Methods for electrodeposition

Abstract

Methods for electrodeposition using aqueous electrolytes where water molecules are depleted are described herein. Methods of electrodepositing superconducting thin films from aqueous electrolytes where water molecules are depleted are also described herein.

Claims

1. A method of electrodeposition, the method comprising: applying an electric potential to a working electrode, wherein the working electrode is in electrochemical contact with an aqueous electrolyte and the aqueous electrolyte is further in electrochemical contact with a counter electrode; wherein the aqueous electrolyte comprises a solvate, a salt, and water; wherein the solvate comprises an alkali metal salt, an alkaline earth metal salt, an organic compound, or a combination thereof; wherein a fully hydrated solution of the solvate in water has a first molar ratio of water to solvate; wherein the aqueous electrolyte has a second molar ratio of water to solvate, and the second molar ratio is less than the first molar ratio, such that the aqueous electrolyte has a decreased number of free water molecules than the corresponding fully hydrated solution of the solvate in water; wherein the salt comprises a metal, a metalloid, a nonmetal, or a combination thereof; wherein the solvate and the salt are different; and wherein the solvate has a lower reduction potential than the salt; thereby reducing at least a portion of the salt in the aqueous electrolyte and electrodepositing a layer comprising the metal, the metalloid, the nonmetal, or combination thereof; and wherein the method has a suppressed H.sup.+ reduction compared to the corresponding method performed using the fully hydrated solution of the solvate in water due to the decreased number of free water molecules in the aqueous electrolyte compared to the corresponding fully hydrated solution of the solvate in water.

2. The method of claim 1, wherein the solvate comprises an alkali metal salt comprising an alkali metal selected from the group consisting of lithium, sodium, potassium, rubidium, cesium, and combinations thereof.

3. The method of claim 1, wherein the solvate comprises an alkaline earth metal salt comprising an alkaline earth metal selected from the group consisting of magnesium, calcium, strontium, barium, and combinations thereof.

4. The method of claim 1, wherein the solvate comprises an organic compound comprising an element selected from the group consisting of sulfur, oxygen, nitrogen, phosphorous, other non-metallic elements, and combinations thereof.

5. The method of claim 1, wherein the solvate comprises an organic compound selected from the group consisting of choline, ammonia, an ammonium salt, imine, imide, fructose, glucose, sucrose, and combinations thereof.

6. The method of claim 1, wherein the solvate comprises ammonium acetate, ammonium chloride, ammonium formate, ammonium nitrate, ammonium thiocyanate, tetrabutylammonium chloride, tetrabutylammonium sulfate, cesium acetate, cesium chloride, cesium formate, calcium chloride, indium chloride, lithium acetate, lithium chloride (LiCl), lithium formate, lithium thiocyanate, lithium bis(trifluoromethane sulfonyl) imide (LiTFSI), potassium acetate, potassium chloride, potassium thiocyanate, sodium chloride, sodium formate, zinc chloride, choline chloride, fructose, glucose, mannose, sucrose, xylose, urea, thiourea, polyethyleneimine, polyethylene glycol, dioxime, dimethyl glyoxime, mercapto-propylsulfonate, saccharin, or a combination thereof.

7. The method of claim 1, wherein the concentration of the solvate is 5 moles per liter (M) or more.

8. The method of claim 1, wherein the metal, the metalloid, the nonmetal, or combination thereof comprising the salt is/are selected from the group consisting of Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and combinations thereof.

9. The method of claim 1, wherein the metal, the metalloid, the nonmetal, or combination thereof comprising the salt is/are selected from the group consisting Re, W, Ru, Pd, Zn, Fe, Co, Mn, Se, Ni, Ga, As, Cu, In, Sn, Si, Ge, and combinations thereof.

10. The method of claim 1, wherein the salt has a concentration in the aqueous electrolyte of from 0.001 M to 1 M.

11. The method of claim 1, wherein the electrodeposited layer comprises Re, Mn, Nb, Si, Ge, Ga, Mo, Ru, ReW, ReRu, ReMn, ReFe, ReCo, ReNi, ReMo, PdZn, RuFe, RuCo, RuNi, RuMo, FeMn, CoMn, NiFeMo, FeCoMn, FeCoSe, NiFeSe, GaAs, CulnGa, CuInGaSe, or combinations thereof.

12. The method of claim 1, wherein the electrodeposited layer has a lower amount of hydrogen incorporated therein, an improved morphology, an improved property, or a combination thereof compared to the corresponding electrodeposited layer resulting from the corresponding method performed using the fully hydrated solution of the solvate in water.

13. A sample comprising the electrodeposited layer made using the method of claim 12.

14. The sample of claim 13, wherein the electrodeposited layer exhibits superconductivity.

15. A method of use of the sample of claim 13, the method of use comprising using the sample as a coating, in an electronic device, in a microdevice, in an aerospace device, or a combination thereof.

16. The method of claim 1, wherein the aqueous electrolyte further comprises an additional solvent, wherein the additional solvent comprises ethanol, isopropanol, ethylene glycol, polyethylene glycol, glycerol, alkane diol, or combinations thereof.

17. The method of claim 1, wherein the applied electric potential is from −3 volts (V) to −0.2 V.

18. The method of claim 1, further comprising annealing the electrodeposited layer at a temperature of from 100° C. to 2000° C.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The accompanying figures, which are incorporated in and constitute a part of this specification, illustrate several aspects of the disclosure, and together with the description, serve to explain the principles of the disclosure.

