Abstract
A light source. The light source includes as components which superimpose one another in this sequence: a first light-emitting semiconductor component; a first carrier element comprising a first carrier surface which faces the first light-emitting semiconductor component and a first cooling surface deliminating at least in part a first fluid path; and a distributor element comprising a first cavity and a further cavity. The first cavity and the further cavity are fluidically connected to one another by the first fluid path. Also disclosed are a printing machine; methods, in particular for producing a printed product, for irradiating a material to be irradiated, and for producing a light source; corresponding method products; an assembly having the light source; and uses of the light source.
Claims
1. A light source comprising as components which superimpose one another in this sequence: at least one first light-emitting semiconductor component; a first carrier element comprising a first carrier surface which faces the at least one first light-emitting semiconductor component and a first cooling surface deliminating at least in part a first fluid path; and a distributor element comprising a first cavity and a further cavity, wherein the first cavity and the further cavity are fluidically connected to one another by the first fluid path.
2. The light source as claimed in claim 1, wherein the first carrier element is releasably connected to the distributor element.
3. The light source as claimed in claim 1, wherein the first carrier element has a cooling structure with a surface and the first cooling surface is at least in part the surface of the cooling structure of the first carrier element.
4. The light source as claimed in claim 3, wherein the cooling structure comprises a multiplicity of cooling ribs.
5. The light source as claimed in claim 1, wherein the carrier surface and the cooling surface are mutually opposite external surfaces of the first carrier element.
6. The light source as claimed in claim 1, wherein the distributor element has a surface that faces the first carrier element and the first fluid path is at least in part additionally delimited by the surface of the distributor element that faces the first carrier element.
7. A method for producing a light source, the method comprising as method steps: A} providing a) at least one first light-emitting semiconductor component, b) a first carrier element comprising i) a first carrier surface, and ii) a first cooling surface, and c) a distributor element comprising i) a first cavity, and ii) a further cavity; and B} releasably connecting the first carrier element to the distributor element such that the first cavity and the further cavity are fluidically connected to one another by a first fluid path. wherein the at least one first light-emitting semiconductor component is superimposed on the first carrier element on a side of the first carrier surface and the first fluid path is at least in part delimited by the first cooling surface.
8. The method as claimed in claim 7, wherein the first cooling surface is at least in part a surface of a cooling structure of the first carrier element and, in method step A}, the providing of the first carrier element comprises generating the cooling structure using a disk cutter.
9. A light source made by the method as claimed in claim 7.
10. A printing machine comprising the light source as claimed in claim 1.
11. A method comprising as method steps: A) providing the light source as claimed in claim 1 and an object; B) superimposing the object with a composition; and C) irradiating the composition with light emitted by the at least one first light-emitting semiconductor component.
12. The method as claimed in claim 11, wherein method step C) comprises curing the composition and the curing comprises a reduction of a proportion of one vehicle in the composition.
13. A printed product made by the method as claimed in claim 11.
14. An assembly comprising: the light source as claimed in claim 1; and a material to be irradiated, wherein the light source and the material to be irradiated are disposed and configured for irradiating the material to be irradiated with light emitted from the at least one first light-emitting semiconductor component.
15. A method comprising as method steps: A] providing the assembly as claimed in claim 14; and B] irradiating the material to be irradiated with light emitted by the at least one first light-emitting semiconductor component.
16. A use of the light source as claimed in claim 1 for curing a composition.
17. A use of the light source as claimed in claim 1 in a printing machine.
18. A light source made by the method as claimed in claim 8.
19. A printed product made by the method as claimed in claim 12.
20. The light source as claimed in claim 1, wherein the first carrier element is releasably connected to the distributor element, the first carrier element has a cooling structure with a surface and the cooling surface is at least in part the surface of the cooling structure of the first carrier element, the carrier surface and the cooling surface are mutually opposite external surfaces of the first carrier element, and the distributor element has a surface that faces the first carrier element and the first fluid path is at least in part additionally delimited by the surface of the distributor element that faces the first carrier element.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0162] The invention will be illustrated in more detail by examples and drawings, wherein the examples and drawings do not limit the invention. Furthermore, unless otherwise stated, the drawings are not to scale.
