ORGANIC LIGHT EMITTING DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
20210336198 ยท 2021-10-28
Assignee
Inventors
Cpc classification
H10K71/00
ELECTRICITY
International classification
Abstract
An organic light emitting display panel includes a backplate, an organic light emitting module disposed on the backplate, and a lip portion of the backplate is defined between an edge of the backplate and an edge of the organic light emitting module. An encapsulation layer is configured to encapsulate the backplate and the organic light emitting module and cover the lip portion. The encapsulation layer includes an encapsulation resin film laminated on the backplate and a metal film disposed on the encapsulation resin film. The metal film extends toward the backplate and bends inwardly within the encapsulation resin film on the lip portion of the backplate to form a groove.
Claims
1. An organic light emitting display panel, comprising: a backplate; an organic light emitting module disposed on the backplate, wherein a lip portion of the backplate is defined between an edge of the backplate and an edge of the organic light emitting module; and an encapsulation layer configured to encapsulate the backplate and the organic light emitting module and covering the lip portion of the backplate, wherein the encapsulation layer comprises an encapsulation resin film laminated on the backplate and a metal film disposed on the encapsulation resin film; wherein the metal film extends toward the backplate and bends inwardly within the encapsulation resin film on the lip portion of the backplate to form a groove.
2. The organic light emitting display panel of claim 1, wherein the groove of the metal film comprises an opening and an end portion disposed between the opening and the backplate, a first distance is defined between the end portion and an upper surface of the backplate, a second distance is defined between the upper surface of the backplate and a surface of the organic light emitting module far away from the backplate, and the first distance is less than the second distance.
3. The organic light emitting display panel of claim 2, wherein the end portion of the groove has an aperture width less than or equal to an aperture width of the opening of the groove.
4. The organic light emitting display panel of claim 1, wherein the groove is triangular in shape in a perpendicular cross-section of the groove.
5. The organic light emitting display panel of claim 1, wherein a third distance is defined between a surface of the organic light emitting module far away from the backplate and the metal film, and the third distance is less than a depth of the groove.
6. The organic light emitting display panel of claim 1, wherein the metal film is made of an Invar alloy.
7. The organic light emitting display panel of claim 1, wherein the organic light emitting module comprises an anode layer, a light emitting layer, and a cathode layer.
8. A method of manufacturing an organic light emitting display panel, comprising: providing a backplate; forming an organic light emitting module on the backplate, wherein a lip portion of the backplate is defined between an edge of the backplate and an edge of the organic light emitting module; providing an encapsulation layer comprising an encapsulation resin film configured to be laminated on the backplate and a metal film disposed on the encapsulation resin film, wherein the metal film is processed in advance through a cold forming process to extend toward the backplate and bend inwardly within the encapsulation resin film on the lip portion of the backplate to form a groove; and laminating the encapsulation layer onto the backplate and the organic light emitting module, wherein the backplate is laminated with the encapsulation layer through the encapsulation resin film, the encapsulation resin film is processed through thermal curing to complete encapsulation of the organic light emitting module, and the groove is disposed within the encapsulation resin film on the lip portion of the backplate.
9. The method of manufacturing the organic light emitting display panel of claim 8, wherein the groove of the metal film comprises an opening and an end portion disposed between the opening and the backplate, a first distance is defined between the end portion and an upper surface of the backplate, a second distance is defined between the upper surface of the backplate and a surface of the organic light emitting module far away from the backplate, and the first distance is less than the second distance.
10. The method of manufacturing the organic light emitting display panel of claim 8, wherein a third distance is defined between a surface of the organic light emitting module far away from the backplate and the metal film, and the third distance is less than a depth of the groove.
11. The method of manufacturing the organic light emitting display panel of claim 8, wherein before the encapsulation layer is laminated onto the backplate and the organic light emitting display panel, pre-curing the encapsulation resin film, then laminating the pre-cured encapsulation resin film onto the backplate and the organic light emitting module, and then thermo-curing the pre-cured encapsulation resin film.
12. An organic light emitting display panel, comprising: a backplate; an organic light emitting module comprising an anode layer, a light emitting layer disposed on the anode layer, and a cathode layer disposed on the light emitting layer, wherein the organic light emitting module is disposed on the backplate, and a lip portion of the backplate is defined between an edge of the backplate and an edge of the organic light emitting module; and an encapsulation layer configured to encapsulate the backplate and the organic light emitting module and covering the lip portion of the backplate, wherein the encapsulation layer comprises an encapsulation resin film laminated on the backplate and a metal film disposed on the encapsulation resin film; wherein the metal film extends toward the backplate and bends inwardly within the encapsulation resin film on the lip portion of the backplate to form a groove, and the groove comprises an opening and an end portion disposed between the opening and the backplate, a first distance is defined between the end portion and an upper surface of the backplate, a second distance is defined between the upper surface of the backplate and a surface of the organic light emitting module far away from the backplate, and the first distance is less than the second distance.