(2) FIG. 1 shows the effect of LiCl concentration on the proton reduction current density in plain electrolytes with (red dotted line) 10, (blue dashed line) 5, and (green solid line) 1 M LiCl. Insets are the configurations of hydrated chloride anion and lithium cation in dilute electrolyte.

(3) FIG. 2 shows the effect of LiCl concentration on the proton reduction in a Re free acidic electrolyte with (red) 3 M, (blue) 5 M, and (green) 8 M LiCl.

(4) FIG. 3 is cyclic voltammograms on Pt rotating disk electrode at 1600 rpm with different cathodic potential boundaries for LiCl free traditional acidic Re electrolyte with potential corrected for ohmic drop in solution, and (inset) cyclic voltammograms down to −0.8 V and −1 V to show the start of Re deposition.

(5) FIG. 4 is cyclic voltammograms on Pt rotating disk electrode at 1600 rpm with different cathodic potential boundaries for Re electrolyte with 5 M LiCl with potential corrected for ohmic drop in solution.

(6) FIG. 5 is cyclic voltammograms on Pt rotating disk electrode at 400 rpm with different cathodic potential boundaries for Re electrolyte with 5 M LiCl with ohmic drop corrected.

(7) FIG. 6 shows the suppression of H.sup.+ reduction during electrodeposition of Re from an acidic (pH=2) Re electrolyte when the electrolyte included 5 M LiCl.

(8) FIG. 7a-FIG. 7d are top down SEM micrographs of the surface morphology of rhenium films deposited from LiCl free traditional Re electrolyte at (FIG. 7a) −100 mA/cm.sup.2, (FIG. 7b) −150 mA/cm.sup.2, (FIG. 7c) −200 mA/cm.sup.2, and (FIG. 7d) −250 mA/cm.sup.2.

(9) FIG. 8a-FIG. 8d are top down SEM micrographs of the surface morphology of rhenium films deposited from Re electrolyte with 5 M LiCl at (FIG. 8a) −1.0 V, (FIG. 8b) −1.1 V, (FIG. 8c) −1.2 V, and (FIG. 8d) −1.4 V.

(10) FIG. 9 is an X-ray diffraction spectrum, labeled “(a)”, of a rhenium film deposited from Re electrolyte with 5 M LiCl at −1.0 V, and XRD spectrum, labeled “(b)”, and (inset) top-down SEM image of the same rhenium film after vacuum annealing at 400° C. for 6 hours.

(11) FIG. 10 is an optical image of a rhenium film deposited from Re electrolyte with 5 M LiCl at −1.0 V on patterned Au strip.

(12) FIG. 11 is a cross sectional SEM image of a rhenium film deposited from Re electrolyte with 5 M LiCl at −1.0 V on patterned Au strip.

(13) FIG. 12 shows the dependence of resistance on temperature of the Re strip before and after annealing at 400 K for 30 minutes.

(14) FIG. 13 shows the suppression of H.sup.+ reduction during electrodeposition of Ni from an acidic (pH=4) Ni electrolyte when the electrolyte included 1 M LiCl or 5 M LiCl.

(15) FIG. 14 is a SEM image of a Ni film deposited from the electrolyte without LiCl.

(16) FIG. 15 is a SEM image of a Ni film deposited from the electrolyte including 5 M LiCl.

(17) FIG. 16 is a SEM image of a Ni film deposited from the electrolyte including 10 M LiCl.

(18) FIG. 17 shows the suppression of H.sup.+ reduction when the electrolyte comprises ZnCl.sub.2 with a concentration of 1 M or more.

(19) FIG. 18 shows the cyclic voltammogram of the Co electrolyte with 0.01 M CoSO.sub.4 and 5 M LiCl on Pt RDE at 400 rpm and 1600 rpm.

(20) FIG. 19 shows the cyclic voltammogram of the ReCo electrolyte with 0.01 M CoSO.sub.4 and 5 M LiCl on Pt RDE in comparison with the cyclic voltammogram of the Re electrolyte and Co electrolyte with the same concentration of NH.sub.4ReO.sub.4 or CoSO.sub.4.

(21) FIG. 20 shows the four-point resistance measurements along the strip with the temperature decreasing from 10 K to 1.8 K for pure Re and four different ReCo films.

(22) FIG. 21 shows the suppression of H.sup.+ reduction when the electrolyte comprises fructose with a concentration of 0.5 M or more.

DETAILED DESCRIPTION

(23) The methods described herein may be understood more readily by reference to the following detailed description of specific aspects of the disclosed subject matter and the Examples included therein.

(24) Before the present methods are disclosed and described, it is to be understood that the aspects described below are not limited to specific synthetic methods or specific reagents, as such may, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting.

(25) Also, throughout this specification, various publications are referenced. The disclosures of these publications in their entireties are hereby incorporated by reference into this application in order to more fully describe the state of the art to which the disclosed matter pertains. The references disclosed are also individually and specifically incorporated by reference herein for the material contained in them that is discussed in the sentence in which the reference is relied upon.

