MANUFACTURE OF OPTICAL LIGHT GUIDES
20210333445 · 2021-10-28
Inventors
Cpc classification
G02B6/43
PHYSICS
G02B6/13
PHYSICS
F21V7/0091
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29D11/00721
PERFORMING OPERATIONS; TRANSPORTING
G02B3/0062
PHYSICS
International classification
F21V7/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G02B13/00
PHYSICS
Abstract
The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.
Claims
1. A method for manufacturing optical light guide elements, the method comprising a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement; the method further comprising at least one of steps d), d′), d″): d) segmenting the bar arrangement into prism bars, each of the prism bars comprising a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; d′) segmenting the bar arrangement into prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d″) segmenting the bar arrangement into prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions; the method further comprising e) segmenting the prism bars into parts.
2. The method according to claim 1, wherein at least one of each of the parts is comprised in one of the optical light guide elements; each of the parts comprises one of the optical light guide elements.
3. The method according to claim 1, wherein each of the first side faces comprises a first reflective coating.
4. The method according to claim 1, wherein each of the first side faces is reflective due to total internal reflection.
5. The method according to claim 1, wherein, in step b), the initial bars are positioned in a distance to each other.
6. The method according to claim 5, wherein each of the initial bars has a first, a second, a third and a fourth side faces, each extending from the first to the second bar end, the first and second side faces being planar faces aligned parallel to each other, the third and fourth side faces being separated from each other by and arranged between the first and the second side faces.
7. The method according to claim 1, comprising providing a plate having an upper face and a lower face which are aligned parallel to each other; obtaining the plurality of initial bars by conducting a plurality of cuts through the plate which run parallel to each other and parallel to the initial-bar directions and which create cut faces which are aligned perpendicularly to the upper and lower faces.
8. The method according to claim 1, comprising a*) providing a plurality of further bars, each further bar extending along a respective further-bar direction from a first further bar end to a second further bar end; b*) positioning, in step b), each of the further bars between two neighboring ones of the initial bars with their respective further-bar direction aligned parallel to the initial-bar directions; c*) fixing, in step c), the plurality of further bars with respect to each other and with respect to the initial bars in the position achieved in step b) to obtain the bar arrangement.
9. The method according to claim 8, comprising providing a plate referred to as further plate having an upper face and a lower face which are aligned parallel to each other; obtaining the plurality of further bars by conducting a plurality of cuts through the further plate which run parallel to each other and parallel to the further-bar directions and which create cut faces which are aligned perpendicularly to the upper and lower faces.
10. The method according to claim 1, comprising accomplishing the positioning mentioned in step b) by the aid of a jig.
11. The method according to claim 1, wherein the fixing mentioned in step c) comprises attaching a first substrate to the each of the initial bars.
12. The method according to claim 1, wherein the cut lines mentioned in steps d′) and d″) and the cuts mentioned in step d), respectively, are at an angle of between 20° and 75° with respect to the initial bar directions.
13. The method according to claim 1, comprising, before step e), attaching the prism bars to one or more further substrates, wherein the segmenting mentioned in step e) comprises segmenting the one or more further substrates.
14. The method according to claim 13, wherein each of the one or more further substrates comprises a wafer on which a plurality of lens elements are present.
15. The method according to claim 1, wherein each of the initial bars has a third side face extending from the first bar end to the second bar end, wherein each of the third side faces comprises a third reflective coating.
16. The method according to claim 11 wherein the fixing mentioned in step c) comprises, in addition, attaching a second substrate to the each of the initial bars to sandwich the initial bars between the first and second substrates.
17. The method according to claim 13 wherein each of the at least two parts comprises a section of the one or more further substrates.
18. The method according to claim 14, wherein each of said parts comprises at least one of the lens elements.
Description
[0172] Below, the invention is described in more detail by means of examples and the included drawings. The figures show:
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[0213] The described embodiments are meant as examples or for clarifying the invention and shall not limit the invention.
