Tunable and reconfigurable atomically thin heterostructures
11293116 · 2022-04-05
Assignee
Inventors
- Anthony Vargas (Somerville, MA, US)
- Fangze Liu (Shijiazhuang, CN)
- Christopher Adrian Lane (Boston, MA, US)
- Daniel Rubin (Boston, MA, US)
- Swastik KAR (Belmont, MA, US)
- Arun Bansil (Dover, MA, US)
- Gianina Buda (Cambridge, MA, US)
- Zachariah Hennighausen (Boston, MA, US)
Cpc classification
C30B30/00
CHEMISTRY; METALLURGY
C30B29/46
CHEMISTRY; METALLURGY
C30B33/04
CHEMISTRY; METALLURGY
C30B29/68
CHEMISTRY; METALLURGY
H01L21/02485
ELECTRICITY
H01L21/0262
ELECTRICITY
H01L21/02568
ELECTRICITY
G11B7/1369
PHYSICS
International classification
C30B29/68
CHEMISTRY; METALLURGY
H01L21/02
ELECTRICITY
G11B7/1369
PHYSICS
C30B29/46
CHEMISTRY; METALLURGY
C30B30/00
CHEMISTRY; METALLURGY
Abstract
Heterocrystals of metal dichalcogenides and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 are presented, in which the metal dichalcogenides and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 do not largely retain their independent properties. These heterocrystals exhibit electronic and optical changes, which make them attractive for beyond-silicon electronics and optoelectronics. Particularly, these heterocrystals can be re-configured in a manner that allows bit writing and pattern drawing. Embodiments of these heterocrystals, methods of forming these heterocrystals, methods of reconfiguring the heterocrystals, information storage devices, optoelectronic circuits and photonic crystals are presented.
Claims
1. A heterocrystal consisting of a metal dichalcogenide having the formula ME.sub.2 in contact with Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3, wherein M is a Cr, Mo, or W and E is S, Se, or Te; or a heterocrystal consisting of MoS.sub.2 in contact with Bi.sub.2Te.sub.3; wherein the ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 have an interface area in which they contact, and the interface has been disrupted in selected positions to thereby reverse suppression of photoluminescence in these positions, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence are part of a photonic circuit or an optoelectronic circuit, wherein the heterocrystal exhibits a photonic pattern which has been formed by reconfiguring positions of the heterocrystal.
2. The heterocrystal of claim 1, wherein the heterocrystal is characterized by lattice matching between 4×4 unit cells of MoS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, lattice matching between 4×4 unit cells of WS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, or lattice matching between 5×5 unit cells of MoSe.sub.2 and 4×4 unit cells of Bi.sub.2Se.sub.3.
3. The heterocrystal of claim 1, wherein ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 provide a rotationally-aligned epitaxial stack.
4. The heterocrystal of claim 1, wherein positions of the heterocrystal exhibit unsuppressed photoluminescence whereas elsewhere the heterocrystal exhibits suppressed photoluminescence.
5. The heterocrystal of claim 1, wherein positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions, wherein the positions form a pattern encoding information.
6. The heterocrystal of claim 1, wherein positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions.
7. The heterocrystal of claim 1, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence represent bits of information.
8. The heterocrystal of claim 1, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of increased average height and root means square surface roughness relative to untreated areas.
9. The heterocrystal of claim 1, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of an average height increased by 0.35 to 0.45 nm.
10. The heterocrystal of claim 1, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of randomly-oriented grains of Bi.sub.2Se.sub.3 that remain attached to a surface of ME.sub.2.
11. The heterocrystal of claim 1, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas with photoluminescence recovered by at least 10% relative to untreated areas.
12. The heterocrystal of claim 1, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence are part of the optoelectronic circuit.
13. The heterocrystal of claim 1, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas with sub-micrometer spatial resolution.
14. The heterocrystal of claim 1, wherein positions have been light-treated by exposure to light of a wavelength of 200 nm to 1100 nm focused onto a spot size below 10 μm with 100 nW/μm.sup.2 to 1 mW/μm.sup.2 intensity.
15. The heterocrystal of claim 1, wherein positions have been light-treated by exposure to light of a wavelength of about 488 nm focused onto a spot size below 1 μm with about 76 μW/μm.sup.2 intensity.
