Component with a reflective housing and method for producing such a component

Abstract

In one embodiment, the component comprises a light reflective housing. The housing comprises a matrix material of a light-transmittive plastic and particles of a glass ceramic embedded therein. The particles comprise a mean diameter of at least 5 μm. The particles comprise a glass matrix and crystallites. A refractive index difference between the glass matrix and the crystallites is at least 0.5, and the crystallites exhibit a mean diameter between 20 nm and 0.5 μm, inclusive.

Claims

1. A component with a light-reflecting housing, wherein the housing comprises a matrix material of a light-transmissive plastic and particles of a glass ceramic embedded therein, the particles comprise a mean diameter of at least 5 μm, the particles comprise a glass matrix and crystallites a refractive index difference between the glass matrix and the crystallites is at least 0.5 at a temperature of 300 K and at a wavelength of 530 nm, and the crystallites have a mean diameter of between 20 nm and 0.5 μm inclusive.

2. The component according to claim 1, wherein the housing is white, the crystallites comprise or consist of at least one of the following materials: TiO.sub.2, ZrO.sub.2, TeO.sub.2, HfO.sub.2, ZnO, Ta.sub.2O.sub.5, Nb.sub.2O.sub.5, La.sub.2O.sub.3, V.sub.2O.sub.5, and the glass matrix comprises at least one of the following materials or consists of at least one of these materials: SiO.sub.2, Al.sub.2O.sub.3, CaO, BaO, MgO, Na.sub.2O, K.sub.2O, TeO.sub.2, GeO.sub.2, MnO.sub.2, Ag.sub.2O, Li.sub.2O, B.sub.2O.sub.3, Fe.sub.2O.sub.3, CuO, SrO, MoO.sub.3, As.sub.2O.sub.3, Y.sub.2O.sub.3, Yb.sub.2O.sub.3, Cr.sub.2O.sub.3, P.sub.2O.sub.5, Sb.sub.2O.sub.5.

3. The component according to claim 1, wherein at least a part of the crystallites is of ZrO.sub.2, wherein a mean diameter of these crystallites is at most 300 nm.

4. The component according to claim 1, wherein at least a part of the crystallites is of TiO.sub.2, wherein a mean diameter of these crystallites is at most 300 nm.

5. The component according to claim 1, wherein the matrix material is a silicone, an epoxy or a silicone-epoxy hybrid material, wherein a weight fraction of the particles on the housing is between 40% and 85% inclusive, and wherein a volume fraction of the particles on the housing is between 20% and 70%, inclusive.

6. The component according to claim 1, wherein a proportion of the crystallites to the particles is between 25% and 75% inclusive.

7. The component according to claim 1, wherein at least 75% of the particles comprise a diameter between 5 μm and 90 μm, inclusive, wherein at least 30% of the particles comprise a diameter of 30 μm or less, and at least 25% of the particles comprise a diameter of 30 μm or more.

8. The component according to claim 1, wherein a mean thickness of the housing in a direction perpendicular to a mounting side of the component is between three times and thirty times, inclusive, the mean diameter of the particles.

9. The component according to claim 1, further comprising at least one light emitting diode chip mounted in at least one recess of the housing, wherein the light emitting diode chip is configured to generate visible light and a reflectance of the housing for this light is at least 90%.

10. The component according to claim 9, further comprising at least one phosphor arranged downstream of the light emitting diode chip along an emission direction, wherein the phosphor is arranged spaced apart from the housing.

11. The component according to claim 9, wherein a total thickness of the housing with a tolerance of at most 10 μm is equal to a thickness of the light emitting diode chip together with the phosphor, wherein the phosphor and the light emitting diode chip are arranged stacked on top of each other.

12. The component according to claim 9, wherein the matrix material contacts the light emitting diode chip in places, wherein a light exit side of the light emitting diode chip is free of the matrix material and free of the particles.

13. The component according to claim 1, wherein a specific thermal conductivity of the particles is higher than a specific thermal conductivity of the matrix material by at least a factor of 10, wherein the particles are present percolated, so that thermal conduction paths are formed by the particles in the matrix material.

14. The component according to claim 1, in which, in addition to the particles made of the glass ceramic, at least one type of further particles is present in order to stabilize the housing mechanically and/or thermally and/or which are suitable for increasing a reflectivity of the housing, wherein the further particles are of a ceramic, of a glass, of a plastic and/or of a metal.

15. A method for producing components according to claim 1 comprising the steps: providing a glass and performing a temperature treatment of the glass so that a glass ceramic is formed, or alternatively directly generating and/or providing a glass ceramic so that the particles are formed or so that a raw material for the particles is formed; optionally generating the particles from the raw material in a separate step; adding the particles to the matrix material so that a molding mass is formed, and filling a mold with the molding mass by means of casting, injection and/or pressing, and curing to form the housing.

