Microwave assisted magnetic recording head slider and lapping method thereof
11308981 ยท 2022-04-19
Assignee
Inventors
- Shi Xiong CHEN (Hong Kong, CN)
- Bin QI (Hong Kong, CN)
- Wen Rong GUO (Hong Kong, CN)
- Peng LIU (Hong Kong, CN)
Cpc classification
G11B5/1871
PHYSICS
International classification
Abstract
A lapping method of a MAMR head slider includes a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider; and the second lapping process includes a final lapping process section, and the second force in the final lapping process being zero. In such a way, lapping marks on the ABS are reduced to improve the roughness and the reliability.
Claims
1. A lapping method of a microwave assisted magnetic recording (MAMR) head slider, adapted for polishing a predetermined surface of the MAMR head slider by a lapping plate with a lapping surface to form a MAMR head having a spin torque oscillator (STO) on the predetermined surface, and the lapping method comprising: a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider so as to polish the predetermined surface; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider so as to polish the predetermined surface; and the second lapping process comprising a final lapping process section, and the second force in the final lapping process being zero.
2. The lapping method according to claim 1, wherein in the second lapping process, the second speed of the lapping plate is in a range of 0.5-0.2 rpm.
3. The lapping method according to claim 1, wherein in the second lapping process except for the final lapping process section, the second force applied to the MAMR head slider is larger than zero and smaller than 0.6 kgf.
4. The lapping method according to claim 1, wherein in the second lapping process, the second moving speed of the MAMR head slider is in a range of 0.8-0.25 mm/s.
5. The lapping method according to claim 1, wherein in the first and second processes, the MAMR head slider is configured to make a reciprocating linear movement along a radial direction of the lapping plate.
6. The lapping method according to claim 1, wherein in the first and second processes, the MAMR head slider is configured to apply the first and the second forces in a direction perpendicular to a surface of the lapping surface.
7. The lapping method according to claim 1, wherein the second lapping process comprises multiple sub-lapping process sections and the final lapping process section, the second speed, the second force and the second moving speed in a latter sub-lapping process section is smaller than or equal to that in a previous sub-lapping process section.
8. A microwave assisted magnetic recording (MAMR) head slider obtained according to the method in claim 1, comprising a leading edge, a trailing end, an air bearing surface facing a medium, and a MAMR head embedded in the trailing end and having a spin torque oscillator (STO), and the air bearing surface having unidirectional lapping marks.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The accompanying drawings facilitate an understanding of the various embodiments of this invention. In such drawings:
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DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
(10) Various preferred embodiments of the invention will now be described with reference to the figures, wherein like reference numerals designate similar parts throughout the various views. As indicated above, the invention is directed to a lapping method of MAMR head slider, which reduces lapping marks on the ABS, improves the roughness of the surface of magnetic pole or the ABS, thereby improving the pole tip recession, improving the reliability of the MAMR head and extending the life time of the MAMR head accordingly.
(11)
(12) As shown in
(13) Specifically, as shown in
(14) Specifically, as shown in
(15) The read head 341 includes a magnetic film 351 exhibiting a magnetoresistance effect; and two shielding layers 352 and 353 arranged on the trailing end and the leading end of the magnetic film 351 and sandwiching the magnetic layer 351 therebetween.
(16) The write head 343 is disposed on the trailing edge 205 of the slider 230 and includes a main magnetic pole 361, a spin torque oscillator (STO) 362, a gap layer 363, a write coil layer 364, a write shielding layer 365 and a coil layer 366. The write coil layer 364 is formed on an insulating layer 369 and passes through at least one loop between the main pole layer 361 and the write shielding layer 365. The STO 362 is configured at the ABS between the front end of the main magnetic pole and a tail shielding layer 368, as shown in
(17) According to the lapping method of the present invention, the lapping marks on the ABS of the MAMR head are reduced, and the directions of the lapping marks are basically unified (unidirectional lapping marks), which greatly improves the stability and life time of the magnetic head. The lapping method of the present invention will be described in detail below.
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(19) As shown in
(20) Specifically, referring to
(21) S610, positioning pretreatment: positioning the row bar at a predetermined position of the lapping plate.
(22) S620, a first lapping process (also called rough lapping): controlling the lapping plate to spin at a predetermined first speed; meanwhile controlling the row bar (that is, the MAMR head slider) to make a reciprocating linear movement at a predetermined first speed within a predetermined range; almost at the same time, controlling the supporting mechanism 55 to apply a predetermined downward force (first force) to the row bar in a direction perpendicular to the surface of the lapping plate. By virtue of the reciprocating movement and the downward force, the predetermined surface (ie, ABS) of the MAMR head slider is in uniform contact with the lapping surface 50A, so that the predetermined end surface is lapped.
