Conductive nanocomposites
11286394 · 2022-03-29
Assignee
Inventors
- Beate Reiser (Kaiserslautern, DE)
- Tobias Kraus (Saarbrücken, DE)
- Lola González-García (Saarbrücken, DE)
- Johannes H. M. Maurer (Homburg, DE)
- Ioannis Kanelidis (Saarbrücken, DE)
Cpc classification
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
C09D11/102
CHEMISTRY; METALLURGY
C09D11/106
CHEMISTRY; METALLURGY
C09D165/00
CHEMISTRY; METALLURGY
C09D7/70
CHEMISTRY; METALLURGY
International classification
C09D165/00
CHEMISTRY; METALLURGY
H01B1/20
ELECTRICITY
C09D11/106
CHEMISTRY; METALLURGY
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.
Claims
1. A composition for producing conductive layers by wet coating, comprising: a) a plurality of conductive metallic nanostructures, b) a conductive polymer or oligomer based on thiophene; and c) at least one solvent, wherein the conductive polymer or oligomer has heteroatoms of the thiophene that form at least ten coordinate bonds to surfaces of the plurality of metallic nanostructures.
2. The composition as claimed in claim 1, wherein the nanostructures are nanorods having an aspect ratio of length to diameter of at least 2:1.
3. The composition as claimed in claim 1, wherein the composition further comprises a matrix polymer.
4. The composition as claimed in claim 3, wherein the matrix polymer is present as a solution in the composition.
5. The composition as claimed in claim 3, wherein the matrix polymer comprises polystyrene, polyacrylate, polyvinyl alcohol, or polyvinylpyrrolidone.
6. The composition as claimed in claim 1, wherein the at least one solvent comprises solvents or solvent mixtures of solvents having in each case a boiling point below 120° C.
7. A process for producing a conductive layer on a surface, comprising: a) applying a composition as claimed in claim 1 to a surface; and b) removing the at least one solvent.
8. The process as claimed in claim 7, wherein the process does not comprise any treatment of the coating at temperatures above 60° C. after application to the surface.
9. A composite material, comprising: a composition as claimed in claim 1; and at least one matrix polymer.
10. A process for producing a composition as claimed in claim 1, comprising: a) providing a dispersion of conductive metallic nanostructures, with the dispersion being stabilized by at least one first ligand; b) adding the conductive polymer or oligomer; and c) replacing at least part of the first ligand by the conductive polymer or oligomer.
11. A display comprising the composite material as claimed in claim 9.
12. A conductor track comprising the composite material as claimed in claim 9.
13. A circuit comprising the composite material as claimed in claim 9.
14. A capacitor comprising the composite material as claimed in claim 9.
15. A solar cell comprising the composite material as claimed in claim 9.
16. The composition as claimed in claim 1, wherein the conductive polymer or oligomer comprises ethylene-3,4-dioxythiophene, 2-(3-thienyl)ethoxy-4-butylsulfonate, poly(ethylene-3,4-dioxythiophene), or poly(2-(3-thienyl)ethoxy-4-butylsulfonate).
17. The composition as claimed in claim 1, wherein the conductive polymer or oligomer has a side chain having at least one polar side group.
18. The composition as claimed in claim 1, wherein the metallic nanostructures comprise a metal, mixture of two or more metals, or an alloy of two or more metals.
19. The composition as claimed in claim 1, wherein the metallic nanostructures comprise gold, silver, copper, platinum, palladium, nickel, ruthenium, indium or rhodium.
20. The composition as claimed in claim 1, wherein the at conductive polymer or oligomer adsorbs on the nanostructure via its conjugated pi system or directly via a functionality in or in the direct vicinity of the conductive polymer backbone.
21. The composition as claimed in claim 1, wherein the at conductive polymer or oligomer has a molecular mass of at least 5 kDa.
22. The composition as claimed in claim 1, wherein the nanostructures are present in at least 10% by weight, based on the composition without solvent.
23. The composition as claimed in claim 1, wherein a degree of coverage of a nanostructure with the conductive polymer or oligomer is at least one monolayer on the total nanostructure surface.
24. A composition, comprising: a plurality of metallic nanorods; a conductive polymer or oligomer comprising a thiophene, wherein heteroatoms of the thiophene form at least ten coordinate bonds to a surface of the metallic nanorods; and at least one solvent comprising water, an alcohol, a ketone, an ether, or mixtures thereof.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF INVENTION
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(20) The layers composed of the gold nanorods with ligands according to the invention are conductive immediately after drying without any further treatment.
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(23) The composite shown is conductive and displays a resistance of 45Ω.
(24) The matrix polymer can, for example, serve as “protective layer” or as insulating layer between a plurality of conductive layers. The nanostructure of the particle is also fixed by the matrix polymer and is thus more mechanically stable.
(25) Numerous modifications and developments of the working examples described can be realized.
LITERATURE CITED
(26) Kanehara et al. Angew. Chem. Int. Ed. 2008, 47, 307-310; Abe et al. Organic Electronics 2014, 15, 3465-3470; Minari et al. Adv. Funct. Mater. 2014, 24, 4886-4892 US 2013/0001479 A1 US 2007/0057255 A1 Englebienne et al. J. Coll. Interface Sci. 2005, 292, 445-454; U.S. Pat. No. 7,686,983 Ye et al. Nano Lett. 2013, 13, 765-771; Liu et al. Nanoscale 2013, 5, 7936-7941; Zhang et al. Adv. Mater. 2012, 24, 82-87; Colle et al. Phys. Status Solidi B 2011, 248, 1360-1368.