(26) In this specification and in the claims that follow, reference will be made to a number of terms, which shall be defined to have the following meanings:

(27) Throughout the description and claims of this specification the word “comprise” and other forms of the word, such as “comprising” and “comprises,” means including but not limited to, and is not intended to exclude, for example, other additives, components, integers, or steps.

(28) As used in the description and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a composition” includes mixtures of two or more such compositions, reference to “the compound” includes mixtures of two or more such compounds, reference to “an agent” includes mixture of two or more such agents, and the like.

(29) “Optional” or “optionally” means that the subsequently described event or circumstance can or cannot occur, and that the description includes instances where the event or circumstance occurs and instances where it does not.

(30) It is understood that throughout this specification the identifiers “first” and “second” are used solely to aid the reader in distinguishing the various components, features, or steps of the disclosed subject matter. The identifiers “first” and “second” are not intended to imply any particular order, amount, preference, or importance to the components or steps modified by these terms.

(31) Disclosed herein are methods of electrodeposition, the methods comprising applying an electric potential to a working electrode; wherein the working electrode is in electrochemical contact with an aqueous electrolyte and the aqueous electrolyte is further in electrochemical contact with a counter electrode; wherein the aqueous electrolyte comprises a solvate and a salt, wherein the salt comprises a metal, a metalloid, a nonmetal, or a combination thereof; and wherein the in method thereby reduces at least a portion of the salt in the aqueous electrolyte and electrodeposits a layer comprising the metal, the metalloid, the nonmetal, or combination thereof. In some examples, a reference electrode can further be in electrochemical contact with the aqueous electrolyte.

(32) The working electrode, the counter electrode, and/or the reference electrode can comprise any conducting and/or semiconducting material consistent with the methods described herein. Appropriate materials for working electrodes and counter electrodes are well known in the art.

(33) For example, the working electrode, the counter electrode, the reference electrode, or combination thereof can comprise(s) a transparent conducting oxide, a polymer, a carbon material, a metal, an alloy, a compound, a semiconductor, or a combination thereof. The metal can, for example, be selected from the group consisting of Be, Mg, Al, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Ba, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and combinations thereof. The semiconductor can, for example, be selected from the group consisting of Si, Ge, GaAs, InGaAs, InSb, GaSb, InP, GaN, InGaP, ZnO, ZnSe, CdTe, ZnTe, SbTe, CuZnSe, CulnSe, TaN, TiN, RuO, and combinations thereof. Examples of carbon materials include, but are not limited to, graphitic carbon and graphites, including pyrolytic graphite (e.g., highly ordered pyrolytic graphite (HOPG)) and isotropic graphite, amorphous carbon, carbon black, single- or multi-walled carbon nanotubes, graphene, glassy carbon, diamond-like carbon (DLC) or doped DLC, such as boron-doped diamond, pyrolyzed photoresist films, and others known in the art.

(34) The aqueous electrolyte comprises the solvate and the salt, wherein the solvate and the salt can be the same or different. The solvate comprises an alkali metal salt, an alkaline earth metal salt, a transition metal salt, an organic compound (e.g., an ammonium salt), or a combination thereof. The solvate has a lower reduction potential than the salt, when the solvate and the salt are different. In some examples, the solvate can comprise an alkali metal salt comprising an alkali metal selected from the group consisting of lithium, sodium, potassium, rubidium, cesium, and combinations thereof. In some examples, the solvate can comprise an alkaline earth metal salt comprising an alkaline earth metal selected from the group consisting of magnesium, calcium, strontium, barium, and combinations thereof. In some examples, the solvate can comprise a transition metal salt comprising a transition metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, Hg, and combinations thereof. In some examples, the solvate can comprise an organic compound comprising an element selected from the group consisting of sulfur, oxygen, nitrogen, phosphorous, other non-metallic elements, and combinations thereof. In some examples, the solvate can comprise an organic compound selected from the group consisting of choline, ammonia, an ammonium salt, an imine, an imide, fructose, glucose, sucrose, and combinations thereof. The solvate can, for example, comprise ammonium acetate, ammonium chloride, ammonium formate, ammonium nitrate, ammonium thiocyanate, tetrabutylammonium chloride, tetrabutylammonium sulfate, cesium acetate, cesium chloride, cesium formate, calcium chloride, indium chloride, lithium acetate, lithium chloride (LiCl), lithium formate, lithium thiocyanate, lithium bis(trifluoromethane sulfonyl) imide (LiTFSI), potassium acetate, potassium chloride, potassium thiocyanate, rubidium chloride, rubidium formate, sodium chloride, sodium formate, zinc chloride, choline chloride, fructose, glucose, mannose, sucrose, xylose, urea, thiourea, polyethyleneimine, polyethylene glycol, dioxime, dimethyl glyoxime, mercapto-propylsulfonate, saccharin, or a combination thereof.

(35) The solvate has a concentration in the aqueous electrolyte of 1 mole per liter (M) or more (e.g., 2 M or more, 3 M or more, 4 M or more, 5 M or more, 6 M or more, 7 M or more, 8 M or more, 9 M or more, or 10 M or more). The aqueous electrolyte can have a decreased number of free water molecules than the corresponding aqueous electrolyte where the concentration of the solvate is less than 1 M.

