Security element comprising a printed image with a three-dimensional effect

Abstract

A method for manufacturing a physical security element with a spatially appearing pattern includes a carrier and at least one see-through transparent cover layer. Onto the carrier is applied a design layer deformable under pressure. Either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier. A see-through transparent structural layer forming the pattern is arranged between carrier and cover layer. The structural layer has a higher dimensional stability under heat than either the carrier or a cover layer. During lamination, the structural layer is pressed into the carrier or into the cover layer, whereby the design layer is deformed under the pattern formed by the structural layer and the structural layer in its edge regions is reshaped in such a way that its surfaces, in cross-section, converge tangentially.

Claims

1. A method for manufacturing a physical security element having a spatially appearing pattern, comprising the steps of: providing a carrier, providing at least one see-through transparent cover layer, applying a design layer onto the carrier, wherein either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier, wherein the design layer is deformable under pressure, wherein the thickness of the design layer is not changed or is changed by a maximum of 10%, by the deformation, arranging a see-through transparent structural layer between carrier and cover layer forming the pattern, wherein the structural layer has a higher or a similar dimensional stability under heat than the carrier or a cover layer, laminating the carrier and the layers under pressure and heat, wherein during lamination the structural layer is pressed into the carrier or via the carrier into a cover layer, whereby the design layer is deformed in accordance with the pattern formed by the structural layer, and whereby the structural layer in its edge regions is reshaped in such a way that, in cross-section, the surfaces of the structural layer converge tangentially.

2. The method according to claim 1, wherein the carrier has a lower dimensional stability under heat than design layer, cover layer and structural layer, and the structural layer is arranged between design layer and cover layer so that during lamination the design layer is pressed into the carrier by the structural layer, wherein the structural layer in its edge regions is reshaped lenticularly in such a way that the surface of the structural layer which faces the top layer and the surface of the structural layer which faces the design layer converge tangentially at the edges.

3. The method according to claim 1, wherein the design layer is applied onto the side of and facing away from the carrier, and a further cover layer is arranged thereabove the design layer, wherein the further cover layer has a lower dimensional stability under heat than design layer, cover layer, carrier and structural layer, and the structural layer is arranged between carrier and cover layer, so that during lamination the design layer and the carrier are pressed into the further cover layer by the structural layer, wherein the structural layer is reshaped lenticularly in such a way that the surface of the structural layer which faces the cover layer and the surface of the structural layer which faces the design layer converge tangentially at the edge regions thereof.

4. The method according to claim 1, wherein the structural layer is applied as a lacquer layer onto the design layer and/or the cover layer.

5. The method according to claim 4, wherein the lacquer layer is hardened.

6. The method according to claim 1, wherein the design layer is a metallic ink and/or is applied onto the carrier before the lamination.

7. The method according to claim 1, wherein the surface of the structural layer which faces the design layer rises towards the surface which faces the cover layer.

8. The method according to claim 1, wherein the design layer has a thickness of 5 to 25 μm and/or is applied in the form of at least two layers which differ in a material property.

9. The method according to claim 1, wherein the structural layer possesses a thickness of 25 to 125 μm.

10. The method according to claim 1, wherein the cover layer possesses a thickness of 50 to 200 μm.

11. The method according to claim 1, wherein the structural layer is substantially undeformed in the inner zones, and the edge regions are reshaped lenticularly, forming a transition by decreasing the layer thickness until it disappears.

12. A physical security element which carries a spatially appearing pattern, having a carrier on which a design layer, a see-through transparent structural layer and a see-through transparent cover layer are configured, wherein the structural layer covers only parts of the security element and the pattern is formed wholly or partially by the structural layer, wherein the structural layer is pressed into the carrier and is reshaped lenticularly at its edge regions so that the surfaces of the structural layer converge tangentially in the edge regions, and through the structural layer also the design layer is pressed into the carrier, the design layer being deformed in accordance with the pattern in the structural layer, wherein the thickness of the design layer in the deformed regions is the same or, apart from deviations of max 10%, almost the same as in the rest of the regions.