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[0215] The optical light guide element 1 includes a prism 40 having two reflective faces 51, 52 embodied, e.g., by two reflective coatings 21r, 23r. Light entering the optical light guide element 1 through lens element 15 is reflected by reflective face 52 along a main direction of the optical light guide element 1 onto reflective face 51 which again redirects the light out of optical light guide element 1, e.g., through another lens element (which would be not visible in
[0216] Optical light guide element 1 includes first and third outer side panels 61, 63 which are aligned parallel to base faces 9, 72 of prism 40, and to which base faces 71, 72 are fixed.
[0217] Optical light guide element 1 further includes second and fourth outer side panels 62, 64, which are sections 13a and 14a, respectively, of a lens wafer (cf. below).
[0218] Optical light guide element 1 has, within a cuboid described by the outer side panels 61, 62, 63, 64, two cavities 9, 9′.
[0219] In the same way as
[0220] In this optical light guide element 1 of
[0221] Prism 41 has base faces 71, 72, and prism 42 has base face 73 and another base face not visible in
[0222] Light entering optical light guide element 1 through lens element 15 is reflected by first and second reflective faces 51, 52 and propagates between first and second reflective faces 51, 52 inside cavity 9″ along the main direction.
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[0224] In this case, optical light guide element 1 includes three prisms 40, 41, 42 which roughly correspond to prisms 40, 41, 42 of
[0225] There are different ways of manufacturing a light guide as illustrated in
[0226] In another way, reflective face 51 is realized by prism 41, e.g., by a reflective coating 21r, and reflective face 52 is realized by prism 42, e.g., by a reflective coating 23r. In this case, the optical light guide element 1 is of type III, because light propagating inside optical light guide element 1 along the main direction does not propagate through a prism bearing the reflective faces (which would be obtained from an initial bar, cf. below).
[0227] And still in another way, reflective face 52 is realized by prism 42, and reflective face 51 is realized by prism 40; or reflective face 52 is realized by prism 40, and reflective face 51 is realized by prism 41. This way, optical light guide element 1 could be a type I optical light guide element.
[0228] The base faces of the prisms are, also in case of
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[0230] In this case, optical light guide element 1 includes three prisms 40, 41, 42 which roughly correspond to prisms 40, 41, 42 of
[0231] Prisms 41, 42 can protect reflective faces 51, 52 from dirt and damage.
[0232] In another embodiment based on
[0233] In the following, ways of manufacturing optical light guide elements, such as optical light guide elements 1 of one or more of
[0234] The manufacturing can be accomplished on wafer level, thus making possible to manufacture high numbers of high precision parts within a relatively small period of time and/or by means of a relatively low number of processing steps.
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[0237] As is clear from the above and from the below, reflective coatings, such as coatings 21r, 23r, can, in some instances, be dispensed with.
[0238] Plate 6 is, in some instances further below, also referred to as “P/C wafer”.
[0239] In
[0240] Each initial bar 2 has a first bar end 28 and a second bar end 29 and four side faces 21, 22, 23, 24, wherein reflective coating 21r is at side face 21, and reflective coating 23r is at side face 23.
[0241] In order to produce a bar arrangement 20 (cf., e.g.,
[0242] One way of positioning the initial bars 2 is to use a jig 8 as illustrated in
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[0244] Jig 8 has a plurality of protrusions 81 on which an initial bar 2 can be positioned each. After attaching initial bars 2 to protrusions 81, spacers 8a are inserted between the initial bars 2 (cf.
[0245] By application of a force, e.g., by a spring or by applying a vacuum, a suitable, e.g., equidistant, spacing of the initial bars 2 is achieved, cf.
[0246] Also other jigs may, alternatively, be used, e.g., jig 8′ as illustrated in
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[0248] Jig 8′ has grooves 8b into which initial bars 2 can be inserted, thus ensuring a precise mutual alignment of the initial bars 2.
