POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT

Abstract

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

Claims

1. A press-fit contact dement (1), comprising: a press-fit portion (2), a compensating portion (4) and a foot portion (5); the compensating portion (4) being elastic in a longitudinal direction (z) of the press-fit contact element (1); the compensating portion (4) having at least two O-shaped sub-portions (41, 42, 43) that each have a respective recess (412, 422, 432); and at least a first constriction (401, 402, 403) arranged in the longitudinal direction (z) between two successively arranged O-shaped sub-portions (41, 42, 43).

2. The press-fit contact element (1), according to claim 1, wherein: the recesses (412, 422, 434) of two successively arranged sub-portions (41, 42, 43) being one of (i) completely separated from each other in the region of the first constriction (401, 402) arranged therebetween, and (ii) the recesses (412, 422) of two successively arranged sub-portions (41, 42) merging into one another in the region of the second constriction (403).

3. The press-fit contact element (1), according to claim 2, wherein: the compensating portion (4) is flat and planar.

4. The press-fit contact element (1), according to claim 3, wherein: at least two of the O-shaped sub-portions (41, 42, 43) are arranged so as to directly adjoin one another.

5. The press-fit contact element (1), according claim 4, wherein: a width (D411) of the respective O-shaped sub-portions (41, 42, 43) is decreasing monotonically from the press-fit portion (2) in the direction of the foot portion.

6. The press-fit contact element (1), according to claim 4, wherein: an outer contour (414) of at least one O-shaped sub-portion (41,42) being V-shaped.

7. The press-fit contact element (1), according to claim 4, wherein: in the case of two O-shaped sub-portions (41,42,43) a width (D411) of at least one of said at least two O-shaped sub-portions (41, 42, 43) is at least 25%, of the length of a compensating portion (D400).

8. The press-fit contact element (1), according to claim 4 wherein: in a case of at least three O-shaped sub-portions (41, 42, 43) a width (D412) of at least one O-shaped sub-portion (41, 42, 43) is at least 20%, of the length of a compensating portion (D400).

9. The press-fit contact element (1), according to claim 7, wherein: the width of the first constriction (401, 402) is at most 30% of the length of the compensating portion (D400); and the width of a second constriction (403) being at most 40%, of the length of the compensating portion (D400).

10. The press-fit contact element (1), according to claim 7, wherein: at least one of the O-shaped sub-portions (41, 42, 43) has a recess (412, 422, 432) whose width at its widest point is at least 60% of the O-shaped sub-portion (41, 42, 43).

11. The press-fit contact element (1), according to claim 4, wherein: a stop portion (3) is arranged between the press-fit portion (2) and the compensating portion (4); and said stop portion (3) has two laterally protruding flat stop elements (31,32).

12. The press-fit contact element (1) according to claim 4, wherein: at least the compensating portion (4) is formed from a flat having two main surfaces that are arranged parallel to each other and which are planar.

13. A power semiconductor module (6) assembly, comprising: a press-fit contact element (1) according to claim 1; and said module (6) further comprising; a substrate (60) and a plurality of power semiconductor components (600) arranged thereon; said power semiconductor components (600) including a load (62) and an auxiliary connector element; a plastic molded body, having one of a housing and a housing frame (66) and which has a channel (660); channel (660) receiving an arrangement of said compensating portion (4) of said press-fit contact element (1); and said channel (660) is one of laterally closed and at least partially open on one longitudinal side.

14. The power semiconductor module (6) assembly, according to claim 13, wherein: a sub-portion (41, 42) of the compensating portion (4) of the press-fit contact element (1) is in said channel (660).

15. The power semiconductor module (6) assembly, according to claim 14, wherein: at least one narrow side (662) of the channel (660) has a V-shaped contour (664); and said V-shaped contour (664) being shaped to accommodate a V-shaped, outer contour (424) of an O-shaped sub-portion (41, 42) of said press-fit contact element (1).

16. The power semiconductor module (6) assembly, according to claim 14, wherein: the compensating portion (4) bears against the narrow side (662) of the channel (660) with fewer than all the outer contours of the O-shaped sub-portions (41, 42, 43).

17. The power semiconductor module (6) assembly, according to claim 14, wherein: the compensating portion (4) of said press-fit contact element (1) has two stop elements (31, 32) arranged in the channel (660); and said stop elements (31, 32) lying on a counter-bearing (666) of the housing (66).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG. 1 shows a schematic side view of a first design of a press-fit contact element according to the invention.

