DISPLAY PANEL AND PREPARATION METHOD THEREOF
20210333588 · 2021-10-28
Inventors
Cpc classification
G02F1/13394
PHYSICS
G02F1/133516
PHYSICS
G02F2201/506
PHYSICS
International classification
Abstract
A display panel and a preparation method thereof are provided. The preparation method includes a base substrate arrangement step, a retaining wall forming step, a primary sealant providing step, a liquid crystal layer forming step, a color filter substrate bonding step, a curing step, and a cutting step. The display panel includes an array substrate, a color filter substrate, a liquid crystal layer, and a primary sealant. The technical effect of the invention is that the retaining wall is disposed on the periphery of the primary sealant such that the display panel prevents the primary sealant from being broken by the air flow during the atmosphere introduction step, thereby realizing the preparation of the flexible sealant display panel.
Claims
1. A method of preparing a display panel, comprising: a base substrate arrangement step, forming two or more array substrates on the base substrate; a retaining wall forming step, forming a retaining wall on the base substrate, wherein the retaining wall encircles at least one array substrate; a primary sealant providing step, providing a primary sealant to each of the array substrates to form sealant cavities; a liquid crystal layer forming step, dropping liquid crystals into the sealant cavity of each of the array substrates to form liquid crystal layers encircled by the primary sealant; a color filter substrate bonding step, vacuum bonding a color filter substrate on the liquid crystal layers; a curing step, curing the primary sealant, and a cutting step, cutting the base substrate, removing the retaining wall encircling each of the array substrates to form two or more display panels.
2. The method of preparing the display panel according to claim 1, further comprising a sealant coating step after the base substrate arrangement step, applying the sealant to a periphery of the base substrate, the sealant encircling all the array substrates.
3. The method of preparing the display panel according to claim 2, wherein the retaining wall forming step comprises forming the retaining walls at a periphery of each of the array substrates, wherein the retaining wall each encircles each of the array substrates, and providing the primary sealant to an inner side of each of the retaining walls.
4. The method of preparing the display panel according to claim 2, wherein the retaining wall forming step comprises dividing the base substrate into two or more regions and forming the retaining walls at a periphery of each of the regions.
5. The method of preparing the display panel according to claim 1, wherein the retaining wall forming step comprises forming the retaining wall on a periphery of the base substrate to encircle all of the array substrates.
6. The method of preparing the display panel according to claim 1, wherein in the retaining wall forming step, the retaining wall is a non-flexible sealant and the retaining wall comprises a spacer or a black matrix.
7. The method of preparing the display panel according to claim 1, wherein the color filter substrate bonding step comprises: a color filter substrate covering step, covering the liquid crystal layers with the color filter substrate; a vacuuming step, feeding the base substrate into a vacuum chamber and vacuuming the vacuum chamber to bond the color filter substrate to the liquid crystal layers; and an atmosphere introduction step, introducing atmosphere into the vacuum chamber.
8. The method of preparing the display panel according to claim 1, wherein the curing step comprises adopting an ultraviolet light curing method and/or a thermal curing method.
9. A display panel, prepared by the method according to claim 1.
10. The display panel according to claim 9, comprising: the array substrate; the color filter substrate disposed opposite to the array substrate; the liquid crystal layer disposed between the array substrate and the color filter substrate; and the primary sealant disposed between the array substrate and the color filter substrate and encircles the liquid crystal layer.
Description
DESCRIPTION OF DRAWINGS
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[0028] The reference numerals of components in the drawings are denoted as follows: [0029] 1: array substrate, [0030] 2: retaining wall, [0031] 3: primary sealant, [0032] 4: liquid crystal layer, [0033] 5: color filter substrate.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0034] The preferred embodiments of the present invention are described in detail following with reference to the accompanying drawings to certify the invention can be implemented and render the disclosed technical content of the invention clearer. Those skilled in the art will more readily understand how to implement the invention. However, the present invention may be embodied in different forms and embodiments, and the scope of the invention is not limited to the embodiments described herein.
