HIGH-SPEED, HERMAPHRODITIC CONNECTOR AND CONNECTOR ASSEMBLIES
20230396030 · 2023-12-07
Inventors
- John C. Laurx (Aurora, IL, US)
- Khang Choong Yong (Selangor, MY)
- Michael D. Rost (Lisle, IL, US)
- Pue Xie (Naperville, IL, US)
Cpc classification
International classification
H01R13/28
ELECTRICITY
Abstract
High-speed, hermaphroditic electrical connectors may be connected to form a hermaphroditic connector assembly that uses less space than existing connector assemblies. A housing can provide a first and second engagement feature that are intended to engage each other so that when two such connectors are rotated 180 degrees the engagement features allow two such connectors to mate together. Cables can be connected directly to the terminals so as to provide for improved electrical performance.
Claims
1. A hermaphroditic connector assembly, comprising: a first connector with a housing comprising first and second engagement features, the first engagement feature configured to mate with the second engagement feature; and a second connector substantially similar to the first connector, the second connector orientated with 180 degrees of rotation compared to the first connector, the second connector mated to the first connector.
2. The hermaphroditic connector assembly of claim 1, wherein the first engagement feature of the first and second housings is configured as a T-shaped rib while the second engagement feature of the first and second housings is configured as a T-shaped slot.
3. The hermaphroditic connector assembly of claim 1, wherein each of the first and second connectors further comprises a plurality of shields that are U-shaped and formed of a conductive alloy and are inserted into a pocket of the housing, wherein each of the shields is connected to a shielding layer of a cable, wherein the shields are configured so that each shield can mate with the another such shield if the shields are rotated 180 degrees relative to each other and multiple shields are supported by a wafer.
4. The hermaphroditic connector assembly of claim 3, wherein each of the shields comprises an opening for receiving solder or another connection material to connect a shielding layer of a cable to the respective shield to form a ground path.
5. The hermaphroditic connector assembly of claim 3, wherein the cable includes a flat drain wire.
6. The hermaphroditic connector assembly of claim 3, wherein the ends of the respective shield are configured inwardly towards the shielding layer of the cable to provide a surface at which the shield is electrically bonded to the shielding layer.
7. The hermaphroditic connector assembly of claim 3, further comprising a collar aligned with each shield, each collar configured to connect the shielding layer to the shield to form a ground path therebetween.
8. The hermaphroditic connector assembly of claim 7, wherein the collar is formed integrally with the shield.
9. The hermaphroditic connector assembly of claim 3, wherein each of the shields includes retaining arms and the corresponding cables include dual, side drain wires, wherein the retaining arms are configured to engage the dual sides drain wires.
10. The hermaphroditic connector assembly of claim 3, wherein each of the shields supports a chicklet that in turn supports a pair of terminals, each of the terminals including a tail, wherein conductors in the cable are connected to the tails.
11. The hermaphroditic connector assembly of claim 10, wherein each of the shields includes a main wall and has an opening in the main wall so as to provide access to the connection between the tails and the conductors
12. The hermaphroditic connector assembly of claim 11, further comprising a micro-clamp being positioned on each of the shields so that the micro-clamp is aligned with the opening in the main wall of an adjacent shield.
13. The hermaphroditic connector assembly of claim 12, wherein the micro-clamp is formed of a conductive plastic.
14. The hermaphroditic connector assembly of claim 12, wherein each of the cables include dual, side drain wires and each of the micro-clamps is configured to compress the dual, side ground drain wires against integral tabs of the corresponding shield to form a ground path therebetween.
15. The hermaphroditic connector assembly of claim 10, wherein each of the tails is configured with an undulated edge comprising one or more indentations.
16. The hermaphroditic connector assembly of claim 15, wherein the assembly is configured to support a 112 Gbps data rate using PAM 4 encoding.
17. The hermaphroditic connector assembly of claim 3, wherein each pocket is configured to provide a region of air on one side of the shield.
18. The hermaphroditic connector assembly of claim 3, wherein each of the shields comprises flexible fingers that configured to electrically connect to a mating shield.