[0027] FIG. 2 shows a schematic side view of a second design of a press-fit contact element according to the invention.

[0028] FIG. 3 shows a schematic side view of a third design of a press-fit contact element according to the invention.

[0029] FIGS. 4 and 5 show three-dimensional views of the arrangement of a press-fit contact element according to the invention in a portion of a housing of a power semiconductor module.

[0030] FIG. 6 shows a three-dimensional view of a power semiconductor module according to the invention.

[0031] FIG. 7 shows a three-dimensional view of a further press-fit contact element according to the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Reference will now be made in detail to embodiments of the invention. Wherever possible, same or similar reference numerals are used in the drawings and the description to refer to the same or like parts or steps. The drawings are in simplified form and are not to precise scale. The word ‘couple’ and similar terms do not necessarily denote direct and immediate connections, but also include connections through intermediate elements or devices. For purposes of convenience and clarity only, directional (up/down, etc.) or motional (forward/back, etc.) terms may be used with respect to the drawings. These and similar directional terms should not be construed to limit the scope in any manner. It will also be understood that other embodiments may be utilized without departing from the scope of the present invention, and that the detailed description is not to be taken in a limiting sense, and that elements may be differently positioned, or otherwise noted as in the appended claims without requirements of the written description being required thereto.

[0033] FIG. 1 shows a schematic side view of a first design of a press-fit contact element 1 according to the invention. This design has different portions arranged in a row. The press-fit portion 2 is represented with the actual press-fit area, which may basically be realized in the conventional manner. Adjoining this press-fit portion 2 is the compensating portion 4, which is adjoined by the foot portion 5, which likewise may basically be realized in the conventional manner.

[0034] The compensating portion 4 thus extends in a longitudinal direction z of the press-fit contact element 1 and is elastic. For this purpose, the compensating portion 4 has two O-shaped sub-portions 41, 42, which are likewise arranged in succession in the longitudinal direction z, and a first constriction 401 arranged therebetween, which realizes, as it were, a connecting portion between the sub-portions 41, 42.

[0035] The press-fit contact element 1 is produced from a flat sheet by means of a stamping or stamping-bending process. Thus, at least the compensating portion 4 is flat and planar and has two mutually parallel and planar main surfaces whose normal vectors run in the y-direction.

[0036] The entire compensating portion 4 has a length D400 of approximately 12 mm, the first O-shaped sub-portion 41 adjacent to the press-fit portion 2 having a length D410 of approximately 7 mm, and the second O-shaped sub-portion 42 having a length D420 of approximately 5 mm.

[0037] The first O-shaped sub-portion 41 has a width of approximately 5 mm, and the second O-shaped sub-portion 42 has a width of approximately 4.4 mm and is thus narrower than the first O-shaped sub-portion 41. The first O-shaped sub-portion 41 furthermore comprises a recess 412,422,432 having a width of approximately 80% of its width, thus approximately 4 mm.

[0038] The recesses 412,422 of the two sub-portions 41,42 arranged in succession are completely separated from each other in the region of the first constriction 401 arranged therebetween.

[0039] The compensating portion 4 is resilient, due to its described design When a force is applied in the negative z-direction to the press-fit portion 2, the two arcs of the respective O-shaped sub-portion 41, 42 are elastically compressed, thus forming a restoring force.

[0040] FIG. 2 shows a schematic side view of a second embodiment of a press-fit contact element 1 according to the invention. It is similar to the first design in respect of production technology. In addition, this press-fit contact element 1 has a stop portion 3 between the press-fit portion 2 and the compensating portion 4. This has two laterally projecting flat stop elements 31, 32, the effect of which is described in greater detail in FIG. 5.

[0041] FIG. 3 shows a schematic side view of a third embodiment of a press-fit contact element 1 according to the invention. Again, it is similar to the first design in respect of production technology. In addition, this press-fit contact element 1 has a third O-shaped sub-portion 43. The width D411 of the respective O-shaped sub-portions 41, 42, 43 decreases strictly monotonically here, as viewed from the press-fit portion 2, in the direction of the foot portion 5, i.e., in the negative z-direction.

[0042] The recesses 412, 422, 423 of the respective sub-portions 41, 42, 43 arranged in succession are completely separated from each other in the region of the first constriction 401, 402 arranged therebetween.