(23) Specifically, in the first lapping process, the lapping plate rotates at a high speed, and the range of the first speed is 2.7-1.1 rpm; the reciprocating speed of the MAMR head slider is relatively large, and the range of the first moving speed is 10.0-5.0 mm/s; and the first force received by the MAMR head slider is relatively large, and the range is 1.0-0.8 kgf. Preferably, the rough lapping process includes an initial lapping process section and multiple sub-lapping lapping process sections. During the multiple sub-lapping process sections, the speed of the lapping plate and the reciprocating speed of the MAMR head slider may be successively reduced according to a predetermined removal quantity. The first force in the multiple sub-lapping process sections may be constant. It is understandable that the initial lapping process section is the beginning of the operation of the machine, and the lapping plate is usually started at a low speed and will be adjusted to a predetermined high speed for the next lapping. Similarly, the reciprocating speed of the MAMR head slider is also started at a low speed and will be adjusted to the predetermined high speed for the next lapping. During the initial lapping process section, a first force is not applied to the MAMR head slider, that is, the first force is zero. Preferably, in order to ensure the lapping effect and the lapping efficiency, the lapping process sections in the first lapping process are preferably 3-4.
(24) S630, the second lapping process (also called fine lapping): controlling the lapping plate to spin at a second speed, applying a second force to the MAMR head slider, and controlling the MAMR head slider to move at a second moving speed, so as to lap the predetermined surface. Specifically, the second speed, the second force, and the second moving speed are lower than the first speed, the first force, and the first moving speed in the first lapping process, respectively, and the second force of the final lapping process section is zero.
(25) Specifically, in the second lapping step, the rotation speed of the lapping plate, the reciprocating speed of the MAMR head slider, and the force applied to the MAMR head slider are all significantly reduced compared to the first lapping process, so as to reduce the lapping marks (scratches) generated on the ABS along the lapping direction. It should be noted that in this fine lapping process, in addition to the above parameters, the rotation direction of the lapping plate, the direction of the reciprocating movement of the MAMR head slider and the direction of applied force to the MAMR head slider remain unchanged. Preferably, the second lapping process includes multiple sub-lapping process sections and a final lapping process section. In the multiple sub-lapping process sections, the speed of the lapping plate, the reciprocating speed of the MAMR head slider can be successively reduced according to the predetermined removal quantity, or the reciprocating speed at the last one or last two sub-lapping steps is kept constant; and the predetermined second force applied to the MAMR head slider can be kept constant or decreased successively at the multiple sub-lapping process sections.
(26) Specifically, in order to ensure the optimal lapping effect, the second force applied to the MAMR head slider needs to be removed in the final lapping process section, that is, the second force is zero. The rotation speed of the lapping plate and the reciprocating speed of the MAMR head slider remain the same as in the previous sub-lapping process.
(27) For ensuring the lapping effect and lapping efficiency, the lapping process sections in the first lapping process are preferably 3-4.
(28) Specifically, in the second lapping process, the second speed of the lapping plate is in a range of 0.5-0.2 rpm; the second moving speed of the MAMR head slider is in a range of 0.8-0.25 mm/s; except for the final lapping process section, the second force applied to the MAMR head slider is larger than zero and smaller than 0.6 kgf.
(29) The following table 1 shows a preferable embodiment of the second lapping process including multiple sub-lapping process sections and a final lapping process section, which is not limited however.
(30) TABLE-US-00001 TABLE 1 Moving speed of Second force Rotation speed of MAMR head slider applied to lapping plate (second moving MAMR head Section of fine (second speed) speed) slider lapping (rpm) (mm/s) (kgf) 1.sup.st 0.5 0.8 0.6 2.sup.nd 0.4 0.25 0.6 3.sup.rd 0.2 0.25 0.6 4.sup.th (final) 0.2 0.25 0
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(32) In addition, the Sigma of the pole tip recession (PTR) of the MAMR head according to the present invention has an improvement of 0.04-0.05 nm compared with the traditional MAMR head, and the magnetic pole roughness has an improvement of about 0.01-0.03 nm.
(33) By this token, the lapping method of the present invention uses multiple lapping processes to optimize the method, and reduces the rotation speed of the lapping plate and the moving speed of the MAMR head slider in the subsequent lapping processes, and removes the pressure on the MAMR head slider in the final lapping process, so as to reduce lapping marks on the ABS, improve the roughness of the surface of magnetic pole or the ABS, thereby improving the pole tip recession, improving the reliability of the MAMR head and extending the life time of the MAMR head accordingly.
(34) While the invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.