[0035] The directional terms mentioned in the present invention, such as “upper”, “lower”, “front”, “rear”, “left”, “right”, “inside”, “outside”, “side”, etc., only represent the directions in the drawings. The directional terms used herein are used to explain the invention and are not intended to limit the scope of the invention.
[0036] In the drawings, structurally identical components are denoted by the same reference numerals, and structural or functionally similar components are denoted by similar reference numerals. Moreover, the size and thickness of each component shown in the drawings are arbitrarily shown for ease of understanding and description, and the invention does not limit the size and thickness of each component.
[0037] When a component is described as “on” the other component, the component may be placed directly on the other component; there may also be an intermediate component, the component is placed on the intermediate component and the intermediate component is placed on the other component. When a component is described as “mounted/connected” to the other component, it may be understood as the component is directly “mounted/connected” to the other component or “mounted/connected” to the other component by an intermediate component.
Embodiment 1
[0038] As shown in
[0039] S11: a base substrate arrangement step, two or more array substrates are disposed on one base substrate, and the two or more array substrates are arranged in a matrix.
[0040] S12: a sealant coating step, applying a sealant to a periphery of an upper surface of the base substrate, and the sealant encircling all the array substrates on the base substrate. The sealant acts to support the base substrate to prevent an upper substrate and a lower substrate from sticking together during the subsequent bonding process, and avoiding cutting abnormality issues in the subsequent cutting step.
[0041] S13: a retaining wall forming step, forming the retaining walls at a periphery of each of the array substrates, the retaining wall made of at least one of a non-flexible sealant, a spacer, and a black matrix. The shape of the retaining wall includes at least one of right-angled rectangle, rounded rectangle, and ellipse. In other embodiments, the base substrate can be divided into a plurality of regions with a retaining wall at the periphery of each region.
[0042] S14: a primary sealant providing step, providing a primary sealant to each of the array substrates to form sealant cavities. The material of the primary sealant is a flexible sealant, which meets the requirements of the current flexible display panel. In a display panel preparation process of the prior art, after the flexible sealant is provided, the subsequent vacuum relief and curing, etc., steps are performed, which cause the flexible sealant to be easily destroyed by the atmosphere, and cause an outflow of the liquid crystals in the sealant cavity encircled by the flexible sealant, thereby the display panel is damaged. For this reason, in the embodiment, a non-flexible sealant is applied to the periphery of the flexible sealant to protect the flexible sealant.
[0043] S15: a liquid crystal layer forming step, dropping liquid crystals into the sealant cavity of each of the array substrates to form liquid crystal layers each encircled by the primary sealant.
[0044] S16: a color filter substrate bonding step, vacuum bonding a color filter substrate on the liquid crystal layers, wherein the color film substrate bonding step specifically includes S161 to S163.
[0045] S161: a color filter substrate covering step, covering the liquid crystal layers with the color filter substrate, wherein a size of the color filter substrate needs to be larger than that of the liquid crystal layer to ensure the liquid crystal layers are completely covered to prevent the liquid crystals from flowing out.
[0046] S162: a vacuuming step, feeding the base substrate into a vacuum chamber and vacuuming the vacuum chamber to completely bond the color filter substrate to the liquid crystal layers.
[0047] S163: an atmosphere introduction step, introducing the atmosphere into the vacuum chamber. In the atmosphere introduction step, due to the barrier protection of the retaining wall, the primary sealant is not affected by the air flow, and the liquid crystals are prevented from flowing out.
[0048] S17: a curing step, curing the primary sealant by ultraviolet light curing method or heat curing method. (refer to
[0049] S18: a cutting step, cutting the base substrate and removing the retaining wall encircling each of the array substrates to form two or more display panels. (refer to
[0050] As shown in
[0051] The array substrate 1 is disposed opposite to the color filter substrate 5, and the liquid crystal layer 4 is disposed in the sealant cavity encircled by the primary sealant 3.
