Electro-Formed Metal Foils

Abstract

A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.

Claims

1. A process for producing a cube textured foil, comprising: providing a cube textured metal foil M; and electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M.

2. The process of claim 1 wherein the epitaxial alloy layer comprises Ni(1-X-Y)BXCY and wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14, in atomic fractions.

3. The process of claim 2, further comprising electroplating at least one non-epitaxial layer of Ni(1-X-Y)BXCY on the epitaxial layer.

4. The process of claim 3, wherein the non-epitaxial layer has a random texture or a fiber texture or mixture thereof.

5. The process of claim 3, wherein electroplating comprises transporting the cube textured metal foil M through a first electroplating bath having a first solution comprising one or more of the elements to form Ni(1-X-Y)BXCy wherein the cube textured metal foil M is configured to operate as a cathode in the first electroplating bath to cause the first solution to be electroplated as the epitaxial layer on the cube textured metal foil M.

6. The process of claim 5, wherein electroplating comprises transporting the cube textured metal foil M having the epitaxial Ni(1-X-Y)BXCy layer deposited thereon through a second electroplating bath having a second solution comprising the elements to form Ni(1-X-Y)BXCy in any combination, wherein the electroplated cube textured metal foil M is configured to operate as a cathode in the second electroplating bath to cause the elements in the second solution to be electroplated on the epitaxial layer as the non-epitaxial Ni(1-X-Y)BXCy layer.

7. The process of claim 3, wherein the epitaxial layer has a thickness of 0.5 to 80 microns and the non-epitaxial layer has a thickness of 0.5 to 150 microns.

8. The process of claim 3, wherein the epitaxial layer has a thickness of 2 to 6 microns and the non-epitaxial layer has a thickness of 55 to 70 microns.

9. The process of claim 3, wherein the epitaxial layer and the non-epitaxial layer each comprise one of Ni(1-X-Y)Wx, Ni(1-X-Y)Mox, Ni(1-X-Y)CrX, Ni(1-X-Y)WXMoY, or Ni(1-X-Y)WXCrY.

10. The process of claim 3, wherein the epitaxial layer and the non-epitaxial layer each comprise Ni(1-X-Y)Wx wherein X is 0.08-0.10 and Y is 0.

11. The process of claim 1, wherein the cube textured metal foil M has a length from 10 meters to 2000 meters.

12. The process of claim 3, further comprising removing the combined epitaxial and non-epitaxial layers from the cube textured metal foil M; the removing comprising spalling, etching, reverse plating, controlled delamination, peeling, reel-to-reel delamination, rolling delamination, thermal mismatch, or any combination thereof.

13. The process of claim 1, wherein the cube textured metal foil M comprises a cube textured sacrificial layer on a surface thereof, wherein the sacrificial layer comprises a metal different than the metal foil M.

14. The process of claim 13 wherein the sacrificial layer has a thickness of ≤10 nm.

15. The process of claim 1, wherein the cube textured metal foil M comprises a surface roughness of less than 50 nm Ra.

16. The process of claim 1, wherein the lattice mismatch between the epitaxial layer and the cube textured metal foil M is ≤2%.

17. The process of claim 1, wherein the cube textured metal foil M comprises Cu, Ni, NiFe, or any alloy thereof.

18. The process of claim 3, wherein the cube textured metal foil M includes a first surface having a cube texture and a second surface, opposite the first surface, having a cube texture, and wherein an epitaxial Ni(1-X-Y)BXCY layer is electroplated on each of the two surfaces.

19. The process of claim 18, further comprising electroplating a non-epitaxial layer of Ni(1-X-Y)BXCY on the epitaxial Ni(1-X-Y)BXCY layers on each of the two surfaces.

20. The process of claim 19, further comprising removing the electroplated layers (epitaxial and non-epitaxial layers) from each of the first and second surfaces of the cube textured metal foil M; the removing comprising spalling, etching, reverse plating, controlled delamination, peeling, reel-to-reel delamination, rolling delamination, thermal mismatch, or any combination thereof.

