Bone cut treatment
11154359 · 2021-10-26
Assignee
Inventors
Cpc classification
A61B2018/20361
HUMAN NECESSITIES
A61B17/16
HUMAN NECESSITIES
International classification
Abstract
A method of cutting a bone (2) comprises the steps of: preparing the bone (2) in order to be accessible to an osteotomic instrument; predefining an osteotomic geometry on the bone (2); and applying the osteotomic instrument to the bone (2) thereby cutting the bone (2) along the osteotomic geometry and generating a cut surface (21) to the bone (2). The method further comprises delivering a laser beam to the cut surface (21) of the bone (2) such that the cut surface (21) of the bone (2) is ablated. The method according to the invention allows to improve healing of a bone at its cut surface after being cut by the osteotomic instrument.
Claims
1. A method of cutting a bone, comprising: preparing the bone in order to be accessible to an osteotomic instrument, predefining an osteotomic geometry on the bone, applying the osteotomic instrument to the bone thereby cutting the bone along the osteotomic geometry and generating a cut surface to the bone, wherein a smear layer is generated at the cut surface of the bone when applying the osteotomic instrument to the bone, and delivering a laser beam configured to ablate the bone towards the cut surface of the bone such that the cut surface of the bone is ablated by the laser beam, wherein delivering the laser beam to the cut surface of the bone comprises removing the smear layer at the cut surface of the bone.
2. The method according to claim 1, wherein the smear layer has a thickness in a range of about one to about eight micrometer.
3. The method according claim 1, wherein delivering the laser beam to the cut surface of the bone comprises the laser beam applying lines of adjacent spots.
4. The method according to claim 3, wherein delivering the laser beam to the cut surface of the bone comprises applying further lines of further adjacent spots wherein the further adjacent spots are offset and between the adjacent spots.
5. The method according to claim 3, wherein the spots have a diameter in a range of about four hundred micrometer to about five millimeter or in a range of about four hundred micrometer to about one millimeter.
6. The method according to claim 1, wherein the laser beam is a pulsed laser beam.
7. The method according to claim 1, wherein the laser beam is generated by a solid-state Erbium laser device.
8. The method according to claim 1, wherein the laser beam has a wavelength in a range of about two thousand nine hundred nanometer to about three thousand nanometer.
9. The method according to claim 1, wherein delivering the laser beam to the cut surface of the bone comprises cooling and hydrating the bone where the laser beam is applied.
10. The method according to claim 1, wherein the smear layer has a thickness in a range of about two to about five micrometer.
11. The method according to claim 5, wherein the spots have a diameter of about five hundred micrometers.
12. The method according to claim 8, wherein the laser beam has a wavelength of about two thousand nine hundred and forty nanometer.
13. The method according to claim 7, wherein the solid-state Erbium laser device is a solid-state Erbium-doped Yttrium Aluminium Garnet laser device.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The device for treating a cut surface of a bone according to the invention, the method of cutting a bone according to the invention and the method of preparing an osteotomy according to the invention are described in more detail herein below by way of exemplary embodiments and with reference to the attached schematic drawings, in which:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
DESCRIPTION OF EMBODIMENTS
(11) In the following description certain terms are used for reasons of convenience and are not intended to limit the invention. The terms “right”, “left”, “up”, “down”, “under” and “above” refer to directions in the figures. The terminology comprises the explicitly mentioned terms as well as their derivations and terms with a similar meaning. Also, spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper”, “proximal”, “distal”, and the like, may be used to describe one element's or feature's relationship to another element or feature as illustrated in the figures. These spatially relative terms are intended to encompass different positions and orientations of the devices in use or operation in addition to the position and orientation shown in the figures. For example, if a device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be “above” or “over” the other elements or features. Thus, the exemplary term “below” can encompass both positions and orientations of above and below. The devices may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly. Likewise, descriptions of movement along and around various axes includes various special device positions and orientations.