[0249] A jig is used for the positioning only and will be removed later.
[0250] Positioning the initial bars alone or together with further bars (cf. below) without using a jig is possible, too, e.g., by simply pushing the bars against each other, each one against its one or two neighboring ones, cf., e.g.,
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[0253] The initial bars 2 can be fixed relative to each other by attaching one or two substrates to the bar arrangement 20. After attachment to a first substrate, a jig, if applied before, can be removed from the bar arrangement. However, the positioned initial bars as illustrated, e.g., in
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[0256] Now, the initial bars 2 are sandwiched between first and second substrates 11, 12. A wafer stack is obtained in which the initial bars 2 are mutually positioned with high precision.
[0257] In a next step, the obtained wafer stack of
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[0260] In the coordinate system of the prism bar 4, x′ is a coordinate along the extension of the prism bar 4—which runs somewhere (depending on the cutting angle) between the x and y coordinates of the initial bar coordinate system. It corresponds, in the produced optical light guide element to the main direction M of the optical light guide element.
[0261] And z′ is a height coordinate of the prism bar 4—which corresponds to the opposite direction of the y coordinate.
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[0269] The addition of one or more further substrates such as lens wafers 13 and/or 14 as described above is generally an option. It is, accordingly, also possible to separate a prism bar 4 (such as the one of
[0270] As has been mentioned before, it is possible to make use of “further bars”, in addition to the initial bars 2, in the manufacture of optical light guide elements. This opens up the possibility to realize further embodiments.
[0271] The initial bars 2 can, in some embodiments, be congeneric, as illustrated in the examples above.
[0272] And, the further bars can, in some embodiments, be congeneric, as illustrated in the examples below.
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[0275] The method steps illustrated in
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[0277] Depending on where the prism bar 4 is separated into parts, different type I optical light guide elements can be obtained.
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[0281] Separating the bar arrangement 20 of
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[0285] Opto-electronic component 90 is attached to contact pads which are in electrical contact to further contact pads 99 outside cavity 9″ by vias 95. By providing electrical contacts across the non-transparent dielectric material, optical light guide element 1 can be supplied with power and/or be controlled from outside optical light guide element 1.
[0286] In the illustrated example, optoelectronic component 90 is a light emitter. This way, light produced by optical light guide element 1 (more specifically: by optoelectronic component 90) can propagate along a path similar to (e.g., parallel to) the path of light guided through optical device 1.
[0287] In panel 62, a transparent region 62a is provided to which lens element 15 is attached. Panel 64 comprises a transparent region, too, for letting light pass through the otherwise non-transparent panel.
[0288] Considering the manufacturing steps and methods above (cf. also, e.g.,
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[0291] Considering the manufacturing steps and methods above (cf. also, e.g.,
[0292] As has been mentioned above, it is also possible to use initial bars 2 which are reflective only at one side (but not at the opposite side). They can be positioned, e.g., parallel to each other, to produce a bar arrangement, optionally with further bars 3 between the initial bars, wherein the further bars 3 can optionally have no reflective face, one reflective face, or two (oppositely arranged) reflective faces. Spaces 99 between neighboring bars can optionally be provided.
[0293] An exemplary method is described in detail in the following. The enclosed Figures illustrate and partially also comment details of that and of possible further methods.
[0294] 1. Start with smooth (e.g., polished), coated wafer (herein “p/c wafer”—which corresponds to the “plate” described before). The first coating may be comprised of a highly reflective metal such as aluminum, silver, and/or gold or a dielectric material and may further comprise an additional coating material (e.g. Silflex) to enhance the optical properties of the metal coating and/or provide environmental protection. For example, when a silver coating is used the additional coating could prevent or reduce tarnishing.
[0295] 2. The p/c wafer is further coated with a protective coating. The protective coating, e.g. a resin and/or photoresist, prevents damage to the first coating (e.g. a silver, Silflex coating) in the following step.