21. A foil comprising a first layer of Ni(1-X-Y)BXCY having a cube texture overlying a untextured layer of Ni(1-X-Y)BXCY, wherein B and C are selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14.

22. The foil of claim 21 wherein the untextured layer comprises one of a random texture or a fiber texture.

23. The foil of claim 21 wherein the first layer has a thickness of 0.5 to 80 microns and the untextured layer has a thickness of 0.5 to 150 microns.

24. The foil of claim 21 wherein the first layer has a thickness of 2 to 6 microns and the untextured layer has a thickness of 56 to 78 microns.

25. The foil of claim 21 wherein the foil has a length of 10 meters to 2000 meters.

26. The foil of claim 21 wherein the first layer and the untextured layer each comprise one of Ni(1-X-Y)Wx, Ni(1-X-Y)Mox, Ni(1-X-Y)CrX, Ni(1-X-Y)WXMoY, or Ni(1-X-Y)WXCrY.

27. The foil of claim 21 wherein the first layer and the untextured layer each comprise Ni(1-X-Y)Wx wherein X is 0.08-0.10 and Y is 0.

28. A high temperature superconductor (HTS) tape, comprising: a substrate comprising a first layer of Ni(1-X-Y)BXCY having a cube texture overlying an untextured layer of Ni(1-X-Y)BXCY, wherein B and C are selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14; at least one buffer layer disposed on the first layer of the substrate, the at least one buffer layer having a cube texture which substantially replicates the cube texture of the first layer of the substrate; and at least one HTS layer disposed on the at least one buffer layer; the at least one HTS layer having a cube texture which substantially replicates the cube texture of the at least one buffer layer.

29. A process for producing a cube textured foil, comprising: providing a cube textured metal foil M; electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M; wherein the epitaxial alloy layer comprises Ni(1-X-Y)BXCY; and electroplating at least one non-epitaxial layer of Ni(1-X-Y)BXCY on the epitaxial layer; wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14, in atomic fractions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1A shows an example flow diagram of a process for producing a cube textured foil.

[0021] FIG. 1B shows a cross sectional view of a cube textured metal foil M with an optional sacrificial layer, an epitaxial layer, and a non-epitaxial layer.

[0022] FIG. 1C shows a cross sectional view of a cube textured foil including an epitaxial layer and a non-epitaxial layer.

[0023] FIG. 2 shows an example schematic of E-forming of Ni9 W foil.

[0024] FIG. 3A shows a top view of a Ni9 W reel-to-reel Ni9 W electroplating line with horizontal pancake coils or reels.

[0025] FIG. 3B shows a side view of the electroplating line shown in FIG. 3A.

[0026] FIG. 4 shows an example reel-to-reel delamination line with liquid nitrogen assist.

[0027] FIG. 5 shows a cross sectional view of an article with a cube textured metal foil M including two optional sacrificial layers, two epitaxial layers of an alloy and two non-epitaxial layers of an alloy.

[0028] FIG. 6 shows a cross sectional view of a high temperature superconductor (HTS) tape including a substrate comprising a non-epitaxial layer of an alloy and an epitaxial layer of an alloy.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

[0029] The technology herein provides a process for producing an alloy S foil with one surface being cube textured and the other being non-epitaxial and fine-grained. The processes can be continuous reel-to-reel designed for high throughput by utilizing, for example, multiple electroplating tanks. The processes can produce cube textured foils in lengths of about 10 meters to about 2 kilometers or more. Compositions including cube textured foil are also disclosed herein. The processes begin with providing a cube textured metal foil M which will act as a template for growing the first epitaxial layer of alloy S. The cube textured metal foil M may include any metal that provides a cube texture on at least one surface. Non-limiting examples of suitable metals for the cube textured metal foil M are copper, nickel, nickel-iron, or an alloy thereof. As metal foil M is recycled or discarded at the end of the process it is preferably cheap, easy to manufacture with a sharp cube texture throughout and a very smooth surface on one side or both sides. It also should be chemically compatible with the plating solutions. One example is Cu when plating NiW alloys using a conventional citrate plating bath.