[0052] The technical effect of the embodiment is that in the preparation process of the display panel, the retaining wall is provided on the periphery of the primary sealant to prevent the primary sealant from being broken during the atmosphere introduction step, thereby, avoiding the technical issue that the liquid crystals flowing out from the sealant cavity. Thus, the yield of forming the flexible sealant on the display panel is improved and the yield of the display panel is further improved accordingly.
Embodiment 2
[0053] As shown in
[0054] S21: a base substrate arrangement step, two or more array substrates are disposed on one base substrate, and the array substrates are arranged in a matrix.
[0055] S22: a retaining wall forming step, forming an encircled retaining wall at a periphery of the base substrate, the retaining wall made of at least one of a non-flexible sealant, a spacer, and a black matrix. The shape of the retaining wall includes at least one of right-angled rectangle, rounded rectangle, and ellipse. The retaining wall also functions a supporting effect to support the base substrate to prevent the upper and lower substrates from sticking together during the subsequent bonding process, thereby avoiding a cutting abnormality issue in the subsequent cutting step.
[0056] S23: a primary sealant providing step, providing a primary sealant to each of the array substrates to form a sealant cavity. The material of the primary sealant is a flexible sealant, which meets the requirements of the current flexible display panel. In a display panel preparation process of the prior art, after the flexible sealant is provided, the subsequent vacuum relief and curing, etc., steps are performed, which cause the flexible sealant to be easily destroyed by the atmosphere, and further cause an outflow of the liquid crystals in the sealant cavity encircled by the flexible sealant, thereby the display panel is damaged. For this reason, in the embodiment, a non-flexible sealant is provided on a periphery of the flexible sealant to protect the flexible sealant.
[0057] S24: a liquid crystal layer forming step, dropping liquid crystals into the sealant cavity of each of the array substrates to form liquid crystal layers encircled by the primary sealant.
[0058] S25: a color filter substrate bonding step, vacuum bonding a color filter substrate on the liquid crystal layers. The color filter substrate bonding step specifically includes S251 to S253.
[0059] S251: a color filter substrate covering step, covering the liquid crystal layers with a color filter substrate. A size of the color filter substrate needs to be larger than that of the liquid crystal layer to ensure the liquid crystal layer is completely covered to prevent the liquid crystal from flowing out.
[0060] S252: a vacuuming step, feeding the base substrate into a vacuum chamber and vacuuming the vacuum chamber to completely bond the color filter substrate to the liquid crystal layers.
[0061] S253: an atmosphere introduction step, introducing the atmosphere into the vacuum chamber. In the atmosphere introduction step, due to the barrier protection of the retaining wall, the primary sealant is not affected by the air flow, such that the liquid crystals are prevented from flowing out.
[0062] S26: a curing step, curing the primary sealant by ultraviolet light curing method or heat curing method. (refer to
[0063] S27: a cutting step, cutting the base substrate and removing the retaining wall to form two or more display panels. (refer to
[0064] As shown in
[0065] The array substrate 1 is disposed opposite to the color filter substrate 5, and the liquid crystal layer 4 is disposed in the sealant cavity encircled by the primary sealant 3.
[0066] The technical effect of the invention is that in the preparation process of the display panel, the retaining wall is provided on the periphery of the primary sealant to prevent the primary sealant from being damaged during the atmosphere introduction step, thereby avoiding the technical problem of liquid crystals flowing out from the sealant cavity. Thus, the yield of forming the flexible sealant in the display panel is improved and yield of the display panel is further improved accordingly.
[0067] The description of the above exemplary embodiments is only for the purpose of understanding the invention. It is to be understood that the present invention is not limited to the disclosed exemplary embodiments. It is obvious to those skilled in the art that the above exemplary embodiments may be modified without departing from the scope and spirit of the present invention.