DEVICE FOR ADMINISTERING MEDICAL LIQUID, HAVING A HEAT SINK WITH COOLING FINS

Abstract

A device for administering medical liquid, in particular an infusion pump, and a system that includes the device and a holding device. The device includes a housing and a component that generates heat during use of the device. The component is arranged inside the housing. A passive heat sink is attached to an outer side of the housing and is connected thermally, in particular in a heat-conducting manner, to the component. The heat sink has cooling fins.

Claims

1.-10. (canceled)

11. A device for administering medical fluid comprising: a housing; a component which is heat-generating at least when the device is in use and which is arranged inside the housing; and a heat sink that is passive, the heat sink being mounted on an outer side of the housing and connected to the component, the heat sink comprising cooling ribs, the heat sink having a coupling portion for coupling in a heat-conductive manner with an external counter-coupling portion, the coupling portion having a contact surface configured to contact a surface of the counter-coupling portion in a heat-conducting manner, and the coupling portion being arranged between the cooling ribs.

12. The device according to claim 11, wherein a heat-conducting profile is arranged within the housing, the heat-conducting profile being thermally connected to the component and to the heat sink.

13. The device according to claim 12, wherein the heat-conducting profile is directly thermally connected to the component and/or the heat sink.

14. The device according to claim 11, wherein the device has a fixing portion for attaching the device to a holding device, wherein the fixing portion is formed by the coupling portion of the heat sink and the counter-coupling portion is the holding device.

15. The device according to claim 14, wherein the fixing portion has a rail which is provided and configured to fix the device to the holding device in a form-fit manner.

16. The device according to claim 15, wherein the rail is configured to fix the device to the holding device without tools.

17. The device according to claim 15, wherein an insertion direction of the fixing portion guided by the rail on the holding device corresponds to an orientation of the cooling ribs and/or to a vertical direction of the device.

18. The device according to claim 14, wherein the heat sink and the holding device serve as a radiator of the component which is heat-generating at least during use of the device.

19. The device according to claim 11, wherein the cooling ribs are oriented vertically in a position of use of the device.

20. The device according to claim 11, wherein the heat sink is arranged on a rear side of the housing, and/or the heat sink has a protection against contact covering the coupling portion and insulating the coupling portion from the outside.

21. The device according to claim 11, wherein the housing is substantially fluid-tight.

22. The device according to claim 11, wherein the heat sink is made from a material having a heat conductivity greater than 10 W/mK and/or a surface of the heat sink has an emissivity of greater than 0.8 and/or the surface of the heat sink is anodized.

23. The device according to claim 11, wherein the heat sink is connected to the component in a heat-conducting manner.

24. The device according to claim 11, wherein the contact surface of the coupling portion is planar.

25. The device according to claim 11, wherein the contact surface of the coupling portion directly contacts the surface of the counter-coupling portion.

26. The device according to claim 11, wherein the coupling portion is arranged on a rear side of the housing.

27. The device according to claim 11, wherein the housing is configured without ventilation openings.

28. The device according to claim 11, wherein the heat sink is made from a metal.

29. The device according to claim 28, wherein the metal comprises aluminum or copper.

30. A system comprising: a device according to claim 11; and a holding device, the heat sink of the device being connectable or connected to the holding device in a heat-conducting manner, and the heat sink and the holding device serving as a radiator for the device.

Description

BRIEF DESCRIPTION OF THE DRAWING FIGURES

[0030] FIG. 1 is a perspective view of a device for administering medical fluids according to the present disclosure;

[0031] FIG. 2 is a perspective sectional view of the device; and

[0032] FIG. 3 is a schematic representation of a system comprising a holding device and the device.

DETAILED DESCRIPTION

[0033] A preferred embodiment of the present disclosure is described below based on the accompanying figures.

[0034] FIGS. 1 and 2 show a device 2 for administering medical fluid according to the present disclosure. In particular, the device 2 is configured as an infusion pump, for example as a syringe pump or a hose pump. The device 2 has a housing 4 and at least one, in particular when the device is in use, heat-generating component 6, i.e. a component to be cooled. The component 6 is arranged inside the housing 4.

[0035] In the embodiment shown, the device 2 has two components 6 to be cooled. A power adaptor 8 for power supply is a heat-generating component 6 (cf. FIG. 2). A radio module 10 for signal transmission in the form of a WLAN-/WIFI-module is a heat-generating component 6 (cf. FIG. 2). Alternatively, the component 6 could also be formed by an accumulator for power supply, another radio module such as a Bluetooth module, a drive for conveying the fluid, a display unit for displaying operation-relevant data and/or a control device for controlling the device 2, even if this is not shown.

[0036] The device 2 has a passive heat sink 12. The heat sink 12 is attached/arranged on an outer side of the housing 4. The heat sink 12 is thermally connected, in particular in a heat-conducting manner, to the component 6 (or components 6). Thus, heat is transported by heat conduction from the interior of the housing 4 to the heat sink 12 on the outside, where it is released into the environment.

[0037] Preferably, the heat sink 12 may be made from a material whose heat conductivity is greater than 10 W/mK, preferably greater than 50 W/mK, more preferably greater than 100 W/mK. Preferably, the heat sink may be made from a metal, in particular aluminum or copper. Furthermore, the heat sink 12 may have a surface that has an emissivity greater than 0.8. Alternatively or additionally, the surface of the heat sink 12 may be anodized.

