Abstract
The invention relates to a device for guiding an electromagnetic wave within a cylinder head of a cylinder system, wherein the device comprises analysis electronics arranged in or on the cylinder head and a probe located in the cylinder head, as well as a connecting structure guiding the electromagnetic wave and arranged between the analysis electronics and the probe for versatile positioning of the analysis electronics, the connecting structure having a first signal connection (101, 201, 301, 401, 501a, 501b, 601, 701) for connection to the probe and a second signal connection (314, 514a, 514b, 714) for connection to the analysis electronics.
Claims
1. A device for guiding an electromagnetic wave within a cylinder head of a cylinder system, comprising: analysis electronics arranged in or on the cylinder head; a probe located in the cylinder head; and a connecting structure configured to guide the electromagnetic wave, wherein the connecting structure is arranged between the analysis electronics and the probe, and the connecting structure comprises a first signal connection connected to the probe and a second signal connection connected to the analysis electronics.
2. The device of claim 1, wherein the connecting structure is flexible.
3. The device of claim 1, wherein the connecting structure is rigid.
4. The device of claim 1, wherein the connecting structure is a coaxial connection configured to transmit the electromagnetic wave.
5. The device of claim 1, wherein the first signal connection and the second signal connection are reconfigurable to different angles with respect to each other.
6. The device of claim 1, wherein the first signal connection and/or the second signal connection are/is configured on a printed circuit board (104, 404).
7. The device of claim 1, wherein the first signal connection and/or the second signal connection are/is configured as a coaxial connection on a printed circuit board.
8. The device of claim 1, wherein the connecting structure further comprises strip lines.
9. The device of claim 1, comprising a galvanic contact between the first signal connection and the second signal connection.
10. The device of claim 9, wherein the galvanic contact is configured as an element with spring effect.
11. The device of claim 10, wherein the galvanic contact is configured as a spring contact, a conductive elastomer, or a conductive film-over-foam contact.
12. The device of claim 9, wherein the galvanic contact is configured as a plug-in connection or a clamping connection.
13. The device of claim 9, wherein the galvanic contact is configured as a screw connection or a press connection.
14. The device of claim 13, wherein the screw connection or the press connection is: configured as an interference fit; or a press fit.
15. The device of claim 9, wherein the galvanic contact is configured as a solder connection.
16. The device of claim 1, wherein the first signal connection and/or the second signal connection are/is galvanically isolated, and wherein the device further comprises coupling structures configured as one or more signal lines guided in parallel.
17. The device of claim 16, wherein the galvanic isolation is configured between the first signal connection and the analysis electronics.
18. The device of claim 16, further comprising directional couplers integrated into the one or more signal lines.
19. The device of claim 16, further comprising calibration structures integrated into the one or more signal lines.
20. The device of claim 1, further comprising analog or digital temperature sensors configured to monitor a temperature, wherein the temperature sensors are provided at the connecting structure.
21. The device of claim 1, wherein the electromagnetic wave has a frequency in a range from 10 MHz to 100 GHz.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0028] FIG. 1A shows a schematic sectional illustration of a cylinder system comprising external analysis electronics in generalized form.
[0029] FIG. 1B shows a schematic sectional illustration of a cylinder system comprising internal analysis electronics in generalized form.
[0030] FIG. 2 shows a perspective illustration of an embodiment of the connecting structure according to the application with a 90-degree connection between a coaxial line which leads to the probe and a microstrip line which leads to the analysis electronics using a spring contact metal sheet on a printed circuit board.
[0031] FIG. 3 shows a sectional illustration of an embodiment of the connecting structure according to the application with a connection between two coaxial lines using a spring contact pin.
[0032] FIG. 4 shows a sectional illustration of an embodiment of the connecting structure according to the application with a straight connection between two coaxial lines using a spring contact pin.
[0033] FIG. 5 shows a perspective illustration of an embodiment of the connecting structure according to the application with a screwed press connection between a coaxial line coming from the probe and a microstrip line, which leads to the analysis electronics, with a printed circuit board.
