Anaerobically Curable Compositions
20220089920 · 2022-03-24
Inventors
- Frances Murphy (Ratoath, IE)
- David Mullen (Co. Meath, IE)
- David Condron (Dublin, IE)
- Brendan Kneafsey (Lucan, IE)
- Nigel SWEENEY (Terenure, IE)
Cpc classification
C09J151/003
CHEMISTRY; METALLURGY
C08L33/08
CHEMISTRY; METALLURGY
C09J4/06
CHEMISTRY; METALLURGY
C09J133/14
CHEMISTRY; METALLURGY
C09J4/06
CHEMISTRY; METALLURGY
C08F220/1812
CHEMISTRY; METALLURGY
C08F220/1812
CHEMISTRY; METALLURGY
International classification
C09J151/00
CHEMISTRY; METALLURGY
C08L33/08
CHEMISTRY; METALLURGY
Abstract
An anaerobically curable composition comprising: (a) a non-encapsulated liquid anaerobically curable monomer forming a liquid phase; (b) a solid component dispersed as a solid phase within the liquid phase formed by the non-encapsulated liquid anaerobically curable monomer; wherein the solid component has (meth)acrylate functionality and: (i) is in particulate form with the particles having a particle size in the range from about 80 μm to about 300 μm; and (ii) has a melting temperature of from about 50° C. to about 90° C.; and (c) a curing component for curing the anaerobically curable composition within the liquid phase.
The anaerobically curable composition can easily be coated onto substrates such as threaded fasteners or other parts in its flowable form and then converted to anaerobically curable composition in solid form.
Claims
1. An anaerobically curable composition comprising: (a) a non-encapsulated liquid anaerobically curable monomer forming a liquid phase; (b) a solid component dispersed as a solid phase within the liquid phase formed by the non-encapsulated liquid anaerobically curable monomer; wherein the solid component has (meth)acrylate functionality and: (i) is in particulate form with the particles having an average particle size in the range from about 80 μm to about 300 μm; and (ii) has a melting temperature of from about 50° C. to about 90° C.; and (c) a curing component for curing the anaerobically curable composition within the liquid phase.
2. An anaerobically curable composition according to claim 1 wherein the non-encapsulated liquid anaerobically curable monomer is present in an amount from about 10% to about 50%, by weight based on the total weight of the composition.
3. An anaerobically curable composition according to claim 1 wherein the solid component is present in an amount from about 15% to about 50%, by weight based on the total weight of the composition.
4. An anaerobically curable composition according to claim 1 wherein the curing component is present in an amount from about 4% to about 6% by weight based on the total weight of the composition.
5. An anaerobically curable composition according to claim 1 further comprising from about 10% to about 30% propoxylated bisphenol A fumarate polyester by weight based on the total weight of the composition dissolved in the liquid phase.
6. An anaerobically curable composition according to claim 1 wherein the solid component comprises solid anaerobically curable monomer with a melting point from about 50° C. to about 90° C.
7. An anaerobically curable composition according to claim 1 wherein the solid component comprises solid resin with a melting point from about 50° C. to about 90° C.
8. An anaerobically curable composition according to claim 1 wherein the composition is a flowable paste having a viscosity at 25° C. of from about 40,000 mPa.Math.s to 500,000 mPa.Math.s, as measured by ASTM D4287.
9. An anaerobically curable composition in solid form formed by heating a composition according to claim 1 so that the solid component melts to a melted form and mixes with the non-encapsulated liquid anaerobically curable monomer to form a mixture and passively or actively cooling the mixture to a solid form.