13. The security element according to claim 12, wherein it is configured in the form of a card in a standardized format.

14. A method for manufacturing a physical security element having a spatially appearing pattern, comprising the steps of: providing a carrier, providing at least one see-through transparent cover layer, applying a design layer onto the carrier, wherein either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier, wherein the design layer is deformable under pressure, arranging a see-through transparent structural layer between carrier and cover layer forming the pattern, wherein the structural layer has a higher or a similar dimensional stability under heat than the carrier or a cover layer, laminating the carrier and the layers under pressure and heat, wherein during lamination the structural layer is pressed into the carrier or via the carrier into a cover layer, whereby the design layer is deformed in accordance with the pattern formed by the structural layer, and whereby the structural layer in its edge regions is reshaped in such a way that, in cross-section, the surfaces of the structural layer converge tangentially; wherein the structural layer is substantially undeformed in the inner zones, and the edge regions are reshaped lenticularly, forming a transition by decreasing the layer thickness until it disappears.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Embodiment examples of the invention will hereinafter be explained in more detail with reference to the drawing.

(2) There are shown:

(3) FIG. 1 shows a card furnished with features in a partial perspective view,

(4) FIG. 2 components to be joined before connecting, by the example of a card,

(5) FIG. 3 a detail of a card manufactured with the components according to FIG. 1 after connecting,

(6) FIG. 4 a plan view of a detail of a card manufactured according to the FIG. 1 or 2,

(7) FIG. 5 a variant of the method according to FIG. 1 before the connecting, and

(8) FIG. 6 a card manufactured according to the variant of FIG. 4 after connecting.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

(9) The method according to the invention is described below by the example of a plastic card in a standard format, as they are commonly used as payment cards, credit cards or ID cards. FIG. 1 shows by way of example a chip card whose geometry corresponds for example to ISO 7810. However, the method is not restricted to plastic cards, but is generally suitable for physical security elements which are constructed from several layers connected under pressure and heat and which have a printable surface such as e.g. labels, signs or packaging.

(10) FIG. 1 shows a card having a chip 25 as an example of a physical security element 20 in a partial perspective plan view. The card 20 typically possesses standard dimensions, e.g. according to ISO 7810. Its surfaces are smooth and lie plane-parallel to each other. On the side arbitrarily referred to as upper surface 21, the card 20 carries several features optically recognizable for a user, some of which serve individualization and some security. In particular, the card 20 carries a pattern 10 manufactured with the method of the invention. The pattern 10 covers a part of the surface 21 and possesses a recess 19 in which the surface 21 is visible. Further, the card 20 also carries a lettering 23 which is partly applied over the pattern 10. It also carries a separate security feature, such as a hologram 24.

(11) FIG. 2 shows a first embodiment variant of a method for producing a pattern 10 on a card 20. In an exploded representation which is not true to scale, a part of the components of the board 20 is shown before connecting. The basis of the card 20 is a carrier 1 made of a thermoplastic material which normally is provided in the form of a plastic layer or of a composite of several plastic layers. The plastic can be PVC but can also be different common card materials. If the card to be manufactured corresponds to the ISO standard for credit cards, the carrier 1 typically possesses a thickness h.sub.1 of 250 to 700 μm. The carrier 1 forms the core layer of the card 20. The practical thickness of the carrier 1 depends on the chosen card format, the intended purpose of use, specific requirements for certain card layers and/or the desired number and thickness of individual layers which form the carrier 1.

(12) A design layer 3 is placed above the carrier 1. The design layer 3 is opaque or semi-transparent. It is usually applied over the full area of the surface 11 of the carrier 1 and possesses a thickness h.sub.2 of 5 to 25 μm. Typically, the design layer 3 is applied onto the carrier 1 by screen printing. Expediently, a usual design ink is used which is based on a transparent solution furnished with color particles. In addition, it may contain e.g. metallic particles which generate a particular optical effect, for example a glitter effect.

(13) In an alternative embodiment, the design layer 3 can also be provided as a separate layer in the form of a foil.

(14) As indicated in FIG. 2, the design layer 3 can be executed in a multi-layered manner. It then consists, for example, of a base layer 13 which for instance is executed as a white layer. Thereon there is located an optically effective layer 14 which is executed as a layer having metallic particles, for example. In one variant, the base layer 13 can be formed by a thin metal foil on which a design print 14 is applied as the second layer. Hereinafter, design layer 3 is always represented as a single layer for simplifying the description. Above the design layer 3 there lies a structural layer 5. The structural layer 5 is see-through transparent, i.e. transparent or semi-transparent. It typically covers only a part of the surface 11 of the carrier 1. The structural layer 5, in a plan view, forms a pattern 10 which represents a pictorial or alphanumeric information item. The pattern 10 may be a simple closed geometric shape, such as a dot or rectangle, or possess a complex form which has recesses 19, such as letters, design patterns or pictorial motifs. As an example of a complex pattern 10, in FIG. 1 there is indicated a stylized flower the center of which is formed by a recess 19. The pattern 10 does not cover the entire area of the card. It consists of inner zones 16 and edge regions 15, which differ in their optical effect.