(36) The salt comprises a metal, metalloid, nonmetal, or combination thereof, wherein the metal, the metalloid, the nonmetal, or combination thereof is/are selected from the group consisting of Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and combinations thereof. In some examples, the metal, the metalloid, the nonmetal, or combination thereof comprising the salt is/are selected from the group consisting Re, W, Ru, Pd, Zn, Fe, Co, Mn, Se, Ni, Ga, As, Cu, In, Sn, Si, Ge, and combinations thereof.

(37) The salt can be the same or different than the solvate. The salt can, for example, have a concentration in the aqueous electrolyte of 0.001 M or more when the salt is different than the solvate (e.g., 0.005 M or more, 0.01 M or more, 0.05 M or more, 0.1 M or more, or 0.5 M or more). In some examples, the salt can have a concentration in the aqueous electrolyte of 1 M or less when the salt is different than the solvate (e.g., 0.5 M or less, 0.1 M or less, 0.05 M or less, 0.01 M or less, or 0.005 M or less). The concentration of the salt in the aqueous electrolyte when the salt is different than the solvate can range from any of the minimum values described above to any of the maximum values described above. For example, the salt can have a concentration in the aqueous electrolyte of from 0.001 M to 1 M when the salt is different than the solvate (e.g., from 0.001 M to 0.5 M, from 0.001 M to 0.1 M, from 0.001 M to 0.01 M, or from 0.005 M to 0.5 M).

(38) The aqueous electrolyte comprises water as a solvent. In some examples, the aqueous electrolyte can further comprise an additional solvent. The additional solvent can comprise any suitable solvent. For example, the additional solvent can comprise ethanol, isopropanol, ethylene glycol, polyethylene glycol, glycerol, alkane diol, and combinations thereof.

(39) The electrodeposited layer can, for example, comprise Re, Mn, Nb, Si, Ge, Ga, Mo, Ru, ReW, ReRu, ReMn, ReFe, ReCo, ReNi, ReMo, PdZn, RuFe, RuCo, RuNi, RuMo, FeMn, CoMn, NiFeMo, FeCoMn, FeCoSe, NiFeSe, GaAs, CulnGa, CuInGaSe, or combinations thereof. In some examples, the electrodeposited layer has a lower amount of hydrogen incorporated therein compared to the corresponding electrodeposited layer resulting from the corresponding method performed using the corresponding aqueous electrolyte where the concentration of the solvate is less than 1 M. The electrodeposited layer can, for example, have an improved morphology and/or an improved property compared to the corresponding electrodeposited layer resulting from the corresponding method performed using the corresponding aqueous electrolyte where the concentration of the solvate is less than 1 M.

(40) In some examples, the working electrode and the counter electrode can be electrically connected to a voltage source. The voltage source can be configured to apply an electric potential to the working electrode, the counter electrode, or a combination thereof so as to establish a voltage between the working electrode and the counter electrode. Suitable voltage sources are known in the art.

(41) The method can comprise applying an electric current with a current density and the applied electric current density can, for example, be −400 milliampere per square centimeter (mA/cm.sup.2) or more (e.g., −350 mA/cm.sup.2 or more, −300 mA/cm.sup.2 or more, −250 mA/cm.sup.2 or more, −200 mA/cm.sup.2 or more, −150 mA/cm.sup.2 or more, −100 mA/cm.sup.2 or more, −50 mA/cm.sup.2 or more, −40 mA/cm.sup.2 or more, −30 mA/cm.sup.2 or more, or −20 mA/cm.sup.2 or more). In some examples, the applied electric current density can be −5 mA/cm.sup.2 or less (e.g., −10 mA/cm.sup.2 or less, −20 mA/cm.sup.2 or less, −30 mA/cm.sup.2 or less, −40 mA/cm.sup.2 or less, −50 mA/cm.sup.2 or less, −100 mA/cm.sup.2 or less, −150 mA/cm.sup.2 or less, −200 mA/cm.sup.2 or less, −250 mA/cm.sup.2 or less, or −300 mA/cm.sup.2 or less).

(42) The applied electric current density can range from any of the minimum values described above to any of the maximum values described above. For example, the applied electric current density can range from −400 mA/cm.sup.2 to −5 mA/cm.sup.2 (e.g., from −300 mA/cm.sup.2 to −5 mA/cm.sup.2, from −200 mA/cm.sup.2 to −5 mA/cm.sup.2, from −100 mA/cm.sup.2 to −10 mA/cm.sup.2, or from −50 mA/cm.sup.2 to −20 mA/cm.sup.2).

(43) The applied electric potential can, for example, be −3 volts (V) or more (e.g., −2.5 V or more, −2 V or more, −1.5 V or more, −1 V or more, −0.9 V or more, −0.8 V or more, −0.7 V or more, −0.6 V or more, −0.5 V or more, or −0.4 V or more). In some examples, the applied electric potential can be −0.2 V or less (e.g., −0.3 V or less, −0.4 V or less, −0.5 V or less, −0.6 V or less, −0.7 V or less, −0.8 V or less, −0.9 V or less, −1 V or less, −1.5 V or less, or −2 V or less). The applied electric potential can range from any of the minimum values described above to any of the maximum values described above. For example, the applied electric potential can be from −3 volts (V) to −0.2 V (e.g., from −3 or more, to −0.5 V, from −2 V to −0.5 V, or from −1.5 to −0.8 V).