16. A heterocrystal consisting of MoS.sub.2 in contact with Bi.sub.2Se.sub.3 wherein MoS.sub.2 and Bi.sub.2Se.sub.3 have an interface area in which they contact, and the interface has been disrupted in selected positions to thereby reverse suppression of photoluminescence in these positions, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence are part of a photonic circuit or an optoelectronic circuit, wherein the heterocrystal exhibits a photonic pattern which has been formed by reconfiguring positions of the heterocrystal.
17. The heterocrystal of claim 16, wherein the heterocrystal is characterized by lattice matching between 4×4 unit cells of MoS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3.
18. The heterocrystal of claim 16, wherein MoS.sub.2 and Bi.sub.2Se.sub.3 provide a rotationally-aligned epitaxial stack.
19. The heterocrystal of claim 16, wherein positions of the heterocrystal exhibit unsuppressed photoluminescence whereas elsewhere the heterocrystal exhibits suppressed photoluminescence.
20. The heterocrystal of claim 16, wherein positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions, wherein the positions form a pattern encoding information.
21. The heterocrystal of claim 16, wherein positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions.
22. The heterocrystal of claim 16, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence represent bits of information.
23. The heterocrystal of claim 16, wherein positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence are part of the optoelectronic circuit.
24. The heterocrystal of claim 16, wherein positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas with sub-micrometer spatial resolution.
25. The heterocrystal of claim 16, wherein positions have been light-treated by exposure to light of a wavelength of 200 nm to 1100 nm focused onto a spot size below 10 μm with 100 nW/μm.sup.2 to 1 mW/μm.sup.2 intensity.
26. The heterocrystal of claim 16, wherein positions have been light-treated by exposure to light of a wavelength of about 488 nm focused onto a spot size below 1 μm with about 76 μW/μm.sup.2 intensity.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawings will be provided by the Office upon request and payment of the necessary fee.
(2) The foregoing will be apparent from the following more particular description of example embodiments, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating embodiments.
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DETAILED DESCRIPTION
(48) The heterocrystals of the present invention comprise a metal dichalcogenide having the formula ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3.
(49) Generally, M can be Cr, Mo, or W and E can be S, Se, or Te. Typically, M is Mo or W and E is S, Se or Te. More typically, M is Mo or W and E is Se or Te.
(50) In embodiments, the heterocrystals have a layer metal dichalcogenide in contact with a layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. Typically, this contact can be established by chemically vapor depositing the metal dichalcogenide on top of a layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3, or chemically vapor depositing Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 on top of a layer of metal dichalcogenide.
(51) The layer of metal dichalcogenide can consist of one to five tri-layers of metal dichalcogenide. Typically, the layer of metal dichalcogenide is one tri-layer of metal dichalcogenide, also referred to herein as a “monolayer”.
(52) As used herein, a “tri-layer” refers to three layers of atoms corresponding to the three atoms in the chemical formula ME.sub.2. For example, a bottom layer of atoms E, a middle layer of atoms M, and a top layer of atoms E. See, for example,
(53) The layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 can consist of one to 25 quintuple-layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. Typically, the layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 comprises one to 10 quintuple-layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. More typically, the layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 consists of one to 20, one to 15, one to 10, one to eight, one to six, one to five, two to 10, two to five, or three to five quintuple-layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. Yet more typically, the layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 consists of one to five quintuple-layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3.
(54) As used herein, a “quintuple-layer” refers to three layers of atoms corresponding to the five atoms in the chemical formulas Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 and Bi.sub.2Te.sub.3. For example, a bottom layer of atoms Se, a next layer of atoms Bi, a middle layer of atoms Se, a further layer of atoms Bi, and a top layer of atoms Se, as shown in
(55) By selecting the number of tri-layers and quintuple-layers the transmittance-edge of the heterocrystals can be tuned, for example, from 1.1 eV to 0.75 eV.
(56) A first embodiment is a heterocrystal consisting of a metal dichalcogenide having the formula ME.sub.2 in contact with Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3, wherein M is a Cr, Mo, or W and E is S, Se, or Te; provided that when ME.sub.2 is MoS.sub.2 then the metal dichalcogenide is in contact with Bi.sub.2Se.sub.3.