10. A substrate having applied thereto an anaerobically curable composition according to claim 1.
11. A substrate having applied thereto an anaerobically curable composition according to claim 9.
12. A method of formulating an anaerobically curable composition, the anaerobically curable composition comprising (a) a non-encapsulated liquid anaerobically curable monomer forming a liquid phase; (b) a solid component dispersed as a solid phase within the liquid phase formed by the non-encapsulated liquid anaerobically curable monomer; wherein the solid component has (meth)acrylate functionality and: (i) is in particulate form with the particles having an particle size in the range from about 80 μm to about 300 μm; and (ii) has a melting temperature of from about 50° C. to about 90° C.; and (c) a curing component for curing the anaerobically curable composition within the liquid phase, the method comprising the step of dispersing the solid component in the liquid phase.
13. A method according to claim 12 further comprising adding the curing component after the step of dispersing the solid component in the liquid phase.
14. A method according to claim 13 wherein the curing component is added in microencapsulated form.
15. A method for applying an anaerobically curable composition according to claim 1 to a substrate comprising the steps of: (a) formulating the composition as a flowable composition; (b) applying the flowable composition to a substrate; (c) heating the composition so that the solid component melts to a melted form and mixes with the non-encapsulated liquid anaerobically curable monomer to form a mixture; and (d) passively or actively cooling the mixture to a solid form on the substrate.
16. An assembly comprising a first substrate and a second substrate bonded together utilising a composition according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0130] Embodiments of the invention will be described, by way of example only, with reference to the accompanying drawings in which:
[0131]
DETAILED DESCRIPTION
[0132] Embodiments of the invention will be described, by way of example only, with reference below:
Example 1—Paste Formulation 4158-045
[0133]
TABLE-US-00001 % wt (based on the total Paste Formulation 4158-045 weight of the composition) Ethoxylated Bisphenol A Dimethacrylate 22.6 Saccharin 0.4 Acetyl phenylhydrazine 0.4 Butylated hydroxytoluene 0.025 Lauryl methacrylate 10 2-Methacryloxyethylphenylurethane 31.29 LID 6882 Micronized 31.29 Microencapsulated BPO 4
[0134] LID 6882 is a functional solid resin that is Di-functional Methacrylated PU resin from semi crystalline polyol. When it is micronized it has an average particle size of <100 μm.
[0135] The composition in the table above is combined with solid monomer: 2-Methacryloxyethylphenylurethane.
Example 2: Paste Formulation 4158-063
[0136]
TABLE-US-00002 % wt (based on the total Paste formulation 4158-063 weight of the composition) Ethoxylated Bisphenol A Dimethacrylate 23.175 Butylated hydroxytoluene 0.025 Saccharin 0.4 Acetyl phenylhydrazine 0.4 ATLAC ® 382 Propoxylated Bisphenol- 20 A- Fumarate Polyester Poly(ethylene glycol) dimethacrylate 12 2-Methacryloxyethylphenylurethane 20 LID 6882 Micronized 20 Microencapsulated BPO 4
[0137] LID 6882 is a functional solid resin that is Di-functional Methacrylated PU resin from semi crystalline polyol. When it is micronized it has an average particle size of <100 μm.
[0138] The composition in the table above is combined with solid monomer: 2-Methacryloxyethylphenylurethane.
[0139]
Example 3: Paste Formulation 4158-064
[0140]
TABLE-US-00003 % wt (based on the total Paste Formulation 4158-064 weight of the composition) Ethoxylated Bisphenol A Dimethacrylate 23.175 Saccharin 0.4 Acetyl phenylhydrazine 0.4 ATLAC ® 382 Propoxylated Bisphenol- 20 A- Fumarate Polyester Poly(ethylene glycol) dimethacrylate 12 Butylated hydroxytoluene 0.025 2-Methacryloxyethylphenylurethane 20 Polyethylene glycol Av. Mol. Wt 20 8000 g/mol microencapsulated BPO 4
[0141] With non-functional solid powder: polyethylene glycol with average molecular weight 8000 g/mol.
[0142] The composition in the table above is combined with solid monomer: 2-Methacryloxyethylphenylurethane.
[0143] The words “comprises/comprising” and the words “having/including” when used herein with reference to the present invention are used to specify the presence of stated features, integers, steps or components but do not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.
[0144] It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.