(44) In some examples, the applied electric potential is measured against a reference electrode, such as a standard hydrogen electrode (SHE), saturated calomel electrode (SCE), silver-silver chloride electrode, a platinum strip, or a copper strip. Any suitable reference electrode compatible with the systems and methods described herein can be used. Suitable reference electrodes are known in the art.

(45) In some examples, the method can have an improved power consumption compared to the corresponding method performed using the corresponding aqueous electrolyte where the concentration of the solvate is less than 1 M. In some examples, the method can have a suppressed H.sup.+ reduction compared to the corresponding method performed using the corresponding aqueous electrolyte where the concentration of the solvate is less than 1 M.

(46) In some examples, the methods can further comprise annealing the electrodeposited layer. For example, the electrodeposited layer can be annealed at a temperature of 100° C. or more (e.g., 150° C. or more, 200° C. or more, 250° C. or more, 300° C. or more, 350° C. or more, 400° C. or more, 450° C. or more, 500° C. or more, 600° C. or more, 700° C. or more, 800° C. or more, 900° C. or more, 1000° C. or more, 1100° C. or more, 1200° C. or more, 1300° C. or more, 1400° C. or more, 1500° C. or more, 1600° C. or more, 1700° C. or more, or 1800° C. or more). In some examples, the electrodeposited layer can be annealed at a temperature of 2000° C. or less (e.g., 1900° C. or less, 1800° C. or less, 1700° C. or less, 1600° C. or less, 1500° C. or less, 1400° C. or less, 1300° C. or less, 1200° C. or less, 1100° C. or less, 1000° C. or less, 900° C. or less, 800° C. or less, 700° C. or less, 600° C. or less, 500° C. or less, 450° C. or less, 400° C. or less, 350° C. or less, 300° C. or less, 250° C. or less, or 200° C. or less). The temperature at which the electrodeposited layer is annealed can range from any of the minimum values described above to any of the maximum values described above. For example, the electrodeposited layer can be annealed at a temperature of from 100° C. to 2000° C. (e.g., from 100° C. to 1000° C., from 1000° C. to 2000° C., from 100° C. to 500° C., from 500° C. to 1000° C., from 1000° C. to 1500° C., from 1500° C. to 2000° C., from 250° C. to 2000° C., from 100° C. to 1800° C., or from 250° C. to 1800° C.).

(47) Also described herein are samples comprising electrodeposited layers made using any of the methods described herein. Also described herein are methods of use of the samples described herein. For examples, the samples comprising the electrodeposited layers can be used as a coating, in an electronic device, in a microdevice, in an aerospace device, or a combination thereof.

(48) A number of embodiments of the invention have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims.

(49) The examples below are intended to further illustrate certain aspects of the methods and compounds described herein, and are not intended to limit the scope of the claims.

EXAMPLES

(50) The following examples are set forth below to illustrate the methods and results according to the disclosed subject matter. These examples are not intended to be inclusive of all aspects of the subject matter disclosed herein, but rather to illustrate representative methods, compositions, and results. These examples are not intended to exclude equivalents and variations of the present invention, which are apparent to one skilled in the art.

(51) Efforts have been made to ensure accuracy with respect to numbers (e.g., amounts, temperature, etc.) but some errors and deviations should be accounted for. Unless indicated otherwise, parts are parts by weight, temperature is in ° C. or is at ambient temperature, and pressure is at or near atmospheric. There are numerous variations and combinations of reaction conditions, e.g., component concentrations, temperatures, pressures, and other reaction ranges and conditions that can be used to optimize the product purity and yield obtained from the described process. Only reasonable and routine experimentation will be required to optimize such process conditions.

Example 1

(52) LiCl Electrolyte

(53) An example lithium chloride (LiCl) electrolyte is described in this example, where the electrolyte comprises LiCl in a concentration of from 0 M to 10 M. FIG. 1 shows the effects of high concentration of LiCl on the proton reduction reaction rate in this electrolyte on Pt rotating disk electrodes (RDE) at 400 revolutions per minute (rpm). As the LiCl concentration increased from 1 M to 5 M to 10 M, the maximum proton reduction current decreased from −0.37 mA/cm.sup.2 to −0.12 mA/cm.sup.2 to −0.014 mA/cm.sup.2, by 3 and 26 times, respectively.

(54) In fully hydrated electrolytes with excessive water, the inner hydration layer comprises four water molecules in a tetrahedron configuration for a lithium cation and six water molecules in an octahedron configuration for a chloride anion. Every mole of LiCl would consume 10 moles water molecules to form the inner hydration layer, or to become fully hydrated. The 5 M and 10 M LiCl electrolytes have a water concentration of about 48 M and 36 M, or a H.sub.2O/LiCl ratio of 9.6 and 3.6, respectively. Therefore, the ions and water molecules in these electrolytes are expected to behave significantly differently from dilute electrolytes.

Example 2

(55) LiCl Electrolyte

(56) An example metal-free electrolyte comprising 0.1 M sulfuric acid (H.sub.2SO.sub.4) and various concentrations of LiCl (from 0 M to 10 M) is described herein. FIG. 2 shows the effect of high concentration of LiCl on the proton reduction reaction rate in this electrolyte on Pt RDE at 1600 rpm. As the LiCl concentration increased from 3 M to 5 M to 8 M, the maximum proton reduction current decreased from −280 mA/cm.sup.2 to −200 mA/cm.sup.2 to −130 mA/cm.sup.2, e.g., by 1.4 and 2.2 times, respectively. The electrolyte with no LiCl ([LiCl]=0 M) did not show a maximum proton reduction current.

