METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE AND MICROMECHANICAL STRUCTURE

Abstract

A method for manufacturing a micromechanical structure and a micromechanical structure. The method includes: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which include an upper widened area at the upper side of the first micromechanical functional layer and a lower area of essentially constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and the first trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

Claims

1-15. (canceled)

16. A method for manufacturing a micromechanical structure, comprising the following steps: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which each include an upper widened area at an upper side of the first micromechanical functional layer and a lower area of constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of each of the plurality of trenches being formed below the upper side of the first micromechanical functional layer, and each of the plurality of trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

17. The method as recited in claim 16, wherein the forming of the plurality of trenches includes the following steps: forming a mask layer at the upper side of the first micromechanical functional layer, the mask layer including mask openings corresponding to the plurality of first trenches to be formed, a width of the mask openings corresponding to the constant width of the plurality of trenches to be formed in the lower area; carrying out an isotropic etching process to form each of the upper widened areas at the upper side of the first micromechanical functional layer, the mask openings being undercut; carrying out an anisotropic etching process to form each of the lower areas of constant width; and removing the mask layer.

18. The method as recited in claim 17, further comprising the following steps: forming a polish stop layer at the upper side of the first micromechanical functional layer, which includes openings corresponding to the plurality of trenches to be formed, a width of the openings corresponding to a width of the plurality of trenches to be formed at the upper side in the upper area; and forming the mask layer on the polish stop layer, the mask openings being offset in relation to the openings.

19. The method as recited in claim 16, wherein the forming of the plurality of trenches includes the following steps: forming a polish stop layer at the upper side of the first micromechanical functional layer, which includes openings corresponding to the plurality of trenches to be formed, a width of the openings corresponding to a width of the plurality of trenches to be formed at the upper side in the upper area; forming a mask layer on the polish stop layer, the mask layer including mask openings corresponding to the plurality of trenches to be formed, a width of the mask openings corresponding to the constant width of the plurality of trenches to be formed in the lower area and the mask openings being offset in relation to the openings; carrying out an anisotropic etching process to form the lower areas of the constant width; removing the mask layer; and carrying out an isotropic etching process to form the upper widened areas at the upper side of the first micromechanical functional layer, the polish stop layer being used as a mask.

20. The method as recited in claim 19, wherein the sealing layer is deposited on the polish stop layer and the thinning back of the sealing layer is carried out by the predefined thickness up to the polish stop layer.

21. The method as recited in claim 20, wherein the polish stop layer is removed after the thinning back, the thinned-back sealing layer is thinned back further down up to the upper side, and before the formation of the second micromechanical functional layer on the further thinned-back sealing layer, an intermediate layer is deposited on the upper side and the further thinned-back sealing layer.

22. The method as recited in claim 16, further comprising the following steps: forming a first insulation layer above a substrate; forming the first micromechanical functional layer on the first insulation layer; forming first etching accesses in the thinned-back sealing layer, which expose areas of the first micromechanical functional layer; etching the first micromechanical functional layer through the etching accesses, the trenches and the first insulation layer acting as an etch stop; and forming a second insulation layer on the thinned-back sealing layer after the etching, the etching accesses being sealed.

23. The method as recited in claim 21, further comprising the following steps: forming a first insulation layer above a substrate; forming the first micromechanical functional layer on the first insulation layer; forming first etching accesses in the intermediate layer, which expose areas of the first micromechanical functional layer; etching the first micromechanical functional layer through the etching accesses, the trenches and the first insulation layer acting as an etch stop; and forming a second insulation layer on the intermediate layer after the etching, the etching accesses being sealed.

24. The method as recited in claim 22, further comprising the following steps: forming the second micromechanical functional layer above the second insulation layer; forming second etching accesses in the second micromechanical functional layer, which expose areas of the second insulation layer; and selectively etching the first insulation layer and second insulation layer and thinned-back sealing layer in relation to the first and second micromechanical functional layer, the first insulation layer being removed except for remaining areas which anchor the first micromechanical functional layer on the substrate.