(57) The heterocrystals can be atomically thin (i.e., have an average thickness in the nano meter range). For example, the average thickness of the heterocrystals can be between 2 nm and 50 nm. More typically, the average thickness of the heterocrystals can be between 2 nm and 20 nm. Yet more typically the average thickness of the heterocrystals can be between 2 nm and 6 nm.
(58) The layers of metal dichalcogenide and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 are typically crystalline, which, as used herein, is meant to include that areas of the layers can be polycrystalline.
(59) The ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 can be characterized as having crystallographically incommensurate parent unit cells. As used herein, “crystallographically incommensurate” refers to crystal layers with significantly (i.e., more than 3%) different lattice parameters.
(60) The layers of ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 can be formed (e.g., grown with chemical vapor deposition) on a substrate or without a substrate (i.e., as a free standing film, following, for example, procedures analogues to the ones disclosed in Waduge et al. “Direct and Scalable Deposition of Atomically Thin Low-Noise MoS2 Membranes on Apertures”, ACS Nano, 2015, 9(7), pp 7352-7359).
(61) The substrate can be planar or nonplanar (e.g., curved). Suitable substrate surfaces that can provide planar surfaces include, but are not limited to, a quartz crystal surface, a surface of Si, a surface of a SiO.sub.2/Si substrate, a surface of graphene, a surface of graphite, or a surface of a Si.sub.3N.sub.4 membrane.
(62) The heterocrystals can be characterized by lattice matching. For example, the heterocrystal can be characterized by lattice matching between 4×4 unit cells of MoS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, lattice matching between 4×4 unit cells of WS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, or lattice matching between 5×5 unit cells of MoSe.sub.2 and 4×4 unit cells of Bi.sub.2Se.sub.3.
(63) It has been found that heterocrystals of the present invention are reconfigurable, that is, they, or areas/positions of the heterocrystal, can be configured in a first configuration with first properties (e.g., suppressed photoluminescence) and then changed into a second configuration with second properties (e.g., unsuppressed photoluminescence), as for example described in the below Examples Section.
(64) Reconfiguration can be achieved by disrupting the interface area in which the ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 contact. The disruption can be limited to selected positions, wherein the selected positions can encode bits of information or the positions form any desired pattern, for example, a pattern reflecting a photonic or optoelectronic circuit.
(65) The difference in photoluminescence between positions of suppressed photoluminescence and positions of unsuppressed photoluminescence is typically a difference that is reliably detectable with known detectors in the art. For example, the photoluminescence can be suppressed by at least 5%, at least 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% relative to the photoluminescence at the positions which are not suppressed.
(66) Positions or areas of the heterocrystal can have been exposed to a beam of electromagnetic waves or particles sufficient to reconfigure the heterocrystal in the positions or areas that have been exposed. For example, source of light with wavelength centered in the range of 200 nm to 1100 nm can be used. Suitable power densities can be in the range from 100 nW/μm.sup.2 to 1 mW/μm.sup.2. Suitable exposure time ranges are typically based on a particular desired application. For example, for an information storage device which is required to store information quickly (e.g., because it is meant to rewritable), shorter exposure times are required than for an information storage device which is meant to be premanufactured with information. With shorter exposure time typically higher power densities are required, and with longer exposure time typically lower power densities are required.
(67) Depending on the desired information density or required spatial resolution of patterns to be written in the heterocrystal, the spot size of the beam of electromagnetic waves or particles can be suitably adjusted. Spot sizes of below 100 μm, below, 10 μm, or below 1 μm can be used.
(68) Suitable sources of beams of electromagnetic waves include, but are not limited to, lasers and light emitting diodes. Suitable source of beams of particles, include but are not limited to, electron beam sources.
