Anti-slip, noise reducing pad directly applied and adhered to the back of flooring materials and method
11268287 · 2022-03-08
Assignee
Inventors
Cpc classification
E04F15/02172
FIXED CONSTRUCTIONS
B29C44/022
PERFORMING OPERATIONS; TRANSPORTING
E04F15/02044
FIXED CONSTRUCTIONS
E04F15/181
FIXED CONSTRUCTIONS
E04F15/10
FIXED CONSTRUCTIONS
E04F15/0215
FIXED CONSTRUCTIONS
E04F15/163
FIXED CONSTRUCTIONS
E04F15/087
FIXED CONSTRUCTIONS
E04F15/185
FIXED CONSTRUCTIONS
B29C44/355
PERFORMING OPERATIONS; TRANSPORTING
International classification
E04F15/16
FIXED CONSTRUCTIONS
E04F15/02
FIXED CONSTRUCTIONS
Abstract
Flooring material has an anti-slip, noise reducing pad directly self-adhered to a bottom surface. The pad is formed by applying a foamable PVC material is directly on the bottom surface of the flooring and heating the PVC material to foam the PVC material. The PVC material may then be cooled to form the pad with a definite formed shape having a resilient outer surface layer and a spongy foamy inner structure.
Claims
1. Flooring material comprising a substrate having a bottom surface with a backing layer for reducing slip and noise when the flooring material is in use, the backing layer comprising a polyvinyl chloride material adhered to the flooring without using other adhesive material, the polyvinyl chloride material having a foamed inner structure with a resilient outer surface layer, the polyvinyl chloride material being adapted and configured to foam to form the foamed inner structure when sufficiently heated, the polyvinyl chloride material being adapted and configured to produce the resilient outer surface layer when the polyvinyl material is sufficiently quenched after being heated.
2. The flooring material of claim 1 wherein the substrate comprises at least one of ceramic tile, granite, marble, laminate, engineered wood, solid wood, magnesium oxide, fiber board, stone and carpet.
3. The flooring material of claim 1 wherein the polyvinyl chloride material covers the bottom surface of the substrate in a pattern comprising one of dots and lines.
4. The flooring material of claim 1 further comprising a mesh adhered to the bottom surface of the substrate with the polyvinyl chloride material.
5. The flooring material of claim 4 wherein the mesh is at least one of a fiberglass mesh, a polyester mesh, a polyamide mesh, a spandex mesh, and a cotton mesh.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(8) The description that follows includes many examples of forming an anti-slip, noise reducing pad that may be directly self-adhered to the back of a flooring, ceramic tile, stone or carpet. In being directly self adhered to the back of the flooring material, no intermediate adhesives are used to adhere the backing layer to the flooring material or substrate. The examples that follow provide illustrative methods, and should not be deemed to be limiting in any sense.
(9) As will be described, the pad may be made from a pasty or tacky foamable PVC material that is directly coated on the back of the flooring material, and then foamed by heating. The PVC material may be applied, heated, foamed and cooled in a continuous process during the production of the flooring material. The PVC material may be applied and adhered on the back of the flooring material by showering, roll coating, brushing, spraying, transfer printing, screen printing, and dispensing the material on to the back of the flooring material. The PVC material that is coated on the back of the flooring material may be applied in a dotted pattern, a linear pattern, or a combination of both, and has a coverage rate of between 40 percent and 85 percent.
Embodiment 1
(10) A method of preparing an anti-slip, noise reducing pad adhered to the back of solid wood flooring includes the following steps:
(11) (1) first sanding the back of the solid wood flooring and then performing electrostatic elimination and dedusting of the flooring;
(12) (2) feeding the flooring with the cleaned back into an oven by double rolls, wherein a coating roller provided with dotted through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, moving the flooring while rotating the roller located above the flooring, and dripping the foamable PVC material in the roller onto the back of the flooring through the through-holes; and
(13) (3) heating up the oven by using a heating device in the oven, through the effect of the elevated temperature in the oven, foaming the PVC material coated on the back of the flooring to form an anti-slip, noise reducing pad adhered to the back of the flooring, taking the flooring out from the oven, and cooling the flooring naturally. The formed anti-slip, noise reducing pad is uniformly distributed on the back of the flooring as dots, and the coverage rate of the PVC material in the anti-slip, noise reducing pad on the back of the flooring is 40%.