Example 3

(57) Re Electrolyte

(58) An example electrolyte comprising 0.025 M ammonia perrhenate (NH.sub.4ReO.sub.4), 0.1 M H.sub.2SO.sub.4, and LiCl of varying concentration from 0 M to 10 M is described herein. While LiCl has a solubility of 11.5 M at room temperature, a Re electrolyte with 7 M LiCl was opaque. Cyclic voltammetry (CV) was performed on a Pt rotating disk electrode at 1600 rpm for rhenium electrolytes with 0 M and 5 M LiCl, both of which were colorless and transparent.

(59) FIG. 3 shows the cyclic voltammogram of a Re electrolyte with 0 M LiCl on Pt RDE at 1600 rpm after ohmic correction for the voltage. It can be seen from FIG. 3 that the potential did not reach much below −0.6 V even when a potential of −2 V was applied. Due to this narrow range of potential, Re films were prepared using galvanostatic deposition at current densities from −100 mA/cm.sup.2 to −250 mA/cm.sup.2. The current efficiencies calculated from the film thickness and deposition time were all below 2%. No significant change was observed in the Re deposition rates between the films. The hydrogen evolution reaction contributed to the majority of current and no limiting current was observed at the conditions studied.

(60) FIG. 4 shows the cyclic voltammogram of the Re electrolyte with 5 M LiCl on Pt RDE at 1600 rpm after ohmic correction for the voltage; a current plateau of about −200 mA/cm.sup.2 was observed. The actual applied potential after ohmic drop correction reached beyond the case without LiCl. A sharp increase of current density was observed at about −1.7 V, or −1.4 V after ohmic correction, due to the reduction of water. Re films can be deposited from this electrolyte at a potential between −0.6 V and −2 V, or at a current density between −150 mA/cm.sup.2 and −300 mA/cm.sup.2.

(61) FIG. 5 shows the cyclic voltammogram of the Re electrolyte with 5 M LiCl on Pt RDE at 400 rpm after ohmic correction for the voltage; a current plateau of about −100 mA/cm.sup.2 was observed. Decreasing the rotation rate to 400 (¼ of 1600) rpm resulted in a halved current plateau, indicative of a mass transport limiting current. A sharp increase of current density was observed at about −1.7 V, or −1.4 V after ohmic correction, due to the reduction of water. Re films can be deposited from this electrolyte at a potential between −0.6 V and −2 V, or at a current density between −80 mA/cm.sup.2 and −300 mA/cm.sup.2.

(62) FIG. 6 shows a comparison of the cyclic voltammograms of Re electrolytes with 0 M LiCl at 1600 rpm, 5 M LiCl at 1600 rpm, and 5 M LiCl at 400 rpm. Suppression of H.sup.+ reduction during electrodeposition of Re from an acidic (pH=2) Re electrolyte was observed when the electrolyte included 5 M LiCl (FIG. 6).

(63) Highly stressed films are often obtained along with a rapid hydrogen evolution and incorporation during electrodeposition. The morphology of rhenium films deposited on Cu rotating disk electrodes from the two different electrolytes were examined with SEM. FIG. 7a-FIG. 7d shows the morphology of films deposited from the traditional acidic LiCl-free electrolyte at a DC current density from −100 mA/cm.sup.2 to −250 mA/cm.sup.2. Cracks were observed on all films regardless of the current density used. In addition, pin holes were also observed, resulting from the hydrogen bubble blocking the electrode surface. Small nodules below 1 micron in size were also observed. On the other hand, FIG. 8a-FIG. 8d presents the SEM images of four films deposited from the water-in-salt Re electrolyte with 5 M LiCl at different DC potentials between −1 V and −1.4 V. Potential control was used in this case because a current plateau is present in the cyclic voltammetry. In other words, the deposition current was approximately the same under the limiting current condition regardless of the applied potential and, therefore, potential control is necessary. No film cracks were observed. A flaky film delaminated from the copper substrate was obtained at −1.4 V, which can relate to the further reduction of Re into a rhenide anion. A continuous smooth film with nanometric nodules was obtained at −1.2 V. Extremely smooth continuous films were obtained at −1 V and −1.1 V. As shown in the insets, crystal-like features of a few microns in size and sub-micron sized flower shaped features were observed sporadically.

(64) The crystallinity of the electrodeposited Re films were characterized with X-ray diffraction. FIG. 9 shows the spectrum (labeled “(a)”) of the same film in FIG. 8a deposited at −1 V. Only two broad peaks at 20 of 47.8° and 88.8° were observed in the spectrum, suggesting an amorphous or nanocrystalline film. Such amorphous or nanocrystalline characteristics were observed for all the as deposited films regardless of the electrolytes, potentials, or currents used for deposition. Polycrystalline Re films were obtained upon a high temperature annealing at 600° C. for 5 hours for all the electrodeposited films. As shown in FIG. 9, spectrum (b), all the XRD peaks can be assigned to metallic Re.