(12) To avoid repetition in the figures and the descriptions of the various aspects and illustrative embodiments, it should be understood that many features are common to many aspects and embodiments. Omission of an aspect from a description or figure does not imply that the aspect is missing from embodiments that incorporate that aspect. Instead, the aspect may have been omitted for clarity and to avoid prolix description. In this context, the following applies to the rest of this description: If, in order to clarify the drawings, a figure contains reference signs which are not explained in the directly associated part of the description, then it is referred to previous or following description sections. Further, for reason of lucidity, if in a drawing not all features of a part are provided with reference signs it is referred to other drawings showing the same part. Like numbers in two or more figures represent the same or similar elements.
(13)
(14) The laser source 12 has the laser head 121 which is directly attached to the drive unit 15 and a nozzle body 125 connected to the laser head 121 and directed towards the cut surface 21 of the bone 2. In
(15) The debris extraction unit 16 has a nose positioned close to the cut surface 21 of the bone 2. Through its nose the debris extraction unit 16 sucks debris generated by the ablation of the bone tissue by the laser beam from the cut surface 21 of the bone 2.
(16) The drive unit 15 comprises three perpendicularly arranged rails. More particularly, these rails consist of an x-rail 151, a y-rail 152 and a z-rail 153.
(17) The device 1 further comprises a camera 18 which is positioned below the laser head 121 of the laser source 12. It is directed to the cut surface 21 of the bone 2 and particularly to an area thereof where the laser beam hits the cut surface 21. By means of the camera the ablation process can be monitored and evaluated. It can be an infrared camera suitable for measuring the temperature at the laser beam—bone tissue contact area.
(18) In
(19)
(20) As shown in
(21) The power supply cables 134 are connected to all power consumers remote from the electronic unit 17. Thereby, the power consumers such as, in particular, the motor of the drive unit 15, the camera 18, the debris extraction unit 16 and the autofocusing arrangement 14 are supplied with electric energy via the power supply cables 134 of the media wiring 13.
(22) The forward cooling media tube 131 and the backward cooling media tube 132 are connected to a cooling entity. The cooling medium can be any liquid or other medium such as a sole suitable for cooling the attached components such as the laser head 121 or the like. More particularly, in the forward cooling media tube 131 the cooling medium is provided from a cooling medium reservoir to the cooling entity and in the backward cooling media tube 132 the heated cooling medium is provided back after circulating through the cooling entity.
(23) The gas tube 133 and the liquid tube 136 are connected to the nozzle body 125 of the laser head 121 of the laser source 12. The nozzle body 125 comprises plural two-fluid nozzles directed to the laser beam—bone tissue contact area. By the two-fluid nozzles the liquid provided by the liquid tube 136 such as, e.g., sterile sodium chloride or distilled water which can be enriched with an antiseptic substance, and the gas provided by the gas tube 133 are mixed at an elevated pressure in order to generate a spray. During ablation of the bone tissue the two-fluid nozzles direct sprays to the laser beam—bone tissue contact area for cooling and thereby minimizing heat transfer in the bone tissue. For example, the two-fluid nozzles can deliver the sterile sodium chloride to the cut surface 21 at a flow rate of about 8 to 10 ml/min under a pressure of about 3 bar. The liquid is then removed from the cut surface 21 of the bone together with the debris by the debris extraction unit 16.
(24) The controller cable 137 is connected to the processing unit 173 and the controllable components of the device 1 such as the motor of the drive unit 15, the camera 18, the autofocusing arrangement 14, the two-fluid nozzles of the nozzle body 125 and the like. Through the controller cable 137 the processing unit 173 communicates with the mentioned controllable components. For example, the processing unit automatically adjusts the orientation of the lenses 141 of the autofocusing unit 14 considering the depth of the ablation of the bone tissue on the cut surface 21 of the bone 2.