[0296] 3. The p/c wafer is put into contact with a first dicing substrate (e.g. UV dicing tape).
[0297] 4. The p/c wafer above is segmented into bars (herein “p/c bars”—which correspond to the “initial bars” described before). Segmentation may be accomplished via dicing, laser cutting and/or laser-scribe-and-break. In some cases when dicing, several passes of the dicing blade may be employed in order to reduce stresses in the p/c bars.
[0298] 5. The p/c bars are released from the first dicing substrate (e.g. if UV dicing was employed, the assembly above is exposed to UV radiation in order to remove the UV dicing tape).
[0299] 6. Alternative/additional step to the above, following 3: An easily removable adhesive (e.g. a wax or resin) is applied to the p/c wafer and an additional p/c wafer is put into contact with the first p/c wafer via the easily removable adhesive. Force may be applied to better adhere, spread the adhesive. This step may be repeated such that a multiple p/c wafer stack may be made. Following segmentation (as in step 4) each p/c bar is removed, the easily removable adhesive removed, e.g. via solvent, and the process continues with step 7.
[0300] 7. The p/c bars above are rotated 90° about the p/c bar long axis (also referred to as “initial-bar direction”) and placed into a positioning jig, e.g. by pick-and-place technology. The positioning jig is employed to position p/c bars precisely with respect to each other. Several versions of positioning jigs may be employed. A precisely machined/polished component of the positioning jig is common to each version. The precisely machined/polished component positions p/c bars with respect to each other (with a high degree of accuracy). Compression, vacuum, or easily removable adhesive is/are employed to hold the bars in place. Additional positioning jig details are disclosed in the attached figures and in the description.
[0301] 8. After the p/c bars are fixed in place in the positioning jig, an adhesive (e.g. an adhesive that is UV or thermally curable, or both) is dispensed onto a first surface of the p/c bars and/or a first substrate. When adhesive is dispensed onto p/c bars, the adhesive is dispensed onto the long surface perpendicular to the coated surface. The adhesive may be dispensed via needle dispensing/jetting, or screen printing (onto the p/c bars, first substrate, or both). The first substrate may be transparent (e.g. a glass substrate) or may be substantially non-transparent (e.g. PCB material such as FR4/G10 or a silicon substrate).
[0302] 9. The p/c bars (within the positioning jig) are brought into contact with the first substrate (via the adhesive). Force may be applied to better adhere, spread the adhesive. The adhesive is cured with UV radiation, heat or both UV radiation and heat, or partially cured e.g. via UV radiation alone. The form of curing energy depends on the type of substrate material used. For example, if the substrate is comprised of glass, UV radiation may be used, however, if the substrate is comprised of PCB or other non-transparent material heat may be used for curing.
[0303] 10. Following curing (or partial curing) in the previous step the positioning jig is removed.
[0304] 11. Adhesive is applied to a second surface of the p/c bars and/or a second substrate as above (e.g. via needle dispensing/jetting and/or screen printing). When adhesive is dispensed onto p/c bars, the adhesive is dispensed on a surface parallel to the first surface of the p/c bars (the surface with adhesive); that is, on a long surface perpendicular to a coated (metal) surface).
[0305] 12. The p/c bars (adhered to the first substrate) are brought into contact with the second substrate via the adhesive. Force may be applied to better adhere, spread the adhesive.
[0306] 13. The adhesive applied in the previous step (step 12) is cured with UV radiation, heat or both UV radiation and heat, or partially cured e.g. via UV radiation alone.
[0307] 14. In some instance when previously applied adhesive is partially cured (as in steps 9 and/or 13), the adhesive may be fully cured e.g. by applying heat, additional heat. In some cases there may be advantages to full curing both wafers in the same step (e.g. better dimensional stability).
