to the projecting portion 141.
(18) Optionally, a second NCT thermistors may be provided, either at a further detached portion 142 in order to determine the fluid temperature, such that the first and second NTC thermistor measurements can be averaged in order to increase the liability. Alternatively, the second NTC thermistor 170b may be mounted at the non-detached portion 144 of the heat conducting plate 140 in order to determine the temperature of the heating unit 120 itself for preventing for instance that the pump is running dry. In the latter case, an NTC thermistor sustaining the resulting temperatures reachable by the heating unit must be chosen.
(19) In the embodiment schematically illustrated in FIG. 3a, a heating system component 100 is shown which provides one or more temperature sensors, preferably NTC thermistors 180, inside the groove 112. The heating unit 120 inserted in the groove 112 of the carrier unit 110 provides connecting pins 123 at both ends of the heating unit 120. These connecting pins 123 are not located inside the groove 112, but project towards an axial direction to be connected to a power source. The temperature sensor 180 is therefore preferably provided in the portion of the groove 112 which is not covered by the heating unit 120 and is located below the connection pins 123. In order to shield the temperature sensor 180 from the heating unit 120, a shielding unit 181 is provided inside and preferably form-fit to the walls of the groove 112. The shielding unit 181 is made of a heat insulating material such as—but not limited to—stainless steel. As shown in cross-sectional view of FIG. 3b, the shielding unit 181 provides a hollow chamber 182 into which the temperature sensor 180a, preferably in form of an NTC pill, is inserted. In order to fix the NTC thermistors inside the hollow chamber 182, an epoxy resin is injected into the chamber 182, preferably a temperature resistant two-component resin. Again, optionally a second NTC thermistor 180b may be provided inside the hollow chamber 182 in order to determine an average temperature of the fluid circulating at the wet side 101 of the carrier unit 110. The compact, yet cost-efficient design provided by this embodiment allows a reliably measurement of the fluid temperature on the wet side 101 of the carrier unit 120 providing an easy assemble of the heating system component 100 within a respective household appliance. Since there are no components protruding from the dry side of the carrier unit, the risk of damages during assembly is significantly reduced.
(20) FIG. 4 schematically shows a further embodiment, in which one or more NTC thermistors 270a, 270b are provided at respective pads 250a, 250b made of a ceramic material. Each pad 250a, 250b is fixed at the heat conducting plate 240 via a form fit connection. The heat conducting plate 240 covers at least parts of an inner circumferential portion 113 of the carrier unit 110, such that an NTC thermistor 270a mounted at the projecting part 241 of the heat conducting plate 240 may measure the temperature of the water circulating at the wet side 101 of the carrier unit 110. Again, in case a second NTC thermistor 270b shall be provided, the second NTC thermistor 270b may either be positioned at another portion of the inner circumferential portion 113 of the carrier unit 110 or the heat conducting plate 240 may also cover at least portions 244 of the groove 112 in which the heating unit 120 is embedded such that the second NTC thermistor 270b may measure the temperature of the heating unit 120 itself in addition to the water temperature. The conducting paths 261 which connect the NTC thermistors 270a, 270b with an external processing unit (not shown) are electrically connected with the NTC thermistors 270a, 270b, wherein the NTC thermistor 270a, 270b and the conducting paths 261 are covered with a resin. The conducting paths 261 are preferably guided along the heat conducting plate 240 wherein a thin heat insulating layer 260, preferably a thin foil, is provided between the conducting paths 261 and the heat conducting plate 240. The thin heat insulating layer 260 is preferably made of the polyimide Kapton. However, any other suitable polyimide, polyamide or polyester may be used instead. In a preferred embodiment, a single plug 300 can be used to provide electric power to the connecting pins 123 of the heating unit 120 via respective pins 302 and to provide a connection between the conducting paths 261 from the one or more NTC thermistors 270a, 270b and an external processing unit. Preferably, the heat conducting plate 240 is grounded by the plug assembly 300 via a corresponding connection 301. Again, the compact design provides advantages during assembly of the heating system component 100 within a superordinate component into which the heating system component 100 is integrated. Having a single plug 300 to connect the heating unit 120 as well as the one or more temperature sensors 270a, 270b further decreases the complexity during assembly as well as the required material budget.