Embodiment 2
(14) A method of preparing an anti-slip, noise reducing pad adhered to the back of a ceramic tile includes the following steps:
(15) (1) first sanding the back of the ceramic tile and then performing electrostatic elimination and dedusting of the tile;
(16) (2) feeding the ceramic tile with the cleaned back into an oven by double rolls, wherein a roller provided with dotted through-holes and linear through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, moving a flooring while rotating the roller located above the ceramic tile, and dripping the foamable PVC material in the roller onto the back of the ceramic tile through the through-holes; and
(17) (3) heating up the oven by using a heating device in the oven, through the effect of the elevated temperature in the oven, foaming the PVC material coated on the back of the ceramic tile to form an anti-slip, noise reducing pad adhered to the back of the ceramic tile, taking the ceramic tile out from the oven, and cooling the ceramic tile naturally. The formed anti-slip, noise reducing pad is distributed on the back of the ceramic tile as dots and lines, and the coverage rate of the PVC material in the anti-slip noise reducing pad on the back of the ceramic tile is 85%.
Embodiment 3
(18) A method of preparing an anti-slip noise reducing pad adhered to the back of a ceramic tile includes the following steps:
(19) (1) performing electrostatic elimination and dedusting of the back of the carpet;
(20) (2) feeding the carpet with the cleaned back into an oven by double rolls, wherein a roller provided with linear through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, moving a flooring while rotating the roller located above the carpet, and dripping the foamable PVC material in the roller onto the back of the carpet through the through-holes; and
(21) (3) heating up the oven by using a heating device in the oven, through the effect of the elevated temperature in the oven, foaming the PVC material coated on the back of the carpet to form an anti-slip noise reducing pad adhered to the back of the carpet, taking the carpet out from the oven, and cooling the carpet naturally. The formed anti-slip, noise reducing pad is distributed on the back of the carpet as lines, and the coverage rate of the PVC material in the anti-slip, noise reducing pad on the back of the carpet is 70%.
Embodiment 4
(22) A method of preparing an anti-slip, noise reducing pad adhered to the back of laminated, engineered flooring includes the following steps:
(23) (1) first sanding the back of the laminated engineered flooring and then performing electrostatic elimination and dedusting of the flooring;
(24) (2) feeding the flooring with the cleaned back into an oven by double rolls, wherein a roller provided with dotted through-holes and/or linear through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, moving the flooring while rotating the roller located above the flooring, and dripping the foamable PVC material in the roller onto the back of the flooring through the through-holes; and
(25) (3) through the effect of the elevated temperature in the oven, foaming the PVC material coated on the back of the flooring to form an anti-slip, noise reducing pad adhered to the back of the flooring, taking the flooring out from the oven, cooling the flooring in a cooling device, and then taking the flooring out from the cooling device.
Embodiment 5
(26) A method of preparing an anti-slip, noise reducing pad adhered to the back of flooring includes the following steps:
(27) (1) first sanding the back of the flooring and then performing electrostatic elimination and dedusting of the flooring;
(28) (2) covering a layer of fiberglass mesh, polyester mesh, polyamide mesh, spandex mesh, or cotton mesh directly on the back of the flooring without using any adhesive;
(29) (3) feeding the flooring overlaid with a layer of mesh into an oven by double rolls, wherein a roller provided with dotted through-holes and/or linear through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, moving the flooring while rotating the roller located above the flooring, and dripping the foamable PVC material in the roller onto the back of the flooring through the through-holes; and
(30) (4) heating up the oven by using a heating device in the oven, through the effect of the elevated temperature, foaming the PVC material coated on the back of the flooring to form an anti-slip, noise reducing pad adhered to the back of the flooring, taking the flooring out from the oven, cooling the flooring in a cooling device, and then taking the flooring out from the cooling device.
Embodiment 6
(31) A method of preparing an anti-slip, noise reducing pad adhered to the back of a ceramic tile includes the following steps:
(32) (1) directly roll-coating a layer of a foamable PVC material on the back of the ceramic tile; and foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad adhered to the back of the ceramic tile.
Embodiment 7
(33) A method of preparing an anti-slip, noise reducing pad adhered to the back of LVT flooring/WPC flooring includes the following steps:
(34) (1) first sanding the back of the flooring and then performing electrostatic elimination and dedusting of the flooring;
(35) (2) covering a layer of mesh on the back of the flooring; and
(36) (3) spraying a layer of a foamable PVC material on the mesh; and foaming by heating the PVC material to form an anti-slip, noise reducing pad self-adhered to the back of the flooring.
Embodiment 8
(37) A method of preparing an anti-slip, noise reducing pad adhered to the back of SPC flooring includes the following steps:
(38) (1) showering a foamable PVC material on the back of the SPC flooring to form a layer of the foamable PVC material on the back of the SPC flooring; and
(39) (2) foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad adhered to the back of the flooring.
Embodiment 9
(40) A method of preparing an anti-slip, noise reducing pad adhered to the back of SPC flooring includes the following steps:
(41) (1) sanding the back of the flooring and then performing electrostatic elimination and dedusting of the SPC flooring; and
(42) (2) transfer-printing a layer of a foamable PVC material on the cleaned back of the SPC flooring; and
(43) (3) foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad adhered to the back of the flooring. By means of transfer-printing, various patterns and figures can be formed on the anti-slip, noise reducing pad.