(69) In one embodiment of the heterocrystal of the first embodiment, E is S or Se. In one aspect of this embodiment, M is Mo or W. In a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the metal dichalcogenide is in contact with Bi.sub.2Se.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal consists of MoS.sub.2 in contact with Bi.sub.2Se.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises one tri-layer of ME.sub.2. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises at least one quintuple layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises between 1 and 25 quintuple layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises between 1 and 5 quintuple layers of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the average thickness of the heterocrystal is between about 2 nm and 20 nm. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the average thickness of the heterocrystal is between about 2 nm and 6 nm. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises a crystalline layer of ME.sub.2 in contact with a crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 are characterized by crystallographically incommensurate parent unit cells. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal comprises a crystalline layer of ME.sub.2 in contact with a crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3, wherein the crystalline layer of ME.sub.2 has an average thickness of about 1 nm and the crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 has an average thickness of about 1 nm to 5 nm. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 or Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 was grown on a nonplanar surface or a planar surface, or without a substrate. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 or Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 was grown on a the planar surface, wherein the planar surface is a quartz crystal surface, a surface of Si, a surface of a SiO.sub.2/Si substrate, a surface of graphene, a surface of graphite, or a surface of a Si.sub.3N.sub.4 membrane. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 was grown on the ME.sub.2, or the ME.sub.2 was grown on the Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 was grown on a planar surface using chemical vapor deposition and the Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 was grown on top of the ME.sub.2 using chemical vapor deposition, or the Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 was grown on a planar surface using chemical vapor deposition and the ME.sub.2 was grown on top of the Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 using chemical vapor deposition. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 is MoS.sub.2 characterized by a lattice spacing of 3.1622±0.0276 Å. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the Bi.sub.2Se.sub.3 is characterized by a lattice spacing of 4.1401±0.0223 Å. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal is characterized by lattice matching between 4×4 unit cells of MoS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, lattice matching between 4×4 unit cells of WS.sub.2 and 3×3 unit cells of Bi.sub.2Se.sub.3, or lattice matching between 5×5 unit cells of MoSe.sub.2 and 4×4 unit cells of Bi.sub.2Se.sub.3. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 provide a rotationally-aligned epitaxial stack. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the heterocrystal is a 2D-heterocrystal. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the ME.sub.2 and Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 have an interface area in which they contact, and the interface has been disrupted in selected positions to thereby reverse suppression of photoluminescence in these positions. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal exhibit unsuppressed photoluminescence whereas elsewhere the heterocrystal exhibits suppressed photoluminescence. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions, wherein the positions form a pattern encoding information. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal exhibit photoluminescence whereas elsewhere photoluminescence is suppressed by at least 90% relative to the photoluminescence at the positions. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence represent bits of information. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal with suppressed photoluminescence and positions with photoluminescence are part of a photonic circuit or optoelectronic circuit. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles sufficient to reconfigure the heterocrystal in the positions being exposed. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas with sub-micrometer spatial resolution. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of increased average height and root means square surface roughness relative to untreated areas. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of an average height increased by 0.35 to 0.45 nm. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas of randomly-oriented grains of Bi.sub.2Se.sub.3 that remain attached to a surface of ME.sub.2. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles to form exposed areas with photoluminescence recovered by at least 10% relative to untreated areas. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been exposed to a beam of electromagnetic waves or particles, wherein the the beam of electromagnetic waves or particles is a beam of laser light or an electron beam. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been light-treated by exposing the positions to light of a wavelength of 200 nm to 1100 nm focused onto a spot size below 10 μm with 100 nW/μm2 to 1 mW/μm2 intensity. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, positions of the heterocrystal have been light-treated by exposing the positions to light of a wavelength of about 488 nm focused onto a spot size below 1 μm with about 76 μW/μm.sup.2 intensity.
(70) Information Storage Devices, Optoelectronic Circuits and Photonic Crystals
(71) A second embodiment is an information storage device comprising a heterocrystal of the first embodiment or any embodiment or aspect of embodiment thereof described herein.
(72) In one embodiment of the information storage device of the second embodiment, the information storage device further comprises a source of a beam of electromagnetic waves or particles suitable for forming positions of suppressed photoluminescence. In an aspect of this embodiment, the information storage device further comprises a source of heat suitable for annealing the heterocrystal to reverse suppression of photoluminescence in positions of suppressed photoluminescence. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the information storage device further comprises a light detector suitable for distinguishing positions of suppressed photoluminescence from those of unsuppressed photoluminescence.