13. The organic light emitting display panel of claim 12, wherein the end portion of the groove has an aperture width less than or equal to an aperture width of the opening of the groove.
14. The organic light emitting display panel of claim 12, wherein a third distance is defined between a surface of the organic light emitting module far away from the backplate and the metal film, and the third distance is less than a depth of the groove.
15. The organic light emitting display panel of claim 12, wherein the metal film is made of an Invar alloy.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
DESCRIPTION OF PREFERRED EMBODIMENTS
[0027] The following embodiments are referring to the accompanying drawings for exemplifying specific implementable embodiments of the present disclosure. Furthermore, directional terms described by the present disclosure, such as upper, lower, front, back, left, right, inner, outer, side, etc., are only directions by referring to the accompanying drawings, and thus the used directional terms are used to describe and understand the present disclosure, but the present disclosure is not limited thereto. In the drawings, elements with similar structures are labeled with like reference numerals.
[0028] An organic light emitting display panel of the present invention is exemplified as an organic light emitting diode (OLED) display panel.
[0029] The encapsulation layer 3 is configured to encapsulate the backplate 1 and the organic light emitting module 2 and to cover the lip portion 11 of the backplate 1. The encapsulation layer 3 includes an encapsulation resin film 31 laminated on the backplate 1 and a metal film 32 disposed on the encapsulation resin film 31, wherein the metal film 32 is completely laminated onto the encapsulation resin film 31 and is made of an Invar alloy. The Invar alloy has the smallest alloy expansion coefficient and is similar to glass in terms of material properties, which avoids stresses due to differences in expansion coefficients. Being distinct from a traditional encapsulation metal film, the metal film 32 of the present invention is configured based on the asymmetry principle to be different from a flat surface structure of a traditional metal film. Specifically, the metal film 32 of the encapsulation layer 3 extends toward the backplate 1 and bends inwardly within the encapsulation resin film 31 on the lip portion 11 of the backplate 1 to form a groove 33. The groove 33 has an opening 331 and an end portion 332 disposed between the opening 331 and the backplate 1.
[0030] Please continuously refer to
[0031] Furthermore, as shown in
[0032]
[0033]
[0034] The organic light emitting display panel of the present invention utilizes the encapsulation structure that the groove 33 of the metal film 32 extends toward and bends inwardly within the encapsulation resin film 31 on the lip portion 11 of the backplate 1 to effectively reducing a width of the passage where moisture can permeate through, thereby to prevent outside moisture from permeating into the interior of the display panel, and to avoid reducing lifespan of products because of external moisture. Furthermore, a space between the metal film 32 and the organic light emitting module 2 is enough to accommodate foreign matter and can improve tolerance to foreign matter for the encapsulation structure, thereby to prevent the light emitting layer 22 from being damaged by the pressure from the foreign matter during the encapsulation process, and further to improve a yield rate of a product. Accordingly, the organic light emitting display panel of the present invention effectively overcome drawbacks of traditional encapsulation structure that moisture is easily to permeate into interior of a device and foreign matter tends to depress and damage a light emitting layer.
[0035]
[0036] Step S1: providing a backplate;
[0037] Step S2: forming an organic light emitting module on the backplate, wherein a lip portion of the backplate is defined between an edge of the backplate and an edge of the organic light emitting module;
[0038] Step S3: providing an encapsulation layer comprising an encapsulation resin film configured to be laminated on the backplate and a metal film disposed on the encapsulation resin film, wherein the metal film is processed in advance through a cold forming process to extend toward the backplate and bend inwardly within the encapsulation resin film on the lip portion of the backplate to form a groove; and
[0039] Step S4: laminating the encapsulation layer onto the backplate and the organic light emitting module, wherein the backplate is laminated with the encapsulation layer through the encapsulation resin film, the encapsulation resin film is processed through thermal curing to complete encapsulation of the organic light emitting module, and the groove is disposed within the encapsulation resin film on the lip portion of the backplate.
[0040] Particularly, the encapsulation resin film is made of organic polymer (such as polyethylene terephthalate, PET) and is added with a water absorbing material (such as calcium oxide or the like) and a hydrophobic material. Before the encapsulation layer is laminated onto the backplate and the organic light emitting display panel, pre-curing the encapsulation resin film, then laminating the pre-cured encapsulation resin film onto the backplate and the organic light emitting module, and then thermo-curing the pre-cured encapsulation resin film.
[0041] Other structures of the organic light emitting display panel manufactured according to the method of manufacturing the organic light emitting display panel are described in the previous paragraphs, and will not be repeated herein.
[0042] It is understood that the invention may be embodied in other forms within the scope of the claims Thus the present examples and embodiments are to be considered in all respects as illustrative, and not restrictive, of the invention defined by the claims