(21) The embodiment schematically illustrated in FIG. 5a, also shows a heating system component 100 with a heat conducting plate 340 wherein at least a part 341 of the heat conducting plate 340 is in direct contact with the dry side 102 of the carrier unit 110 and wherein one or more NTC thermistors 370a, 370b as well as conducting paths 361 are provided thereon having an insulating layer 360, preferably in form of a thin foil, between the heat conducting plate 340 and the NTC thermistors 370a, 370b conducting paths 361. The insulating layer 360, the one or more NTC thermistors 370, and the respective conducting paths 361 are printed or sprayed onto the heat conducting plate 340 as thin layers, Wherein the insulating layer 360, preferably made of a ceramic material is provided as a first layer, the NTC thermistors 370 and the respective conducting paths 361 are provided on top of that first layer. Again, the heating system component 100 may preferably be provided with a single plug 300 as shown in FIG. 5b which is adapted to provide electric power to connecting pins 123 of the heating unit 120 as in the embodiment depicted in FIG. 4. Additionally, the plug 300 provides one or more connection pins 302 to be coupled to the conducting paths 361, e.g. by soldering. Preferably, the heat conducting plate 340 is grounded by the plug 300 via a corresponding connection 301 as shown in the embodiment depicted in FIG. 4. Alternatively, the grounding may be achieved by connecting an upper extension 345 of the conducting plate with ground providing a plug 300 with connection pins 302 at the bottom to be connected with the conducting paths 361 and a ground connection to the side of the plug 300. Again, the compact design provides advantages during assembly of the heating system component 100 within a superordinate component into which the heating system component 100 is integrated. Having a single plug 301 to connect the heating unit 120 as well as the one or more temperature sensors 370 further decreases the complexity during assembly as well as the required material budget.
(22) FIG. 6a schematically shows a further embodiment, in which one or more temperature sensors 470 are provided at an inner circumferential portion of the carrier unit 110, wherein the carrier unit 110 comprises an undercut portion 400 which is filled with a thermoplastic layer 500 by injection-molding to form the bases of a so-called molded interconnect device (MID). In a first step, the undercut portion 400 is provided with a microstructure by a thin laser beam. The thermoplastic is provided on top of the microstructured surface of the metal layer. The metal layer is heated up by a further laser beam while the thermoplastic is pressed onto the microstructure at surface in order to provide a hybrid metal-plastic connection. The thermoplastic layer 500 is doped with a metal-plastic additive that can be activated by exposure to a laser beam. This process is commonly referred to as metallization, wherein two different sections are metalized, one for the temperature sensors 470, e.g. NTC thermistors, and the other for the conducting paths 461. The NTC thermistors 460 and respective conducting paths 461 are cut free with a laser. Also in this embodiment, a form fit plug 600 is provided having connection pins 602 to connect to the respective conducting paths 461. The housing of the plug 600 is preferably made of a transparent plastic material which can be laser-welded to the thermoplastic layer 500 which should therefore preferably be made of thermoplastic material absorbing the energy of a laser beam which previously passes the transparent plug 600 housing without depositing significant amounts of energy in the plastic material and thus deforming it. The form fit design provided by this embodiment eases the assembly of the heating system component 100 into a super ordinate system as well as reduces the size and material budget required to implement a temperature sensor 460 for the heating system component 100.
(23) FIG. 7 schematically shows a further embodiment, in which one or more temperature sensors, in particular NTC thermistors 770 as well as the conductor paths 761 between the one or more NTC thermistors 770 and an external plug are formed at a thin layer 760, preferably a thin polymer foil, before the foil is attached to the carrier unit 110. NTC thermistors 770 as well as the conductor paths 761 may either be formed by printing, vapor deposition or metallization. Preferably, the sensor foil is pre-assembled with a suitable plug 600 providing conductor pins to the conductor paths as well as preferably also power connections for the heating unit and as well as a pin to ground the carrier unit. The plug 600 may then be mounted at the carrier unit 710 by welding, in particular spot welding the power connections 302 and a ground connection 301 to the heating unit 120 and carrier unit 710, respectively. The thin foil 760 is then attached to the carrier unit 710 by gluing at least a portion of the lower side of the foil 760 to the dry side of the carrier unit 110 using a heat resistant gluing material. The NTC thermistors are preferably positioned at a portion of the dry side of the carrier unit 110 whose wet side is in contact with the fluid circulating at the wet side. The embodiment allows a particular flexible way of arranging the temperature sensors at a desired position of the carrier unit. Furthermore, the embodiment provides a very compact design without any protrusions or cables which require space and caution during assembly.
(24) An example application of the invention generally relates to situations where a fluid medium needs to be heated in an efficient manner, for example in household appliances such as dishwashers, dryers, and washing machines, small electrical appliances such as coffeemakers, irons, steam generators etc. or in water heaters. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.
(25) In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality.
(26) A single unit or device may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
(27) Determinations like measuring a temperature performed by one or several units or devices can be performed by any other number of units or devices. For example, measuring a temperature can be performed by a single temperature sensor or by any other number of different units. The determinations and/or the control of the heating system for heating fluid media can be implemented as program code means of a computer program and/or as dedicated hardware.
(28) A computer program may be stored/distributed on a suitable medium, such as an optical storage medium or a solid-state medium, supplied together with or as part of other hardware, but may also be distributed in other forms, such as via the Internet or other wired or wireless telecommunication systems. The term “computer program” may also refer to embedded software.
(29) Any reference signs in the claims should not be construed as limiting the scope.