[0030] The cube textured metal foil M can be smooth on at least one surface, for example, with a surface roughness of less than 15 nm Ra, or less than 50 nm Ra, or less than 100 nm Ra. As used herein, Ra refers to the arithmetic average of the roughness profile. An epitaxial layer of an alloy S is deposited on the cube textured metal foil M, and the epitaxial layer substantially replicates the cube texture of the cube textured metal foil M. The deposition utilizes a technique that can produce an epitaxial layer on the cube textured metal foil M, for example, electroplating. Applied to HTS, the epitaxial layer of an alloy includes Ni-9at % W or more general, Ni(1-X-Y)BXCY. B and C are elements selected from the group consisting of W, Mo, and Cr; X is 0.02-0.14 and Y is 0-0.14, in atomic fractions.

[0031] An example of a general process for producing a cube textured foil is shown in the flow diagram 100 of FIG. 1A, wherein at step 105 a cube textured metal foil M, as described above, is provided. The cube textured metal foil M can be provided in a length of about 10 meters to about 2 kilometers or more, for example, on coils or reels. The length can be cut at any point in the process to shorter lengths. The width of the cube textured metal foil M is typically 50 to 80 mm but can be as narrow as 4 mm or as wide as 150 mm. In some examples, the edge of the cube textured metal foil M or cube textured alloy S foil is removed after its formation to provide a smooth edge. Further, the shape of the cube textured metal foil M is not limited by the examples described herein, which include a flat foil or a round or flattened wire shape.

[0032] In optional step 107, in FIG. 1A, on a surface of the cube textured metal foil M a sacrificial layer that includes a cube texture may be formed. An epitaxial layer of an alloy S is electroplated at step 110 on the cube textured metal foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The electroplating may include transporting the cube textured metal foil M through a first electroplating bath having a first solution comprising the elements for the desired alloy. The cube textured metal foil M is configured to operate as a cathode in the first electroplating bath to cause the first solution to be electroplated as the epitaxial layer on the cube textured metal foil M.

[0033] At least one high rate, fine grained (non-epitaxial) layer of alloy S can be electroplated at step 120 on the epitaxial layer of alloy S. Electroplating of the non-epitaxial layer can be in the second electroplating tank or in multiple electroplating tanks 130, to increase throughput. The alloy S used for the non-epitaxial layer is preferably the same as alloy S in the epitaxial layer but can be different if so desired. In step 140 a delamination process is undertaken, which includes removing the combined epitaxial and non-epitaxial layers from the cube textured metal foil M. The removal can be by any means known in the art, for example, spalling, etching, reverse plating, controlled delamination, peeling, reel-to-reel delamination, rolling delamination, thermal mismatch, or any combination thereof. After delamination in step 140, an alloy S foil with one cube textured surface is formed at step 150.

[0034] If a sacrificial layer is utilized on the cube textured metal foil M, the epitaxial layer of an alloy may be electroplated on the sacrificial layer as described above. The sacrificial layer can include an element, metal or material different than the cube textured metal foil M. The sacrificial layer may include a cube texture. The sacrificial layer may have a lattice mismatch, measured between the cube textured metal foil M and the sacrificial layer or between the sacrificial layer and the epitaxial layer. For example, the sacrificial layer can have a thickness of ≤10 nm or about 1 or 2 atomic layers. After delamination, the sacrificial layer remains on the cube textured metal foil M. The formation of the sacrificial layer in step 107 may promote a reduction in defects or even a defect-free delamination, promote epitaxial growth, or both. Examples of sacrificial layers are 1-5 nm thick FeNi, 1-1.5 nm FCC Fe (stable to about 2 nm before converting to bcc Fe) 1-2 nm Pd, or a mono-layer sulfur superstructure. The latter is an example of a layer with a cubic structure but not a cube texture.