(15) In the embodiment example of FIG. 2, the structural layer 5 is executed in the form of a lacquer layer. Such a lacquer layer 5 is based on a solvent or is solvent-free and is printed in a screen printing method. The printing can be done either on the cover layer 7 or on the design layer 3. After the application, the lacquer layer is cured. Its thickness h.sub.3 expediently is between 25 μm and 100 μm; in the practical tests the thickness was between 30 and 60 μm.

(16) As an alternative to an embodiment as a lacquer layer, the structural layer 5 can also be executed as an independent foil in which the pattern 10 is incorporated in the form of a structure of recesses.

(17) Above the structural layer 5 there lies a cover layer 7. Its top side is smooth and forms the surface 21 of the card 20. The cover layer 7 is also see-through transparent, i.e. transparent or semi-transparent. It is expediently provided as a foil and possesses a thickness h.sub.4 of 50 to 100 μm. Expediently, its thickness is between 60 and 80 μm.

(18) Compared to the other components, the carrier 1 possesses a higher plasticity, i.e. its shape can be permanently changed at a lower temperature than with the other components. The glass transition temperature of the carrier 1 is lower than that of the cover layer 7.

(19) The cover layer 7 behaves hard in comparison to the carrier 1 and also in comparison to the other components and experiences no or hardly any shape changes by a usual lamination, i.e. it can be compressed by at most 15%.

(20) The structural layer 5 possesses a greater or a similar dimensional stability under heat as the carrier 1. Under pressure and heat during lamination it experiences a change of shape in its edge regions 15, while for the rest it substantially maintains its shape and is compressed by at most 10%.

(21) Likewise, the design layer 3 possesses a higher dimensional resistance under heat than the carrier 1. The design layer 3 can hardly be compressed under usual laminating conditions, i.e. its thickness changes by at most 15%. However, the design layer 3 can be deformed by the action of pressure without its thickness being changed. Connecting the components represented in FIG. 1 is effected in two phases: in the first phase the design layer 3 is applied onto the carrier 1 and the structural layer 5 is applied onto the design layer 3 or onto the cover layer 7. In the second phase, the components present thereafter are connected to each other under pressure and heat in a usual laminating method.

(22) During lamination, the carrier 1 behaves softly towards the design layer 3 and the lacquer layer 5. The carrier 1 also behaves softly towards the cover layer 7 and the structural layer 5. This means that while cover layer 7, structural layer 5, design layer 3 and lacquer layer 5 completely or at least fundamentally maintain their shape during lamination, the carrier 1 changes its shape. During lamination, the lacquer layer 5 is pressed into the carrier 1. Together with the lacquer layer 5, the design layer 3 is pressed into the carrier 1. The carrier 1 is thus compressed and reshaped wherever the lacquer layer 5 is located.

(23) The lacquer layer 5 remains basically unchanged during lamination, but the edge regions 15 change their shape. The inner zones 16 of the lacquer layer 5 remain substantially unchanged. In particular, in the inner zones the thickness of the lacquer layer 5 remains substantially unchanged; the laminating can result in at most a low homogeneous compression of the thickness of max. 10%. In the edge regions 15, however, the lacquer layer 5 is reshaped lenticularly. When viewed in cross-section, the lower surface 18 of the lacquer layer 5 which faces the carrier 1 and the upper surface 1 which faces the cover layer 7 extend tangentially towards each other after reshaping and form an acute angle. And the lower surface 18 rises in the edge regions 15 towards the upper surface 17.

(24) During lamination the design layer 3 is deformed where the lacquer layer 5 is located, but this does not or only insignificantly change its thickness, i.e. less than 10%, and the design layer 3 remains contiguous.