(25) Through the ablation optical fiber 123 a laser beam is provided from the Er:YAG laser 122 passing the autofocusing arrangement 14 out of the nozzle body 125. For this, the laser beam is introduced into the ablation optical fiber 123 as shown in
(26) Similarly as the laser beam for ablating the bone tissue a second laser beam is provided through the depth control optical fiber 135. This second laser beam is for detecting the depth of the ablation process on the bone 2. As shown in
(27) In use the device 1 can be applied in an embodiment of a method of cutting the bone 2 according to the invention. Before the device 1 is used the bone 2 is prepared in order to be accessible to an osteotomic instrument. For preparing the bone and the complete osteotomy an embodiment of a method of preparing an osteotomy according to the invention can be applied preoperatively. Thereby, data about the bone 2 is obtained by computer tomography. The data is analysed and on the computer tomography image an osteotomic line is defined on the bone 2 as osteotomic geometry. Then a saw is chosen as osteotomic instrument suitable for cutting the bone 2 along the osteotomic line and for, thereby, generating the cut surface 21 to the bone 2. In the preoperative planning a timeframe is allocated and an environment defined in which the bone 2 is prepared in order to be accessible to the saw and in which the saw is applied to the bone 2 thereby cutting the bone 2 along the osteotomic geometry and generating the cut surface 21 to the bone 2. The preoperative planning further includes that a further timeframe is allocated and that the environment is further defined for delivering a laser beam to the cut surface 21 of the bone 2 after the cut surface 21 is generated to the bone 2. The environment is then arranged in accordance with its definition in the allocated time frame.
(28) After the preoperative planning is finished the method of cutting the bone 2 is continued by applying the saw to the bone 2, thereby, cutting the bone 2 along the osteotomic line and generating the cut surface 21 to the bone 2 as shown in the drawings. After the bone is cut the device 1 is attached to the bone 2 as shown in
(29) For ablating the cut surface 21, the processing unit 173 controls the drive unit 15 such that it moves the laser head 121 of the laser source 12 together with its nozzle body 125 over the cut surface 21. Thereby, the sub-microsecond pulsed laser beam generated by the laser source 12 of the device 1 creates lines of adjacent circular spots and further lines of further adjacent circular spots. The further adjacent spots are offset and between the adjacent spots. Like this a pattern of spots is created on the cut surface 21 covering the complete area of the cut surface 21. Moreover, since the spots and lines are created alternatingly the bone tissue has time to cool down which allows for minimizing collateral damages to the bone tissue.
(30) In order to efficiently ablating the bone tissue at the cut surface 21, the laser beam generated by the laser source 12 is adjusted to have a wavelength in 2′940 nm. During delivery of the laser beam to the cut surface 21 of the bone 2 a sterile sodium chloride is sprayed to the cut surface 21 by the two-fluid nozzles in the nozzle body 125. Like this the cut surface 21 of the bone 2 is cooled and hydrated where the laser beam is applied.
(31) During ablation the depth control 172 monitors and controls the depth of the ablated bone tissue. The laser beam is adjusted to the depth such that a regular layer of bone tissue is ablated from at the cut surface 21. In particular, a layer of bone tissue including a smear layer generated by the saw to the bone is removed.
(32)
(33) In use the device 10 is similarly prepared and applied as described above in connection with the device 1. The laser beam is delivered via the beam guide rod 1520 into the drill hole of the bone 20. At the end of the beam guide rod 1520 the laser beam is deflected by the mirror 1510 and directed towards the cut surface 210 of the bone 20. By the movable and rotatable beam guide rod 1520 the complete cut surface 210 of the bone 20 can efficiently be ablated.
(34)
(35) By ablating the cut surface by means of a laser beam the smear layer generated by the osteotomic instrument can be removed. In
(36) This description and the accompanying drawings that illustrate aspects and embodiments of the present invention should not be taken as limiting—the claims defining the protected invention. In other words, while the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. Various mechanical, compositional, structural, electrical, and operational changes may be made without departing from the spirit and scope of this description and the claims. In some instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the invention. Thus, it will be understood that changes and modifications may be made by those of ordinary skill within the scope and spirit of the following claims. In particular, the present invention covers further embodiments with any combination of features from different embodiments described above and below.
(37) The disclosure also covers all further features shown in the Figs. individually although they may not have been described in the afore or following description. Also, single alternatives of the embodiments described in the figures and the description and single alternatives of features thereof can be disclaimed from the subject matter of the invention or from disclosed subject matter. The disclosure comprises subject matter consisting of the features defined in the claims or the exemplary embodiments as well as subject matter comprising said features.