[0163] Respectively in the drawings, included are the following figures:
[0164] FIG. 1 shows a schematic illustration of a light source according to the invention;
[0165] FIG. 2 shows a schematic partial illustration of a fragment of the light source according to the invention of FIG. 1;
[0166] FIG. 3 shows a further schematic partial illustration of a fragment of the light source according to the invention of FIG. 1;
[0167] FIG. 4 shows a schematic illustration of the first carrier element of the light source according to the invention of FIG. 1;
[0168] FIG. 5 shows a schematic cross-sectional illustration of the light source according to the invention of FIG. 1;
[0169] FIG. 6 shows a flow chart of a method according to the invention for producing a light source;
[0170] FIG. 7 shows a schematic illustration of a printing machine according to the invention;
[0171] FIG. 8 shows a flow chart of a method according to the invention for producing a printed product;
[0172] FIG. 9 shows a schematic illustration of a printed product according to the invention;
[0173] FIG. 10 shows a schematic illustration of an assembly according to the invention; and
[0174] FIG. 11 shows a flow chart of a method according to the invention for irradiating a material to be irradiated.
DETAILED DESCRIPTION OF THE DISCLOSURE
[0175] FIG. 1 shows a schematic illustration of a light source 100 according to the invention. The light source 100 comprises a distributor element 103 of aluminum. The distributor element 103 is of a one-piece design and elongate in a longitudinal direction 104. A transverse direction 105 is perpendicular to the longitudinal direction 104. A total of 28 carrier elements 102 are screw-fitted to the distributor element 103. Each of the carrier elements 102 is individually replaceable. Furthermore, each of the carrier elements 102 supports a light-emitting semiconductor component 101, more specifically an LED module 101. The light source 100 furthermore has a connector 107 for a cooling fluid inflow, and a connector 108 for a cooling fluid return flow, of a cooling circuit. The connectors 107 and 108 are connected to the distributor element 103 by a connecting element 106. The distributor element 103 is furthermore configured as the housing of the light source 100.
[0176] FIG. 2 shows a schematic partial illustration of a fragment of the light source 100 according to the invention of FIG. 1. Only one first carrier element 102 of the total of 28 carrier elements 102 of the light source 100 is illustrated in FIG. 2. The first light-emitting semiconductor component 101 which is an LED module 101 is soldered to the first carrier element 102. The first carrier element 102 by way of two countersunk screws as fasteners 201 is screw-fitted to the distributor element 103. Accordingly, the first light-emitting semiconductor component 101, the first carrier element 102, and the distributor element 103 are superimposed on one another in the aforementioned sequence. The LED module 101, as shown, comprises a substrate 204 of a ceramic material on which a plurality of LED chips 203 are mounted by chip-on-board technology. The LED module 101 is a UV-LED module. The distributor element 103 furthermore has one sealing groove 202 for accommodating a sealing element 301 (see FIG. 3) for each of the 28 carrier elements 102, the sealing grooves 202 being beside one another in the longitudinal direction 104.
[0177] FIG. 3 shows a further schematic partial illustration of a fragment of the light source 100 according to the invention of FIG. 1. As in FIG. 2, here too only the first carrier element 102 of the total of 28 carrier elements 102 of the light source 100 is shown. Furthermore, one sealing element 301 is in each case accommodated in each sealing groove 202. The sealing elements 301 are configured as O-rings with a rectangular shape. In the case of an assembled carrier element 102, a sealing element 301 accommodated in a sealing groove 202, between the carrier element 102 and the distributor element 103, is disposed about a fluidic connection between the carrier element 102 and the distributor element 103 such that the fluidic connection is laterally sealed in a fluid-tight manner. Furthermore in FIG. 3, two third ducts 302 of a first cavity 501 in the distributor element 103 and two third ducts 303 of a further cavity 502 in the distributor element 103 can be seen for each assembly spot of a further carrier element 102 (not illustrated). The first cavity 501 and the further cavity 502 will be explained below in the context of FIG. 5.