[0035] Referring to FIG. 1B, the cube textured metal foil M 200 can optionally include a sacrificial layer 510 on a surface of the cube textured metal foil M. The epitaxial layer 520 and the non-epitaxial layer 530 have not been delaminated from the cube textured metal foil M in FIG. 1B. FIG. 1C illustrates the alloy S foil with one cube textured epitaxial layer 520 and one non-epitaxial layer 530, without metal M.

[0036] The E-formed cube textured foil illustrated in FIG. 1C can be utilized as a cube textured substrate for another process or composition. Non limiting examples of processes that can include a cube textured substrate are fabrication of semiconductors, fabrication of detectors tuned to specific ranges of electromagnetic radiation, fabrication of devices that emit light or electromagnetic waves, fabrication of band pass filters, tribology materials, crystal growth, nanotechnology, and high temperature superconductors (HTS).

[0037] FIG. 2 shows an example applied to HTS, an example method for simultaneously producing two Ni9 W cube textured foils wherein Ni9 W refers to Ni 9% atomic W. FIG. 2 shows a schematic of E-forming of Ni9 W. It illustrates the concept of four stages in making electro-formed Ni9 W (or, alternatively, Ni(1-X-Y)BXCY wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14, in atomic fractions; or Ni(1-X-Y)Wx with X about 0.08-0.10 and Y=0). They produce a cube textured substrate for use in making an HTS wire. Stage 1 is the manufacture of long lengths of cube textured Cu (or, alternatively, Ni, NiFe, or an alloy thereof), which combines a sharp texture with a smooth surface 201, 202 (e.g., with a surface roughness of less than 15 nm Ra, or less than 50 nm Ra, or less than 100 nm Ra.), on both sides, shown at the left of FIG. 2. The second stage (Stage 2) is the epitaxial deposition of a thin Ni9 W layer 207, which may be about 0.5 micron to about 80 microns, or about 2 to about 6 microns thick. Also usable are Ni(1-X-Y)BXCY. The initial epitaxial deposition rate can be low (e.g., 0.02-0.05 A/cm.sup.2) to obtain good epitaxy. The third stage (Stage 3) can be a fast deposition (e.g., a deposition at a current density of around 0.15 to 0.2 A/cm.sup.2) of 0.5 to 150 μm or about 60 μm Ni9 W or Ni(1-X-Y)BXCY 209 to combine a higher deposition rate and higher line speed with a fine grain size (e.g., ˜lum) for strength. The fourth stage (Stage 4) can be a controlled delamination to separate the Ni9 W foils 280, 290 from the Cu foil. As described above in FIG. 1, the delamination can be by any means known in the art. A sacrificial layer (not shown) on the cube textured metal foil M may promote a defect-free delamination, promote epitaxial growth, or both.

[0038] Suitable metals for the cube textured metal foil M 200 are copper, nickel-iron, or an alloy thereof. An epitaxial layer 207 and non-epitaxial layer 209 can include Ni, W, Mo, Cr, or any combination thereof. An epitaxial layer 207 and a non-epitaxial layer 209 can include Ni(1-X-Y)BXCY; wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14, in atomic fractions. Non-limiting examples of alloys included in the epitaxial layer and non-epitaxial layer are one or more of Ni(1-X-Y)Wx, Ni(1-X-Y)Mox, Ni(1-X-Y)CrX, Ni(1-X-Y)WXMoY, and Ni(1-X-Y)WXCrY.

