SILANE-MODIFIED DIALLYL BISPHENOL COMPOUND AND PREPARATION METHOD THEREOF

Abstract

A silane-modified diallyl bisphenol compound and a preparation method thereof are provided. A diallyl bisphenol compound with hydroxyl groups at both ends and a silane with at least one alkoxy group and at least one functional group having a crosslinkable double bond at the ends are reacted, so as to obtain a silane-modified diallyl bisphenol compound with a functional group having a crosslinkable double bond at the end.

Claims

1. A silane-modified diallyl bisphenol compound having a structure represented by formula (1): ##STR00009## in formula (1), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group having a crosslinkable double bond, and n+m is a positive integer of 1 to 8.

2. The silane-modified diallyl bisphenol compound of claim 1, wherein the functional group having the crosslinkable double bond comprises an allyl group, a vinyl group, an acrylate, or a methacrylate.

3. The silane-modified diallyl bisphenol compound of claim 1, wherein n+m is 2 or 3.

4. A silane-modified diallyl bisphenol compound having a structure represented by formula (2): ##STR00010## in formula (2), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R3 is a functional group having a crosslinkable double bond, and a is a positive integer of 1 to 4.

5. The silane-modified diallyl bisphenol compound of claim 4, wherein the functional group having the crosslinkable double bond comprises an allyl group, a vinyl group, an acrylate, or a methacrylate.

6. A preparation method of a silane-modified diallyl bisphenol compound, wherein a synthesis reaction formula thereof is represented by reaction formula (1): ##STR00011## in reaction formula (1), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group having a crosslinkable double bond, n+m is a positive integer of 1 to 8, and a is a positive integer of 1 to 4.

7. The preparation method of the silane-modified diallyl bisphenol compound of claim 6, wherein the functional group having the crosslinkable double bond comprises an allyl group, a vinyl group, an acrylate, or a methacrylate.

8. The preparation method of the silane-modified diallyl bisphenol compound of claim 6, wherein n+m is 2 or 3.

9. The preparation method of the silane-modified diallyl bisphenol compound of claim 6, wherein a reaction temperature of reaction formula (1) is 100° C. to 180° C.

10. The preparation method of the silane-modified diallyl bisphenol compound of claim 6, wherein calculated based on a mole ratio of a hydroxyl group of a diallyl bisphenol compound to an alkoxy group containing a dialkoxysilane with a functional group having a crosslinkable double bond, a ratio of the diallyl bisphenol compound to the dialkoxysilane with the functional group having the crosslinkable double bond is 1:0.5 to 1:4.0.

11. The preparation method of the silane-modified diallyl bisphenol compound of claim 6, wherein an amount of a catalyst of reaction formula (1) is 500 ppm to 5000 ppm relative to a weight of the diallyl bisphenol compound.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0024] FIG. 1 is an IR spectrum of the silane-modified diallyl bisphenol compound of Example 2.

DESCRIPTION OF THE EMBODIMENTS

[0025] In the following, the embodiments of the invention are described in detail. However, the embodiments are exemplary, and the invention is not limited thereto.

[0026] In the present specification, a range represented by “a numerical value to another numerical value” is a schematic representation for avoiding listing all of the numerical values in the range in the specification. Therefore, the recitation of a specific numerical range covers any numerical value in the numerical range and a smaller numerical range defined by any numerical value in the numerical range, as is the case with the any numerical value and the smaller numerical range stated explicitly in the specification.

[0027] The invention provides a silane-modified diallyl bisphenol compound having a structure represented by formula (1):

##STR00004##

[0028] in formula (1), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group having a crosslinkable double bond, n+m is a positive integer of 1 to 8, and n+m is preferably 2 or 3.

[0029] In more detail, in formula (1), R3 is a functional group having a crosslinkable double bond, and the functional group having the crosslinkable double bond may include an allyl group, a vinyl group, an acrylate, or a methacrylate, but the invention is not limited thereto. In addition, it should be noted that in formula (1), R3 may or may not contain an oxygen atom. If R3 contains an oxygen atom, for example, the oxygen atom may be attached first, and then the functional group having the crosslinkable double bond may be attached.

[0030] In addition to the silane-modified diallyl bisphenol compound represented by formula (1) above, the invention also provides another silane-modified diallyl bisphenol compound having a structure represented by formula (2):

##STR00005##

[0031] in formula (2), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R3 is a functional group having a crosslinkable double bond, and a is a positive integer of 1 to 4.