(73)
(74) A third embodiment is an optoelectronic circuit comprising a heterocrystal of the first embodiment or any embodiment or aspect of embodiment thereof described herein, in which at least part of the optoelectronic circuit has been formed by reconfiguring positions of the heterocrystal. In an aspect of this embodiment, the reconfiguring was performed using a method of reconfiguring of the sixth embodiment or an aspect thereof, as described below.
(75)
(76) A fourth embodiment is a photonic crystal comprising a heterocrystal of the first embodiment or any embodiment or aspect of embodiment thereof described herein, wherein the heterocrystal exhibits a photonic pattern which has been formed by reconfiguring positions of the heterocrystal. In an aspect of this embodiment, the reconfiguring was performed using a method of reconfiguring of the sixth embodiment or an aspect thereof, as described below.
(77)
(78) Methods of Forming a Heterocrystal
(79) A fifth embodiment is a method of forming a heterocrystal, comprising growing a crystalline layer of ME.sub.2 and growing a crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3, wherein M is a Cr, Mo, or W and E is S, Se, or Te.
(80) In one embodiment of the heterocrystal forming method of the fifth embodiment, the crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 is grown on top of a crystalline layer of ME.sub.2, or the crystalline layer of ME.sub.2 is grown on top of a crystalline layer of Bi.sub.2S.sub.3, Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3. In an aspect of this embodiment, the crystalline layers are grown by chemical vapor deposition. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the crystalline layer of ME.sub.2 is a single tri-layer and the crystalline layer of Bi.sub.2S.sub.3 or Bi.sub.2Se.sub.3 or Bi.sub.2Te.sub.3 has 1 to 25 quintuple-layers. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the method comprises growing a crystalline layer of ME2 to an average thickness of about 1 nm and growing a crystalline layer of Bi2S3, Bi2Se3 or Bi2Te3 to an average thickness of about 1 nm to about 20 nm.
(81) Methods of Reconfiguring Heterocrystals
(82) A sixth embodiment is a method of reconfiguring a heterocrystal, comprising providing a heterocrystal of the first embodiment or any embodiment or aspect of embodiment thereof described herein, and exposing positions of the heterocrystal to a beam of electromagnetic waves or particles sufficient to reconfigure the heterocrystal in the positions being exposed. In an aspect of this embodiment, the method comprises exposing the positions to light of a wavelength of 200 nm to 1100 nm focused onto a spot size below 10 μm with 100 nW/μm.sup.2 to 1 mW/μm.sup.2 intensity. In yet a further aspect of this embodiment or any of the foregoing aspects of this embodiment, the method comprises exposing the positions to light of a wavelength of about 488 nm focused onto a spot size below 1 μm with about 76 μW/μm.sup.2 intensity.
(83) A description of example embodiments follows.
EXAMPLES
2D Heterocrystals Obtained by Epitaxial Stacking of Crystallographically Incommensurate Bi.SUB.2.Se.SUB.3 .and MoS.SUB.2 .Atomic Layers
(84) 1 tri-layer (TL) MoS.sub.2 single crystals were first synthesized on various substrates, followed by depositing Bi.sub.2Se.sub.3 quintuple layers (QLs), both using CVD (A. Vargas, S. Basak, F. Z. Liu, B. K. Wang, E. Panaitescu, H. Lin, R. Markiewicz, A. Bansil, S. Kar, The changing colors of a quantum-confined topological insulator. ACS Nano 8, 1222-1230 (2014); I. Bilgin, F. Z. Liu, A. Vargas, A. Winchester, M. K. L. Man, M. Upmanyu, K. M. Dani, G. Gupta, S. Talapatra, A. D. Mohite, S. Kar, Chemical vapor deposition synthesized atomically thin molybdenum disulfide with optoelectronic-grade crystalline quality. ACS Nano 9, 8822-8832 (2015)). Monolayer (1TL) MoS.sub.2 has a very strong photoluminescence (PL) signature, and it was used as the starting crystal to grow 1- and few-QL Bi.sub.2Se.sub.3 layers on top of MoS.sub.2. Since the heterocrystal unit cell contains dissimilar number of MoS.sub.2 and Bi.sub.2Se.sub.3 unit cells, the present description refers to the corresponding layers as TL and QL (instead of Mo.sub.16S.sub.32 and Bi.sub.18Se.sub.27 etc.), respectively. By varying the synthesis conditions, it was possible to obtain samples whose overall thicknesses were those corresponding to 1TL⊕nQL, where nQL denotes the thickness equivalent of n-quintuple-layers of Bi.sub.2Se.sub.3.