19. A connector assembly, comprising: a housing with a first engagement features and a second engagement feature, the housing having a plurality of pockets; a wafer mounted in the housing and supporting a plurality of shields and a plurality of cables extending out of the wafer, wherein each shield is connected to a corresponding cable and each cable has a pair of conductors and a shielding layer, the shielding layer electrically connected to the corresponding shield, wherein the shields are positioned in the pockets; and a chicklet positioned in each of the shields, the chicklet supporting a pair of terminals, each terminal including a tail, each of the terminals configured to engage another terminal, wherein the conductors are terminated to the tails, wherein the shield includes a main wall and has an opening in the main wall that is aligned with where the tails are connected to the conductors.
20. The connector assembly of claim 19, wherein each cable further comprises a drain wire that is electrically connected to the shield.
21. The connector assembly of claim 20, wherein the drain wire is a first drain wire and each cable includes a second drain wire, the first and second drain wires positioned on opposing sides of the conductors.
22. The connector assembly of claim 21, further comprising a micro-clamp that mounts on shield and presses the first and second drain wires against the shield.
23. The connector assembly of claim 22, wherein the wafer is a first wafer, the housing having a second wafer positioned adjacent the first wafer, wherein one of the micro-clamps in the first wafer is aligned with one of the openings in the second wafter.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The present disclosure is illustrated by way of example and not limited to the accompanying figures in which like reference numerals may refer to similar elements and in which:
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DETAILED DESCRIPTION, INCLUDING EXEMPLARY EMBODIMENTS
[0043] Simplicity and clarity in both illustration and description are sought to effectively enable a person of skill in the art to make, use, and best practice embodiments disclosed herein in view of what is already known in the art. One skilled in the art will appreciate that various modifications and changes may be made to the specific embodiments described herein without departing from the spirit and scope of the disclosure. Thus, the specification and drawings are to be regarded as illustrative and exemplary rather than restrictive or all-encompassing, and all such modifications to the specific embodiments described herein are intended to be included within the scope of the disclosure. Yet further, unless otherwise noted, features disclosed herein may be combined together to form additional combinations that were not otherwise described or shown for purposes of brevity.
[0044] It should also be noted that one or more exemplary embodiments may be described as a method or process. Although a method or process may be described as an exemplary sequence (i.e., sequential), unless otherwise noted the steps in the sequence may also be performed in parallel, concurrently or simultaneously. In addition, the order of each formative step within a method or process may be re-arranged. A described method or process may be terminated when completed, and may also include additional steps that are not described herein if, for example, such steps are known by those skilled in the art.
[0045] As used herein the terms “high-speed” and “high-data rate” may be used interchangeably. As used herein, the term “embodiment” or “exemplary” mean an example that falls within the scope of the disclosure. Substantially similar, when referring to a first and second connector, means that both connectors are close enough to being identical so as to allow each other to mate together and form a hermaphroditic connector assembly.
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[0047] As can be appreciated, each of the connectors 1a, 1b supports a plurality of wafers 22 that are inserted into the housing 2a. The wafers 22 can be formed by overmolding a portion of one or more cables 5a and an associated shield/terminal so to support the components within the housing 2a and to provide strain relief for the cables 5a. It should be noted that while the cables for both connectors can be the same, such uniform construction of the cables is not required and different cables can be used for both connectors, as desired.
[0048] For ease of reference cables received by connector 1a may be referred to herein as a “first” plurality of cables while cables received by connector 1b 5b may be referred to herein as a “second” plurality of cables.
[0049] Each connector 1a, 1b may comprise one or more, respective, engagement features formed as a part of (i.e., integral to) a respective housing 2a.
[0050] As shown in
[0051] Further, the respective ribs and slots also align respective terminals 7a of respective connectors 1a, 1b in order to allow high-speed electrical signals (e.g., 112 Gbps) to be transported or conducted from cable to cable, as will be described in more detail elsewhere herein. As can be appreciated, for each connector, the first and second engagement features may be positioned on opposite sides of the respective connector so that two such connectors can mate with each other when properly orientated.
[0052] Because each connector 1a, 1b has both first and second engagement features and two such connectors can be mated together, such connectors may be referred to as hermaphroditic connectors.