(38) Furthermore, in the claims the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single unit or step may fulfil the functions of several features recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. The terms “essentially”, “about”, “approximately” and the like in connection with an attribute or a value particularly also define exactly the attribute or exactly the value, respectively. The term “about” in the context of a given numerate value or range refers to a value or range that is, e.g., within 20%, within 10%, within 5%, or within 2% of the given value or range. Components described as coupled or connected may be electrically or mechanically directly coupled, or they may be indirectly coupled via one or more intermediate components. Any reference signs in the claims should not be construed as limiting the scope.
(39) The disclosure further comprises the following embodiments:
(40) Embodiment 1 is a method of cutting a bone, comprising preparing the bone in order to be accessible to an osteotomic instrument, predefining an osteotomic geometry on the bone, and applying the osteotomic instrument to the bone thereby cutting the bone along the osteotomic geometry and generating a cut surface to the bone, characterized by delivering a laser beam to the cut surface of the bone such that the cut surface of the bone is ablated.
(41) Embodiment 2 is a method according to embodiment 1, wherein delivering the laser beam to the cut surface of the bone comprises removing a layer of bone tissue at the cut surface of the bone.
(42) Embodiment 3 is a method according to embodiment 2, wherein the layer of the bone tissue has a thickness in a range of about one to about eight micrometer or, particularly, in a range of about two to about five micrometer.
(43) Embodiment 4 is a method according any of the preceding embodiments, Method according to any one of embodiments 1 to 3, wherein delivering the laser beam to the cut surface of the bone comprises the laser beam applying lines of adjacent spots.
(44) Embodiment 5 is a method according to embodiment 4, wherein delivering the laser beam to the cut surface of the bone comprises applying further lines of further adjacent spots wherein the further adjacent spots are offset and between the adjacent spots.
(45) Embodiment 6 is a method according to embodiment 4 or 5, wherein the spots have a diameter in a range of about four hundred micrometer to about five millimeter or in a range of about four hundred micrometer to about one millimeter or in a range of about four hundred micrometer to about six hundred micrometer or, particularly, a diameter of about five hundred micrometer.
(46) Embodiment 7 is a method according to any one of the preceding embodiments, wherein the laser beam is a pulsed laser beam.
(47) Embodiment 8 is a method according to any one of the preceding embodiments, wherein the laser beam is generated by a solid-state Erbium laser device or, particularly, by a solid-state Erbium-doped Yttrium Aluminium Garnet laser device.
(48) Embodiment 9 is a method according to any one of the preceding embodiments, wherein the laser beam has a wavelength in a range of about two thousand nine hundred nanometer to about three thousand nanometer or, particularly, a wavelength of about two thousand nine hundred and forty nanometer.
(49) Embodiment 10 is a method according to any one of the preceding embodiments, wherein delivering the laser beam to the cut surface of the bone comprises cooling and hydrating the bone where the laser beam is applied.
(50) Embodiment 11 is a device for treating a cut surface of a bone comprising a laser source for generating a laser beam, a support carrying the laser source and having a mounting structure adapted to be connected to the bone such that the laser source is in a predefined position and orientation to the cut surface of the bone.
(51) Embodiment 12 is a device according to embodiment 11, comprising a drive unit adapted to move the laser beam along the cut surface of the bone.
(52) Embodiment 13 is a device according to embodiment 12, wherein the drive unit comprises a laser source positioner adapted to move the laser source in relation to the bone when the device is connected to the bone by the support.
(53) Embodiment 14 is a device according to embodiment 12 or 13, wherein the drive unit comprises an adjustable optics adapted to move a direction in which the device provides the laser beam.
(54) Embodiment 15 is a device according to embodiment 14, wherein the adjustable optics comprise a mirror deflecting the laser beam provided by the laser source, wherein the mirror can be rotated around an axis such that the laser beam can be radially provided around 360°.
(55) Embodiment 16 is a device according to any one of embodiments 11 to 15, comprising a depth detecting unit adapted to the detect a depth of an ablation applied to the cut surface of the bone by the device.
(56) Embodiment 17 is a device according to any one of embodiments 11 to 16, comprising an auto-focusing arrangement to automatically adjust a focus of the laser beam in relation to the cut surface of the bone.
