INITIAL TREATMENT METHOD FOR TARGET MATERIAL FOR PHYSICAL VAPOR DEPOSITION PROCESS, AND CONTROLLER
20220074043 · 2022-03-10
Assignee
Inventors
Cpc classification
C23C14/3414
CHEMISTRY; METALLURGY
International classification
Abstract
A method for initial treatment of a target material based on a physical vapor deposition (PVD) process and a controller includes: enhancing a turn-on current on a new target material multiple times from zero to a preset current. The method for initial treatment of a target material provided by the disclosure can avoid the occurrence of electric arc causing downtime for maintenance when the new target material participates in a cavity cleaning process.
Claims
1. A method for initial treatment of a target material based on a physical vapor deposition (PVD) process, comprising: enhancing a turn-on current on a new target material multiple times from zero to a preset current.
2. The method for initial treatment of a target material of claim 1, wherein each said enhancing is preceded by a pause of a first preset time.
3. The method for initial treatment of a target material of claim 2, wherein durations of the first preset time are same or different.
4. The method for initial treatment of a target material of claim 1, wherein, each time the turn-on current is enhanced, each turn-on current is controlled to reach a target current within a second preset time, and durations of the second preset time are same or different.
5. The method for initial treatment of a target material of claim 1, wherein the preset current value is m; the enhancing a turn-on current on a new target material multiple times from zero to a preset current comprises: enhancing the turn-on current from zero n times; each time the turn-on current is enhanced by a value that is not greater than m/n, wherein m and n are both positive integers, and n≥2.
6. The method for initial treatment of a target material of claim 1, wherein the enhancing a turn-on current on the new target material multiple times from zero to a preset current comprises: in response to an electrification signal of the new target material, controlling a constant current source to sequentially output a first current to an nth current from low to high until the preset current is output, n≥2, wherein a duration for outputting each current from the first current to the nth current is 30 s to 60 s.
7. The method for initial treatment of a target material of claim 1, wherein the enhancing a turn-on current on the new target material multiple times from zero to a preset current comprises: in response to an electrification signal of the new target material, controlling a plurality of constant current sources connected to the new target material to be initiated in sequence; and an interval between initiation time of two adjacent constant current sources is 30 s to 60 s.
8. The method for initial treatment of a target material of claim 1, wherein working gas is continuously fed in a process of enhancing the turn-on current to the preset current.
9. The method for initial treatment of a target material of claim 1, wherein the enhancing a turn-on current on the new target material multiple times from zero to a preset current comprises: in response to an electrification signal of the new target material, controlling a constant voltage source connected to the new target material to output a first voltage to an nth voltage from low to high in sequence until a preset voltage corresponding to the preset current is output, n≥2; and a duration of the first voltage to the nth voltage is equal, which is 30 s to 60 s.
10. The method for initial treatment of a target material of claim 1, wherein the enhancing a turn-on current on the new target material multiple times from zero to a preset current comprises: in response to an electrification signal of the new target material, controlling a plurality of constant voltage sources connected to the new target material to be initiated in sequence, wherein a voltage output by each constant voltage source is the same; and an interval between the initiation times of two adjacent constant voltage sources is 30 s to 60 s.
11. A controller for a physical vapor deposition (PVD) process, wherein the controller is configured to execute the method for initial treatment of a target material according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and, together with the specification, serve to explain the principles of the disclosure. Apparently, the drawings in the following description are only some embodiments of the disclosure. Those of ordinary skill in the art can further obtain other drawings based on these drawings without creative work.
[0017]
[0018]
[0019]
[0020]
DETAILED DESCRIPTION
[0021] Example implementation modes will be now described below more comprehensively with reference to the accompanying drawings. However, the example implementation modes can be embodied in a variety of forms and should not be construed as being limited to the examples set forth herein. Rather, these implementation modes are provided to make the disclosure more comprehensive and complete, and fully convey the concept of the exemplary implementation modes to those skilled in the art. The features, structures or characteristics described may be combined in one or more implementation modes in any proper manner. In the following description, many specific details are provided to give a sufficient understanding of the implementation modes of the disclosure. However, those skilled in the art will realize that the technical solutions of the disclosure can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be used. In other cases, the well-known technical solutions are not shown or described in detail to avoid distraction and obscuring of all aspects of the disclosure.
[0022] In addition, the drawings are only schematic illustrations of the disclosure, and the same reference signs in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in the form of software, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and/or processor devices and/or microcontroller devices.
[0023] Exemplary implementation modes of the disclosure will be described in detail below with reference to the accompanying drawings.
[0024] A PVD process may need to be implemented in an environment with high vacuum and high cleanliness requirements. Since a metal target material is a consumable, when an old target material is consumed to a limit, a cavity needs to be opened and replaced with a new target material. This will inevitably lead to a decrease in the cleanliness in the cavity. Therefore, it may be necessary to use an auxiliary wafer to perform the PVD process to clean the cavity every time a new target material is replaced. When the cavity is cleaned, it is necessary to connect the new target material that participates in the PVD process for the first time to a positive electrode of a power supply and apply a preset current to attract argon molecules of a negative electrode to hit the new target material, such that metal particles fall onto a surface of the auxiliary wafer.
