HEAT TRANSPORT SYSTEM

Abstract

Provided is a heat transport device that has high heat transport capability despite being small and lightweight. The heat transport device includes a flat plate-shaped base having a heat receiving surface that contacts a heating element, multiple flow paths that extend in the base so as to be approximately in parallel with the heat receiving surface, and working fluid sealed in the flow paths. The base is formed of a photocurable synthetic resin. The flow paths have multiple concave grooves formed on the inner circumferential walls of circular main flow paths. The grooves are disposed so as to be inclined with respect to the axial direction of the flow paths.

Claims

1. A heat transport device comprising: a base having a heat receiving surface that contacts a heating element; a plurality of flow paths that extend in the base so as to be approximately in parallel with the heat receiving surface; and working fluid sealed in the flow paths, wherein the base is formed of a photocurable synthetic resin, the flow paths have a plurality of concave grooves formed on inner circumferential walls of circular tubular main flow paths, and the grooves are disposed so as to be inclined with respect to an axial direction of the flow paths.

2. A heat transport device comprising: a base having a heat receiving surface that contacts a heating element; a heat receiving space formed in the base; a plurality of heat pipes extending from a surface opposite to the heat receiving surface of the base; flow paths disposed in the heat pipes and communicating with the heat receiving space; and working fluid sealed in the heat receiving space, wherein the base and the heat pipes are formed of a photocurable synthetic resin, the flow paths have a plurality of concave grooves formed on inner circumferential walls of circular tubular main flow paths, and the grooves are disposed so as to be inclined with respect to an axial direction of the flow paths.

3. The heat transport device of claim 1, wherein D≤30° is satisfied where D represents an inclination angle of the grooves with respect to the axial direction of the flow paths.

4. The heat transport device of claim 1, wherein the main flow paths of the flow paths each have a diameter of 1.5 mm or less.

5. The heat transport device of claim 1, wherein the grooves each have a radius of 0.25 mm or less.

6. The heat transport device of claim 1, wherein a film having a higher thermal conductivity than the synthetic resin is formed as an inner surface.

7. The heat transport device of claim 1, wherein a film having a higher thermal conductivity than the synthetic resin is formed as an outer surface.

8. The heat transport device of claim 2, wherein D≤30° is satisfied where D represents an inclination angle of the grooves with respect to the axial direction of the flow paths.

9. The heat transport device of claim 2, wherein the main flow paths of the flow paths each have a diameter of 1.5 mm or less.

10. The heat transport device of claim 2, wherein the grooves each have a radius of 0.25 mm or less.

11. The heat transport device of claim 2, wherein a film having a higher thermal conductivity than the synthetic resin is formed as an inner surface.

12. The heat transport device of claim 2, wherein a film having a higher thermal conductivity than the synthetic resin is formed as an outer surface.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0026] FIG. 1 is a perspective view schematically showing the appearance of a heat transport device according to a first embodiment of the present invention;

[0027] FIG. 2 is a front view of the heat transport device shown in FIG. 1;

[0028] FIG. 3 is an exploded perspective view of the heat transport device shown in FIG. 1;

[0029] FIG. 4 is a sectional view taken along line A-A of the heat transport device shown in FIG. 2;

[0030] FIG. 5 is a sectional view taken along line B-B of the heat transport device shown in FIG. 2;

[0031] FIG. 6 is a perspective view schematically showing the appearance of a heat transport device according to a second embodiment of the present invention;

[0032] FIG. 7 is a plan view of the heat transport device shown in FIG. 6;

[0033] FIG. 8 is a front view of the heat transport device shown in FIG. 6;

[0034] FIG. 9 is a sectional view taken along line A-A of the heat transport device shown in FIG. 7;

[0035] FIG. 10 is a sectional view taken along line B-B of the heat transport device shown in FIG. 7;

[0036] FIG. 11 is a perspective view taken along line C-C of the heat transport device shown in FIG. 8;

[0037] FIG. 12 is a sectional view taken along line C-C of the heat transport device shown in FIG. 8; and

[0038] FIG. 13 is an enlarged view schematically showing the flow paths of the heat transport device shown in FIG. 11.