[0039] As illustrated in FIG. 2, the Ni9 W inner surfaces 205, originally in contact with metal M, are sharply textured and have a smooth surface, of around 12-20 nm Ra. Applied to HTS, this Ni9 W inner surface 205 will be the deposition surface for an Yttria seed layer, the first layer in a buffer layer for YBCO deposition. In this example, annealing of the Ni9 W is not needed for texture. Annealing can be considered for a strain relief if desired. A continuous method for annealing, for example, can include passing the Ni9 W foil through a tube furnace in a reducing atmosphere. Two cube textured foils 280, 290 are removed from the cube textured metal foil, and the cube textured metal foil M can optionally be recycled at 230.

[0040] An example electroplating line for producing a cube textured foil is shown in FIG. 3A (top view) and FIG. 3B (side view), which illustrate a reel-to-reel Ni9 W (or Ni(1-X-Y)BXCY as described above) electroplating line with horizontal pancake coils or reels 305 for introduction of cube textured metal foil M 200 and for reeling 307 of electroplated cube textured foil 395. These figures illustrate a reel-to-reel electroplating line with eight plating cells, two rinse tanks (370) and 11 antechambers (382 the spaces between the plating cells and/or rinse cells). The long length of the electroplating line has been shortened, for illustration purposes, as designated by the slanted line 390 near the center of FIG. 3A and FIG. 3B. Moving from left to right, the cube textured Cu foil 200 (Cu, Ni, NiFe, or an alloy thereof) enters cell 1 (310) for the epitaxial deposition of ˜0.5-80 μm Ni9 W on both sides. The Cu foil acts as the cathode. The Cu foil can travel vertically. In the side view of FIG. 3B, the Cu foil 200 is shown traveling through the electroplating line left to right. The plated Cu then continues through cell 2 (320) though additional cells to cell 8 (380) for the fast deposition of the fine-grained but not necessarily cube textured Ni9 W, which can be non-epitaxial. The texture of this second Ni9 W layer (˜0.5-150 μm or ˜55-70 μm thick) is a non-epitaxial layer of any kind and may be a fiber or a random texture, or a mixture of the two. The diagrams in FIG. 3B shows the individual power supplies 350, 351, 357, 358 and solution tanks 360, 361, 362, 363 with pumps, P (340-345), for each cell and rinse tank 370. Each cell uses consumable anodes: the Ni 330 and W 335 are placed in titanium baskets which are connected to the individual power supplies.

[0041] As illustrated in FIG. 3A and FIG. 3B, a reel-to-reel process for electroplating an epitaxial layer of an alloy on a cube textured metal foil M can utilize multiple electroplating tanks and a reel of the cube textured metal foil M (left 305), with the product 395 collected on a reel (right 307). The cube textured metal foil M can be guided into a first electroplating tank, with sliding or rolling contacts (not shown) to make the cube textured metal foil M into a cathode. Electroplating in the first electroplating tank 310 can be at a rate and conditions to produce an epitaxial layer of an alloy. Electroplating can then include transporting the cube textured metal foil M having the epitaxial layer deposited thereon through a second electroplating tank 320 having a second solution comprising the elements Ni, B, C, in any combination. Rolling or sliding contacts may be used in the second and additional tanks, wherein the electroplated cube textured metal foil M is configured to operate as a cathode in the second and additional electroplating tanks to cause the elements in the second solution to be electroplated on the epitaxial layer as the non-epitaxial layer.

[0042] The electroplating described herein is not limited by the type of power supplies and the applied current. The power supplies can provide, for example, direct current (DC), pulsed current, reverse pulse current, a square or other wave current, periods of one form of current followed by another form. Typically, a low and constant DC current is initially utilized to provide epitaxial growth but other current modes are possible as well.

[0043] Replenishment of metal ions in an electrolyte of an electroplating tank can be accomplished by utilizing, for example, tungsten 335 and nickel 330 anodes (FIGS. 3A-3B), or NiW alloy anodes, or simply by adding Ni and W salts to the solution tanks. Pumps (340-345, FIG. 3B) can be used to circulate the solution from storage tank to plating cell and apply filtration to remove unwanted deposits. The concentration of metal ions in an electrolyte, for example, can be held at a W:Ni atomic ratio of 2.3:1, yet epitaxial layers of 3-25 atomic percent tungsten can be deposited by tuning of electroplating variables discussed below. One or more additional electrodes (anodes or cathodes) may also be present in each electroplating bath or tank.