[0034] FIG. 6A shows a perspective illustration of an embodiment of the connecting structure according to the application with an L-shaped connection between two coaxial lines using a clamping connection with a spring-action rotary part.
[0035] FIG. 6B shows a sectional illustration of the embodiment according to FIG. 6A.
[0036] FIG. 7 shows a sectional illustration of an embodiment of the connecting structure according to the application with an L-shaped connection between two coaxial lines using a clamping connection.
[0037] FIG. 8 shows a sectional illustration of an embodiment of the connecting structure according to the application with a straight connection between two coaxial lines using a pressed plug-in contact at the internal conductor and a press connection at the external conductor.
DETAILED DESCRIPTION
[0038] FIG. 1A schematically shows the sectional illustration of a cylinder system comprising the device according to the application in which the analysis electronics (22a) of a sensor system are arranged externally. In the case of external implementation, a connection between the probe (21a) and the analysis electronics (22a) is provided by a bore or milled portion in the cylinder wall of the cylinder head (24a). A coaxial connection is preferably used to transmit the electromagnetic wave.
[0039] FIG. 1B schematically shows the sectional illustration of a cylinder system comprising the device according to the application in which the analysis electronics (22b) of the sensor system are arranged internally. In the case of the internal implementation, the analysis electronics (22b) are preferably arranged in the cylinder head (24b) of the cylinder system in a cavity close to the probe (21b). A short coaxial line is preferably used to connect the analysis electronics (22b).
[0040] FIG. 2 shows a perspective view of an embodiment of the connecting structure according to the application in which a 90-degree connection is realized between a coaxial signal connection (101) that leads to the probe and a signal connection that leads to the analysis electronics. The signal connection that leads to the analysis electronics is a microstrip line, preferably a Grounded Coplanar Waveguide (gCPW)-type microstrip line that is guided into a bore hole. The galvanic contact is achieved with the aid of one or more spring contact metal sheets (103) that can be manufactured, for example, from copper-beryllium or other conductive materials with corresponding spring properties. The copper contact sheet (103) is arranged on the signal path of the microstrip line (105). When designing the signal path, attention should be given to the power distribution at the contact point and the inductive influence of the spring contact metal sheet (103). The use of a dedicated network for impedance matching, preferably on the printed circuit board (104) and/or in the coaxial system, can prove expedient, but is not absolutely necessary given correct design of the spring contact metal sheet (103). Furthermore, one or more analog and/or digital temperature sensors (106) are arranged on the printed circuit board (104), which temperature sensors monitor the temperature response of the connection between the probe and the analysis electronics in order to compensate for this temperature response by means of a suitable method during the signal analysis.
[0041] FIG. 3 shows the sectional illustration of an embodiment of the connecting structure according to the application in which an L-shaped connection is realized between the two signal connections. The first signal connection and the second signal connection are each a coaxial connection, wherein a spring contact pin (208) is used as a mechanically flexible connecting element in order to generate a coaxial angled system.
[0042] FIG. 4 likewise shows the sectional illustration of an embodiment of the connecting structure according to the application in which a straight connection is implemented between the two signal connections (301, 314). As in FIG. 3, the first signal connection (301) and the second signal connection (314) in FIG. 4 are each a coaxial connection, wherein a spring contact pin (308) is used as the mechanically flexible connecting element.
[0043] FIG. 3 and FIG. 4 show spring contacts as the mechanically flexible connecting element in straight and angled coaxial systems. In both illustrations, the external conductor (202, 302) of the coaxial line is formed by the wall of the bore holes (211) in the cylinder head. The internal conductors of the lines to the probe (201, 301) or to the electronics (314) are achieved in the illustration using spring contact pins (208, 308) which are spring-mounted in a sleeve (210, 310). In this case, the spring (209, 309) generates pressure on the contact point in the axial direction. A dielectric sleeve (210, 310) provides for mechanical stability of the contact system in the radial direction and additionally serves for impedance matching of the change in bore diameter that arrises.