Embodiment 10
(44) A method of preparing an anti-slip, noise reducing pad adhered to the back of a carpet includes the following steps:
(45) (1) brush-coating a layer of a foamable PVC material directly on the back of the carpet; and
(46) (2) foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad adhered to the back of the carpet.
Embodiment 11
(47) A method of preparing an anti-slip, noise reducing pad adhered to the back of HDPC flooring includes the following steps:
(48) (1) roll-coating a layer of a foamable PVC material on the back of the HDPC flooring; and
(49) (2) foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad adhered to the back of the flooring.
Embodiment 12
(50) A method of preparing an anti-slip, noise reducing pad adhered to the back of WPC flooring includes the following steps:
(51) (1) first sanding the back of the WPC flooring and then performing electrostatic elimination and dedusting of the flooring;
(52) (2) feeding the flooring with the cleaned back into an oven by double rolls, wherein a roller provided with dotted through-holes and/or linear through-holes is disposed at an inlet end of the oven, adding a foamable PVC material into the roller, wherein color powder is added into the foamable PVC material in advance for coloring, moving the flooring while rotating the roller located above the flooring, and dripping the foamable PVC material in the roller onto the back of the flooring through the through-holes; and
(53) (3) heating up the oven by using a heating device in the oven, foaming the PVC material coated on the back of the flooring at the temperature of 140° C. to form an anti-slip, noise reducing pad directly self-adhered to the back of the flooring, taking the flooring out from the oven, and cooling the flooring naturally. By using this method, various patterns and figures can be formed on the anti-slip, noise reducing pad.
(54) By way of example and not in any limiting sense, in connection with the foregoing example or any of the methods and examples described herein, the foamable PVC material may comprise (%/weight):
(55) TABLE-US-00001 Resin emulsion PVC 72%/wgt CaHCO.sub.3 0.45%/wgt Foamer AC 0.45%/wgt Plasticizer DOP 2.0%/wgt PE wax 1.0%/wgt G60 0.9%/wgt Stabilizer tribasic lead sulfate 3.0%/wgt Stabilizer dibasic lead sulfite 0.2%/wgt Stabilizer HSt 0.5%/wgt MBS 5.0%/wgt ACR 3.0%/wgt CaCO.sub.3 10%/wgt Color powder 1.5%/wgt
Embodiment 13
(56) A method of preparing an anti-slip, noise reducing pad directly self-adhered to the back of SPC flooring includes the following steps:
(57) (1) first sanding the back of the flooring and then performing electrostatic elimination and dedusting of the flooring; and
(58) (2) screen-printing a layer of foamable PVC material on the back of the cleaned back of the SPC flooring, wherein color paste is added into the foamable PVC material in advance for coloring, and
(59) (3) foaming the PVC material by heating the flooring to 200° C., so as to form an anti-slip, noise reducing pad directly self-adhered to the back of the flooring. By using the screen-printing method, various patterns and figures can be formed on the anti-slip, noise reducing pad.
(60) By way of example and not in any limiting sense, in connection with the foregoing example or any of the methods and examples described herein, the foamable PVC material may comprise (%/weight):
(61) TABLE-US-00002 Resin emulsion PVC 80%/wgt Foamer AC .sup. 3%/wgt Stabilizer tribasic lead sulfate 3.0%/wgt Dibasic lead stearate 0.2%/wgt PE wax 0.3%/wgt Lubricant pbst 0.5%/wgt Filler CaCO.sub.3 12%/wgt Color concentrate 0.8%/wgt
Embodiment 14
(62) A method of preparing an anti-slip, noise reducing pad adhered to the back of HDPC flooring includes the following steps:
(63) (1) first sanding the back of the HDPC flooring and then performing electrostatic elimination and dedusting of the flooring; and
(64) (2) dispensing a layer of a foamable PVC material on the cleaned back of the SPC flooring; and
(65) (3) foaming the PVC material by heating the PVC material to form an anti-slip, noise reducing pad directly self-adhered to the back of the flooring. By using the dispensing method, various patterns and figures can be formed on the anti-slip, noise reducing pad.
Embodiment 15
(66) As shown in
Embodiment 16
(67) As shown in
Embodiment 17
(68) As shown in
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(70) Further embodiments can be envisioned to one of ordinary skill in the art after reading this disclosure. In other embodiments, combinations or sub-combinations of the above-disclosed invention can be advantageously made. The example arrangements of components are shown for purposes of illustration and it should be understood that combinations, additions, re-arrangements, and the like are contemplated in alternative embodiments of the present invention. Thus, while the invention has been described with respect to exemplary embodiments, one skilled in the art will recognize that numerous modifications are possible.