SMART CHIP ASSEMBLY CAPABLE OF COMMUNICATING WITH EACH OTHER AND VARIABLE ARRAY IN PACKAGING

Abstract

A smart chip assembly capable of communicating with each other and variable array in packaging contains at least two intelligent single-chip, which can be easily formed into a smart chip assembly by cutting after packaging. Each intelligent single-chip has a camera lens module, and each lens module is arranged in a different position and angle to separately obtain images of different angles or depths of field of the object to be recognized, and provide each intelligent single-chip to independently process the image and judge by itself. The result of each judgment based on the obtained images of different angles or depths of field can also be used as one of the options for reference judgment. Then through the mutual communication between the intelligent single-chips, they calculate and analyze different image and image dynamics, and make comprehensive judgments to obtain the best interpretation. Finally, the command is sent to the connected power mechanism to perform corresponding actions to achieve more flexible application and improve the accuracy of identification.

Claims

1. A smart chip assembly capable of communicating with each other and variable array in packaging containing at least two intelligent single-chip, which are packaged and cut to complete the integrated structure, wherein each intelligent single-chip has a camera lens module, each of which obtains images of different angles or depths of field of the object to be identified and judged by itself, or to provide the result of the judgment as one of the options for reference judgment, and through the mutual communication between the intelligent single-chips to calculate and analyze each different image and image dynamics, to obtain the best interpretation, that then sends a command to a connected power mechanism to perform corresponding actions.

2. The smart chip assembly capable of communicating with each other and variable array in packaging as in claim 1, wherein the intelligent single-chips can be arranged in a single row, arranged side by side, or up and down to form a smart chip assembly.

3. The smart chip assembly capable of communicating with each other and variable array in packaging as in claim 1, wherein the smart chip assembly has at least two intelligent single-chips arranged and combined in a predetermined manner, and during wafer manufacturing, multiple arrays of intelligent single-chips combinations are arranged side by side and packaged together, which can be cut to obtain multiple independent smart chip assembly directly.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is a schematic diagram of the combination of two intelligent single-chips and the communication judgment between them according to the present invention.

[0006] FIGS. 2A and 2B are two schematic diagrams of the combination of three intelligent single-chips of the present invention.

[0007] FIGS. 3A and 3B are two schematic diagram of the combination of four intelligent single-chips of the present invention.

DETAILED DESCRIPTION AND PREFERRED EMBODIMENT

[0008] The present invention relates to a smart chip assembly 1 capable of communicating with each other and variable array in packaging. First, as shown in FIG. 1, combining two intelligent single-chips 11 and 12 as an example, when the smart single chip assembly 1 of the present invention is packaged, the two intelligent single-chips 11, 12 are packaged and cut in a parallel manner. As it can directly use the original pin to connect the application device on the connection pin, the two intelligent single-chips 11 and 12 can be combined into a single smart chip assembly 1. The two intelligent single-chips 11, 12 have camera lens modules 111, 121, respectively. When in use, the same external object 2 to be identified can be obtained through the shooting angle or depth of field of different lens modules to obtain two images 21, 22 of different angles or depth of field. The two images 21 and 22 can be independently processed by the intelligent single-chips 11 and 12 respectively, and the results can be judged by themselves. Or it can provide the result of the judgment as one of the options of the reference judgment, so that it can communicate with each other between the two intelligent single-chips 11 and 12, through its calculation and analysis, and then comprehensive judgment to get the best interpretation. Finally, based on the final interpret the results, the single smart chip assembly 1 then send the instructions to the connected power mechanism 3 to perform corresponding actions to achieve more accurate identification.

[0009] In another embodiment, the present invention can be used to combine three intelligent single-chips 11, 12, 13 into a smart chip assembly 1. The arrangement of the intelligent single-chips can be arranged in a single row, as shown in FIG. 2A, or in triangular shape, as shown in FIG. 2B. This invention can also be applied to the combination of four intelligent single-chips 11, 12, 13, and 14, which can be arranged in a single row, as shown in FIG. 3A, or arranged side by side, as shown in FIG. 3B. In actual use, depending on the needs, more intelligent single-chips can be combined as a smart chip assembly 1 to achieve the effect of variable arrangement chip packaging. In addition, for the above-mentioned intelligent chip combinations with different numbers or arrangements, during wafer manufacturing, various predetermined arrangements and combinations can be set and packaged together, so it is convenient to cut according to the arranged position and quickly obtain the chip assembly of multiple independent intelligent chips with a specific number or arrangement of this invention.

[0010] The characteristic of this invention is to combining at least two intelligent single-chips as a smart chip assembly, and the arrangement of each intelligent single-chip can be changed according to needs. Each intelligent single-chip has a camera lens module to obtain images of different angles or depths of field of the object to be identified. In addition to self-judgment, it can also communicate with each other between intelligent single-chips, calculate and analyze, and make comprehensive judgments to get the best interpretation. Finally, send instructions to the connected power mechanism to perform corresponding actions to improve the accuracy of identification. However, this operation does not need to be connected by an external transmission line or wireless transmission method, and has direct and effective communication, and can provide more applications in more fields, which has significant progress.