[0308] 15. The first substrate+p/c bars+second substrate assembly (resulting from the previous steps—also referred to as “sandwich wafer” or “wafer stack” before) is segmented into bars (herein “prism bars”). Segmentation occurs at 45° relative to the p/c bars long axis and perpendicular to the plane of the first substrate+p/c bars+second substrate. Segmentation may occur as in the previous steps, e.g. by dicing. In some cases, many passes may be made with the dicing blade (in which successive amounts of material are cut away) in order to reduce stress, in other instances, the first substrate+p/c bars+second substrate may be diced partially from either side of the plane.
[0309] 16. As the precision/accuracy of the segmentation techniques typically employed (as disclosed in previous steps) is not sufficient (e.g. for dicing may be +/−50 μm), the cut surface (the surface cut in step 15) may be polished in order to obtain well defined dimensions (e.g. +/−10 μm), in some instances when such accuracy/precision is required. These surfaces are particularly important as they define the z-height (and the optical path of the module, i.e. the light path inside the optical light guide element).
[0310] 17. The prisms bars generated in the previous step may be attached to a lens wafer via adhesive and cured or partially cured (as disclosed above, within the spirit of the above). The lens wafer may be comprised of a transparent substrate (such as a glass wafer) or other transparent or non-transparent material (such as a PCB material; PCB=printed circuit board). In other cases where thermal dissipation may be critical (e.g. for optical quality) the substrate material may be a high (relatively high) thermal conductivity material (e.g. sapphire). In other instances the substrate material may be a low thermal expansion material (e.g. sapphire or other inorganic composites). The lens wafer is further comprised of lenses (lens elements). The lenses may be previously formed, cured on aforementioned wafer by known wafer level techniques. In other instances where improved lens quality is required pick-and-place technology may be used to position injection-molded lenses onto the aforementioned substrate (adhesive would have been previously applied by known technologies).
[0311] 18. In some instances, additional lens wafers may be added to the lens wafer (via adhesive) where the adhesive is cured or partially cured as above.
[0312] 19. An additional lens wafer may be added to the opposite side (within the spirit of steps 17 and 18). Further other optical elements may be added, and need not be added by wafer-level technology. E.g. pick and place may be used to position diffractive optical elements (DOEs) or other optical elements onto the lens wafers attached above.
[0313] 20. After all lens wafers and optical elements have been added, the module is diced perpendicular to the lens wafer plane and long axis of the prism bars.
[0314] Note in any of the previous steps when adhesive is used to join components where their height is critical, a special adhesive may be used that is comprised of typical adhesive material and plastic or glass balls/spheres of a particular diameter. The spheres precisely define the ultimate thickness of the adhesive layer.
[0315] The various methods and embodiments described may, in some instances, permit the manufacture of light pipes (optical light guide elements) with a very low z height. Additionally, in some instances, very high precision alignment of and distancing between parts (constituents) of the light pipe and/or very high precision alignment of the light pipe and distancing between the light pipe and further items may be achievable. The described processes can employ smooth (e.g., polished) material (e.g., glass or other transparent material; or—in particular for type II light pipes, cf. above—also non-transparent material), which may be coated with a highly reflective coating. By smooth material we mean in the present context material having a planar surface, typically at least from micron scale to millimeter scale (the surface having a low roughness), e.g., like an ordinary mirror does. The provision of such material may make possible to overcome various technical challenges. The smooth material can be of importance for the light pipes. The smooth (e.g., polished and coated) sides effect that the entire smooth material can have a very well defined thickness. This thickness translates into a very well-defined optical path. In some cases, the smooth material is transparent (e.g., polished glass or a polished transparent polymer—e.g., having an index of refraction enabling total internal reflection), and in some other cases, the smooth material is a non-transparent (and possibly also non-reflective) material such as PCB material (e.g., fiber-reinforced epoxy), and in still some other cases, the smooth material is a reflective (in particular highly reflective) non-transparent material such as a metal, e.g., polished aluminum.
[0316] The smooth material (e.g., polished glass) mentioned above provides a well defined space/optical path 1.) directly (as in