(25) FIG. 3 illustrates the resulting card construction after the components represented in FIG. 2 were laminated together. In the regions of the card 20 where the lacquer layer 5—and thus the pattern 10—is configured, the carrier 1 is compressed and reshaped accordingly. The lacquer layer 5 is pressed into the carrier 1, taking the intermediate design layer 3 with it. The design layer 3 is deformed according to the contour of the structural layer 5, but has not or only insignificantly changed its thickness, i.e. by at most 10%, and has remained contiguous. The lacquer layer 5 is substantially undeformed in the inner zones 16, i.e. its thickness has changed by at most 10%, and in the edge regions 15 is has been reshaped lenticularly. The lacquer layer 5 thus runs out in the edge regions 15, forming a gentle transition by decreasing the layer thickness, until it disappears. The design layer 3 accordingly lies in the inner zones 16 between the structural layer 5 and the carrier 1. In the edge regions 15, it respectively rises in a gentle, continuous transition towards the cover layer 8 in order to tangentially meet the cover layer 7 at the transitions to the recesses 19 or to the adjacent regions of the surface 21 without pattern 10. In the recesses 19 or in the regions of the surface 21 without pattern 10, the design layer 3 directly abuts the cover layer 7.

(26) The gentle transitions between regions with lacquer layer 5 and regions without lacquer layer 5, which arise in the edge regions 15 of lacquer layer 5, lead to an, in plan view, optically perceptible effect, because light in the edge zones 15 is reflected differently than in the inner zones 16 and in the zones outside the pattern 10 in which only the design layer 3 is present. The impact of the effect produced by the edge regions 15 is that the pattern 10 represented by the lacquer layer 5 appears to be spatial.

(27) FIG. 4 illustrates the spatial effect. There is shown a card 20 in plan view, which has a pattern 10 manufactured according to the methods described. The pattern 10 in the example is an asymmetric “U”. The cross-section through the pattern 10 along line A-A corresponds in principle to the cross-section represented in FIG. 3. If the represented pattern 10 receives e.g. incidence of light from the left side, as indicated by the arrows, the edge regions 15 appear to reflect differently strong, depending on whether they are inclined away from the incidence of light, are parallel to it, or are inclined towards the incidence of light. In this manner, the edge regions 15 produce a depth effect. The pattern 10 in combination thus becomes perceptible as a spatial structure in the design layer 3.

(28) FIGS. 5 and 6 show an embodiment variant of the method described, in which the structural layer 5 is pressed indirectly via the carrier layer 1 into a cover layer 8. Here, the design layer 3 is not configured on the side 11 of the carrier 1 which faces the structural layer 5, but on the side 12 facing away. Furthermore, above the structural layer 5, there is arranged a further cover layer 8, likewise on the side facing away. Its top side is smooth and forms the lower surface 22 of the card 20. The further cover layer 8, like the cover layer 7, is see-through transparent and possesses a thickness of 50 to 150 μm, expediently of 60 to 90 μm. However, the further cover layer 8 possesses a lower dimensional stability under heat and a higher plasticity than carrier 1 and also than design layer 3. This means that the further cover layer 8 is more easily plastically deformable than carrier 1 and design layer 3 and possesses a lower glass transition temperature.

(29) During the lamination of the arrangement shown in FIG. 5, the structural layer 5 is pressed into the carrier 1. Here, the structural layer 5 again changes its cross-sectional profile in the edge regions 15 as shown in FIG. 2 and is reshaped. By the pressed-up structural layer 5, in turn the carrier 1 is deformed and reproduces the surface contour thereof. However, the carrier 1 here—unlike the embodiment example of FIG. 2—is not or at most insignificantly reshaped in its profile and maintains its thickness h.sub.1 substantially over the entire area; “insignificant” is understood here to mean a homogeneous change in a dimension of at most 10%. Instead of undergoing reshaping, the carrier 1 merely deforms and on the side facing away reproduces the contour of the structural layer 5.

(30) On the side 6 facing away, the carrier 1 presses on the design layer 3 and the further cover layer 8. The design layer 3 is deformed by the carrier 1 but again substantially maintains its thickness h.sub.2, i.e. changes by at most 10%, and remains contiguous. This results in the design layer 3 in turn reproducing the contour of the structural layer 5 and being pressed into the further cover layer 8.

(31) Unlike in the embodiment example of FIG. 2, in the variant according to FIG. 5 now the further cover layer 8 is compressed and thereby reshaped. As a result of the deformation of the edge regions 15, the pattern 10 represented by the structural layer 5 thus becomes perceptible on the opposite side 6 of carrier 1 as a spatial pattern.

(32) While maintaining the basic idea of configuring a pattern 10 having a spatial effect on a multi-layer security element 20 by deforming an inner layer of the security element 20, which carries a design layer 3, with the aid of a structural layer 5, whereby the structural layer 5 itself is reshaped lenticularly at its edge regions 15, the method described allows a series of reasonable and obvious modifications. For example, it is possible to provide further layers in the layer constructions which are either also deformed or not deformed.