Abstract
A process for the production of a glass-plastic connection which is form-fitting, and to a form-fitting composite between glass and plastic which is obtainable by the process. The process and the glass-plastic composite are characterized in that a glass, which in particular is planar, neither during the process nor in the glass-plastic composite is subjected to a mechanical load which could lead to cracks, e.g. microcracks. Accordingly, in the composite, the glass is connected to a plastic in a stress-free manner The composite of glass with plastic is especially gas-proof and/or liquid-proof.
Claims
1. A process for the production of a glass-plastic composite comprising or consisting of the steps of 1. providing a glass substrate having spaced-apart recesses traversing through the glass substrate and having at least one undercut which is formed by the recesses widening within the glass substrate, 2. applying at least one solidifying plastic onto the glass substrate in the area of the recesses and introducing the plastic into the recesses, 3. solidifying the plastic.
2. The process according to claim 1, characterized in that the recesses within the glass substrate taper and adjacently widen.
3. The process according to claim 1, wherein the recesses within the glass substrate widen in the direction towards the surface of the glass substrate which lies opposite to the surface onto which the solidifying plastic is applied.
4. The process according to claim 1, wherein the glass substrate having recesses is provided by treating a glass substrate with laser pulses at the positions where recesses are to be generated, and subsequently etching the glass substrate.
5. The process according to claim 1, wherein the recesses traversing through the glass substrate are inclined toward one another, and in that different plastics are applied onto opposite surfaces of the glass substrate and are each introduced into the recesses.
6. The process according to claim 1 wherein the recesses traversing through the glass substrate are arranged such that one portion of the recesses tapers from a first surface of the glass substrate to its opposite second surface and another portion of the recesses tapers from the second surface of the glass substrate to its first surface, and in that different plastics are applied onto opposite surfaces of the glass substrate and are each introduced into the recesses.
7. The process according to claim 1, wherein the recesses are arranged at a spacing from one another which amounts to at least 10% up to the 20-fold of the diameter of the recess, measured in the plane of the surface of the glass substrate.
8. The process according to claim 1, wherein the solidifying plastic is a thermoplastic at a temperature above its softening or melting temperature, or is a mixture which can be cured to a thermoset.
9. The process according to claim 1, wherein the plastic forms a conduit, the cross-section of which is covered by the glass substrate, and the plastic circumferentially encloses an area of the glass substrate, wherein the glass substrate has traversing through-holes in its area that is enclosed by the plastic.
10. The process according to claim 9, wherein prior to the application of the plastic, traversing recesses are generated by irradiation with laser radiation and subsequent etching through the glass substrate in the area of the glass substrate which is circumferentially enclosed by the plastic forming the conduit.
11. The process according to claim 1, wherein at least two glass substrates are arranged with their recesses matching one another and plastic is arranged between the glass substrates, and the plastic is introduced into the recesses which are arranged matching one another.
12. The process according to claim 11, wherein the at least two glass substrates are arranged directly adjacent to one another when the plastic is introduced into the recesses which are arranged matching one another.
13. The process according to claim 11, wherein the at least two glass substrates are arranged at a distance from one another and are moved against one another, and while doing so the plastic is introduced into the recesses which are arranged matching one another.
14. The process according to claim 1, wherein prior to introducing the plastic into the recesses, glass frit, which has a lower softening temperature or melting temperature than the glass substrate, is introduced into at least one recess or into all recesses, and the glass substrate with the glass frit introduced into the at least one recess or into all recesses is heated to a temperature which is above the softening temperature or melting temperature of the glass frit and below the softening temperature or melting temperature of the glass substrate.
15. The process according to claim 1, wherein the plastic is introduced into the recess by heating, applying pressure onto the plastic against the glass substrate, applying negative pressure to the surface of the glass substrate which lies opposite to the one to which the plastic is applied, and/or applying ultrasound to the plastic.
16. A glass-plastic composite, obtainable by a process according to claim 1, wherein plastic is arranged solidified in recesses which are arranged traversing through a glass substrate and which widen inside the glass substrate to form at least one undercut.
17. The glass-plastic composite according to claim 16, wherein different plastics are arranged on the opposite surfaces of the glass substrate, which plastics are arranged in recesses of the glass substrate, wherein the recesses traversing through the glass substrate are arranged such that one portion of the recesses tapers from a first surface of the glass substrate to its opposite second surface and another portion of the recesses tapers from the second surface of the glass substrate to its first surface.
18. The glass-plastic composite according claim 16, wherein at least two glass substrates are arranged with their recesses matching one another and plastic is introduced into the recesses, which are arranged matching one another, and connects the glass substrates to one another.
19. The glass-plastic composite according claim 16, wherein the glass substrate along its circumference is encompassed by the plastic and the glass substrate has an area which is encompassed by the plastic and which is free of the plastic.
20. The glass-plastic composite according to claim 16, wherein the plastic forms a conduit or a wall having an opening, the cross-section of which opening is covered by the glass substrate, wherein the glass substrate with its area outside of the glass-plastic composite covers the clear cross-section of the conduit or of the opening and has traversing through-holes there.