[0043] FIGS. 4 and 5 show three-dimensional views of the arrangement of a press-fit contact element 1 according to the invention in a portion of a housing 66 of a power semiconductor module 6. FIG. 4 in this case shows the arrangement in an exploded representation, while FIG. 5 shows the standard representation. The press-fit contact element 1 again has, in this order, a press-fit portion 2, a stop portion 3, a compensating portion 4 and a foot portion 5.

[0044] The foot portion 5 here, represented in FIG. 5, is connected in a materially bonded manner to a conductor track 600 of a substrate 60 of a power semiconductor module 6.

[0045] The compensating portion 4 has three O-shaped sub-portions 41, 42, 43 which merge directly into one another, with a first constriction being arranged between each two sub-portions. The width of the O-shaped sub-portions, as viewed from the press-fit portion 2, decreases in a strictly monotonic manner in the direction of the foot portion 5.

[0046] The course of the first and second O-shaped sub-portions 41, 42 in each case has a V-shaped outer contour 424, in the middle of its arcuate course.

[0047] The housing 66 represented in a detail is realized as a plastic molded body and has a channel 660, in which the press-fit contact element 1 is arranged substantially with its compensating portion 4. The channel 660 itself is open on one longitudinal side.

[0048] Both narrow sides 662 of the channel 660 likewise have a V-shaped contour 664. This V-shaped contour of the channel corresponds to the V-shaped outer contour 414, 424 of the O-shaped sub-portions 41, 42 of a press-fit contact element 1. Therefore, when the press-fit contact element 1 is arranged in the channel 660, no movement perpendicular to the longitudinal direction, the z-direction, of the press-fit contact element 1 can be affected, the press-fit contact element 1 being thus fixed in this position in both orthogonal directions, i.e., the x- and the y-direction.

[0049] In the case of this design, the third sub-portion 43, which also does not have a V-shaped outer contour, is not included in the fixing of the press-fit contact element 1 in the channel 660. This third sub-portion 43, since it can extend in the x-direction, assumes the main proportion of the spring action of the compensating portion 4.

[0050] The stop portion 3 is basically realized as described in FIG. 2 and is arranged between the press-fit portion 2 and the compensating portion 4. The stop portion 3 again has two laterally projecting fiat stop elements 31, 32, each of which rests on a counter-bearing 666, in this case a surface portion of the housing. This prevents displacement in the negative z-direction when force is applied to the press-fit portion 2 of the press-fit contact element 1 in this direction.

[0051] As a result of the press-fit contact element 1 being fixed in the housing 66 by means of the described stop portion 3 and the compensating portion 4, which is also described, the spring action of the compensating section 4 acts here in the case of a relative movement in the z-direction between the substrate 60 and the housing 66.

[0052] FIG. 6 shows a three-dimensional view of a power semiconductor module 6 according to the invention. This has a housing frame 66 formed from a plastic molded body, as well as power semiconductor components 602 arranged on a substrate 60 and connected by means of a conventional, foil-like connecting means 604. Furthermore, the power semiconductor module 6 comprises load 62 and auxiliary connector elements. The auxiliary connector elements are realized here as the press-fit contact elements 1 described in FIGS. 4 and 5 and are arranged in a row.

[0053] The respective press-fit contact elements 1 are arranged in associated channels 660 of the housing frame 66, and are fixed in this position, and thus in a row, and with respect to their respective distances.

[0054] FIG. 7 shows a three-dimensional view of a further press-fit contact element according to the invention. This differs from the press-fit element according to FIGS. 4 and 5 in that it has a second constriction 403 between the first and second sub-portions, which is realized in such a manner that recesses 412, 422 of the sub-portions 41, 42 arranged in succession merge into one another in the region of this second constriction 403. They thus form a dumbbell-shaped recess common to both sub-portions 41, 42. In addition, the third sub-portion 44 of the compensating portion 4 is realized here as an S shape.

[0055] It is to be noted that of course features of different exemplary embodiments of the invention can be combined with one another in an arbitrary manner, unless the features are mutually exclusive, without departing from the scope of the invention.

[0056] Also, the inventors intend that only those claims which use the specific and exact phrase “means for” are intended to be interpreted under 35 USC 112, sixth paragraph. The structure herein is noted and well supported in the entire disclosure. Moreover, no limitations from the specification are intended to be read into any claims, unless those limitations are expressly included in the claims.

[0057] Having described at least one of the preferred embodiments of the present invention with reference to the accompanying drawings, it will be apparent to those skills that the invention is not limited to those precise embodiments, and that various modifications and variations can be made in the presently disclosed system without departing from the scope or spirit of the invention. Thus, it is intended that the present disclosure cover modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.