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(90) The transmittance data also reveals a significant red-shift of transmittance spectral weight below the exciton energy values with increasing QLs. Although increased reflectance is evident (changing sample contrast in inset of images of
(91) The obtained DFT density of states (DoS) of 1TL MoS.sub.2 and representative heterocrystals are plotted in
(92) Reconfigurability
(93) It was discovered that application of a high-intensity laser spot on the heterocrystals results in nearly complete reversal of their optical properties.
(94) Using the sub-micrometer-resolution laser treatment 2D heterocrystal sheets with laser-patterned/written optical/electronic properties were prepared.
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(96) The crystallographic and optical modifications are even more dramatic when the laser treatment is performed on “suspended” heterocrystals. The Bi.sub.2Se.sub.3 as well as MoS.sub.2 layers appear to break down into smaller domains with a range of rotational orientations, resulting in ring-like patterns characteristic of polycrystalline samples, as seen in the SAED pattern in
(97) Variation of optical properties of the heterocrystals as a function of layer-thickness and laser-treatment revealed a number of interesting features. In pristine MoS.sub.2, the A and B excitons are both known to be localized at the valence-band peaks at the K and K′-points of the first Brillouin zone (D. Y. Qiu, F. H. da Jornada, S. G. Louie, Optical Spectrum of MoS.sub.2: Many-body effects and diversity of exciton states. Phys. Rev. Lett. 111, 216805 (2013)).
(98) As mentioned earlier, (
(99) Additionally, it was found that the PL quenching and recovery, when measured from the same spot of a heterocrystal can be partially repeated through annealing of the laser-treated samples as shown in
(100) Materials and Methods
(101) Growth of MoS2-Bi.sub.2Se.sub.3 Heterocrystals
(102) MoS.sub.2 substrates were grown using CVD. The growth setup consisted of 1 inch diameter quartz tubes in a horizontal tube furnace (Lindberg/Blue M). A quartz boat, containing a thin 3 mg MoO.sub.2 powder layer with SiO.sub.2/Si or polished quartz (MTI Corporation) substrates suspended over the powder with the growth side facing down, was placed in the hot center of the furnace. 150 mg sulfur powder was placed near the insulating edge of the furnace upstream. The setup was pumped down and purged with argon gas before being filled with an Ar atmosphere. Downstream was then opened to atmosphere in addition to a constant 200 sccm Ar flow. The furnace was heated at a rate of 50° C./min to 780° C., and then held there for 15-25 minutes. After the elapsed time, the furnace was opened and allowed to cool rapidly.
(103) Bi.sub.2Se.sub.3 growth was performed in an identical CVD setup. 50 mg of Bi.sub.2Se.sub.3 powder was placed in the hot center of the furnace. The MoS.sub.2 substrate was placed downstream 14-16 cm to a temperature range of 315° C. to 290° C., respectively. The system was pumped down to a base pressure of ˜10 mTorr before a 20 sccm Ar flow was introduced, raising the growth pressure to ˜350 mTorr. The furnace was heated at a rate of 50° C./min to 480° C., and then held there for 10-20 minutes depending on desired thickness. Once growth was completed, the furnace was opened and allowed to cool rapidly.
(104) Instrumentation
(105) Raman and PL spectra were measured using a Renishaw Raman microscope equipped with a 488 nm laser and 1800 l/mm grating. A 100× objective focused the laser to diffraction-limited spot size. TEM images and SAED patterns were collected from a JEOL 2010F operated at 200 kV. AFM images were taken from a NanoMagnetics Instrument Ambient AFM. Transmittance spectra of individual heterocrystals were measured by a custom-built UV/Vis absorption microspectrometer. Monochromatic light from a monochromator (200 nm-1000 nm) was focused by a 50× objective and chopped at 200 Hz. The power was attenuated below 10 μW to avoid additional effects. All Raman, PL, AFM and UV/Vis experiments were performed under ambient condition.