16. The method according to claim 15, further comprising the step of shaping the particles resulting from the raw material or from the glass ceramic into spherical or nearly spherical particles by means of comminution, rounding, temperature treatment and/or spray pyrolysis.

17. The method according to claim 15, wherein the glass is an aluminosilicate glass and comprises or is made exclusively from the following starting materials: SiO.sub.2 with a weight fraction between 15% and 70% inclusive, Al.sub.2O.sub.3 with a weight fraction between 2% and 30% inclusive, TiO.sub.2 with a weight fraction between 20% and 40% inclusive, ZrO.sub.2 with a weight fraction between 0.5% and 30%, and Alkali oxides and alkaline earth oxides with a total weight fraction of not more than 15%.

18. The method according to claim 15, wherein the temperature treatment of the glass to the glass ceramic is carried out at least temporarily at a temperature between 105% and 130% inclusive of a glass transition temperature of the glass, specified in K.

19. The method according to claim 15, wherein no further temperature treatment of a molten raw material is performed, so that directly the glass ceramic is produced from powdered starting materials, without an intermediate step via a glass.

Description

(1) In the following, a component described here and a method described here are explained in more detail with reference to the drawings using exemplary embodiments. Identical reference signs specify identical elements in the individual figures. However, no references to scale are shown; rather, individual elements may be shown in exaggerated size for better understanding.

(2) In the figures:

(3) FIG. 1 shows a schematic sectional view of a method step for treating a glass for the production of components described here,

(4) FIG. 2 shows a schematic sectional view of a method step for treating a glass ceramic for components described here,

(5) FIG. 3 shows a schematic sectional view of a method step for generating particles for components described here,

(6) FIG. 4 shows a schematic sectional view of a method step for generating particles for components described here,

(7) FIG. 5 shows a schematic sectional view of a method step for producing a molding mass for components described here,

(8) FIG. 6 shows a schematic sectional view of a method step for producing a housing for components described here, and

(9) FIGS. 7 to 12 show schematic sectional views of exemplary embodiments of components described herein.

(10) FIGS. 1 to 6 show a production process for components 1. The finished components 1 are preferably semiconductor devices such as light-emitting diodes, or LEDs for short.

(11) In FIG. 1 it is illustrated that a glass 51 is provided. The glass 51 is preferably an aluminosilicate glass. The starting material for the glass 51 is titanium dioxide in the highest possible weight fraction. For example, the weight fraction of titanium dioxide is around 30% when weighed in. Further constituents of the glass 1 are, with respect to the initial weight, preferably silicon dioxide with a weight fraction of about 30% as well as aluminum oxide, for example with a weight fraction of about 20% or about 10% or about 5%. Zirconium dioxide is used with a weight fraction with respect to the initial weight of approximately 10% or only 1%. The remaining components, which make up only a relatively small weight fraction of the starting materials, are formed by alkali oxides and by alkaline earth oxides.

(12) The glass 51 is produced in particular by mixing the starting materials together, wherein the starting materials may be in the form of fine granules or powders. Subsequently, a temperature treatment is carried out at a relatively high temperature, for example at a temperature of at least 1400 K and/or of at most 1800 K. Subsequently, cooling to the glass 51 takes place. A glass transition temperature of the finished glass 51 is, for example, around 1100 K.

(13) In the step of FIG. 2, it is illustrated that the glass ceramic 52 is obtained from the glass 51. For this purpose, the glass 51 of FIG. 1 is raised relatively rapidly to a temperature which is, for example, about 10% above the glass transition temperature of the glass 51. This results in the growth of crystallites 32 which remain in an amorphous glass matrix 31. The final glass ceramic 52 may be a glass ceramic frit or glass ceramic spheres previously formed from the melt by an alternative forming process, such as spray pyrolysis.

(14) According to the optional step of FIG. 3, left side, the glass ceramic 52 of FIG. 2 is comminuted. Thus, a plurality of particles 22 is obtained from the glass ceramic 52. The glass ceramic particles 22 comprise, for example, a mean diameter around 40 μm. Thereby, the glass ceramic particles 22 can exhibit a comparatively large distribution of diameters.

(15) In FIG. 3, right side, one of the glass ceramic particles 22 is shown in detail in a schematic sectional view. The particle 22 includes the glass matrix 31 as well as many of the crystallites 32 located within the glass matrix 32. The particle 22 may be approximately spherical in shape or may comprise a comparatively irregular outer surface. A diameter of the crystallites 32 is much smaller than a diameter of the particle 22.