[0044] Electroplating of NiW or NiMo is referred to as induced co-deposition. Neither W nor Mo ca be deposited in pure form but can be plated in alloy form if the second element is Ni, Co or Fe. For HTS applications the magnetism of Co and Fe is problematic but that of Ni can be dealt with if the W concentration exceeds 8-9 at %. Extensive research has been carried out since 1946 to formulate a proper bath (Ni:W ratios, various complexing agents and additives) and plating conditions (pH, current densities, and temperature).

TABLE-US-00001 Nickel sulphate 0.06 mol/L Sodium tungstate 0.14 mol/L Citric acid 0.5 mol/L Ammonium chloride 0.5 mol/L Sodium bromide 0.15 mol/L Temperature 75 ° C. pH 7.5 Current density 0.05-0.3 A/cm.sup.2 A so-called Yamasaki bath for electroplating of NiW alloys T. Yamasaki, R. Tomohira, Y. Ogino, P. Schloβmacher & K. Ehrlich, Formation of Ductile Amorphous & Nanocrystalline Ni-W Alloys by Electrodeposition″, Plating & & Surface Finishing 2000, Vol 87, pp. 148-151.

[0045] For most purposes, a so-called Yamasaki bath, shown above, is now the standard solution for NiW electroplating and widely practiced across the field (with minor variations). It can yield a wide range of compositions despite the constant Ni:W ratio. The main variables are temperature and current density.

[0046] Formation of hydrogen can be an issue in this type of co-deposition. It needs to be addressed, as adsorption of the H.sub.2 by the electroplated NiW can embrittle the plate. Proper current profile selection can strongly reduce this effect, while the use of, for example, a sonicated bath can prevent H.sub.2 gas bubbles sticking to the surface.

[0047] The high-deposition rate, fine grained non-epitaxial layer can make a substrate stronger than its conventional thermo-mechanical equivalent. With the cast-and-roll process the final grain size after texture-annealing is typically in the 20-40 micrometer range. A 1-5 micrometer average grain size will improve the yield stress which is, in addition to the inherent alloy strength, inversely proportional to the square root of the average grain size. This can imply that the overall thickness can be reduced and retain a comparable overall strength of the superconducting wire, an economical benefit. Additional strength can also be utilized during a delamination process, wherein the combined epitaxial and non-epitaxial alloy S layer are removed from the cube textured metal foil M (e.g., FIG. 4). As discussed above, if a sacrificial layer is utilized on the cube textured metal foil M, the sacrificial layer can improve delamination of the epitaxial layer from the cube textured metal foil M. Delamination can be accomplished by any means known in the art. Delamination should provide an efficient removal of the epitaxial layer from the cube textured metal foil M, by for example, producing a smooth epitaxial layer free of cracks without inducing surface defects.

[0048] Examples of suitable methods for delamination are spalling, etching, reverse plating, controlled delamination, peeling, reel-to-reel delamination, rolling delamination, thermal mismatch, or any combination thereof. Continuous delamination can be used to produce long cube textured foils, for example 10 meters to 2 kilometers long. A continuous delamination can be utilized to improve throughput of the production process.

[0049] In some examples, there may be a high thermal mismatch between a cube textured foil and an epitaxial layer (or non-epitaxial layer). An example of a high thermal mismatch between copper and nickel is at 77K: ΔL/LCu=0.31%, ΔL/LNi=0.23%.