(65) Si coupons with Au strip patterns were used to deposit Re for superconductivity measurements. Such substrates were fabricated on Si wafers with 50 nm thermal SiO.sub.2, a layer of 10 nm Ti and 100 nm Au. The Si coupon was mounted on a holder rotating in the same way as rotating disk electrode at 400 rpm. Electrical connections were made through a front pin contact to the pad.

(66) Re films were electrodeposited on silicon substrates patterned with 1 mm wide Au strips. FIG. 10 and FIG. 11 show the optical image and cross section SEM, respectively, of a Re strip deposited from a Re electrolyte with 5 M LiCl at −1 V. The as deposited Re is a smooth, shiny, gray colored strip with a thickness of 318 nm. Four point-contacts were made along the strip with aluminum wire bonding and the resistivity was measured as the temperature decreased from 8 K to 4 K. As shown in FIG. 12, the resistance suddenly drops to 0 ohm at a T.sub.c between 5.95 K to 6.05 K. The same measurements were repeated after annealing at 400 K for 30 minutes and no change was observed in T.sub.c. The same measurements were repeated after further annealing at 400 K for 1200 minutes and still no change was observed in T.sub.c. While a small increase of T.sub.c was also reported for evaporated Re as the film thickness increased due to the buildup of film stress, this increase diminishes and T.sub.c falls back toward the intrinsic value of 1.7 K upon room temperature aging. Such a decrease of T.sub.c was also observed for Re films electrodeposited from traditional Re electrolytes with 0 M LiCl upon 400 K annealing. While the exact cause for the improvement in the T.sub.c stability is yet to be understood, different film stress and hydrogen incorporation resulted from the use of water-in-salt electrolyte can be involved. This can be related to the suppressed proton reduction and hydrogen incorporation, presence of a large amount of LiCl in the electrolyte and incorporation of chloride compound as an impurity, more negative potential achieved and incorporation of rhenide anion in the film, or a different film stress.

Example 4

(67) Ni Electrolyte

(68) Example electrolyte solutions comprising 0.01 M nickel sulfate (NiSO.sub.4), 0.01 M H.sub.2SO.sub.4, 0.3 M boric acid (H.sub.3BO.sub.3), and LiCl with concentration varying from 0 M to 10 M is described herein. Suppression of H.sup.+ reduction during electrodeposition of Ni the electrolyte was observed when the electrolyte included 1 M LiCl or 5 M LiCl (FIG. 13). FIG. 14-FIG. 16 show the morphology of the Ni film deposited from the Ni electrolyte as the concentration of LiCl increased from 0 M to 5 M to 10 M.

Example 5

(69) Zn Electrolyte

(70) Example electrolyte solutions comprising 0.01 M H.sub.2SO.sub.4 and varying concentrations of zinc chloride (ZnCl.sub.2) from 0.1 M to 10 M are described herein. In this example, the solvate and the salt are the same species (e.g., ZnCl.sub.2). FIG. 17 shows the suppression of H.sup.+ reduction during electrodeposition of Zn from the Zn electrolyte as the ZnCl.sub.2 concentration increased from 0.1 M to 1 M to 5 M to 10 M.

Example 6

(71) Co Electrolyte

(72) Example electrolyte solutions comprising 0.1 M H.sub.2SO.sub.4, varying concentrations of CoSO.sub.4 from 0.001 to 0.1 M, and varying concentrations of LiCl from 1 M to 10 M are described herein. FIG. 18 shows the cyclic voltammogram of the Co electrolyte with 0.01 M CoSO.sub.4 and 5 M LiCl on Pt RDE. Suppressed maximum proton reduction current at −100 mA/cm.sup.2 and −200 mA/cm.sup.2 were observed at 400 and 1600 rpm, respectively, with 5 M LiCl. Metallic Co films were obtained from this electrolyte. A shift of the starting potential of proton reduction from −0.24 V to −0.75 V was observed sur to the change of electrode surface properties from Pt to Co.

Example 7

(73) ReCo Electrolyte

(74) Example electrolyte solutions comprising 0.1 H.sub.2SO.sub.4, 0.025 M NH.sub.4ReO.sub.4, varying concentrations of CoSO.sub.4 from 0.001 to 0.01 M, and varying concentrations of LiCl from 1 M to 10 M are described herein. FIG. 19 shows the cyclic voltammogram of the ReCo electrolyte with 0.01 M CoSO.sub.4 and 5 M LiCl on Pt RDE in comparison with the cyclic voltammogram of the Re electrolyte and Co electrolyte with the same concentration of NH.sub.4ReO.sub.4 or CoSO.sub.4. The same suppressed maximum proton reduction current at −100 mA/cm.sup.2 was observed at 400 rpm with 5 M LiCl. A synergistic interaction between Re and Co resulting in a faster metal deposition rate was observed as the anodic stripping peak in the ReCo electrolyte was much bigger than the sum of the two stripping peaks in the Re electrolyte and Co electrolyte. ReCo films with compositions of from 1% to 80% Co, preferably 3% to 30% Co can be deposited from these electrolytes. ReCo films were electrodeposited on silicon substrates with 1 mm wide Au strips. FIG. 20 shows the four-point resistance measurements along the strip with the temperature decreasing from 10 K to 1.8 K for pure Re and four different ReCo films. Superconductivity critical temperatures were found to depend on the alloy composition.