25. The method as recited in claim 23, further comprising the following steps: forming the second micromechanical functional layer above the second insulation layer; forming second etching accesses in the second micromechanical functional layer, which expose areas of the second insulation layer; and selectively etching the first and second insulation layer, the thinned-back sealing layer, and the intermediate layer in relation to the first and second micromechanical functional layer, the first insulation layer being removed except for remaining areas which anchor the first micromechanical functional layer on the substrate.

26. The method as recited in claim 16, wherein the plurality of trenches include rounded edges and/or intersections including local constrictions.

27. The method as recited in claim 16, wherein the sealing layer includes one of more of the following layers: oxide layer, silicon nitride layer, silicon oxynitride layer, silicon layer, aluminum layer, germanium layer, titanium layer, tungsten layer, copper layer.

28. The method as recited in claim 21, wherein the intermediate layer includes one of more of the following layers: oxide layer, silicon nitride layer, silicon oxynitride layer, silicon layer, aluminum layer, germanium layer, titanium layer, tungsten layer, copper layer.

29. A micromechanical structure, comprising: a first micromechanical functional layer; a plurality of trenches in the first micromechanical functional layer, each of the plurality of trenches including an upper widened area at an upper side of the first micromechanical functional layer and a lower area of constant width; a sealing layer on the upper side of the first micromechanical functional layer which seals the plurality of trenches, a sealing point of each of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and each of the plurality of trenches being at least partially filled; and a second micromechanical functional layer above the sealing layer.

30. A micromechanical structure, comprising: a first micromechanical functional layer; a plurality of trenches in the first micromechanical functional layer, each of the plurality of trenches including an upper widened area at an upper side of the first micromechanical functional layer and a lower area of constant width; a sealing layer on the upper side of the first micromechanical functional layer which seals the plurality of trenches, a sealing point of each of the plurality of trenches being formed below the upper side of the first micromechanical functional layer, and the plurality of trenches being at least partially filled, the sealing layer extending flush with the upper side of the first micromechanical functional layer; an intermediate layer on the upper side and the sealing layer; and a second micromechanical functional layer above the intermediate layer.

31. The micromechanical structure as recited in claim 29, wherein a polish stop layer is on the upper side, which laterally adjoins the sealing layer and extends flush thereto.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Further features and advantages of the present invention are explained hereinafter on the basis of specific embodiments of the present invention with reference to the figures.

[0026] FIGS. 1A) through 1G) show schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a first specific embodiment of the present invention.

[0027] FIGS. 2A) through 2H) show schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a second specific embodiment of the present invention

[0028] FIGS. 3A) through 3C) show schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a third specific embodiment of the present invention.

[0029] FIGS. 4A) through 4E) show schematic views to explain preferred trench forms in the specific embodiments of the present invention, FIG. 4A) showing a cross-sectional view and FIGS. 4B) through 4E) showing top views.

[0030] FIGS. 5A) through 5H) show schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a fourth specific embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0031] In the figures, identical reference numerals identify identical or functionally-identical elements.

[0032] FIGS. 1A) through 1G) show schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a first specific embodiment of the present invention.

[0033] In FIG. 1A), reference numeral 5 identifies a micromechanical functional layer, for example, a polysilicon layer, which is applied, for example, to a substrate (not shown).

[0034] Initially a plurality of trenches 7 is to be formed in micromechanical functional layer 5, which include an upper cup-like widened area 7a at upper side O of first micromechanical functional layer 5 and a lower area 7b of essentially constant width, as explained hereinafter. To simplify the illustration, only one of trenches 7 of the plurality of trenches 7 is shown in each case hereinafter.

[0035] Furthermore with reference to FIG. 1A), initially a mask layer 6, for example a photoresist mask, is formed on the upper side of first micromechanical functional layer 5, which includes mask openings 6a corresponding to the plurality of first trenches 7 to be formed. A width b of mask openings 6a corresponds to the essentially constant width of the plurality of trenches 7 to be formed in lower area 7b.

[0036] With reference to FIG. 1B), initially an isotropic etching process is carried out to form upper widened area 7a at upper side O of first micromechanical functional layer 5, mask openings 6a being undercut.

[0037] Subsequently thereto, according to FIG. 1C), an isotropic etching process is carried out to form lower area 7b of essentially constant width. Thereafter, mask layer 6 is removed again.

