PROTECTION DEVICE FOR LINES IN A PROJECTION PRINTING INSTALLATION FOR SEMICONDUCTOR LITHOGRAPHY
20210336429 · 2021-10-28
Inventors
Cpc classification
H02G11/00
ELECTRICITY
G03F7/70841
PHYSICS
G03F7/70991
PHYSICS
International classification
H02G3/04
ELECTRICITY
Abstract
A protective apparatus for lines between two components of a projection exposure apparatus for semiconductor lithography is firmly connected to the two components. the protective apparatus includes first and second partial regions which are configured to protect against mechanical damage to the lines. The first partial region is at least temporarily configured to mechanically decouple the first component from the second component.
Claims
1. A protective apparatus configured to protect lines between first and second components of a projection exposure apparatus for semiconductor lithography, the protective apparatus comprising: a first partial region; and a second partial region comprising multiple segments, wherein the protective apparatus is configured so that when the protective apparatus is firmly connected to the first and second components: the first and second partial regions protect against mechanical damage to the lines; and the first partial region at least temporarily mechanically decouples the first component from the second component.
2. The protective apparatus of claim 1, wherein the segments of the second partial region have different lengths.
3. The protective apparatus of claim 1, wherein the first partial region and a segment of the second partial are clamped together.
4. The protective apparatus of claim 1, wherein the first partial region is firmly connected to a segment of the second partial region.
5. The protective apparatus of claim 4, wherein the first partial region has a first position in which it is connected to the segment of the second partial region, and the first partial region has a second position in which it is connected to the segment of the second partial region.
6. The protective apparatus of claim 5, wherein, when the first partial region is in its first position, the first partial region firmly connects two segments of the second partial region to one another.
7. The protective apparatus of claim 5, wherein, when the first partial region is in its first position, the first partial region firmly connects the segment of the second partial region to at least one component selected from the group consisting of the first component and the second component.
8. The protective apparatus of claim 5, wherein, when the first partial region is in its second position, the first partial region is firmly connected to a segment of the second partial region.
9. The protective apparatus of claim 5, wherein, when the first partial region is in its second position, the first partial region is firmly connected to a component selected from the group consisting of the first component and the second component.
10. The protective apparatus of claim 1, wherein a ratio of a static stiffness of the first partial region to a static stiffness of the second partial region is greater than 1.
11. The protective apparatus of claim 1, wherein, in a frequency range of from 500 Hz to 2000 Hz, a ratio of a dynamic stiffness of the first partial region to a dynamic stiffness of the second partial region is less than 1/10.
12. The protective apparatus of claim 1, wherein the first partial region comprises a material having an inherent damping of more than 20%.
13. The protective apparatus of claim 1, wherein the first partial region comprises multiple segments.
14. The protective apparatus of claim 13, wherein the first and second components and the segments of the first and second partial regions are arranged successively according to one of the following: the first component, a segment of the first partial region, a segment of the second partial region, the second component; the first component, a segment of the second partial region, a segment of the first partial region, the second component; the first component, a first segment of the first partial region, a segment of the second partial region, a second segment of the first partial region, the second component; to the first component, a first segment of the first partial region, a first segment of the second partial region, a second segment of the first partial region, a second segment of the second partial region, a third segment of the first partial region, the second component; the first component, a first segment of the first partial region, a first segment of the second partial region, a second segment of the first partial region, a second segment of the second partial region, the second component; the first component, a first segment of the second partial region, a first segment of the first partial region, a second segment of the second partial region, a second segment of the first partial region, the second component; and the first component, a first segment of the second partial region, a segment of the first partial region, a second segment of the second partial region, the second component.
15. The protective apparatus of claim 1, wherein the first partial region comprises a tuned mass damper.
16. The protective apparatus of claim 1, wherein materials of the protective apparatus are vacuum-suitable.
17. The protective apparatus of claim 1, wherein the segments of the second partial region have different lengths, and the first partial region and a segment of the second partial are clamped together.
18. The protective apparatus of claim 1, wherein the segments of the second partial region have different lengths, and the first partial region is firmly connected to a segment of the second partial region.
19. An apparatus, comprising: an illumination system configured to illuminate an object field; a projection optical unit configured to image the object field into an image field; and a protective apparatus according to claim 1, wherein the apparatus is a semiconductor lithography projection exposure apparatus.
20. A method of using a semiconductor lithography projection exposure apparatus comprising an illumination system, a projection optical unit and a protective system, the method comprising: using the illumination system configured to illuminate an object field; and using the projection optical unit configured to image the object field into an image field, wherein the protective apparatus is a protective apparatus according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Exemplary embodiments and variants of the disclosure are explained in more detail below with reference to the drawing, in which:
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[0035]
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0036]
[0037] A reticle 7 arranged in the object field 5 and held by a schematically illustrated reticle holder 8 is illuminated. A merely schematically illustrated projection optical unit 9 serves for imaging the object field 5 into an image field 10 in an image plane 11. A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 12, which is arranged in the region of the image field 10 in the image plane 11 and held by a likewise partly represented wafer holder 13. The light source 3 can emit used radiation for example in a wavelength range of between 5 nm and 120 nm.
[0038] The disclosure can likewise be used in a DUV apparatus, which is not illustrated. A DUV apparatus is set up in principle like the above-described EUV apparatus 1, wherein mirrors and lens elements can be used as optical elements in a DUV apparatus and the light source of a DUV apparatus emits used radiation in a wavelength range of 100 nm to 300 nm.
[0039] For example, the disclosure can also find application between components of which one is arranged at what is known as a force frame and the other is arranged at what is known as a sensor frame. The force frame is a carrying structure of a projection exposure apparatus absorbing forces emanating from the components used, for example their weights. The sensor frame, by contrast, substantially carries only sensor components and are desirably decoupled from mechanical influences of the force frame as much as possible in order to ensure for example position measurements that are as precise as possible.
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[0048] The position of the first partial region 31 shown in
[0049]
LIST OF REFERENCE SIGNS
[0050] 1 Projection exposure apparatus
[0051] 2 Facet mirror
[0052] 3 Light source
[0053] 4 Illumination optical unit
[0054] 5 Object field
[0055] 6 Object plane
[0056] 7 Reticle
[0057] 8 Reticle holder
[0058] 9 Projection optical unit
[0059] 10 Image field
[0060] 11 Image plane
[0061] 12 Wafer
[0062] 13 Wafer holder
[0063] 14 EUV radiation
[0064] 15 Intermediate field focal plane
[0065] 16 Pupil facet mirror
[0066] 17 Assembly
[0067] 18 Mirror
[0068] 19 Mirror
[0069] 20 Mirror
[0070] 30 Protective apparatus
[0071] 31 First partial region
[0072] 32, 32′, 32″ Segment of the first partial region
[0073] 33 Second partial region
[0074] 34, 34′ Segment of the second partial region
[0075] 40 Corrugated tube
[0076] 41 Fastening mechanism
[0077] 42 Bushing
[0078] 50, 50′ Tube
[0079] 51 Fastening mechanism
[0080] 52 Sleeve
[0081] 60,60′ Component
[0082] 61 Attachment mechanism
[0083] 70 Line