[0050] An example of a reel-to-reel delamination line with liquid nitrogen assist is shown in FIG. 4. The figure shows a side view of a frame 410 with various reels, driven by motors. The plated Ni9 W/Cu/Ni9 W trilayer 395 leaves the left pay-off reel 400 and is guided by rollers through a liquid nitrogen bath 410. The difference in thermal contraction between Ni9 W and Cu enhances the shear force at the interface when entering the bath, while the difference in thermal expansion does the same when exiting the bath. Both facilitate the delamination.

[0051] Reel-to-reel delamination can provide rolls of cube textured NiW foil 450 ready for buffer layer deposition and subsequent HTS manufacture. A roll of cube textured metal foil M 460 can be ready for recycling or even for re-deployment. Reel-to-reel delamination can be a green-chemistry process by providing a cube textured metal foil M for recycling using little to no chemicals. In the example shown in FIG. 4, liquid nitrogen assist is utilized with reel-to-reel delamination. However, any method of assisted delamination, as discussed above, may be utilized with reel-to-reel configurations.

[0052] As illustrated in FIG. 5, the technology herein can provide an intermediate product comprising a cube textured metal foil M 200 and an epitaxial layer of an alloy 520 overlying the cube textured metal foil M. The sacrificial layers 510 and 511 are optional. The article may further comprise a non-epitaxial layer 530. The cube textured metal foil M 200 illustrated in FIG. 5 may have a second surface 505 having a cube texture. A second epitaxial Ni(1-X-Y)BXCY layer (521) can be on the second surface 505. An optional sacrificial layer 511 may be disposed on the second surface 505 between a second epitaxial layer and the cube textured metal foil M 200. A non-epitaxial layer 531 can be on the second epitaxial layer. The epitaxial layer substantially replicates the cube texture of the metal foil M. The epitaxial layer can include Ni(1-X-Y)BXCY and wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14. The optional sacrificial layer 510 can be provided on the cube textured metal foil M 200 disposed between the cube textured metal foil M and the epitaxial layer 520. The optional sacrificial layer can be disposed on the cube textured metal foil M in any one of FIGS. 2-4. The sacrificial layer can, for example, be cube textured and can include a different metal or alloy compared to the cube textured metal foil M. The sacrificial layer can improve epitaxial deposition. The sacrificial layer can improve later delamination of the epitaxial layer from the cube textured metal foil M. In some examples, the sacrificial layer can provide other functions, for example, to prevent diffusion or to provide a thermal coefficient of expansion.

[0053] In FIG. 5, the cube textured metal foil M 200 can have a length from about 10 meters to about 2000 meters or longer. The additional layers can have lengths corresponding to the foil 200. The non-epitaxial layer 530 can have one of a random texture or a fiber texture or mixture thereof. The epitaxial layer 520 can have a thickness of about 0.5 to 80 microns, or about 2 to 6 microns. The non-epitaxial layer 530 can have a thickness of about 0.5 to 150 microns, or from about 55 to 70 microns. In FIG. 5, the cube textured metal foil M 200 can include Cu, Ni, Fe, or any combination thereof. The epitaxial layer and the non-epitaxial layer can each include Ni(1-X-Y)Wx wherein X is 0.08-0.10 and Y is 0.

[0054] The epitaxial layer 520 on the cube textured metal foil M 200 can have a lattice mismatch in the range from about 0% to about 2%, about 0% to about 4%, about 0% to about 6%, about 0% to about 8%, or about 0% to about 10%. If an optional sacrificial layer 510 is disposed, the lattice mismatch may be measured between the sacrificial layer and the cube textured metal foil M 200, between the sacrificial layer and the epitaxial layer 520, or between the cube textured metal foil M 200 and the epitaxial layer 520.

[0055] The methods herein can provide cube textured foil having a cube texture 520 overlying a non-epitaxial layer 530 (FIG. 1C, FIG. 5 and FIG. 6). The foil can comprise a first layer of Ni(1-X-Y)BXCY having a cube texture 520 overlying a non-epitaxial layer of Ni(1-X-Y)BXCY 530; wherein B and C are selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14. As discussed above, the foil can be utilized as a substrate for a large variety of technologies. The foil is illustrated as a HTS substrate by layers 520 and 530 in FIG. 6 (e.g., FIG. 1C). The layer 520 may have a sharp texture and a surface smoothness of 12-20 nm Ra.