DESCRIPTION OF EMBODIMENTS

First Embodiment

[0039] Now, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0040] A heat transport device according to the present embodiment is assumed to be incorporated into a mobile electronic device, such as a smartphone, portable information terminal, tablet terminal, or notebook personal computer. As shown in FIGS. 1 to 3, a heat transport device 10 includes a rectangular parallelepiped base 11 in the shape of a flat plate and first and second sealing members 12 and 13 disposed such that both sides in the side direction of the base 11 are sandwiched therebetween. The base 11 and the first and second sealing members 12 and 13 are formed of a photocurable synthetic resin. Among methods for forming a three-dimensional object is vat photopolymerization (stereolithography), which forms a three-dimensional object by selectively solidifying a photocurable synthetic resin. In the present embodiment, the base 11 and the first and second sealing members 12 and 13 are formed by stereolithography using acrylate-based monomers having a heat resistance of 250° C. as a material. Note that the bottom surface of the base 11 serves as a heat receiving surface 11A.

[0041] Multiple flow paths 14 extend approximately in parallel with the heat receiving surface 11A in the base 11. The flow paths 14 are formed so as to penetrate the base 11 from one side to the other side in the left-right direction in FIG. 2.

[0042] The first and second sealing members 12 and 13 are in the shape of a rectangular parallelepiped. Mounting holes 12A and 13A are formed so as to penetrate the first and second sealing members 12 and 13, respectively, in the up-down direction in FIG. 2. The mounting holes 12A and 13A are used to mount the heat transport device 10 on a circuit board having a semiconductor device or the like acting as a heating element mounted thereon. The first and second sealing members 12 and 13 include seal protrusions 12B and 13B, respectively, that correspond to the number of flow paths 14 and protrude in the left-right direction in FIG. 2. Specifically, the first sealing member 12 includes the seal protrusions 12B protruding rightward, and the second sealing member 13 includes the seal protrusions 13B protruding leftward. The seal protrusions 12B and 13B are in the shape of a cylinder whose tip is a spherical surface. The diameter of the cylindrical seal protrusions 12B and 13B is approximately the same as the diameter of the main flow paths of the flow paths 14.

[0043] The flow paths 14 will be described in detail below. As shown in FIGS. 4 and 5, the flow paths 14 are disposed in parallel at equal intervals in the base 11. In the present embodiment, five flow paths 14 are disposed in the base 11. The number of flow paths 14 can be increased and reduced in accordance with the amount of heat generated by the heating element. The flow paths 14 has multiple concave grooves 14A formed on the inner circumferential walls of the circular tubular main flow paths. The grooves 14A are disposed so as to be inclined with respect to the axial direction of the flow paths 14. Specifically, the inclination angle D (lead angle) of the grooves 14A with respect to the axial direction of the flow paths 14 satisfies the following condition expression (1).

D≤30°  (1)

[0044] In the present embodiment, the main flow paths of the flow paths 14 each have a diameter of 1.0 mm, and the grooves 14A consist of 8 grooves and each have a radius of 0.2 mm. Both the main flow paths and grooves 14A of the flow paths 14 are preferably thin in terms of reduction in size and improvement in the heat transport capability of the heat transport device 10. In the present embodiment, the dimensions of the main flow paths and grooves 14A of the heat transport device 10 are determined considering the ease of production. In the heat transport device 10, the base 11 is formed of the photocurable synthetic resin and therefore the diameter of the main flow paths and the radius of the grooves 14A can be further reduced.

[0045] The inner surfaces and outer surfaces of the base 11 and the first and second sealing members 12 and 13 are electroless-plated with nickel, copper, or the like. The thermal conductivity of the electroless plating is higher than the thermal conductivity of the synthetic resin, which is the material of these members, and therefore the heat dissipation capability of the heat transport device 10 is improved.

[0046] The assembly of the members described above will be described briefly. First, the first sealing member 12 is joined to the base 11 by fitting the seal protrusions 12B of the first sealing member 12 to the flow paths 14. Then, working fluid is injected into the flow paths 14 of the base 11. Examples of the working fluid include pure water, alcohols such as ethanol, fluorine-based inert liquid, ammonia, and CFC substitute such as HFC-134a. Then, the second sealing member 13 is joined to the base 11 by fitting the seal protrusions 13B of the second sealing member 13 to the flow paths 14. Thus, the working fluid is sealed in the flow paths 14 of the heat transport device 10.