Example 8

(75) Fe and ReFe Electrolytes

(76) Example electrolyte solutions comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, and 0.001 to 0.1 M FeSO.sub.4 can be used to deposit pure Fe films, using the rotation rates, current densities, and other conditions described in previous examples.

(77) Example electrolyte solutions comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, 0.025 M NH.sub.4ReO.sub.4, and 0.001 to 0.5 M FeSO.sub.4 can be used to deposit ReFe films using the rotation rates, current densities, and other conditions described in previous examples. The alloy compositions vary from 2% Fe to 80% Fe.

Example 9

(78) Re Electrolytes Containing Organic Additives

(79) Example electrolyte solutions comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, 0.025 M NH.sub.4ReO.sub.4, and 0 to 200 ppm thiourea can be used to deposit pure Re films with sulfur inclusion. Electrolytes comprising other organic molecules that comprise elements such as sulfur, oxygen, nitrogen, phosphorus, and other non-metallic elements can be used to deposit pure Re or Re alloys with the incorporation of these elements. The organic molecules include tetrabutylammonium chloride, tetraethylammonium sulfate, choline chloride, polyethyleneimine, polyethylene glycol, dioxime, dimethyl glyoxime, mercapto-propylsulfonate, saccharin, thiourea.

Example 10

(80) Fructose Electrolyte

(81) Example electrolyte solutions comprising 0.01 M sulfuric acid (H.sub.2SO.sub.4), 1 M LiCl, and varying concentrations of fructose from 0 M to 4 M are described herein. FIG. 21 shows the suppression of H.sup.+ reduction from the fructose electrolyte as the fructose concentration increased from 0 M to 4 M.

Example 11

(82) This disclosure relates to methods where an electrolyte with a high concentration of a solvate is used. Such solvates include 1) salts of alkali metals salts such lithium, sodium, potassium, rubidium, cesium; 2) salts of alkaline earth metals such as magnesium, calcium, strontium, barium; and/or 3) organic compounds such as choline, ammonia, imine, imide, fructose, glucose, sucrose. The concentration of these solvates are higher than 1 M, preferably higher than 2 M, more preferably higher than 5 M, even more preferably higher than 10 M.

(83) The hydration of a high concentration of the solvate decreases the amount of free water molecules in the electrolyte by restricting water molecules around the solvate molecules. Therefore, while the solution retains many of the advantages of aqueous solutions for electroplating, the scarcity of free water molecules suppresses the hydrogen evolution reaction. This helps to 1) improve the power consumption, 2) decrease the hydrogen incorporation in the deposited materials, 3) improve the morphology of materials, 4) improve the control of properties of materials.

(84) For example, the methods described herein can be used to electroplate Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and combinations thereof, including alloys and compounds thereof. One embodiment can be electroplating of Re from a solution containing 5 M LiCl. Other embodiments can include electroplating of ReMo, ReW, ReRu, PdZn, FeCoMn, FeCoSe, NiFeSe, GaAs, CulnGa, CuInGaSe.

(85) The methods described herein can be used to fabricate materials for numerous applications, including coating, electronics, microdevices, aerospace, and national defense applications.

Example 12

(86) Deposition of Layered Structures

(87) Two example electrolytes solutions, the first comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, and 0.025 M NH.sub.4ReO.sub.4, and the second comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, and 0.025 M FeSO.sub.4, can be used separately to deposit pure Re and pure Fe layers.

(88) Two example electrolytes solutions, the first comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, and 0.025 M NH.sub.4ReO.sub.4, and the second comprising 0.1 H.sub.2SO.sub.4, 5 M LiCl, and 0.05 M (NH.sub.4).sub.2MoO.sub.4, can be used separately to deposit pure Re and pure Mo layers.

(89) The deposited layers of Re and Fe or of Re and Mo can be annealed at temperatures between 100 to 2000° C. to inter-diffuse the layers and to produce ReFe and ReMo alloys.

Example 13

(90) Methods for electrodeposition using an aqueous electrolyte comprising a solvate are described herein. The methods can suppress the reaction of water during electroplating without sacrificing the benefits of using aqueous electrolyte solutions as hydration of the solvate reduces free water molecules.

(91) Candidate solvates have a high solubility, high coordinate number with water molecules, strong interaction with water molecules, do not consume electrons in the potential of interest, do not result in deposition in the potential of interest, are affordable, or a combination thereof. For example, salts with a ΔG lower than that of Li.sup.+ and Cl.sup.− are candidate solvates.

(92) The deposited Re film from the electrolyte without LiCl exhibited cracks, while the Re film deposited from the electrolyte including 5 M LiCl did not exhibit cracks.

(93) The methods and compositions of the appended claims are not limited in scope by the specific methods and compositions described herein, which are intended as illustrations of a few aspects of the claims and any methods and compositions that are functionally equivalent are within the scope of this disclosure. Various modifications of the methods and compositions in addition to those shown and described herein are intended to fall within the scope of the appended claims. Further, while only certain representative methods, compositions, and aspects of these methods and compositions are specifically described, other methods and compositions and combinations of various features of the methods and compositions are intended to fall within the scope of the appended claims, even if not specifically recited. Thus a combination of steps, elements, components, or constituents can be explicitly mentioned herein; however, all other combinations of steps, elements, components, and constituents are included, even though not explicitly stated.