[0178] FIG. 4 shows a schematic illustration of the first carrier element 102 of the light source 100 according to the invention of FIG. 1. The first carrier element 102 has the external dimensions 59.5 mm×24.3 mm×5 mm. The first carrier element 102 is composed of a main body of copper with the material specification Cu-ETP R250 and the material reference number CW004A. A nickel layer with a thickness of 3 to 7 μm is applied to this main body. A gold layer with a thickness of 0.03 to 0.13 μm is in turn coated on the nickel layer. The two coatings are coatings which in the technical field are referred to as electroless nickel immersion gold (ENIG) which serve in particular for protecting the surface and moreover facilitate an application of the LED module 101 to a carrier surface 401 of planar configuration of the first carrier element 102 (in the figure on the obscured lower side of the first carrier element 102). The first carrier element 102 furthermore has an external surface which is opposite the carrier surface 401 and is referred to as the cooling surface 402. This cooling surface 402 is in part a surface of a cooling structure 403 which is composed of 13 cooling ribs 404 and 14 ducts 405. With the exception of the two outermost ducts 405, the ducts 405 are routed between two respective neighboring cooling ribs 404. Each of the cooling ribs 404 has a thickness of 0.65 mm. A width of the ducts 405 is approximately 0.82 mm. The cooling ribs 404 have in each case two interruptions. A distribution chamber 407 forms in each case one interruption of the cooling ribs 404, while a collection chamber 408 forms the second interruption of each cooling rib 404. A thickness of the first carrier element 102 is at the minimum in the ducts 405, in the distribution chamber 407, and in the collection chamber 408. This minimum thickness is 1 mm. This material thickness imparts to the first carrier element 102 a sufficient mechanical stability for the assembly of the LED module 101 using adhesive bonding, soldering or sintering. Furthermore, the first carrier element 102 having this material thickness is sufficiently stable mechanically so as to not be damaged in the event of usual pressure shocks in the cooling circuit. Furthermore, a sufficient discharge of heat by the first carrier element 102 to a cooling fluid can be achieved by way of the chosen material thickness. The cooling fluid can flow along a first fluid path 409 which is indicated by arrows in the figure. This first fluid path 409 fluidically connects the first cavity 501 and the further cavity 502 of the distributor element 103 to one another (see FIG. 5). The first fluid path 409, emanating from the first cavity 501 of the distributor element 103 (not shown here), leads into the distribution chamber 407, by way of the 14 ducts 405 into the collection chamber 408, and from there into the further cavity 502 of the distributor element 103 (not shown here). Accordingly, the cooling surface 402 partially delimits the first fluid path 409. The distribution chamber 407 is disposed and configured for distributing the cooling fluid which flows along the first fluid path 409 to the ducts 405. In a manner analogous thereto, the collection chamber 408 is disposed and configured for directing the cooling fluid which flows out of the ducts 405 into the further cavity 502. Each of the cooling ribs 404 is composed of a first portion 410 and two further portions 411. The portions 410, 411 are in each case separated from one another by interruptions in the form of the distribution chamber 407 or the collection chamber 408. The first portions 410 but not the further portions 411 are situated in the first fluid path 409. Nevertheless, the further portions 411 contribute toward a positive distribution of the cooling fluid and thus toward homogeneous cooling of the first carrier element 102. A height of the cooling ribs 404 in the first portions 410 is constant. A height of the cooling ribs 404 in the further portions 411 decreases toward the outside in the transverse direction 105, thus in a direction which is perpendicular to the thicknesses and heights of the cooling ribs 404 and directed away from the first portions 410. The reason for this is that a depth of the ducts 405 in the further portions 411 decreases toward the outside in the transverse direction 105. The first carrier element 102 furthermore has through-hole threads 412. These through-hole threads 412 are preferably M2 threads and can be used for fastening add-on parts such as mountings for optics, or else for fastening assembly aids, for example a protective cap for the LED module 101. The above-mentioned countersunk screws for releasably fastening the first carrier element 102 to the distributor element 103 can be guided through one or more through holes 406. Each further carrier element 102 of the 28 carrier elements 102 of the light source 100 is configured like the previously described first carrier element 102.
[0179] FIG. 5 shows a schematic cross-sectional illustration of the light source 100 according to the invention of FIG. 1. It can be seen that the distributor element 103 comprises a first cavity 501 which is configured as an inflow for the cooling fluid. The first cavity 501 comprises a first duct 503 which is routed through below each of the carrier elements 102. Two second ducts 504 of the first cavity 501 are routed from the first duct 503 into the first fluid path 409. For each further carrier element 102, two third ducts 302 of the first cavity 501 lead in each case into a further fluid path, thus to the cooling surface 402 of the respective carrier element 102 (see FIG. 3). The distributor element 103 furthermore comprises a further cavity 502 which is configured as a return flow for the cooling fluid. The further cavity 502 comprises a first duct 505 which is routed through below each of the 28 carrier elements 102. Two second ducts 506 of the further cavity 502 lead from the first fluid path 409 into the first duct 505 of the further cavity 502. For each further carrier element 102, two third ducts 303 of the further cavity 502 lead in each case from a further fluid path, thus from the cooling surface 402 of the respective further carrier element 102, into the first duct 505 (see FIG. 3). Accordingly, the first cavity 501 and the further cavity 502 are fluidically connected to one another by the first fluid path 409 and each further fluid path. It can furthermore be seen in FIG. 5 that the first fluid path 409, indicated by an arrow in the figure, is delimited by the cooling surface 402 and an opposite external surface of the distributor element 103. The first sealing element 301 which for sealing is disposed between the first carrier element 102 and the distributor element 103 can furthermore be seen. The distributor element 103 in terms of the function thereof as a housing furthermore has a mounting 507 which is disposed and configured for holding an emission window 508 of the light source 100.