21. The glass-plastic composite according to claim 20, wherein at least one organic coating having organic residues is bound in the traversing through-holes of the glass substrate which are arranged in the area outside of the glass-plastic composite.
22. Use of a glass-plastic composite according claim 16 in a process for analysis, in which a fluid which can contain an analyte is contacted with the glass substrate and the glass substrate has traversing recesses through the glass substrate outside of the area of the glass-plastic composite.
23. Use according to claim 22, wherein the recesses in the area outside of the glass-plastic composite on their inner surface have an organic coating with organic residues which can form a bond with an analyte.
Description
[0046] The figures show in
[0047] FIG. 1 a glass-plastic composite according to the invention,
[0048] FIG. 2 a process for producing a glass-plastic composite according to the invention,
[0049] FIGS. 3 A) and B) a process for producing a glass-plastic composite according to the invention,
[0050] FIG. 4 A) to C) a process for producing a glass-plastic composite according to the invention,
[0051] FIG. 5 a glass-plastic composite according to the invention,
[0052] FIG. 6 a glass-plastic composite according to the invention,
[0053] FIGS. 7 A) and B) a section through a glass-plastic composite according to the invention,
[0054] FIG. 8) a glass-plastic composite according to the invention,
[0055] FIG. 9 A) to C) a process for producing a glass-plastic composite according to the invention, in which the recess tapers from both opposite surfaces of the glass substrate to an undercut at a distance from both surfaces of the glass substrate,
[0056] FIG. 10 A) to C) a process for producing a glass-plastic composite according to the invention, in which the recess tapers from one surface of the glass substrate to the opposite surface and forms an undercut therein,
[0057] FIG. 11 A) to C) an embodiment of the process,
[0058] FIG. 12 A) to C) a further embodiment of the process,
[0059] FIG. 13 A) to D) a further embodiment of the process,
[0060] FIGS. 14 A) and B) an embodiment of the process, and
[0061] FIG. 15 A) to E) preferred processes for the production of recesses in glass substrates.
[0062] Generally, the glass-plastic composite obtainable by the process is also described by the process.
[0063] FIG. 1 shows a schematic cross-section through a glass substrate 1, into the cone-shaped traversing recesses of which a plastic 2 is introduced and produces a form-fitting connection.
[0064] Generally, the plastic 2 can optionally be introduced into traversing recesses in the glass substrate 1 by applying negative pressure, for example by covering the glass substrate 1 on the surface opposite to the surface onto which plastic 2 is applied, by means of a cover plate 3, and applying negative pressure ΔP, as shown schematically in FIG. 2.
[0065] FIG. 3A) schematically shows the connection of two glass substrates 1, each of which has recesses with undercuts in that the recesses widen conically, wherein the smaller cross-sections of the recesses 4 face one another and the larger cross-sections of the recesses 4, which are traversing, are arranged on the surfaces of the glass substrates 1 facing away from one another. By applying heat and pressure, or resp. by curing a thermosetting plastic, a form-fitting connection between the two glass substrates 1 is produced by the plastic 2 (FIG. 3B).
[0066] FIG. 4 schematically shows the production of a glass-plastic composite covering only one surface of a glass substrate 1. Therein, a glass substrate 1 (FIG. 4A) is brought into contact with the curable plastic on one surface, for example by immersing the glass substrate 1 in a liquid composition of the plastic, for example plastic dissolved in solvent (e.g. ABS in acetone), or in a curable starting mixture for a thermoset (FIG. 4B).
[0067] As shown in FIG. 4C, the plastic 2 forms a coating bonded to the glass substrate 1 by form- fitting, which coating extends into and through the conically widening recess.
[0068] FIG. 5 schematically shows a cross-section through a plastic edge that is made of plastic 2 attached to a glass substrate 1 having recesses with an undercut which is formed in that the recess is arranged to traverse through the thickness of the glass substrate 1 and, due to the preferred production process by irradiating with a laser pulse with subsequent etching, by the recess tapering conically from both surfaces to an area of smallest cross-section within the glass substrate 1.
[0069] FIG. 6 schematically shows a glass substrate 1 which has traversing recesses and which is connected to plastic 2 that forms a wall and has an opening which is covered by the glass substrate 1. Therein, the glass substrate 1 in an edge region is connected to plastic 2 by the glass-plastic composite and also has traversing recesses in the area outside the plastic 2, which area is enclosed by the plastic 2.
[0070] FIG. 7A shows a section through a glass substrate 1 in which through-holes 4 were created by the preferred process by laser pulses and subsequent etching, which through-holes 4 taper conically towards one another from both surfaces of the glass substrate 1 and form a position having the smallest cross-section as an undercut. This glass substrate 1 was moved with low pressure against a liquefied thermoplastic 2 which extended through the traversing recesses of the glass substrate 1, exited on the opposite surface of the glass substrate 1 and creates a form-fitting connection. FIG. 7B shows a section through two interconnected glass substrates 1, the recesses 4 of which have an area of smallest cross-section as an undercut within the recesses 4.
[0071] FIG. 8 shows a glass insert moulding according to the invention. Therein, the glass substrate 1 has recesses traversing through the glass substrate 1 in its circumferential area, and has an undercut which is formed in the recess within the glass substrate 1. The plastic 2 encompasses the glass substrate 1 along its circumferential area.