[0038] Typically, width b is widened in cup-shaped upper area 7a by at least 10% toward upper side O.

[0039] The etching process for trenches 7 is preferably a cyclic etching process, which is made up of at least two repeating steps. In a first step, predominantly isotropic silicon is etched and a passivation layer on the base of trenches 7 is opened by an anisotropic etching component.

[0040] In a second step, a passivation is deposited predominantly isotropically on the entire surface of trenches 7. To generate cup-shaped upper area 7a, for example, it is advantageous to start the cyclic trench etching process with an isotropic silicon etching process and to etch 50% more silicon at least in the first cycle than the average of all silicon etching cycles. In particular, the first and possibly some further silicon etching cycles are carried out in such a way that the upper area is widened by at least the said 10% in relation to width b. Subsequently, with reference to FIG. 1D), a sealing layer 8 is deposited, for example an oxide layer, on upper side O of first micromechanical functional layer 5 to seal the plurality of trenches. Typically, at least 50% of width b is deposited as the thickness of sealing layer 8. The deposition method is a non-conformal deposition method, whereby typically empty spaces V form in the interior of sealed trenches 7. Trenches 7 are filled up enough that their walls are covered by sealing layer 8 and a sealing point P of the plurality of trenches 7 is located below upper side O of first micromechanical functional layer 5, which is significant for the following process steps.

[0041] The effective minimum opening angle of upper area 7a is typically greater than the arctangent of 1—(conformity of the deposition process), the conformity being the ratio of the deposition rate on horizontal upper side O to the deposition rate on the vertical walls of trenches 7.

[0042] According to FIG. 1E), the deposition is continued enough that sealing layer 8 extends beyond upper side O.

[0043] Furthermore, with reference to FIG. 1F), sealing layer 8 is thinned back by a predefined thickness d, for which a CMP process (chemical-mechanical polishing) is preferably used. A CMP process including end point recognition is preferably used in order to achieve a defined residual thickness or a defined thickness removal d, which results in the process state shown in FIG. 1F).

[0044] In a further process step, which is shown in FIG. 1G), a second micromechanical functional layer 13, for example also a polysilicon layer, is deposited on thinned-back sealing layer 8′.

[0045] A stack of first micromechanical functional layer 5 and second micromechanical functional layer 13 including thinned-back sealing layer 8′ located therebetween may be generated without topography by the process step sequence according to FIGS. 1A) through 1G), which enables a very small gap distance between the two micromechanical functional layers 5, 13.

[0046] In further process steps (not shown), second micromechanical functional layer 13 may then be structured and sealing layer 8′ may be partially or entirely removed in a sacrificial layer etching method.

[0047] FIGS. 2A) through 2H) are schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a second specific embodiment of the present invention.

[0048] With reference to FIG. 2A), initially a polish stop layer 20 is formed on upper side O of first micromechanical functional layer 5, polish stop layer 20 including openings 21 corresponding to the plurality of trenches 7 to be formed, whose width b′ corresponds to a width of the plurality of trenches 7 to be formed at the upper side in upper widened area 7a.

[0049] A silicon nitride layer is particularly advantageous as polish stop layer 20. It is particularly well suitable for an oxide CMP process due to the high selectivity and may also be removed very selectively in relation to the oxide layer as sealing layer 7, for example using phosphoric acid.

[0050] Furthermore, with reference to FIG. 2B), mask layer 6 is formed on polish stop layer 20, mask layer 6 including mask openings corresponding to the plurality of trenches 7 to be formed, whose width b corresponds to the essentially constant width of the plurality of trenches 7 to be formed in the lower area. Mask openings 6a are offset accordingly in relation to openings 21, in particular on both sides by a distance x, the relationship 2x+b=b′ applying.

[0051] Following the process state shown in FIG. 2B), initially an anisotropic etching process is carried out to form lower area 7b including the essentially constant width. Thereafter, mask layer 6 is removed as shown in FIG. 2C). Then, with reference to FIG. 2D), an isotropic etching process is carried out to form upper widened area 7a at upper side O of first micromechanical functional layer 5, polish stop layer 20 being used as a mask.