(16) The crystallites 32 are present in a concentration as high as possible in the glass matrix. The crystallites 32 are as small as possible on average, for example with a mean diameter of at most 0.2 μm or of at most 0.5 μm. There is preferably a high refractive index difference between the glass matrix 31 and the crystallites 32, so that due to the crystallites 32 the particle 22 is highly reflective and preferably appears white. The crystallites 32 are preferably made of titanium dioxide as well as zirconium dioxide. Preferably, only one material is present per crystallite 32. In the case of TiO.sub.2, ZrO.sub.2 is particularly preferably additionally present as a nucleating agent if the material is produced by thermal crystal growth. However, titanium dioxide crystallites and zirconium dioxide crystallites can also be present mixed in the glass matrix 31 of the particle 22.

(17) The comminution, the result of which is shown in FIG. 3, does not typically result in spherical particles 22. Therefore, in the optional step of FIG. 4, it is shown that the comparatively irregularly shaped particles 22 obtained from the step of FIG. 3 are transformed into spherical or nearly spherical particles 22. Nearly spherical means, for example, that an aspect ratio of a length and a diameter of the particles 22 is between 0.7 and 2, inclusive, or between 0.75 and 1.25, inclusive, and/or that a surface roughness of the particles 22 is at most 20% or at most 5% of a mean diameter of the particles 22.

(18) Such a rounding of the particles 22 is possible, for example, by a temperature treatment, such as a short-time melting or fusing of the particles 22, or by etching. By such a rounding of the particles 22, an improved processability of a molding mass 53 with the particles 22 can be ensured, in particular in the step of FIG. 5.

(19) As an alternative to the step of FIG. 3 or to the steps of FIGS. 1 to 3, the glass 51 can already be produced in the desired shape or can be brought into the desired shape before the temperature treatment of the step of FIG. 2. For example, this is done by using plasma spray pyrolysis. That is, the comminution into the desired shape, for the production of the spherical structures of a certain size or a certain size distribution, is thus omitted.

(20) In the step of FIG. 5, it is illustrated that the glass ceramic particles 22 are mixed into a matrix material 21. The matrix material 21 is preferably a silicone or an epoxy. A weight fraction of the particles 22 in the material mixture forming a molding mass 53 is, for example, around 65%.

(21) Furthermore, it is shown in FIG. 5 that further particles 7 may be present, as is also possible in all other exemplary embodiments. The further particles 7 can be used to further adjust the mechanical, thermal and/or optical properties of the housing 2. Several different types of further particles 7 may be present. The further particles 7 may optionally be provided with a reflective coating. A mean diameter of the further particles 7 is preferably smaller than the mean diameter of the glass ceramic particles 22, but may alternatively be equal to or larger than the mean diameter of the glass ceramic particles 22.

(22) In the method step of FIG. 6, a mold 54 is provided, for example in two parts. The molding mass 53 is preferably filled into a cavity of the mold 54 in a heated state. After thermal curing or cooling, a housing 2 is formed in the cavity of the mold 54, not shown in FIG. 6.

(23) Deviating from the illustration in FIG. 6, the housing 2 can also be produced by casting. Furthermore, it is possible that a film assisted molding or injection molding is carried out, also referred to as FAM for short.

(24) FIG. 7 illustrates an example of a component 1 comprising such a housing 2. The housing 2 is composed of matrix material 21 and particles 22.

(25) Preferably, the housing comprises a recess 24. In the recess 24 a semiconductor chip, preferably a light emitting diode chip 41 is arranged. The light emitting diode chip 41 is composed of a substrate 43 and of a semiconductor layer sequence 44. The substrate 43 is, for example, a sapphire substrate. The semiconductor layer sequence 44 may be a layer sequence of AlInGaN materials. Deviating from the illustration of FIG. 7, it is possible that the semiconductor layer sequence 44 is located closer to the housing 2 than the substrate 43.

(26) Optionally, the recess 24 is filled with a potting 45. The potting 45 is preferably made of a transparent material such as a silicone. The potting 45 may optionally comprise at least one phosphor 42, which may be present in the form of dispersed or sedimented particles. For example, the potting 45 is lenticular in shape.

(27) FIG. 8 illustrates another exemplary embodiment of the component 1. Here, a first lead frame part 61 and a second lead frame part 62 are integrated in the housing 2. The light emitting diode chip 41 is mounted on the first lead frame part 61. An electrical connection to the second lead frame part 62 is achieved via a bonding wire 46.

(28) The lead frame parts 61, 62 may be located in a common plane in the housing 2, wherein the semiconductor chip 41 is mounted on this plane. Subsequently, the lead frame parts 61, 62 are guided out of the housing 2 and brought to a mounting side 10, for example via bending.

(29) The potting 45 and/or the phosphor 42 of FIG. 7 may also be present in the exemplary embodiment of FIG. 8.

