AIR-CONDITIONED GARMENT HAVING SEMICONDUCTOR COOLING SYSTEM

Abstract

An air-conditioned garment having a semiconductor cooling system comprising a garment body and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprises a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module for generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module.

Claims

1. An air-conditioned garment having a semiconductor cooling system, comprising: a garment body, and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprising: a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module, wherein the cold air fan is capable of generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module, wherein the heat conduction module is attached to a second surface of the semiconductor cooling device, and the heat dissipation fan is fixedly arranged on the heat conduction module, wherein the heat dissipation fan is capable of generating a second directional airflow, wherein the first flow guide air cover guides the first directional airflow, wherein the second flow guide air cover covers the exterior of the heat dissipation fan, and wherein an inlet of the second flow guide air cover extends to the exterior of the garment body, wherein the second directional airflow flows out from the garment body after passing through the inlet, the outlet of the second flow guide air cover and the surface of the heat conduction module.

2. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the semiconductor cooling unit further comprising a power supply, a controller and control buttons.

3. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the cold air guide module and the heat conduction module are provided with a plurality of airflow channels, and the direction of the airflow channels is directed to the exterior of the garment body from the interior of the garment body, wherein the cold air fan is located on one side of the airflow channel of the cold air guide module facing the exterior of the garment body, and wherein the heat dissipation fan is located on one side of the airflow channel of the heat conduction module facing the interior of the garment body.

4. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the first flow guide air cover is fixedly arranged on an outer side of the airflow channel of the cold air guide module.

5. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the second flow guide air cover further comprising a flow guide plate fixedly arranged on an outer side of the airflow channel of the heat conduction module.

6. The air-conditioned garment having a semiconductor cooling system of claim 5, wherein the cold air guide module and the heat conduction module are heat dissipation fins.

7. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the heat dissipation fins are made of aluminum or copper.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1 is a conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.

[0016] FIG. 2 is another conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.

[0017] FIG. 3 is a conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.

[0018] FIG. 4 is another conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.

[0019] FIG. 5 is a conceptual diagram illustrating a top view of the internal structure of the semiconductor cooling unit of the present invention.

[0020] FIG. 6 is a conceptual diagram illustrating a mounting structure of the semiconductor cooling unit of the present invention.

DETAILED DESCRIPTION

[0021] To make the purpose, technical solution and benefits of the present invention clearer, detailed embodiments are combined hereinafter to clearly and completely describe the techniques of the present invention. Obviously, the described embodiments are merely a representative part but not all of the embodiments of the present invention. The specification of the present invention allows those skilled in the art to obtain other embodiments without paying creative labor, and thus all of which shall fall into the scope of the present invention.

[0022] In the description of the present invention, it should be understood that the orientations or positions indicated by the terms “upper” and “lower” are based on the orientations or positions shown in the figures. They are merely for the convenience of describing and simplifying the description of the present invention, but not indicating or implying that the equipment or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Thus, they cannot be understood as a limitation of the present invention.

[0023] In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as the indication or implication of relative importance or the implication of the number of indicated technical features.

[0024] An air-conditioned garment having a semiconductor cooling system comprises a garment body 8 and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body 8. The semiconductor cooling unit further comprises a semiconductor cooling device 1, a cold air guide module 2, a cold air fan 3, a heat conduction module 4, a heat dissipation fan 5, a first flow guide air cover 6 and a second flow guide air cover 7. The cold air guide module 2 is attached to a first surface 11 of the semiconductor cooling device, and the cold air fan 3 is fixedly arranged on the cold air guide module 2 for generating a first directional airflow. The first directional airflow enters the garment body 8 after passing through the exterior of the garment body 8 and the surface of the cold air guide module 2. The first directional airflow is cooled after flowing through the surface of the cold air guide module 2, and the cooled first directional airflow continues to enter the garment body 8 to cool the garment body, thereby making a user feel comfortable. The heat conduction module 4 is attached to a second surface 12 of the semiconductor cooling device, and the heat dissipation fan 5 is fixedly arranged on the heat conduction module 4 for generating a second directional airflow. The first flow guide air cover 6 guides the first directional airflow. The second flow guide air cover 7 covers the exterior of the heat dissipation fan 5, and the inlet of the second flow guide air cover 7 extends to the exterior of the garment body. The second directional airflow flows out from the garment body 8 after passing through the inlet 71 and the outlet 72 of the second flow guide air cover as well as the surface of the heat conduction module 4. Therefore, when the air passes through the surface of the heat conduction module 4, the heat of the heat conduction module 4 is absorbed and finally taken out from the garment body 8 such that the heat dissipation and cooling of the heat conduction module are achieved.

[0025] To achieve the control of the semiconductor cooling unit, in this embodiment, the air-conditioned garment of the present invention further comprises a power supply, a controller and control buttons. Through tapping the control buttons, various functions can be selected by the user. The power supply supplies power to the controller, and the controller controls the semiconductor cooling device 1, the cold air fan 3 and the heat dissipation fan 5 to operate coordinately. The semiconductor cooling device 1 is connected to the controller through a wire 13. To allow the user to move flexibly and conveniently when wearing the air-conditioned garment, preferably, the power supply is a rechargeable battery, and more preferably, the power supply is a lithium battery.

[0026] Further, preferably, the cold air guide module 2 and the heat conduction module 4 are provided with a plurality of airflow channels 21/41, and the direction of the airflow channels 21/41 is directed to the exterior of the garment body from the interior of the garment body. The cold air fan 3 is located on one side of the airflow channel 21 of the cold air guide module facing the exterior of the garment body, and the heat dissipation fan 5 is located on one side of the airflow channel 41 of the heat conduction module facing the interior of the garment body. Through adopting this arrangement, the airflow of the semiconductor cooling unit becomes more reasonable, the heat of the semiconductor cooling device is effectively dissipated, the cooling efficiency is significantly enhanced and the cooling effect of the air-conditioned garment is greatly improved.

[0027] In this embodiment, preferably, the first flow guide air cover 6 is fixedly arranged on the outer side of the airflow channel 21 of the cold air guide module, thus enabling the first directional airflow to sufficiently enter the garment body from the exterior of the garment body along the airflow channel 21 of the cold air guide module. In this way, the cooled first directional airflow is prevented from flowing towards the exterior of the garment body such that the utilization rate of the cooling capacity is enhanced and the cooling effect is improved. Additionally, the second flow guide air cover 7 further comprises a flow guide plate 73 fixedly arranged on the outer side of the airflow channel 41 of the heat conduction module. More preferably, the cold air guide module and the heat conduction module are heat dissipation fins, and the heat dissipation fins are made of aluminum or copper.

[0028] The above embodiments are merely preferred embodiments of the present invention, which do not limit the scope of the present invention. Therefore, all equivalent changes made according to the structure, shape and principle of the present invention shall fall into the scope of the present invention.