Microetch Neutralizer Chemistry For Ni-Au Plating Defect Elimination

Abstract

A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process.

Claims

1. A neutralizing composition comprising: a reducing agent, a chelator; and a pH adjuster.

2. The neutralizing composition of claim 1, wherein the reducing agent is a carbocyclic acid selected from the group consisting of tartaric acid, acetic acid, malic acid, malonic acid, ascorbic acid, lactic acid, succinic acid, and salts thereof.

3. The neutralizing composition of claim 1, wherein the chelator is comprised of citric acid, ethylene diamine tetra-acetic acid (EDTA), or other divalent cation chelator.

4. The neutralizing composition of claim 1, wherein the reducing agent is present in an amount in the range of 12-18 wt. %, the chelator in an amount in the range of 11-15 wt. %, and the pH adjuster in an amount to bring the pH of the composition to a pH of about 2.

5. The neutralizing composition of claim 4, wherein the pH adjuster is selected from the group consisting of sodium hydroxide, potassium hydroxide, and mixtures thereof.

6. The neutralizing composition of claim 1, wherein the reducing agent comprises ascorbic acid, the chelator comprises citric acid and the pH adjuster is selected from the group consisting of sodium hydroxide, potassium hydroxide, and mixtures thereof.

7. A composition comprising: ascorbic acid in an amount of 15 wt. %, citric acid in an amount of 12 wt. %, and sodium hydroxide in an amount sufficient to achieve a pH of the composition of about 2.

8. A process of finish plating a copper substrate bussed to stainless steel with at least one selected from the group consisting of nickel and gold, comprising: recovering a microetched copper substrate bussed to stainless steel; cleaning the copper substrate with an alkaline solution comprising permanganate ions; and contacting a neutralizing composition with the cleaned copper substrate, wherein the neutralizing composition comprises the composition of claim 1, and thereafter plating on the copper substrate at least one selected from the group consisting of nickel and gold.

9. A process of finish plating a copper substrate bussed to stainless steel with at least one selected from the group consisting of nickel and gold, comprising: recovering a microetched copper substrate bussed to a stainless steel; cleaning the copper substrate with an alkaline solution comprising permanganate ions; and contacting a neutralizing composition with the cleaned copper substrate, wherein the neutralizing composition comprises the composition of claim 4, and thereafter plating on the copper substrate at least one selected from the group consisting of nickel and gold.

10. A process of finish plating a copper substrate bussed to stainless steel with at least one selected from the group consisting of nickel and gold, comprising: recovering a microetched copper substrate bussed to a stainless steel; cleaning the copper substrate with an alkaline solution comprising permanganate ions; and contacting a neutralizing composition with the cleaned copper substrate, wherein the neutralizing composition comprises the composition of claim 7, and thereafter plating on the copper substrate at least one selected from the group consisting of nickel and gold.

11. The process of claim 10, wherein the contacting step is carried out at a temperature up to about 50° C.

12. The process of claim 11, wherein the contacting step does not exceed about 30 seconds.

13. The process of claim 12, wherein the contacting step is performed as a continuing process and further comprising performing the contacting step at a speed of 3 meters/minute.

14. The process of claim 10, wherein the permanganate is neutralized in about 1 second.

15. The process of claim 10, wherein nickel is plated directly on the copper substrate to form a nickel plating and the gold is plated on the nickel plating.

16. A process of finish plating a copper substrate bussed to stainless steel with a nickel plating, followed by a gold plating over the nickel plating, comprising: recovering a microetched copper substrate bussed to a stainless steel; cleaning the copper substrate with an alkaline solution comprising permanganate ions; and contacting a neutralizing composition with the cleaned copper substrate, wherein the neutralizing composition comprises ascorbic acid in an amount of 15 wt. %, citric acid in an amount of 12 wt. %, and sodium hydroxide in an amount sufficient to achieve a pH of the composition of about 2, and thereafter plating the nickel directly on the copper substrate and thereafter plating the gold on the nickel plating.

17. The process of claim 16, further comprising performing the contacting step at a temperature up to about 50° C. for a time of about 30 seconds.

18. The process of claim 16, wherein the step of contacting is performed continuously.

19. The process of claim 16, wherein the permanganate ions are neutralized in less than one second.

20. The process of claim 16, wherein yield loss in plating are reduced below 1%.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 (Prior Art) is a schematic representation of assault on stainless steel surface by oxidative reactions due to chrome etch and plasma clean of the stainless steel.

[0015] FIG. 2 is a photomicrograph of a copper substrate electroplated with Ni—Au, illustrating formation of voids in the plating.

[0016] FIG. 3 is a schematic representation of the galvanic couple formed between the stainless steel and the copper and the presence of a residue formed by neutralization with oxalic acid.

[0017] FIG. 4A is a photograph of a copper pad with residue using a neutralizer or composition including oxalic acid.

[0018] FIG. 4B is a photograph of a copper pad without residue utilizing the neutralizer or composition disclosed herein.

[0019] FIG. 5 is a graphical representation of % defects plotted against the systems utilizing: (1) oxalic acid without plasma treatment, (2) oxalic acid with plasma treatment, (3) the formulation of the present disclosure, and (4) the formulation of the present disclosure plus plasma treatment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] As shown in FIG. 1 (Prior Art), the assault on stainless steel surfaces are oxidative reactions due to chrome etch and plasma clean of the stainless steel. Historically, stainless steel passivation has been accomplished using mineral acids (HNO.sub.3). Other mineral acids, such as hydrofluoric acid and sulfuric acid have also been used. Used alone, organic acids such as oxalic acid, citric acid and ethylene-diamine-tetra-acetic acid (EDTA) used in the prior art processes must be used at elevated concentration and temperature for extended times, such as approximately 1-10 wt. %, 21°-80° C., for 5-30 minutes, respectively.