[0032] In more detail, in formula (2), R3 is a functional group having a crosslinkable double bond, and the functional group having the crosslinkable double bond may include an allyl group, a vinyl group, an acrylate, or a methacrylate, but the invention is not limited thereto. In addition, it should be noted that in formula (2), R3 may or may not contain an oxygen atom. If R3 contains an oxygen atom, for example, the oxygen atom may be attached first, and then the functional group having the crosslinkable double bond may be attached.

[0033] At the same time, the invention also provides a preparation method of a silane-modified diallyl bisphenol compound for preparing the silane-modified diallyl bisphenol compounds represented by formula (1) and formula (2), and the synthesis reaction formula thereof is represented by reaction formula (1):

##STR00006##

[0034] in reaction formula (1), X is a straight or branched C1 to C6 alkyl group, a cycloalkyl group, or a sulfonyl group, R1 is a straight or branched C1 to C6 alkyl group or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group having a crosslinkable double bond, n+m is a positive integer of 1 to 8, n+m is preferably 2 or 3, and a is a positive integer of 1 to 4.

[0035] In more detail, in reaction formula (1), R3 is a functional group having a crosslinkable double bond, and the functional group having the crosslinkable double bond may include an allyl group, a vinyl group, an acrylate, or a methacrylate, but the invention is not limited thereto. In addition, it should be noted that in reaction formula (1), R3 may or may not contain an oxygen atom. If R3 contains an oxygen atom, for example, the oxygen atom may be attached first, and then the functional group having the crosslinkable double bond may be attached.

[0036] As shown in the above reaction formula (1), in the invention, a dealcoholization reaction is performed at high temperature under the action of a catalyst mainly with a diallyl bisphenol compound with hydroxyl groups at both ends and a silane with at least one alkoxy group and at least one functional group having a crosslinkable double bond at the ends to obtain a silane-modified diallyl bisphenol compound with a functional group having a cross-linkable double bond at the end (that is, the silane-modified diallyl bisphenol compounds represented by formula (1) and formula (2)).

[0037] In the present embodiment, the reaction temperature of reaction formula (1) is, for example, 100° C. to 180° C., and is preferably, for example, 130° C. to 160° C., and the reaction time is, for example, 2 hours to 15 hours. In more detail, the diallyl bisphenol compound and the silane with the functional group having the crosslinkable double bond may be placed at the bottom of a reaction tank to react, or the diallyl bisphenol compound may be placed at the bottom of the reaction tank, and the silane with the functional group having the crosslinkable double bond is fed in a dropwise addition manner for reaction. The dropwise addition time is, for example, 1 hour to 10 hours. Calculated based on a mole ratio of a hydroxyl group of a diallyl bisphenol compound to an alkoxy group containing a dialkoxysilane with a functional group having a crosslinkable double bond, a ratio of the diallyl bisphenol compound to the dialkoxysilane with the functional group having the crosslinkable double bond is, for example, 1:0.5 to 1:4.0.

[0038] In the present embodiment, relative to the weight of the diallyl bisphenol compound, the amount of the catalyst of reaction formula (1) is, for example, 500 ppm to 5000 ppm. The type of the catalyst may include, but is not limited to, an acid catalyst, a base catalyst, a metal compound catalyst, an ester catalyst, or a combination thereof, and is, preferably, for example, ethyl triphenyl phosphine chloride (ETPPCl), ethyl triphenyl phosphine bromide (ETPPBr), ethyl triphenyl phosphine iodide (ETPPI), ethyl triphenyl phosphine acetate (ETPPAAc), tetrabutyl ammonium bromide (TBAB), triphenyl phosphine (TPP), or tetra-n-butyl ammonium acetate (TBAAc), but the invention is not limited thereto.

[0039] In reaction formula (1), the alkoxysilane containing a functional group having a crosslinkable double bond used in the invention is represented by formula (A):

##STR00007##

[0040] as described above, in formula (A), R1 is a straight or branched C1 to C6 alkyl group or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group having a crosslinkable double bond, and the functional group having the crosslinkable double bond may include an allyl group, a vinyl group, an acrylate, or a methacrylate, but the invention is not limited thereto. In the present embodiment, specific examples of formula (A) may include methyl vinyl dimethoxy silane, methyl vinyl diethoxy silane, allyl methyl dimethoxy silane, 1-allyl-2,2-dimethoxy-1,2-azasilylcyclopentane, or a combination thereof, but the invention is not limited thereto. The chemical structural formulas of specific cases are as follows:

##STR00008##

[0041] Hereinafter, the silane-modified diallyl bisphenol compound provided by the invention is described in detail with experimental examples. However, the following experimental examples are not intended to limit the invention.

EXPERIMENTAL EXAMPLES

[0042] In order to prove that the preparation method provided by the invention may obtain a silane-modified diallyl bisphenol compound, these experimental examples are specifically made as follows.