[0044] In addition to partially or entirely flexible connections, rigid connections in the form of a screw or press connection, an interference fit, as well as a solder connection can be used as an interface between the analysis electronics and the probe.
[0045] FIG. 5 shows a perspective illustration of an embodiment of the connecting structure according to the application that includes a screwed press connection between a coaxial line (401) coming from the probe and a microstrip line (405), which leads to the analysis electronics, with a printed circuit board. Said figure shows a rigid press connection, wherein the electrical contact of external conductors and internal conductors of the coaxial line is made by a press connection on the printed circuit board, and wherein contact pressure is applied by a screw (413) that is tightened with a defined torque.
[0046] FIGS. 6A and 6B show a perspective illustration and, respectively, a sectional illustration of a likewise flexible, galvanic connection with a plug-in or clamping connection in coaxial form. The connection of the internal conductor of the coaxial line (501a, 501b) that leads to the probe and the connection of the electronics (514a, 514b) is realized by a spring-action rotary part (515a, 515b) or bent sheet-metal part, for example composed of brass or copper-beryllium, which is applied to one of the two internal conductors, for example, by adhesive bonding or soldering. The spring-action rotary part (515a, 515b) is formed in a partially slotted manner in the axial direction, so that the groove has a spring effect, firstly, in order to enable insertion of the mating piece and, secondly, to ensure reliable securing in the latched state. The spring-action rotary part (515a, 515b) has to be designed both in mechanical and electrical respects in order to meet the requirements of the transmission path. In particular, the choice of the material and also a shape which permits direct current flow in the axial direction have proven essential for the high-frequency properties of the connection. Furthermore, low parasitic capacitances between the rotary part (515a, 515b) and the cylinder wall (502a, 502b), which serves as external conductor, should be ensured when configuring the spring-action rotary part (515a, 515b) with a solder and clamping connection.
[0047] FIG. 7 shows a sectional illustration of an embodiment of the connecting structure according to the application that includes a press connection in a coaxial system. The coaxial conductors coming from the probe and the analysis electronics form a right angle to one another and the walls of the bore holes (611) in the cylinder head form the external conductors (602) of the connection. The press contact is implemented by a dielectric clamping wedge (616) with a preferred direction, the clamping wedge defining the flexible internal conductor coming from the electronics and pressing onto the rigid internal conductor to establish the connection to the probe.
[0048] FIG. 8 shows a sectional illustration of an embodiment of the connecting structure according to the application that includes a straight connection of two coaxial lines, wherein the connection of the internal conductors is made by means of a pressed-in contact element (718) and the external conductors are electrically connected via a press connection (719).
[0049] Furthermore, a cylinder system comprising external electronics is described in general in FIG. 1A (at the top). FIG. 1B (at the bottom) describes a cylinder system comprising internal electronics. FIG. 2 describes a connection of the analysis electronics and the probe using a printed circuit board with a metal spring sheet. FIG. 3 describes an L-shaped connection of the analysis electronics and the probe using coaxial conductors with a spring contact pin. FIG. 4 describes a straight connection of the analysis electronics and the probe using a spring contact pin and coaxial conductors. FIG. 5 describes a connection of the analysis electronics and the probe using a screwed press connection with a printed circuit board and a coaxial line. FIG. 6A (at the top) describes an L-shaped connection of the analysis electronics and the probe with a coaxial design using a clamping connection with a spring-action rotary part in a perspective illustration. FIG. 6B (at the bottom) describes an L-shaped connection of the analysis electronics and the probe with a coaxial design using a clamping connection with a spring-action rotary part in a sectional illustration. FIG. 7 describes an L-shaped connection of the analysis electronics and the probe using a clamping connection. FIG. 8 describes a straight connection of the analysis electronics and the probe using a pressed-in plug-in contact at the internal conductor and a press connection of the external conductors.