[0038] Preferably, the device 2 may have a heat-conducting profile 14 arranged inside the housing 4. The heat-conducting profile 14 is configured, for example, as a heat-conducting sheet or the like. The heat-conducting profile 14 may be thermally connected, preferably directly, i.e. with mechanical contact, to the component 6 (or components 6). The heat-conducting profile 14 may be thermally connected, preferably directly, i.e. with mechanical contact, to the heat sink 12. In particular, the heat-conducting profile 14 may be connected to the component 6 and/or the heat sink 12 in a surface-to-surface manner. Preferably, the heat-conducting profile may be made from a material whose heat conductivity is greater than 10 W/mK, preferably greater than 50 W/mK, further preferably greater than 100 W/mK. In particular, the heat-conducting profile 14 may be made from a metal, for example aluminum or copper.

[0039] Preferably, the heat sink 12 may have a contact surface that abuts (against) a contact surface of the heat-conducting profile 14. Alternatively, the contact surface of the heat sink 12 may be connected to the contact surface of the heat-conducting profile 14 via a thermal layer 16, such as a thermal paste (cf. FIG. 2). The contact surface of the heat sink 12 and/or the contact surface of the heat-conducting profile 14 are/is preferably configured to be planar. The heat sink may, for example, be arranged in such a way that it reaches through a recess 18 in the housing 4 in order to contact the heat-conducting profile 14 (cf. FIG. 2).

[0040] For example, the heat-conducting profile 14 may thermally connect multiple heat-generating components 6, in the illustrated embodiment the power adaptor 8 and the radio module 10, to the heat sink 12. Preferably, the multiple components 6, in the illustrated embodiment the power adaptor 8 and the radio module 10, are arranged adjacent to each other.

[0041] In addition, the heat-conducting profile 14 may be arranged at a distance from the housing 4. This means that a gap 20 is configured between an inner side of the housing 4 and the heat-conducting profile 14 (cf. FIG. 2) in order to prevent heat transfer via the housing 4.

[0042] According to a preferred embodiment, the heat sink 12 may include a coupling portion 22 for coupling in a heat-conducting manner with an external counter-coupling portion (not shown). Thus, the heat sink 12 can—in addition to heat dissipation via free/natural convection and heat radiation—transfer heat to the counter-coupling portion via heat conduction. Preferably, the coupling portion 22 may have a contact surface 24 which is provided and configured to contact a surface of the counter-coupling portion in a heat-conducting manner, preferably directly, in particular by surface-to-surface contacting. The contact surface 24 and/or the surface is/are preferably configured to be planar.

[0043] According to a preferred embodiment, the heat sink 12 may include cooling ribs 26, in particular to increase the surface area of the heat sink 12. For example, the cooling ribs 26 may be oriented vertically in the use position of the device.

[0044] In other words, the heat sink 12 may have both a surface structure optimized in areas for heat convection and/or heat radiation, in the form of the cooling ribs 26, and a surface structure optimized in areas for heat conduction, in the form of the planar contact surface 24. Preferably, the coupling portion 22 may be arranged between the cooling ribs 26.

[0045] The device 2 may have a fixing portion 28 for attaching the device 2 to an external holding device (not shown). For example, the holding device may be configured as a stand or a stand clamp of a stand. Preferably, the fixing portion 28 may be formed by the coupling portion 22 of the heat sink 12. In other words, the coupling portion 22 simultaneously functions to fix the device 2. Thus, the holding device can serve as a counter-coupling portion. Thus, the contact between the fixing portion 28 and holding device can be used as a heat-conducting contact for transferring heat. For example, the fixing portion 28 may include a rail 30 that is provided and configured to form-fittingly fix the device 2 to the holding device, in particular without the use of tools. In particular, an insertion direction of the fixing portion 28 guided by the rail 30 on the holding device may preferably correspond to an orientation of the cooling ribs 26 and/or a vertical direction.

[0046] Furthermore, complementary latching elements may be provided on the coupling portion 22 of the heat sink 12 and on the counter-coupling portion of the holding device to prevent unintentional detachment of the device 2 from the holding device.

[0047] According to the preferred embodiment, the heat sink 12, in particular the coupling portion 22, may be arranged on a rear side (as seen in the use position of the device) of the housing 4. Preferably, the heat sink 12 may have a protection against contact (not shown) covering the coupling portion 22 and insulating it from the outside. The protection against contact may have a slot for insertion for the holding device, so that fixing to the holding device is ensured.

[0048] Preferably, the housing 4 may be substantially fluid-tight, in particular it may be configured without ventilation openings. This means that the housing 4 has no ventilation slots, ventilation openings or the like through which fluids can enter the interior of the housing 4 from the outside.

[0049] The disclosure also relates to a system 32 comprising a holding device 34, such as a stand, and the described device 2. The system 32 is shown schematically in FIG. 3. The holding device 34 thus serves as the external holding device described above or, respectively, as the counter-coupling portion. Thereby, the heat sink 12 of the device 2 is connectable or connected in a heat-conducting manner to the holding device 34. Thereby, the heat sink 12 and the holding device 34 serve as a radiator of the device 2, in particular of the heat-generating component 6 at least during use of the device 2. Preferably, the holding device 34 may comprise a holding adapter which connects the heat sink 12 and the holding device 34 in a heat-conducting manner. In particular, the holding adapter may be inserted into the heat sink 12, for example via the rail 30. This enables form-fitting attachment of the device 2 to the holding device 34.

[0050] Preferably, the holding device 34 may be made from a material having a heat conductivity greater than 10 W/mK, preferably greater than 50 W/mK, more preferably greater than 100 W/mK. Preferably, the holding device 34 may be made from a metal, in particular aluminum or copper.