(30) Such designs, as illustrated in FIGS. 7 and 8, are also referred to as prefabricated housing designs or premold components.

(31) The component 1 of FIG. 9 is a so-called QFN component, wherein QFN stands for Quad Flat No Leads. The light emitting diode chip 41 is deposited on a first metal part 61 and optionally electrically connected to a second metal part 62 via the bonding wire 46. The metal parts 61, 62 are preferably formed by flat metal plates, for example made of copper, which are preferably flush with the housing 2 at the mounting side 10.

(32) Optionally, the metal parts 61, 62 may comprise protrusions or structuring as seen in cross-section in order to achieve an improved mechanical connection between the housing 2 and the metal parts 61, 62.

(33) In the exemplary embodiment of FIG. 10, the light emitting diode chip 41 is mounted on a carrier 63. The carrier 63 is, for example, a printed circuit board such as a ceramic substrate provided with conductor tracks, or also a printed circuit board based on a plastic or a metal core board.

(34) It is possible that the semiconductor chip 41 is electrically contacted without bonding wires. For this purpose, electrical conductor tracks 64 can be guided from the carrier 63 via chip flanks to a light exit side of the light emitting diode chip 41 facing away from the carrier 63.

(35) Optionally, the phosphor 42 is located on the light exit side of the light emitting diode chip 41. The phosphor 42 is, for example, a silicone platelet or a ceramic platelet with at least one luminescent substance.

(36) The housing 2 is formed directly on side surfaces of the carrier 63, the light-emitting diode chip 41, and the phosphor 42. A thickness of the housing 2 is equal to the sum of the thicknesses of the carrier 63 together with the light emitting diode chip 41 and the phosphor 42, wherein any bonding agents such as adhesives or solders that do not significantly contribute to the thickness are neglected.

(37) In FIG. 11, it is shown that the carrier 63 of the component 1 extends completely over the lateral extent of the component 1. The light emitting diode chip 41 and the optional phosphor 42 are attached to an upper side of the carrier 63 and are surrounded laterally all around by the housing 2.

(38) An electrical contacting of the semiconductor chip 41 takes place, on the one hand, directly towards the carrier 63 and, on the other hand, via an electrical conductor track 64. The conductor track 64 runs on an upper side of the housing 2 facing away from the carrier 63. An electrical contacting of the conductor track 64 towards the carrier 63 is provided by an electrical through-connection 65.

(39) In the exemplary embodiment of component 1 of FIG. 12, it is shown that several of the light-emitting diode chips 41 are present, wherein in each case a phosphor 42 can optionally be present in addition. The housing 2 comprises a separate recess for each light emitting diode chip 41.

(40) The component 1 of FIG. 12 is free of an additional carrier. This means that electrical contacting of the light emitting diode chips 41 can take place directly via electrical contact pads 66 of the light emitting diode chips 41. Mechanical stabilization is achieved via the housing 2 itself. A thickness of the housing 2 is equal to a thickness of the light-emitting diode chips 41 together with the optional phosphor 42. This allows compact, thin components 1 to be realized.

(41) Optionally, side surfaces of the light emitting diode chip 41 are surrounded by a potting 45. The potting 45 is preferably transparent, for example made of a silicone. In the direction away from the mounting side 10, the potting 45 may widen as seen in cross-section.

(42) Unless otherwise indicated, the components shown in the figures preferably follow each other directly in the sequence indicated. Layers not touching in the figures are preferably spaced apart. Insofar as lines are drawn parallel to each other, the corresponding surfaces are preferably also aligned parallel to each other. Likewise, unless otherwise indicated, the relative positions of the drawn components to each other are correctly reproduced in the figures.

(43) The invention is not restricted to the exemplary embodiments by the description on the basis of said exemplary embodiments. Rather, the invention encompasses any new feature and also any combination of features, which in particular comprises any combination of features in the patent claims and any combination of features in the exemplary embodiments, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.

(44) This patent application claims priority to German patent application 10 2018 130 526.5, the disclosure content of which is hereby incorporated by reference.

REFERENCES

(45) 1 component

(46) 10 mounting side

(47) 2 housing

(48) 21 matrix material

(49) 222 particles

(50) 24 recess

(51) 31 glass matrix

(52) 32 crystallite

(53) 41 semiconductor chip/light emitting diode chip

(54) 42 phosphor

(55) 43 substrate

(56) 44 semiconductor layer sequence

(57) 45 potting

(58) 46 bonding wire

(59) 51 glass

(60) 52 glass ceramic

(61) 53 molding mass

(62) 54 mold

(63) 61 first lead frame part

(64) 62 second lead frame part

(65) 63 carrier

(66) 64 conductor track

(67) 65 through-connection

(68) 66 contact pad

(69) 7 further particles