[0047] Next, heat transport performed by the heat transport device 10 according to the present embodiment will be described. The heat transport device 10 is mounted on the circuit board such that the heat receiving surface 11A of the base 11 contacts the semiconductor device, such as SoC. When the semiconductor device generates heat, the heat is transmitted to the working fluid in the flow paths 14 through the heat receiving surface 11A. As a result, the saturated vapor pressure of the working fluid sealed in the flow paths 14 is increased, and the working fluid is transferred from the liquid phase to the gaseous phase. The working fluid absorbs the heat transmitted through the heat receiving surface 11A as the latent heat of vaporization and thus suppresses an increase in the temperature of the heat receiving surface 11A. On the other hand, the working fluid transferred to the gaseous phase is diffused in the flow paths 14 and condensed in areas having a relatively low temperature. At this time, the latent heat of the working fluid is released. The condensed working fluid is refluxed to near the heat receiving surface 11A through the grooves 14A by the capillary force. Due to the circulation of the working fluid using such a phase change, the heat is favorably transported.

[0048] Thus, the heat transport device 10 according to the present embodiment is able to efficiently diffuse the heat released from the semiconductor device incorporated into the mobile electronic device, such as the smartphone, portable information terminal, tablet terminal, or notebook personal computer, as well as to diffuse the heat in the ambient air. As a result, the heat transport device 10 according to the present embodiment is able to suppress an increase in the temperature caused by the heat generation of the semiconductor device and thus to suppress a reduction in the performance or reliability of the mobile electronic device.

Second Embodiment

[0049] Next, a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0050] Electronic devices, industrial machines, automobiles, and the like include many semiconductor devices having high current density, such as a semiconductor integrated circuit, an LED device, and a power semiconductor. A heat transport device according to the present embodiment assumes the purpose of efficiently dissipating heat generated by such a semiconductor device. As shown in FIGS. 6 to 8, a heat transport device 20 includes a rectangular parallelepiped base 21 in the shape of a flat plate and multiple heat pipes 22 disposed so as to extend upward from the upper surface of the base 21. The base 21 and heat pipes 22 are integrally formed of a photocurable synthetic resin. As in the above-mentioned first embodiment, the heat transport device 20 is also formed by stereolithography using acrylate-based monomers having a heat resistance of 250° C. as a material. Note that the bottom surface of the base 21 serves as a heat receiving surface 21A.

[0051] A heat receiving space 23 is formed in the base 21. In the present embodiment, the heat receiving space 23 is a rectangular prism-shaped space formed below the heat pipes 22 and communicates with working fluid injection holes 23A and 23B disposed on the front surface of the base 21. Also, mounting holes 21B and 21C are formed in the base 21 so as to penetrate the base 21 in the up-down direction in FIG. 8. The mounting holes 21B and 21C are used to mount the heat transport device 20 on a circuit board or the like having a heating element mounted thereon.

[0052] As shown in FIGS. 9 and 10, flow paths 24 communicating with the heat receiving space 23 are formed in the heat pipes 22. The flow paths 24 are formed from the upper surface of the heat receiving space 23 to the tips of the heat pipes 22 in the up-down direction in FIG. 9. All the flow paths 24 formed in the multiple heat pipes 22 communicate with the heat receiving space 23.

[0053] The flow paths 24 will be described in detail below. As shown in FIGS. 9 to 13, the flow paths 24 have multiple concave grooves 24A formed on the inner circumferential walls of the circular tubular main flow paths. The grooves 24A are disposed so as to be inclined with respect to the axial direction of the flow paths 24. As in the heat transport device 10 according to the first embodiment, the inclination angle D (lead angle) of the grooves 14A with respect to the axial direction of the flow paths 14 satisfies the following condition expression (1).

D≤30°  (1)

[0054] In the present embodiment, the main flow paths of the flow paths 24 each have a diameter of 1.5 mm, and the grooves 24A consist of 8 grooves and each have a radius of 0.25 mm. Both the main flow paths and grooves 24A of the flow paths 24 are preferably thin in terms of reduction in size and improvement in the heat transport capability of the heat transport device 20. In the present embodiment, the dimensions of the main flow paths and grooves 24A of the heat transport device 20 are determined considering the ease of production. In the heat transport device 20, both the base 21 and heat pipes 22 are formed of the photocurable synthetic resin and therefore the diameter of the main flow paths and the radius of the grooves 24A can be further reduced.

