LIGHT EMITTING DIODE PACKAGE HAVING A SMALL LIGHT EMITTING SURFACE

Abstract

A light emitting diode package, including: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, and a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source is less than 2.0.

Claims

1. A light emitting diode package, comprising: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, and a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source is less than 2.0.

2. A light emitting diode package, comprising: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, and a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein a wire connection is made between the primary and secondary cavities via a wire channel to provide electrical connection between the light emitting diode light source and the lead frame.

3. A light emitting diode package, comprising: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity, and a tertiary cavity, wherein the tertiary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source is less than 2.0.

4. A light emitting diode package, comprising: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity, and a tertiary cavity, wherein the tertiary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein a wire connection is made between the primary and tertiary cavities via a wire channel to provide electrical connection between the light emitting diode light source and the lead frame.

5. A light emitting diode package, comprising: a housing, wherein the housing includes a primary cavity and a primary cavity light emitting surface; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and means for improving color uniformity of the light emitting diode package.

6. The light emitting diode package according to claim 5, wherein the color uniformity improving means comprises a small primary cavity light emitting surface relative to cavity openings of conventional LED packages.

7. The light emitting diode package according to claim 6, wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source is less than 2.0.

8. The light emitting diode package according to claim 7, wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source ranges from 1.2 to 1.9.

9. The light emitting diode package according to claim 5, wherein the encapsulant is translucent and/or transparent.

10. The light emitting diode package according to claim 5, further comprising a secondary cavity positioned adjacent to the primary cavity.

11. The light emitting diode package according to claim 10, wherein the secondary cavity is at least partially filled with an opaque encapsulant.

12. The light emitting diode package according to claim 10, further comprising a wire channel positioned between the primary cavity and the secondary cavity.

13. The light emitting diode package according to claim 10, further comprising a tertiary cavity positioned adjacent to the primary cavity.

14. The light emitting diode package according to claim 13, wherein the tertiary cavity is at least partially filled with an opaque encapsulant.

15. The light emitting diode package according to claim 13, further comprising a wire channel positioned between the primary cavity and the tertiary cavity.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Certain embodiments of the present invention are illustrated by the accompanying figures. It will be understood that the figures are not necessarily to scale and that details not necessary for an understanding of the invention or that render other details difficult to perceive may be omitted.

[0030] It will be further understood that the invention is not necessarily limited to the particular embodiments illustrated herein.

[0031] The invention will now be described with reference to the drawings wherein:

[0032] FIG. 1 is a top view of a prior art light emitting diode package;

[0033] FIG. 2 is a cross-sectional view of a prior art light emitting diode package;

[0034] FIG. 3 is a cross-sectional view of a prior art light emitting diode package showing a plurality of conversion pathways which lead to less than desirable color uniformity;

[0035] FIG. 4 is a top view of a first embodiment of a light emitting diode package manufactured in accordance with the present invention;

[0036] FIG. 5 is a cross-sectional view of a first embodiment of a light emitting diode package manufactured in accordance with the present invention;

[0037] FIG. 6 is a cross-sectional view of a first embodiment of a light emitting diode package manufactured in accordance with the present invention showing a plurality of substantially similar conversion pathways which lead to improved color uniformity;

[0038] FIG. 7 of the drawings is a two-dimensional Color Over Angle (CX) plot showing color change as a function of viewing angle from the central axis;

[0039] FIG. 8 is a top view of a second embodiment of a light emitting diode package manufactured in accordance with the present invention; and

[0040] FIG. 9 is a cross-sectional view of a second embodiment of a light emitting diode package manufactured in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0041] While this invention is susceptible of embodiment in many different forms, there is shown in the drawings and described herein in detail several specific embodiments with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the invention to the embodiments illustrated.

[0042] It will be understood that like or analogous elements and/or components, referred to herein, may be identified throughout the drawings by like reference characters. In addition, it will be understood that the drawings are merely schematic representations of one or more embodiments of the invention, and some of the components may have been distorted from their actual scale for purposes of pictorial clarity.

[0043] As will be explained in greater detail hereinbelow, the present invention is directed to an improved light emitting diode package that includes a cavity having a small light emitting surface (LES), which improves color uniformity.

