MICROWAVE HEATING DEVICE

Abstract

A microwave heating device includes the following components: a heating chamber for accommodating a heating target object, a microwave generator that generates a microwave, and a coaxial connector. The coaxial connector includes a center conductor, an insulator, and an external conductor. The center conductor is connected to the output terminal of the microwave generator. The coaxial connector includes an air gap between the center conductor and the insulator. This aspect can reduce the occurrence of cracking of the soldered joint between the microwave generator and the coaxial connector.

Claims

1. A microwave heating device comprising: a heating chamber configured to accommodate a heating target object; a microwave generator configured to generate a microwave; a waveguide mounted with the microwave generator, the waveguide including one end connected to the heating chamber; and a coaxial connector including a center conductor, an insulator, and an external conductor, wherein the microwave generator includes a substrate mounted with an oscillator system, the center conductor includes one end connected to the substrate of the microwave generator and another end projecting into the waveguide, the one end of the center conductor being closer to the microwave generator, the another end being closer to the waveguide, and the coaxial connector includes an air gap between the center conductor and the insulator.

2. The microwave heating device according to claim 1, wherein the coaxial connector further includes a positioning member projecting from a surface of the insulator, thereby supporting the center conductor, and the air gap includes discontiguous spaces partitioned by the positioning member.

3. The microwave heating device according to claim 1, wherein the air gap has a dimension in a range of 0.4 mm to 0.8 mm, inclusive.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0008] FIG. 1 is a sectional view of a microwave heating device according to an exemplary embodiment of the present disclosure.

[0009] FIG. 2 is a sectional view of the microwave heating device taken along line 2-2 in FIG. 1.

[0010] FIG. 3 is a partially enlarged view of area A in FIG. 1.

[0011] FIG. 4 is a graph showing the analytical results of the electromagnetic field generated when the coaxial connector transmits the microwave.

DESCRIPTION OF EMBODIMENTS

[0012] The microwave heating device according to the first aspect of the present disclosure includes the following components: a heating chamber configured to accommodate a heating target object, a microwave generator configured to generate a microwave, and a coaxial connector. The coaxial connector includes a center conductor, an insulator, and an external conductor. The center conductor is connected to the output terminal of the microwave generator. The coaxial connector includes an air gap between the center conductor and the insulator.

[0013] In the microwave heating device according to the second aspect of the present disclosure, in addition to the first aspect, the air gap includes discontiguous spaces.

[0014] In the microwave heating device according to the third aspect of the present disclosure, in addition to the first aspect, the air gap has a dimension in the range of 0.4 mm to 0.8 mm, inclusive.

[0015] The exemplary embodiment of the present disclosure will now be described with reference to the drawings.

[0016] FIG. 1 is a sectional view of a microwave heating device according to the exemplary embodiment. FIG. 2 is a sectional view of the microwave heating device taken along line 2-2 in FIG. 1. FIG. 3 is a partially enlarged view of area A in FIG. 1.

[0017] As shown in FIG. 1, the microwave heating device of the exemplary embodiment includes heating chamber 1 for accommodating a heating target object. Heating chamber 1 has door 1a at its front opening. The top surface of heating chamber 1 is mounted with waveguide 2 of a rectangular cross section.

[0018] Waveguide 2 has a bent shape consisting of the following: a horizontal portion extending almost horizontally along the top surface of heating chamber 1, and a vertical portion extending almost vertically. One end of waveguide 2 is connected to heating chamber 1 through power-feeding port 1b formed at the top surface of heating chamber 1, and the other end of waveguide 2 is closed. The upper surface of the horizontal portion of waveguide 2 is mounted with microwave generator 4 via coaxial connector 3.

[0019] As shown in FIGS. 2 and 3, coaxial connector 3 includes external conductor 3a, insulator 3b, and center conductor 3c. External conductor 3a supports insulator 3b. Coaxial connector 3 further includes flange-like positioning member 3f, which is placed between insulator 3b and center conductor 3c in such a manner as to project from the surface of insulator 3b. Insulator 3b supports center conductor 3c via positioning member 3f. Coaxial connector 3 has air gap 3d between center conductor 3c and insulator 3b excluding positioning member 3f. The end of center conductor 3c that is closer to waveguide 2 projects into waveguide 2 and functions as an antenna.

[0020] Microwave generator 4 includes substrate 4a mounted with an oscillator system composed of a semiconductor device. The oscillator system generates an electromagnetic wave with a frequency (e.g., 2.45 GHz), within the frequency range of the microwave. Coaxial connector 3 further includes soldered joint 3e connecting substrate 4a and the end of center conductor 3c that is closer to microwave generator 4.

[0021] In FIGS. 2 and 3, air gap 3d is composed of two discontiguous spaces. In the present disclosure, however, air gap 3d may alternatively be a single contiguous space.

[0022] In the microwave heating device according to the exemplary embodiment, the microwave power generated on substrate 4a travels through coaxial connector 3 and waveguide 2 and is radiated into heating chamber 1 through power-feeding port 1b.

[0023] FIG. 4 is a graph showing the analytical results of the electromagnetic field generated when coaxial connector 3 transmits the microwave. More specifically, FIG. 4 shows the reflection coefficient S11 (dB) and the optimum outer dimension OD (mm) of insulator 3b with respect to the dimension GAP (mm) of air gap 3d shown in FIG. 3. As the reflection coefficient S11 is smaller, the reflected power decreases, thereby achieving excellent transmission conditions.

[0024] As shown in FIG. 4, as the dimension GAP of air gap 3d increases, he reflection coefficient S11 increases and the outer dimension OD of insulator 3b decreases. The reflection coefficient S11 is calculated by the following formula:

S11 (dB)=10×log (reflected power/incident power)

[0025] When the reflection coefficient S11 is −30 dB, the ratio of the reflected power with respect to the incident power is 0.1%. In general, when the reflection coefficient S11 is lower than −30 dB, the reflected power does not practically matter.

[0026] In the exemplary embodiment, the outer dimension OD of insulator 3b is set in such a manner that the reflection coefficient S11 is below −30 dB. This causes the reflected power to be equal to or less than 1/1000 of the incident power. The contact area between center conductor 3c and insulator 3b is minimized, and center conductor 3c is left unfixed in waveguide 2.

[0027] In the exemplary embodiment, the internal stress caused by the thermal expansion of center conductor 3c can be released toward waveguide 2. This results in reducing the stress on soldered joint 3e. In particular, setting the dimension GAP of air gap 3d to the range of 0.4 mm to 0.8 mm can reduce the stress on soldered joint 3e without increasing the reflected power.

[0028] As shown in FIG. 4, the outer dimension OD of insulator 3b can be smaller than it is when the dimension GAP of air gap 3d is 0 mm. This enables reducing the outer dimension of coaxial connector 3.

[0029] The exemplary embodiment can reduce the occurrence of cracking of the soldered joint between microwave generator 4 and coaxial connector 3, thereby improving the reliability of the microwave heating device.

INDUSTRIAL APPLICABILITY

[0030] As described above, the present disclosure is applicable to microwave heating devices such as microwave ovens, plasma generators, and dryers.

REFERENCE MARKS IN THE DRAWINGS

[0031] 1 heating chamber [0032] 1a door [0033] 1b power-feeding port [0034] 2 waveguide [0035] 3 coaxial connector [0036] 3a external conductor [0037] 3b insulator [0038] 3c center conductor [0039] 3d air gap [0040] 3e soldered joint [0041] 3f positioning member [0042] 4 microwave generator [0043] 4a substrate