(57) Embodiment 18 is a device according to embodiments 16 and 17, wherein the auto-focusing arrangement is adapted to adjust the focus of the laser beam in accordance with the depth detected by the depth detecting unit.
(58) Embodiment 19 is a device according to any one of embodiments 11 to 18, wherein the laser source is a solid-state Erbium laser source or, particularly, a solid-state Erbium-doped Yttrium Aluminium Garnet laser source.
(59) Embodiment 20 is a method of preparing an osteotomy, comprising obtaining data about a bone, predefining an osteotomic geometry on the bone, choosing an osteotomic instrument suitable for cutting the bone along the osteotomic geometry and for thereby generating a cut surface to the bone, and allocating a timeframe and defining an environment for preparing the bone in order to be accessible to the osteotomic instrument, and for applying the osteotomic instrument to the bone thereby cutting the bone along the osteotomic geometry and generating a cut surface to the bone, characterized by allocating a further timeframe and defining the environment for delivering a laser beam to the cut surface of the bone after the cut surface is generated to the bone, and arranging the environment in accordance with its definition in the allocated time frame.
(60) Embodiment 21 is a method according to embodiment 20, wherein obtaining the data about the bone comprises analyzing the bone with computer tomography.
(61) Embodiment 22 is a method according to embodiment 20 or 21, wherein the further timeframe is allocated and the environment is defined in accordance with delivering of the laser beam to the cut surface of the bone comprising ablating the cut surface of the bone.
(62) Embodiment 23 is a method according to any one of embodiments 20 to 22, wherein the further timeframe is allocated and the environment is defined in accordance with delivering the laser beam to the cut surface of the bone comprising removing a layer of bone tissue at the cut surface of the bone.
(63) Embodiment 24 is a method according to any one of embodiments 20 to 23, wherein the further timeframe is allocated and the environment is defined in accordance with the layer of the bone tissue having a thickness in a range of about one to about eight micrometer or, particularly, in a range of about two to about five micrometer.
(64) Embodiment 25 is a method according to any one of embodiments 20 to 24, wherein the further timeframe is allocated and the environment is defined in accordance with delivering the laser beam to the cut surface of the bone comprising the laser beam applying lines of adjacent spots.
(65) Embodiment 26 is a method according to embodiment 25, wherein the further timeframe is allocated and the environment is defined in accordance with delivering the laser beam to the cut surface of the bone comprising applying further lines of further adjacent spots wherein the further adjacent spots are offset and between the adjacent spots.
(66) Embodiment 27 is a method according to embodiment 25 or 26, wherein the further timeframe is allocated and the environment is defined in accordance with the spots having a diameter in a range of about four hundred micrometer to about five millimeter or in a range of about four hundred micrometer to about one millimeter or in a range of about four hundred micrometer to about six hundred micrometer or, particularly, a diameter of about five hundred micrometer.
(67) Embodiment 28 is a method according to any one of embodiments 20 to 27, wherein the further timeframe is allocated and the environment is defined in accordance with the laser beam being a pulsed laser beam.
(68) Embodiment 29 is a method according to any one of embodiments 20 to 28, wherein the further timeframe is allocated and the environment is defined in accordance with the laser beam being generated by a solid-state Erbium laser device or, particularly, by a solid-state Erbium-doped Yttrium Aluminium Garnet laser device.
(69) Embodiment 30 is a method according to embodiment 29, wherein the further timeframe is allocated and the environment is defined in accordance with the laser beam having a wavelength in a range of about two thousand nine hundred nanometer to about three thousand nanometer and particularly with a wavelength of about two thousand nine hundred and forty nanometer.
(70) Embodiment 31 is a method according to any one of embodiments 20 to 30, wherein the further timeframe is allocated and the environment is defined in accordance with delivering the laser beam to the cut surface of the bone comprising cooling and hydrating the bone where the laser beam is applied.
(71) Embodiment 32 is a method of manufacturing a device for treating a cut surface of a bone, comprising obtaining bone information about the bone and its cut surface; based on the gathered bone information, adapting a mounting structure of a support to be suitable to being connected to the bone such that the laser source is in a predefined position and orientation to the cut surface of the bone; equipping the support with a laser source for generating a laser beam such that the support carries the laser source; and equipping the device with the support.