[0021] While mineral acids have been used historically, the typical mineral acid process will etch away conductors on the stainless steel rendering it unsuitable, which has led to the use of organic acids. However, the typical organic acid, oxalic acid, forms insoluble salts as described above and thus is undesirable.

[0022] As shown in the schematic representation of FIG. 3, the stainless steel 10 and copper 12 form a galvanic couple in the presence of oxalic acid. This can occur in a printed circuit board 13 comprised of dielectric thermosetting or composite materials, such as a polymer containing fibrous reinforcement. The copper is anodic to the stainless steel by several hundred millivolts (a very large value in electrochemical terms) which drives etching of the copper surface, primarily on the stainless steel side. This results in copper ions being emitted into the oxalic acid solution and the formation of the insoluble residue 14. FTIR analysis of residue 14 confirmed the residue 14 a match to hydrated copper oxalate (“moolooite”).

[0023] As shown in FIG. 4A, a copper pad 20 has a residue 22 deposited thereon utilizing the oxalic acid as a neutralizer. By contrast, the neutralizer formulation according to the present embodiment leaves no residue on pad 24, as shown in FIG. 4B.

[0024] Turning to the inventive neutralizer formulation or composition of the present disclosure, the composition is comprised of mild organic acids. Ascorbic acid, citric acid and a pH adjuster, such as sodium hydroxide, to control pH to about 2.0 can be used. The microetch process utilizes a cleaning agent to remove the soot, wherein the cleaning agent comprises permanganate ions. The neutralizer according to the present embodiments can neutralize the permanganate ions in about 1 second. The neutralizer composition of the present disclosure comprises a mild organic acid, such as a carboxylic acid selected from the group consisting of tartaric acid, acetic acid, malic acid, malonic acid, ascorbic acid, lactic acid, succinic acid, and salts thereof, a chelator, such as citric acid, and a pH adjusting agent, such as sodium hydroxide, potassium hydroxide and lithium hydroxide. Typically, sodium hydroxide, potassium hydroxide and mixtures thereof are used. Sodium hydroxide is preferred. As the mild organic acid can be used ascorbic acid, which acts as a reducing agent. As the chelator can be used citric acid, or equivalent. Adjustment of the pH by the base should be in an amount effective to bring the pH to about 2. The mild organic acid can be present in an amount of from 12 to 18 wt. %, the chelator can be present in an amount of from 11 to 15 wt. % and sufficient pH adjuster to bring the pH of the composition to about 2. In some embodiment, use of the formulation according to the present disclosure is carried out at temperatures up to and including 50° C. for a period of about 30 seconds. In other embodiments, use of the formulation according to the present disclosure is carried out at temperatures above 50° C. Conventional surfactants may be included in the compositions. Such surfactants include ionic, non-ionic and amphoteric surfactants. Among the ionic surfactant, cationic and anionic surfactants can be used. Mixtures of the surfactants can also be used. Surfactants may be included in the compositions in amounts between 0.001 g/L to 50 g/L.

[0025] The neutralizer formulation of the present disclosure permits much shorter processing times than were experienced by prior art formulations. The shorter processing times allowed by the chemistry of the formulations of the disclosure enable high manufacturing line throughput. Processing times of 30 seconds are attainable. The current state of the art utilizing organic acids, when processing at temperatures less than 50° C., require a minimum immersion time of 60 minutes which would not likely lend itself well to a continuous process, but rather would likely require a batch-based immersion tank. In contrast, the neutralizer composition of the present disclosure can effectively neutralize the permanganate ions present in the soot cleaning chemistry almost instantaneously, and within one second of contact, at temperatures of about 50° C. After neutralization, the copper substrate can be treated with plasma to further prepare the substrate for Ni—Au plating.

[0026] FIG. 5 is a graphic representation of the remarkable and surprising decrease in defects of the Ni—Au electroplating when the neutralizer of this disclosure is utilized in place of the oxalic acid neutralizer 30 of the prior art. Even in the absence of the best case scenario of utilizing plasma treatment in combination with the present formulation 36, the present formulation 34 exhibits unexpected improvement over the oxalic acid neutralizer of the prior art even when combined with plasma treatment 32, such that the disclosed formulation of the embodiments produces an unexpected reduction in defects in the subsequent Ni—Au plating.

EXAMPLE

[0027] The following example is provided for illustration purposes only and is not intended to limit the scope or teaching of the invention in any way.

[0028] A formulation of neutralizer comprising ascorbic acid as the reducing agent in an amount of 15 wt. %, a chelator comprising citric acid in an amount of about 12 wt. %, and sufficient base, such as sodium hydroxide, to adjust the pH to about 2, was made. In one example the formulation was heated to temperatures up to and including about 50° C. for a time of about 30 seconds to form a residue free copper surface and neutralizes permanganate from a chrome etch. It also conditions stainless steel for good passivation. Subsequent Ni—Au plating on the residue free copper surface results in defects less than 10%. When combined with a plasma treatment before plating, defects were reduced to less than 0.1%. When utilized in a continuous process, machine throughput was increased to 3 meters per minute.

[0029] While we have described certain embodiments, it should be understood that such embodiments are illustrative only and not limiting, as one of ordinary skill in the art, to which this disclosure is directed, will understand that other embodiments of this disclosure and modifications of the disclosed embodiments can be achieved without the exercise of invention.