(106) DFT Computational Details
(107) The ab-initio calculations were performed using the pseudopotential projected augmented wave method (G. Kresse, D. Joubert, From ultrasoft pseudopotentials to the projector augmented-wave method. Phys. Rev. B 59, 1758-1775 (1999)) implemented in the Vienna ab initio simulation package (VASP) (G. Kresse, J. Furthmuller, Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set. Phys. Rev. B 54, 11169-11186 (1996); G. Kresse, J. Hafner, Ab-Initio molecular-dynamics for open-shell transition-metals. Phys. Rev. B 48, 13115-13118 (1993)) with an energy cutoff of 420 eV for the plane-wave basis set. Exchange-correlation effects were treated using the generalized gradient approximation (GGA) (J. P. Perdew, K. Burke, M. Ernzerhof, Generalized gradient approximation made simple. Phys. Rev. Lett. 77, 3865-3868 (1996)) and vdW corrections were included using the method of Grimme (DFT-D2) (S. Grimme, Semiempirical GGA-type density functional constructed with a long-range dispersion correction. J. Comput. Chem. 27, 1787-1799 (2006)), where a 7×7×1 F-centered k-point mesh was used to sample the Brillouin zone. The stacking spacing and band gap were further studied using the new SCAN meta-generalized gradient approximation scheme (SCAN meta-GGA) (J. W. Sun, A. Ruzsinszky, J. P. Perdew, Strongly constrained and appropriately normed semilocal density functional. Phys. Rev. Lett. 115, 036402 (2015)), and we found the same trends as with GGA-PBE. A large enough vacuum of 15 Å in the z-direction was used to ensure negligible interaction between the periodic images of the films. All the structures were relaxed using a conjugate gradient algorithm with the atomic force tolerance of 0.05 eV/Å and the total energy tolerance of 10−4 eV. The spin-orbit coupling effects were included in a self-consistent manner.
(108) Annealing Experiments on Heterocrystals
(109) The PL of the samples were first measured on as-grown heterocrystals. The samples were then laser treated for 90 seconds and the low-power PL was measured again. After the region where the laser treatment was performed was identified with respect to markers on the substrate, the samples were then annealed in pure argon (flowing at a rate of 2 ml/min) at 175° C. overnight. After annealing, low-power PL was measured at the same locations as before. The cycle was then repeated.
(110) 2D Heterocrystals Obtained by Epitaxial Stacking of Crystallographically Incommensurate Bi.sub.2Se.sub.3 and MoSe.sub.2 Atomic Layers
(111) Heterocrystals have been obtained by epitaxial stacking of crystallographically incommensurate Bi.sub.2Se.sub.3 and MoSe.sub.2 using methods analogues to the ones described above.
(112) The heterocrystals have been laser-treated and annealed following methods analogues to the ones described above. As can be seen in
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(114) 2D Heterocrystals Obtained by Epitaxial Stacking of Crystallographically Incommensurate Bi.sub.2Se.sub.3 and WS.sub.2 Atomic Layers
(115) Heterocrystals have been obtained by epitaxial stacking of crystallographically incommensurate Bi.sub.2Se.sub.3 and WS.sub.2 using methods analogues to the ones described above.
(116) The heterocrystals have been laser-treated and annealed following methods analogues to the ones described above. As can be seen in
(117) Laser-treating the heterocrystals causes the silicon raman peak (˜520 cm.sup.−1) to increase substantially, and very often the Bi.sub.2Se.sub.3 raman peaks (˜150 cm.sup.−1) will decrease and the TMD's raman peaks to increase after laser treatment. It is believed that the silicon raman peak is increasing because laser-treating causes the heterocrystals to become more translucent, which has been shown to be the case in the MoS.sub.2+Bi.sub.2Se.sub.3 heterocrystals (see above). Interestingly, annealing causes the silicon peak to decrease, and the Bi.sub.2Se.sub.3 peaks to increase, which provides evidence that annealing causes the heterocrystals to re-form.
(118) The relevant teachings of all patents, published applications and references cited herein are incorporated by reference in their entirety.
(119) While example embodiments have been particularly shown and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the embodiments encompassed by the appended claims.