[0053] As depicted, the engagement features 4a, 4b are provided on opposite sides so that when two connectors are mated together, a completely protected mating interface can be provided. Thus, the engagement feature 4a may fit into the engagement feature 4b.
[0054] Referring to
[0055] Referring now to
[0056] In an embodiment, a set of walls 24a may support and align a respective shield 8a and terminals 7a and separate each of the respective shields 8a and conductors 7a from other shields and conductors of the same connector 1a, for example. Further, in an embodiment, each formed pocket 23a may be configured to provide a region of air on one or more sides of the shield and the region of air can help modify the dielectric constant of the connector system to help improve signal integrity.
[0057]
[0058] Referring now to
[0059] In an embodiment, the terminals 7a may be supported by the respective shield 8a by mounting the chicklet 6a (which can also be referred to as a terminal housing 6a) to the shield 8a. Further, each terminal 7a may comprise a contact portion with end that is formed in an “elbow” shape (i.e., bent) in order to allow mating terminals 7a to engage each other without stubbing and to form a connected, high-speed signal path.
[0060] Each shield 8a may comprise fingers 9a, which can be flexible and can help shield at least conductors 7a when a connection is formed when the conductors 7a of one connector (e.g., connector 1a) are positioned to make physical contact with conductors (e.g., conductors 7b) of another connector (e.g., connector 1b; see
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[0062] Though only one shield 8a, one set of terminals 7a and one cable 5a comprising conductors 11a are shown, it should be understood that each shield 8a, each terminals 7a and each cable 5a/conductor 11a making up, or connected to, connector 1a may be illustrated in a similar fashion.
[0063] Continuing, in an embodiment an exemplary cable 5a may form a connection with connector 1a to transport high-speed, differential signals when its respective conductors 11a are connected to respective tails 10a of connector 1a by a welding process, for example. In an embodiment, one conductor 11a may be overlapped and connected to one tail 10a (or—versa), for example, to insure the high-speed electrical signals transported on conductors 11a (e.g., 112 Gbps signals, signals between 112 Gbps and 224 Gbps) may continue to be transported through tails 10a and, eventually on to terminals 7a. As noted previously, each conductive tail 10a of connector 1a may be one end of a conductive structure 27a that also comprises an internal conductor 7a (see
[0064] In addition to connecting the differential, high-speed signal conductors 11a to tails 10a of connector 1a, a shielding layer of the cable 5a may also be connected to the connector 1a. For example, referring to
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[0067] In the embodiment depicted in
[0068] Referring now to
[0069] In
[0070] Referring now to
[0071] Compared to the collars 5ab, 8ab shown in
[0072] It is believed that the addition of either collars, 5ab, 8ab or 5ac may increase the structural rigidity of a termination of the cable to the terminals and may provide a favorable surface to help facilitate electrical connection to the shield 8a. It should be understood that when a cable (e.g., cables 5a or 5b) includes a different grounding structure than that shown in
[0073] For example, referring now to
[0074] Yet another embodiment for connecting a cable (e.g., twinax cable) to terminals is shown in
[0075] As shown, conductive, micro-clamp 26ab (made from a conductive plated plastic, for example) may be positioned over the connected tails 10a and conductors 11a (the later hidden from view) and when aligned with another shield 8a, the micro-clamp 26ab blocks the opening 8ac so as to reduce or mitigate the potential effects of unwanted cross-talk.
[0076] In
[0077] In an embodiment, the micro-clamp 26ab may include a latch mechanism (not shown) to allow the connected tails 10a and conductors 11a to be accessed via the opening 8ac if need be. Further, the micro-clamp 26ab may be further secured to the connected tails and/or conductors during a wafer overmolding prices, for example. As can be appreciated, a plurality of micro-clamps can be provided as a single structure that spans across multiple shields.
[0078] Referring now to
[0079] In sum, it is believed that scalloped tails 10a provides sufficient electrical performance for the connection of a tail 10a and conductor 11a without sacrificing size (of connector 1a) or the mechanical integrity of the connection.