[0025] In this process, as oxides are often present on the surface of the new target material, overheating often occurs after electrification, and an arc 12 as shown in
[0026] In the embodiments of the disclosure, a target material that is put into operation for the first time is called a new target material.
[0027] As shown in
[0028]
[0029] Referring to
[0030] For example, when the value of the preset current is m, the turn-on current can be enhanced from zero for n times. It is set that the turn-on current is enhanced by a value that is not greater than m/n at each time, where m and n are both positive integers, and n≥2.
[0031] In one embodiment, the preset current Iref can be, for example, 5 A. In the related art, a physical vapor deposition (PVD) process cannot be implemented until the turn-on current on the target material is 5 A. Before the PVD process is implemented on the new target material by formally using the preset current, the turn-on current on the new target material can be enhanced to 5 A in 5 steps from zero. As shown in
[0032] In one embodiment, in response to an electrification signal of the new target material, a constant current source can be controlled to output a first current to an nth current from low to high in sequence until the preset current is output, n≥2. A duration of the first current to the nth current is equal, which is 30 s to 60 s.
[0033] In another embodiment, it can also be set that the new target material can be connected to a plurality of constant current sources, and each constant current source outputs the same current, such that the turn-on current can gradually increase by controlling the plurality of constant current sources to be initiated in sequence. An initiation time interval between two adjacent constant current sources can be set to be 30 s to 60 s. In one embodiment, the time interval can be controlled to be 30 s.
[0034] In addition, the method provided in the disclosure can also be realized by controlling a constant voltage source. When a constant voltage source is used, a resistance value of a resistor corresponding to the constant voltage source needs to be kept unchanged.
[0035] For example, in response to an electrification signal of the new target material, a constant voltage source can be controlled to output a first voltage to an nth voltage from low to high in sequence until a preset voltage corresponding to the preset current is output, n>2. A duration of the first voltage to the nth voltage is equal, which is 30 s to 60 s.
[0036] Corresponding to the embodiment of the constant current source, in response to the electrification signal of the new target material, a plurality of constant voltage sources connected to the new target material can be controlled to be initiated in sequence. A voltage output by each constant voltage source is the same. An interval between initiation time of two adjacent constant voltage sources is 30 s to 60 s.
[0037] It can be understood that although an amplitude of a waveform of the turn-on current corresponding to each value in
[0038] The turn-on current is raised stepwise, and the previous current is allowed to continue for a period of time before each rise, which can effectively prevent the new target material from overheating and generating an arc.
[0039]
[0040] Referring to
[0041] In addition, as shown in
[0042] In the embodiment shown in
[0043] No matter which embodiment mentioned above is used to achieve rise of the turn-on resistance, working gas (for example, argon) can be continuously fed in the process of enhancing the turn-on current to the preset current. In one embodiment, a flow of argon that is continuously fed can be set to 50 sccm, so as to provide a sufficient power ignition environment.
[0044] The method shown in
[0045]
[0046] Referring to
[0047] The method provided by the embodiments of the disclosure can be written into a PVD process implementation controller in the form of a burn in macro, such that after a new target material installation signal and an electrification signal of the new target material are detected, the methods corresponding to the above embodiments are realized to finally apply the preset current to the new target material. Finally, the cavity cleaning process participated by the new target material is completed by the preset current.
[0048] In summary, by means of gradually enhancing the turn-on current on the new target material from zero to a preset current, the embodiments of the disclosure solves unsolved problems of interruption of the cavity cleaning process and downtime overhaul due to the arc generated by the new target material in the cavity cleaning process in the related art, thereby effectively reducing a fault rate of a semiconductor manufacturing process and improving the efficiency of the semiconductor manufacturing process.
[0049] In addition, the above-mentioned drawings are merely schematic illustrations of the treatment included in the method according to the exemplary embodiments of the disclosure, and are not intended for limitation. It is easy to understand that the treatment shown in the above drawings does not indicate or limit the time sequence of these treatments. In addition, it is easy to understand that these treatments can be executed synchronously or asynchronously in multiple modules, for example.
[0050] After considering the specification and implementing the disclosure disclosed here, those skilled in the art will easily conceive other implementation solutions of the disclosure. The present application is intended to cover any variations, uses, or adaptive changes of the disclosure. These variations, uses, or adaptive changes follow the general principles of the disclosure and include common general knowledge or conventional technical means in the technical field, which are not disclosed herein. The specification and embodiments are only regarded as exemplary, the true scope and concept of the disclosure are indicated by the claims.
[0051] In the embodiments of the disclosure, by enhancing the turn-on current on the new target material multiple times from zero to a preset current, it is possible to avoid the occurrence of electric arc caused by the oxides on a surface on the new target material during initial use and causing the failure of a cavity cleaning process due to the cavity voltage failure alarm.