[0052] As shown in FIG. 2E), sealing layer 8 is then deposited with the aid of the nonconformal deposition process on polish stop layer 20. As in the first specific embodiment, the deposition process is continued until sealing layer 8 extends beyond upper side O of first micromechanical functional layer 5, sealing point P being located below upper side O, as shown in FIG. 2F).

[0053] Furthermore, with reference to FIG. 2G), sealing layer 8 is thinned back, for example, by the CMP process and predefined thickness d′ to polish stop layer 20.

[0054] Subsequently, with reference to FIG. 2H), second micromechanical functional layer 13 is deposited, for example a polysilicon layer, and possible further process steps are carried out as mentioned in conjunction with the first specific embodiment.

[0055] The use of polish stop layer 20 including openings 21 is moreover also possible in a variant of the first specific embodiment.

[0056] FIGS. 3A) through 3C) are schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a third specific embodiment of the present invention.

[0057] The third specific embodiment is a variant of the second specific embodiment, after the process state shown in FIG. 2G), polish stop layer 20 being removed after the thinning back, as shown in FIG. 3A), for example selectively with the aid of phosphoric acid.

[0058] Furthermore, with reference to FIG. 3B), thinned-back sealing layer 8′ is thinned back further up to upper side O, so that further thinned-back sealing layer 8′ now extends flush with upper side O of first micromechanical functional layer 5.

[0059] Subsequently, with reference to FIG. 3C), an intermediate layer 8″ is deposited on upper side O and further thinned-back sealing layer 8′, whose thickness is settable arbitrarily low. Intermediate layer 8″ is, for example, also an oxide layer.

[0060] Finally, according to FIG. 3C), second micromechanical functional layer 13 is deposited on the intermediate layer. Further process steps, as mentioned above, may follow the process state shown in FIG. 3C).

[0061] FIGS. 4A) through 4E) are schematic views to explain preferred trench forms in the specific embodiments of the present invention, FIG. 4A) being a cross-sectional view and FIGS. 4B) through E) being top views.

[0062] FIG. 4A) corresponds to the illustration according to FIG. 1A). In FIG. 4B), an upper top view of mask layer 6 is shown, trenches 7 including right-angled corners 20. However, it is preferred for the provided method according to FIG. 4C) that corners 20 include roundings 21, so that a constant trench width is present.

[0063] FIG. 4D) accordingly shows that trenches 7 include right-angle branches 22. However, it is preferred for the provided method according to FIG. 4E) that branches 22 include local constrictions 23, so that the trench width also always remains constant.

[0064] FIGS. 5A) through 5H) are schematic cross-sectional views to explain a micromechanical structure and a corresponding manufacturing method according to a fourth specific embodiment of the present invention.

[0065] With reference to FIG. 5A), a base insulation layer 2 is deposited above a silicon substrate 1. This base insulation layer 2 may optionally be structured, for example, to connect the next functional plane lying above it to substrate 1. Optionally, one or multiple functional layers 3, for example made up of polysilicon, may then be deposited and structured. In the further course of the process, a first insulation layer 4 is deposited on this or these functional layers 3. This first insulation layer 4 is used in the further process as a sacrificial layer or insulation layer or anchoring layer. Of course, first insulation layer 4 may optionally also be structured to establish an electrical and/or mechanical contact to the next functional layer lying above it.

[0066] In the further course of the process, first micromechanical functional layer 5 is deposited on first insulation layer 4. This may be carried out, for example, in an LPCVD method or in a combined method including an LPCVD starting layer and an epitaxial layer made of polysilicon lying above it. First micromechanical functional layer 5 made of polysilicon may then optionally be planarized using a polishing method (CMP=chemical-mechanical polishing). Depending on the substructure or thickness of first micromechanical functional layer 5, this may be necessary to obtain a sufficiently good lithographic resolution in the subsequent step.

[0067] Furthermore, with reference to FIG. 5B), mask layer 6 is provided above first micromechanical functional layer 5, which includes openings 6a, with the aid of which in a following process step the underlying polysilicon of first micromechanical functional layer 5 is to be trenched, as already explained in conjunction with the first through third specific embodiments.

[0068] Polish stop layer 20 already described in conjunction with FIGS. 2A) through 2H) may optionally additionally be provided.