[0080] In embodiments, the minimum width of a valley portion 17a and/or of a peak portion 18a may depend on the width of a conductor 11a (i.e., wire gauge) that is to be connected (e.g., welded) to the tail 10a where the minimum width is about equal to or slightly less than the width of the conductor 11a.
[0081] While the tail 10a shown in the figures comprises the same, uniform width for each valley portion 17a and the same, uniform width for each peak portion 18a (though the widths of portions 17a and 18a differ), this is merely exemplary. Alternatively, the width of each valley portion 17a may differ from one portion 17a to another portion 17a. So too may the width of each peak portion 18a vary from one peak portion 18a to another peak portion 18a for a given tail 10a. For example, the width of the valley and/or peak portions of a given tail may increase or decrease from portion to portion along the connected length 1.sub.t1, of a tail (e.g., valley and/or peak portions may be wider the closer a portion is to a cable). Still further, the width of respective valley and peak portions may have varying, different widths form portion to portion along the connected length to reduce an impedance of a connection or to otherwise optimize the electrical and/or mechanical reliability of the connection.
[0082] Similarly, while the shape of the edges 16a of the peak portions 18a and valley portions 17a in the figures is rounded, this is also merely exemplary. Alternatively, the shape of the edges 16a of the valley and/or peak portions 17a, 18a may be rectangular, diamond-shaped, or another shape that improves the electrical and/or mechanical performance of the connection of a tail to a conductor.
[0083] In embodiments, length-wise distances d.sub.2 and d.sub.3 (i.e., separations), respectively, between the top of each peak portion 18a and between the bottom of each valley portion 17a, respectively, may be uniformly the same or may vary along the connected length. For example, a distance d.sub.2, d.sub.3 may gradually increase or decrease along the connected length. Still further a distance d.sub.2, d.sub.3 may vary from respective portion to respective portion (top of a peak portion 18a to top of another peak portion 18a, or bottom of a valley portion 17a to bottom of another valley portion 17a) along the connected length l.sub.t1, of a tail (e.g., valley and/or peak portions may be wider the closer a portion is to a cable). Still further, the distance d.sub.2, d.sub.3 between respective tops and bottoms of respective valley and peak portions may vary from one portion to another portion along the connected length (i.e., dissimilar lengths between each top, peak portion and/or dissimilar lengths between each bottom, valley portion) to reduce an impedance of a connection or to otherwise optimize the electrical and/or mechanical reliability of the connection.
[0084] Yet further, one or more of the peak portions of a tail may be shaped or otherwise configured to guide a conductor onto the tail during a connection process. For example, referring to
[0085] Though the components (and their connections) of one connector 1a are depicted in
[0086] Referring now to
[0087] In
[0088] In an embodiment, each of the respective terminals 7a of connector 1b may be overlappingly positioned on top of a terminals 7a of connector 1a (or vice-versa) as shown in
[0089] As can be seen in
[0090] The inventors believe that connectors and connector assemblies described herein may use 75% or less of the space of existing connector/connector assemblies, for example, while enabling the transmission of high-speed, differential signals (e.g. 112 Gbps PAM4 capable and potentially 224 Gbps PAM4) without sacrificing electrical or mechanical performance (e.g., very low crosstalk, tight impedance control, low common mode conversion) and at a lower cost due to a reduction in tooling costs and fewer components versus existing connectors and connector assemblies.
[0091] While benefits, advantages, and solutions have been described above with regard to specific embodiments of the present invention, it should be understood that any component(s) that may cause or result in such benefits, advantages, or solutions to become more pronounced are not to be construed as a critical, required, or an essential feature or element of any or all the claims appended to the present disclosure or that result from the present disclosure.
[0092] Further, the disclosure provided herein describes features in terms of specific exemplary embodiments. However, numerous additional embodiments and modifications within the scope and spirit of the appended claims will occur to persons of ordinary skill in the art from a review of this disclosure and are intended to be covered by the disclosure and appended claims. Accordingly, this disclosure includes all such additional embodiments, modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described components in all possible variations thereof is encompassed by the disclosure unless otherwise indicated herein or otherwise clearly contradicted by context.