REINFORCEMENT ELEMENT AND METHOD FOR PRODUCING A REINFORCEMENT ELEMENT

Abstract

A reinforcing element, in particular for shoes, bags or orthopedic applications, comprises a support layer and a cover layer. A memory element such as a RFID chip, is arranged between the support layer and the cover layer. Also, a manufacturing method for such a reinforcing element.

Claims

1. Reinforcing element, in particular for shoes, bags or orthopedic applications, comprising a support layer, and a cover layer connected with the support layer, a memory element arranged between the support layer and the cover layer.

2. Reinforcing element of claim 1, wherein the support layer and/or the cover layer are produced from a prefabricated material, in particular plate material or rolled material.

3. Reinforcing element of claim 1, wherein the support layer and/or the cover layer are made from a powdery material.

4. Reinforcing element of claim 1, wherein an outer contour of the support layer and/or the cover layer is obtained by punching and/or cutting.

5. Reinforcing element of claim 1, wherein an outer contour of the support layer and/or the cover layer is obtained directly during manufacture.

6. Reinforcing element of claim 1, wherein an adhesive layer is provided on an outer side of the support layer and/or the cover layer.

7. Reinforcing element of claim 1, wherein the memory element is configured as an active or passive chip.

8. Method for producing a reinforcing element, in particular for shoes, bags or orthopedic applications, in which a cover layer is connected with a support layer, and a memory element is arranged between the cover layer and the support layer by arranging the memory element on an inner side of the support layer or an inner side of the cover layer prior to connecting the cover layer and the support layer.

9. Method for producing a reinforcing element of claim 8, in which the support layer and/or the cover layer are made of prefabricated plate material or rolled material.

10. Method for producing a reinforcing element of claim 8, in which the support layer and/or the cover layer are made from a powdery material.

11. Method for producing a reinforcing element of claim 10, in which powder particles are arranged in one layer at least substantially in the final shape of an outer contour of the support layer and/or the cover layer.

12. Method for producing a reinforcing element of claim 11, in which the memory element is arranged on/in the support layer of powder particles prior to compounding the powder particles.

13. Method for producing a reinforcing element of claim 11, in which a layer of powder particles for forming the cover layer is arranged on the support layer formed by powder particles, wherein the memory element has been arranged on the inner side of the support layer beforehand.

14. Method for producing a reinforcing element of claim 10, in which the powder particles are compounded by applying heat and/or pressure.

15. Method for producing a reinforcing element of claim 8, in which the support layer and/or the cover layer are produced separately and the support layer and the cover layer are connected with each other after the memory element has been positioned.

16. Method for producing a reinforcing element of claim 8, in which the support layer and the cover layer are produced together, wherein the memory element is arranged between the support layer and the cover layer beforehand.

17. Method for producing a reinforcing element of claim 8, in which the memory element is arranged on the support layer of prefabricated plate-shaped material.

18. Method for producing a reinforcing element of claim 17, in which the cover layer is arranged on the support layer by depositing a layer of powder particles.

19. Reinforcement element of claim 7, wherein said active or passive chip a RFID chip.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the Figures:

[0022] FIG. 1 is a schematic view of a first embodiment for producing a reinforcing element of the present disclosure,

[0023] FIG. 2 is a schematic view of a second embodiment for producing a reinforcing element of the present disclosure, and

[0024] FIG. 3 is a schematic view of a third embodiment for producing a reinforcing element of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0025] For producing a reinforcing element, it is possible, according to a first embodiment (FIG. 1) to provide a plate- or band-shaped support material as the support layer 10. The same can be moved from the left to the right in FIG. 1 using a conveyor belt 12 or another suitable transport device. A cover layer 16 supplied via suitable supply rollers is arranged on an inner side 14 of the support layer 10. Preferably, an adhesive film, also supplied by suitable supply devices, is arranged on an outer side 18 of the cover layer.

[0026] The connection of the support layer 10, the cover layer 16 and the adhesive film 20 is effected, e.g., using pressure and preferably temperature applied via a roll 22. The necessary pressure, possibly together with the temperature necessary for melting, can also be applied via possibly heated dies or band plates or the like.

[0027] In the previous method step a memory element 26, such as a RFID chip, has been arranged on an inner side 24 of the cover layer 16. Likewise, it would be possible to arrange memory elements 26 on the inner side 14 of the support layer 10.

[0028] In a next step, the reinforcing element can be produced by punching or cutting so that reinforcing elements are produced which each have at least one memory element 26 arranged inside, i.e., between the support layer 10 and the cover layer 16.

[0029] In an alternative embodiment of the present disclosure (FIG. 2), the support layer 10, as well as the cover layer 16 are produced from powdery material. In this regard, different approaches are possible. For example, the support layer 10 and the cover layer 16 may be produced such that they already exist in their final form and are compacted or joined by the application of pressure and temperature. Thereafter, the memory element 26 can be arranged between the layers before the inner sides 14 and 24 of the two layers 10, 16 are connected. The connection of the support layer 10 with the cover layer 16 may be effected by temperate and/or pressure. This is possible in particular if the two layers are made of the same or compatible powder materials.

[0030] As an alternative, the support layer 10 made of powder can be finished and, in the next step, the memory element 26 can be arranged on the upper side 14 of the support layer and, thereafter, powder for the cover layer 16 can be arranged on the inner side 14 of the support layer 10. Subsequently, the powder of the cover layer 16 is compacted or compounded by the application of temperature and/or pressure. The memory element 26 was again arranged beforehand on the inner side 14 of the support layer 10 so that, in the finished reinforcing element, the memory element 26 is arranged inside the reinforcing element.

[0031] It is particularly preferred to not yet compound or compact the powder of the support layer 10, but to first arrange the memory element 28 on the inner side 14 and to cover it with powder for the cover layer 16. Thereafter, the powder of the support layer 10 and the powder of the cover layer 16 are compounded or compacted together by application of temperature and/or pressure.

[0032] In a further alternative embodiment (FIG. 3) the support layer 10 is made from a plate material. In the embodiment illustrated the support layer 10 already has the final outer contour which was obtained, e.g., by cutting or punching. Possibly, obtaining the outer contour can also be performed as the last manufacturing step.

[0033] The memory element 26 is arranged on the inner side 14 of the support layer 10. Thereafter, the powdery material for forming the cover layer 16 is applied. If so desired, the inner side 14 can be coated with a bonding agent to ensure a reliable connection between the support layer 10 and the cover layer 16. After the powder of the cover layer 16 has been arranged on the inner side 14 of the support layer 10, temperature and/or pressure are again applied to form the cover layer. Here, it is particularly preferred that a direct connection of the cover layer 16 with the support layer 10 is obtained so that the provision of a bonding agent is not necessary.

[0034] If so intended, the support layer 10 and/or the cover layer 16 can also be produced by a 3D printing method, in particular a FDM method or a SLS method, with combinations of the different manufacturing methods being possible.