Example 1

[0043] 50.19 g of diallyl bisphenol A (Daiwa Kasei Industry, purity>90%), 0.042 g of ethyl triphenyl phosphine acetate, and 51.64 g of methyl vinyl dimethoxy silane (XL12, Wacker, Germany) were added in a reaction tank and evenly stirred and heated to 110° C. for 7 hours to obtain a silane-modified diallyl bisphenol compound.

Example 2

[0044] 72.3 g of diallyl bisphenol A (Daiwa Kasei Industry, purity>90%) was placed in a four-neck round bottom flask, stirred, and heated to 145° C. Then, 0.125 g of tetra-n-butylammonium acetate was added, and after evenly stirring, 58.3 g of methyl vinyl dimethoxysilane (XL12, Wacker, Germany) was added dropwise into a reaction tank. The dropwise addition time was 3 hours, and the methanol liquid produced during the reaction was collected. The total reaction time was 7 hours, and a silane-modified diallyl bisphenol compound was obtained. FIG. 1 is an IR spectrum of the silane-modified diallyl bisphenol compound of Example 2. The raw material diallyl bisphenol A had a strong OH group absorption peak at 3422 cm.sup.−1, but the absorption peak disappeared on the IR spectrum of the product, and the product had a strong Si—O-Ph group absorption peak at 928 cm.sup.−1. From the above, it may be proved that the silane-modified diallyl bisphenol compound was successfully synthesized.

Example 3

[0045] 72.3 g of diallyl bisphenol A (Daiwa Kasei Industry, purity>90%) was placed in a four-neck round bottom flask, stirred, and heated to 145° C. Then, 0.133 g of tetra-n-butylammonium bromide was added, and after evenly stirring, 58.3 g of methyl vinyl dimethoxysilane (XL12, Wacker, Germany) was added dropwise into a reaction tank. The dropwise addition time was 5 hours, and the methanol liquid produced during the reaction was collected. The total reaction time was 8 hours, and a silane-modified diallyl bisphenol compound was obtained.

[0046] The raw material formulas and reaction conditions of Example 1 to Example 3 are summarized in Table 1 below:

TABLE-US-00001 TABLE 1 Methyl vinyl Mole ratio of Diallyl dimethoxy diallyl bisphenol silane bisphenol Reaction A (XL12) A/XL12 Catalyst temperature Example 1 50.19 g 51.64 g 1:2.67 Ethyltriphenylphosphonium 110° C. acetate Example 2 72.3 g 58.3 g 1:2.09 Tetra-n-butylammonium 145° C. acetate Example 3 72.3 g 58.3 g 1:2.09 Tetra-n-butylammonium 145° C. bromide

[0047] Based on the above, the invention provides a silane-modified diallyl bisphenol compound as a small molecule multifunctional crosslinking agent. The silane-modified diallyl bisphenol compound contains at least two functional groups having a crosslinkable double bond and has higher boiling point, is thermally stable, and low in polarity, and may be used with polyphenylene ether, polytetrafluoroethylene, hydrocarbon resin, and other resins to provide a thermosetting resin formulation system that may be used for 5G materials.

[0048] In addition, a preparation method of a silane-modified diallyl bisphenol compound is provided. A diallyl bisphenol compound with hydroxyl groups at both ends and a silane with at least one alkoxy group and at least one functional group having a crosslinkable double bond at the ends are reacted, so as to obtain a silane-modified diallyl bisphenol compound with a functional group having a crosslinkable double bond at the end. Since this reaction may produce a stable Si—O bond on the structure of the diallyl bisphenol compound, the Si—O bond has very high bond energy and therefore has characteristics such as good heat resistance, flame retardancy, low water absorption, weather resistance, and corrosion resistance. At the same time, due to the large bond angle of the Si—O bond, the Si—O bond may be freely rotated, and therefore the flexibility of the molecule is better, thus providing excellent toughness.

[0049] Moreover, the silane-modified diallyl bisphenol compound of the invention introduces a silane with low-polarity and lubricating properties. Therefore, the viscosity of the diallyl bisphenol compound itself may be further reduced, so that the operation of the crosslinking agent is more convenient. A silane-modified diallyl bisphenol compound of the invention has at least two reactive double bonds in structure that may be cross-linked with modified polyphenylene ether to further increase crosslink density to form a cured resin with high crosslink density. Therefore, in addition to being used on a polyphenylene ether resin laminate, the silane-modified diallyl bisphenol compound may also be used as a raw material to compound with a bismaleimide resin to form a thermosetting resin composition with low shrinkage, high Tg, high heat resistance, and low dielectric properties.