[0055] The inner surfaces and outer surfaces of the base 21 and heat pipes 22 are electroless-plated with nickel, copper, or the like. The thermal conductivity of the electroless plating is higher than the thermal conductivity of the synthetic resin, which is the material of these members, and therefore the heat dissipation capability of the heat transport device 20 is improved.

[0056] In the heat transport device 20 described above, working fluid is injected into the heat receiving space 23 through the working fluid injection holes 23A and 23B of the base 21 and then is sealed in heat receiving space 23 by closing the working fluid injection holes 23A and 23B. Note that a separate condenser (radiator) may be connected to the working fluid injection holes 23A and 23B through tubes in place of closing the working fluid injection holes 23A and 23B.

[0057] Next, heat transport performed by the heat transport device 20 according to the present embodiment will be described. The heat transport device 20 is mounted on the circuit board such that the heat receiving surface 21A of the base 21 contacts the semiconductor device, such as a power semiconductor. When the semiconductor device generates heat, the heat is transmitted to the working fluid in the heat receiving space 23 through the heat receiving surface 21A. As a result, the saturated vapor pressure of the working fluid sealed in the heat receiving space 23 is increased, and the working fluid is transferred from the liquid phase to the gaseous phase. The working fluid absorbs the heat transmitted through the heat receiving surface 21A as the latent heat of vaporization and thus suppresses an increase in the temperature of the heat receiving surface 21A. On the other hand, the working fluid transferred to the gaseous phase is diffused in the flow paths 24 and condensed in areas having a relatively low temperature. In the heat transport device 20 according to the present embodiment, the working fluid condenses at the tips of the heat pipes 22 and releases the latent heat. The condensed working fluid is refluxed into the heat receiving space 23 through the grooves 24A by the capillary force. Due to the circulation of the working fluid using such a phase change, the heat is favorably transported.

[0058] Thus, the heat transport device 20 according to the present embodiment is able to efficiently diffuse the heat released from the semiconductor device, electronic component, or the like incorporated into the electronic device, industrial machine, automobile, or the like in the ambient air.

[0059] In the above embodiments, assuming that the heating element is a flat semiconductor device, the heat receiving surface 11A or 21A of the base 11 or 21 is formed so as to be flat. However, the shape of the heat receiving surface need not be flat. If the heating element has a curved surface, the heat receiving surface 11A or 21A may be formed as a curved surface. Since the bases 11 and 21 according to the above embodiments are formed of the photocurable synthetic resin, the heat receiving surface 11A or 21A can be formed into any shape by stereolithography. By forming the heat receiving surface of the base into a shape according to the shape of the heating element, as described above, the heating element and base are closely contacted and thus the heat of the heating element is efficiently transmitted to the base. If multiple heating elements are mounted on a circuit board or the like, the heat receiving surface of the base may be formed into a shape according to the shapes of the heating elements. By contacting the heat transport device closely with the multiple heating elements, the single heat transport device is able to efficiently transport and dissipate heat from the multiple heating elements.

[0060] The heat transport devices according to the above embodiments transport the heat from the heating element using the circulation of the working fluid based on the phase transition and thus are able to transport the heat more efficiently than heat transport using heat conduction in a solid performed by a typical heat sink or the like. While a heat transport device having such a configuration is conventionally formed by metalworking, the heat transport devices according to the above embodiments are formed of the photocurable synthetic resin. Thus, the heat transport devices can be reduced in size and weight. Also, the grooves of the flow paths are inclined. Thus, the reflux of the working fluid is promoted, and the heat transport efficiency is improved while suppressing dryout. The heat transport device according to the present invention has high heat transport capability despite being small and lightweight.

[0061] The present invention can be used for the purpose of suppressing a reduction in performance or reliability due to heat generation of a semiconductor device incorporated into a mobile electronic device such as a smartphone, or a semiconductor device incorporated into an industrial machine, automobile, or the like, or efficiently cooling such a semiconductor device.