[0069] FIG. 5C) shows the process state after carrying out the trenching step, in which trenches 7 are formed in first micromechanical functional layer 5, which extend up to first insulation layer 4. This corresponds, for example, to the process state according to FIG. 1C). If polish stop layer 20 is additionally provided, process steps according to FIGS. 2A) through 2D) may also be carried out, the polish stop layer taking the place of mask layer 6 in FIG. 5C).

[0070] With reference to FIG. 5D), mask layer 6 is removed and then process steps according to FIGS. 1D) through 1F) take place. Alternatively, the process steps according to FIGS. 2E) through 2G) or, subsequently to FIG. 2G), process steps according to FIGS. 3A) through 3C) may be carried out to fill trenches 7 and form thinned-back sealing layer 8′ or intermediate layer 8″.

[0071] Etching accesses 9, which expose areas of first micromechanical functional layer 5, are then formed in sealing layer 8′ or intermediate layer 8″ according to FIG. 5E). The width of these first etching accesses 9 is selected in such a way that they may be completely sealed again by an oxide deposition taking place later and still to be described.

[0072] As shown in FIG. 5F), recesses 10 are etched into first micromechanical functional layer 5 in an etching step. Isotropic methods are preferably used for this purpose. The gas phase method has proven to be particularly favorable, since it may be difficult to flush out liquid etching media again from the undercut areas via narrow first etching accesses 9. One exemplary method is an etching process using SF.sub.6 in a plasma or using ClF.sub.3 or using XeF.sub.2. In this etching of the first micromechanical functional layer, first trenches 7 filled with oxide and underlying first insulation layer 4 are used as the etch stop. In other segments, the etching of the polysilicon of first micromechanical functional layer 5 may be limited via the etching time. Second insulation layer 8 made of oxide deposited in narrow trenches 7 may also be used to stabilize this layer. In the case of such large areas, it is additionally favorable to form etching accesses 9 in second sealing layer 8′ or intermediate layer 8″ in such a way that stress in this layer may be dissipated by the geometrical arrangement of the etching accesses. For example, a meandering arrangement of etching accesses 9 may be used or long etching accesses 9 offset in relation to one another.

[0073] Furthermore, with reference to FIG. 5F), a further insulation layer 11 made of oxide is deposited to seal etching accesses 9 in sealing layer 8′ or intermediate layer 8″. Sealing layer 8′ or intermediate layer 8″ and further insulation layer 11 jointly form a further sacrificial and insulation layer. Due to the described manufacturing method, in particular no significant topography results at points at which first micromechanical functional layer 5 was etched.

[0074] As shown in FIG. 5G), subsequently one or multiple contact areas K of first micromechanical functional layer 5 are exposed in that second sealing layer 8′ or intermediate layer 8″ and insulation layer 11 are removed at the affected locations by an etching process. Such contact areas K define connections to a subsequently deposited further micromechanical functional layer 13 made of polysilicon.

[0075] In a conventional way, second micromechanical functional layer 13 is then structured to form second etching accesses 14 in second micromechanical functional layer 13, which expose areas of insulation layer 11, as shown in FIG. 5G).

[0076] Finally, with reference to FIG. 5H), a further etching process is carried out to remove sealing layer 8′ or intermediate layer 8″ and insulation layer 11 completely and to remove first insulation layer 4 except for remaining areas R, at which first micromechanical functional layer 5 is anchored on substrate 1.

[0077] Although the present invention was described on the basis of preferred exemplary embodiments, it is not restricted thereto. In particular, the mentioned materials and topologies are only by way of example and are not restricted to the explained examples.

[0078] The areas of application are also broad and are not restricted to acceleration and rotation rate sensors, but are possible for arbitrary micromechanical sensors, in particular, for example, capacitive pressure sensors.

[0079] An oxide deposition to fill the trenches was always presumed above, but the described present invention is not restricted to an oxide deposition, it may be transferred to any deposition using which a trench may be sealed. There it also applies in particular for depositions of SiN (silicon nitride), SiRiN (silicon-rich nitride), SiON (silicon oxynitride), Si (silicon), Al (aluminum), Ge (germanium), Ti (titanium), W (tungsten), Cu (copper), etc.