[0056] FIG. 6 shows a cross sectional view of a high temperature superconductor (HTS) tape with a non-epitaxial layer of an alloy 530, an epitaxial layer of an alloy 520, at least one buffer layer 610, and at least 1 HTS layer 600. In FIG. 6, at least one HTS layer 600 can be formed of any suitable superconductor known in the art. For example, the at least one HTS layer can include a material with the general formula (RE)Ba2Cu3O(7-X), with 0≤X≤X; (RE)Ba2Cu3OY; or (RE)Ba4Cu7OY; (Y=7) with RE including at least one primary rare earth metal. Yttrium is an example of a rare earth metal. The at least one HTS layer 600 may also include a second RE element in addition to the Y. For example, a YBCO superconductor layer may include a dysprosium which may be present in an amount of up to 75% relative to the primary rare earth metal. In some examples, dopants can be present in an amount of at least about 1% to enhance the critical current in magnetic fields. Examples of dopants are a transition metal such as Zr, Nb, Ta, Hf or Au. The dopant may combine with other elements in the superconductor to form a single or mixed metal oxide.

[0057] The cube textured foil or substrate has a cube texture in the epitaxial layer 520. In FIG. 6, the epitaxial layer 520 may include texture that is transferred to the at least one buffer layer 610. The epitaxial layer 520 may include a texture that is transferred to the at least one HTS layer 600. As discussed above, texture refers to a microstructure including crystal plane alignment and the presence of low angle grain boundaries in the HTS layer. A high degree of both aspects in the HTS layer can allow a polycrystalline superconductor layer to exhibit near single crystal-like performance. The single crystal-like performance can increase current capacity in the final superconducting wire.

[0058] The at least one buffer layer 610 can, for example, prevent diffusion of metal from the substrate into the one or more HTS layers. The at least one buffer layer can include a metal oxide. For example, the metal oxide layers can prevent diffusion of the metal from the epitaxial Ni9 W (alloy S) layer or from other layers into the at least one HTS layer during the HTS wire manufacturing process. As a non-limiting example, the at least one buffer layer can include CeO2.

[0059] The cube textured foil comprising 520 and 530 can be from about 10 meters to about 2 kilometers long. Applied to HTS, the non-epitaxial layer 530 can be about 0.5 to about 150 microns thick, or about 55 to about 70 microns thick. The cube textured foil comprising 520 and 530 can be utilized to improve HTS AC current capacity, for example, by providing non magnetic Ni9 W (e.g., Ni(1-X-Y)BXCY; wherein B and C are elements selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14, in atomic fractions) in lengths of about 10 meters to 2 kilometers. The methods and articles disclosed herein are not limited to HTS and can be applied to advancement of other technologies.

[0060] The cube textured foil comprising 520 and 530 can have an epitaxial layer 520 with thickness of about 0.5 to about 80 microns. The thickness of the non-epitaxial layer 530 can be higher than 150 microns for various applications. Other technologies that may include the foil 520 and 530, are, for example, tribology, detectors, semiconductors, catalysts, band pass filters, nano-crystals, batteries, and electrodes for hydrogen generation. The technology is also directed to components, machines, devices, parts, and kits including the production methods and articles described herein. The technology herein includes manufacturing processes, coating processes, and treatments including the methods disclosed herein.

[0061] As used herein, the term “about” and “approximately” are defined to be within 10%, 5%, 1%, or 0.5%.

[0062] As used herein, “consisting essentially of” allows the inclusion of materials or steps that do not materially affect the basic and novel characteristics of the claim. Any recitation herein of the term “including”, particularly in a description of components of a composition or in a description of elements of a device, can be exchanged with the alternative expression “comprising”.