[0044] Referring collectively now to FIGS. 4-6 in a first embodiment of the present invention, light emitting diode package 100 of the present invention generally includes: substrate or frame 112 (e.g., metal alloy, PCB, ceramic, etcetera) associated with first electrode 126 (e.g., anode) and second electrode 128 (e.g., cathode); housing 114 having primary cavity 116 and primary cavity opening 118 filled with transparent and/or translucent encapsulant 120 (n.b., opening 118 becomes a small light emitting surface when filled with encapsulant 120); light emitting semiconductor element or chip 122; and secondary cavity 130 positioned adjacent to primary cavity 116. Secondary cavity 130 is filled with an opaque encapsulant. Wire channel 132 is positioned between primary cavity 116 and secondary cavity 130. Secondary cavity 130 accommodates wire 124 and enables primary cavity 116 to comprise a small light emitting surface so that the conversion pathways are essentially the same (See FIG. 6). When the conversion pathways are substantially similar, then the color uniformity of the light emitting diode package is substantially increased (See FIG. 7).

[0045] In a preferred embodiment of the present invention, the ratio of the surface area of primary cavity light emitting surface to that of the light emitting diode light source 122 is less than 2.0.

[0046] In another preferred embodiment of the present invention, the ratio of the surface area of primary cavity light emitting surface to the light emitting diode light source 122 ranges from 1.2 to 1.9.

[0047] Referring collectively now to FIGS. 8-9 in a second embodiment of the present invention, light emitting diode package 100 of the present invention generally includes: substrate or frame 112 (e.g., metal alloy, PCB, ceramic, etcetera) associated with first electrode 126 (e.g., anode) and second electrode 128 (e.g., cathode); housing 114 having primary cavity 116 and primary cavity opening 118 filled with transparent and/or translucent encapsulant 120 (n.b., opening 118 becomes a small light emitting surface when filled with encapsulant 120); light emitting semiconductor element or chip 122; secondary cavity 130 positioned adjacent to primary cavity 116; and tertiary cavity 134 positioned adjacent to primary cavity 116. Secondary and tertiary cavities 130 and 134, respectively, are filled with an opaque encapsulant. Wire channel 132 is positioned between primary cavity 116 and secondary cavity 130, and additional wire channel 136 is positioned between primary cavity 116 and tertiary cavity 134. Secondary and tertiary cavities 130 and 134, respectively, accommodate wires 124 and further enable primary cavity 116 to comprise a small light emitting surface so that the conversion pathways are essentially the same (See FIG. 6).

[0048] The foregoing description merely explains and illustrates the invention and the invention is not limited thereto except insofar as the appended claims are so limited, as those skilled in the art who have the disclosure before them will be able to make modifications without departing from the scope of the invention.

[0049] While certain embodiments have been illustrated and described, it should be understood that changes and modifications can be made therein in accordance with ordinary skill in the art without departing from the technology in its broader aspects as defined in the following claims.

[0050] The embodiments, illustratively described herein may suitably be practiced in the absence of any element or elements, limitation or limitations, not specifically disclosed herein. Thus, for example, the terms “comprising,” “including,” “containing,” etcetera shall be read expansively and without limitation. Additionally, the terms and expressions employed herein have been used as terms of description and not of limitation, and there is no intention in the use of such terms and expressions of excluding any equivalents of the features shown and described or portions thereof, but it is recognized that various modifications are possible within the scope of the claimed technology.

[0051] Additionally, the phrase “consisting essentially of” will be understood to include those elements specifically recited and those additional elements that do not materially affect the basic and novel characteristics of the claimed technology. The phrase “consisting of” excludes any element not specified.

[0052] The present disclosure is not to be limited in terms of the particular embodiments described in this application. Many modifications and variations can be made without departing from its spirit and scope, as will be apparent to those skilled in the art. Functionally equivalent methods and compositions within the scope of the disclosure, in addition to those enumerated herein, will be apparent to those skilled in the art from the foregoing descriptions. Such modifications and variations are intended to fall within the scope of the appended claims. The present disclosure is to be limited only by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled. It is to be understood that this disclosure is not limited to particular methods, reagents, compounds compositions or biological systems, which can of course vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.

[0053] In addition, where features or aspects of the disclosure are described in terms of Markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the Markush group.

[0054] As will be understood by one skilled in the art, for any and all purposes, particularly in terms of providing a written description, all ranges disclosed herein also encompass any and all possible subranges and combinations of subranges thereof. Any listed range can be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etcetera. As a non-limiting example, each range discussed herein can be readily broken down into a lower third, middle third and upper third, etcetera. As will also be understood by one skilled in the art all language such as “up to,” “at least,” “greater than,” “less than,” and the like, include the number recited and refer to ranges which can be subsequently broken down into subranges as discussed above. Finally, as will be understood by one skilled in the art, a range includes each individual member.

[0055] All publications, patent applications, issued patents, and other documents referred to in this specification are herein incorporated by reference as if each individual publication, patent application, issued patent, or other document was specifically and individually indicated to be incorporated by reference in its entirety. Definitions that are contained in text incorporated by reference are excluded to the extent that they contradict definitions in this disclosure.

[0056] Other embodiments are set forth in the following claims.