[0180] FIG. 6 shows a flow chart of a method 600 according to the invention for producing a light source 100. In a method step A} 601, 28 carrier elements 102 are provided which are configured like the first carrier element 102 shown in FIG. 4 are provided. One LED module 101 is applied to the carrier surface 401 of each of these carrier elements 102. Furthermore provided in this method step A} 601 is the distributor element 103 shown in FIG. 5. In a method step B} 602, the carrier elements 102 are in each case releasably screw-fitted to the distributor element 103 by two countersunk screws such that the first cavity 501 and the further cavity 502 of the distributor element 103 for each carrier element 102 are fluidically connected to one another by a fluid path 409. Each of the fluid paths 409 is delimited by a surface of the distributor element 103 and by a cooling surface 402 of the respective carrier element 102. The providing of the distributor element 103 comprises an extrusion while obtaining a formed aluminum body into which the second ducts 504 and 506, and the third ducts 302 and 303, are incorporated by drilling. The providing of each of the carrier elements 102 takes place by providing a formed copper body, machining this copper formed body, inter alia with a CNC milling machine, and coating the machined copper formed body with the ENIG coatings. The machining with the CNC milling machine comprises milling with a disk cutter. The latter has 14 disk-shaped cutting blades which have in each case a diameter of 27.7 mm and a thickness of 0.82 mm. Using this disk cutter, all 14 ducts 405, and thus the cooling ribs 404 of the cooling structure 403 of the carrier element 102, can be simultaneously generated. The distribution chamber 407 and the collection chamber 408 are subsequently incorporated using an end milling cutter, and the cooling ribs 404 are thus subdivided into the first portions 410 and further portions 411. Furthermore, the through holes 406 are drilled and the through-hole threads 412 are drilled and cut. The light source 100 of FIG. 1 is produced by the method 600. The method 600 is distinguished by a short production time, a stable process management (minor production tolerances) and low wear on the tools, in particular in the production of the carrier elements 102. Furthermore, the copper of the carrier elements 102 can be readily machined using the tools mentioned.
[0181] FIG. 7 shows a schematic illustration of a printing machine 701 according to the invention. The printing machine 701 comprises the light source 100 of FIG. 1. The light source 100 in the printing machine 701 is disposed for irradiating a composition which is printed on a print medium 702. The printing machine 701 is a sheet-fed offset printing machine.
[0182] FIG. 8 shows a flow chart of a method 800 according to the invention for producing a printed product 900 (see FIG. 9). In a method step A) 801, the printing machine 701 of FIG. 7 and a print medium 1002 as an object 1002 are provided (see FIG. 10). In a subsequent method step B) 802, a liquid composition 1003, which is a sheet-fed offset printing ink, is printed on the print medium 1002 by the printing machine 701. In a method step C) 803, the printed sheet-fed offset printing ink is irradiated with UV light emitted by the LED modules 101 of the light source 100 and in this way cured by polymerization. As a result of the construction of the light source 100 according to the invention, each of the 28 carrier elements 102 of the light source 100 in the method step C) 803 can be cooled at a cooling output of approximately 300 W by a water/glycol mixture as a cooling fluid which flows into a cooling circuit at approximately 5 bar, so that the two carrier elements 102 that are farthest apart in the longitudinal direction 104 have a temperature differential of at most 4 K. As a result, all LED modules 101 of the light source 100 can be operated at an approximately identical efficiency, this enabling homogeneous irradiating and thus homogeneous curing of the printing ink 1003 across a large area.
[0183] FIG. 9 shows a schematic illustration of the printed product 900 according to the invention. Depicted is a brochure 900 which is obtainable by the method 800 of FIG. 8.
[0184] FIG. 10 shows a schematic illustration of an assembly 1000 according to the invention. The assembly 1000 comprises the printing machine 701 of FIG. 7 and a material to be irradiated 1001 which is composed of the object 1002, here the print medium 1002, and a printing ink 1003 which is printed on the print medium 1002. The light source 100 of the printing machine 701 and the material to be irradiated 1001 are disposed such that the printed printing ink 1003 can be irradiated with light 1004, here UV light, which is emitted by the LED modules 101 of the light source 100.
[0185] FIG. 11 shows a flow chart of a method 1100 according to the invention for irradiating a material to be irradiated 1001. In a method step A] 1101, the assembly 1000 of FIG. 10 is provided. In a method step B] 1102, the material to be irradiated 1001 is irradiated with UV light emitted by the LED modules 101 of the light source 100.
[0186] Although illustrated and described above with reference to certain specific embodiments and examples, the present disclosure is nevertheless not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the spirit of the disclosure. It is expressly intended, for example, that all ranges broadly recited in this document include within their scope all narrower ranges which fall within the broader ranges.