[0072] FIGS. 9 and 10 schematically show a glass substrate 1 with a recess 4 (in FIG. 9 a through-hole 4 having the smallest inner cross-section in the center of the glass substrate 1, in FIG. 10 a through-hole 4 whose funnel shape forms an undercut), into which recess 4 a plastic 2, which is applied onto the glass substrate 1, is pressed into it by means of heat and pressure F. Therein, a plastic 2 is applied onto the glass substrate 1 (FIG. 9A, FIG. 10A) onto one of its surfaces (FIG. 9B, FIG. 10B) and is introduced into the recess 4 by heat and pressure directed against the glass substrate 1 (FIG. 9C, FIG. 10C). The plastic 2 fills the recesses 4 each until behind the undercut which is formed within the recess 4.
[0073] FIGS. 11 to 14 schematically show embodiments of the invention. Onto a surface of the glass substrate 1 shown in FIG. 11A) or FIG. 12A), in which a traversing recess 4 is formed, a plastic 2 is applied (FIG. 11B, FIG. 12B) and (FIG. 11C) is introduced into the recess 4 by means of ultrasound and by pressure directed onto the plastic against the glass substrate 1, or (FIG. 12C) is introduced into the recess 4 by heating by means of radiation 10 and by pressure F directed against the glass substrate 1 in the direction of the plastic 2. Therein, FIG. 12C) schematically shows that the plastic 2 can be introduced into the recess 4 by a combination of pressure F and heating by radiation 10, e.g. laser radiation, the cone shape of which recess 4 forms the undercut within the recess 4.
[0074] FIG. 13 A) shows a glass substrate 1 with a traversing recess 4 having a cone-shaped cross-section. A plastic 2 is arranged against a surface of the glass substrate 1 (FIG. 13B) and is introduced into the recess 4 by means of heat, pressure directed onto the plastic against the glass substrate and additionally by negative pressure ΔP, which is applied to the surface of the glass substrate 1 which lies opposite to the plastic 2 (FIG. 13C). This negative pressure ΔP can be applied by a suction bell 11 which lies against the glass substrate 4 and which covers individual recesses (FIG. 13C), or by a suction bell 11 which covers at least two, preferably all, recesses 4 into which plastic 2 is introduced. Therein, the suction bell 11 can rest on areas of the glass substrate 1 that protrude beyond the areas between which the recesses 4 are arranged, into which recesses 4 plastic 2 is introduced, as schematically shown in FIG. 13 D).
[0075] FIG. 14 shows the connection of two different plastics 2A, 2B, between which a glass substrate 1 having a plurality of traversing recesses 4 is arranged, wherein a portion of the recesses 4 tapers from a first surface 1a of the glass substrate 1 to its opposite second surface 1b, and another portion tapers from the second surface 1b of the glass substrate to its first surface 1a.
[0076] Therein, the traversing and recesses 4, which are inclined against one another, can be cone-shaped or can be long recesses which are inclined towards one another and have a V-shaped cross-section.
[0077] FIG. 15 A) in sectional view shows a process for generating recesses 4 in a glass substrate 1 by irradiating an original glass substrate 1a with laser radiation L at the positions where recesses 4 are to be generated. The laser beam L, which is generally preferably a sequence of laser pulses, penetrates the glass substrate 1a up to a depth dependent on the focal position and generates a modification M therein. FIG. 15 B) in sectional view illustrates that the subsequent etching of the glass substrate 1a generates the recesses 4 in the glass substrate 1. Therein, the laser beam L can be irradiated onto the glass substrate 1 in the form of a point or a line. For generating recesses 4, a portion of which tapers from a first surface of the glass substrate 1 to its opposite second surface and another portion tapers from the second surface of the glass substrate to its first surface, an original glass substrate 1 can be irradiated on the first and on the second surface each with laser radiation L which penetrates the glass substrate only for a portion of the thickness, e.g. up to 70 or up to 80 or up to 90% of the thickness of the glass substrate, so that during the subsequent etching, the larger cross-section of the recesses is generated in the surface onto which the laser radiation was irradiated, and the smaller cross-section of the recesses is generated in the opposite surface of the glass substrate 1, which opposite surface was not irradiated through by the laser radiation. Especially by irradiating the laser beam L up to a small distance in front of or as far as through the opposite surface of the glass substrate 2, a traversing recess is generated during the subsequent etching. Therein, the laser radiation can be irradiated in form of a point in order to generate cone-shaped recesses.
[0078] FIGS. 15 C) to E) illustrate an alternative process for generating recesses 4, in which process an original glass substrate 1a is penetrated by laser radiation L through the cross-section of the glass substrate 1a and generates a modification M extending through the cross-section of the glass substrate 1. A surface of the glass substrate 1 is coated with etch resist R, e.g. lacquer or plastic film. During the subsequent etching, the glass substrate 1 is not attacked on the surface coated by etch resist R, so that the generated recess 4 extends into the glass substrate 1 from the surface that lies opposite to the etch resist R. Subsequently, the etch resist R is preferably removed.
