Coil electronic component

Abstract

A coil electronic component includes a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil, and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform in along the internal coil, and a line width and a thickness of the upper coil pattern are increased in a direction from the center of the internal coil to the outermost portion of the internal coil.

Claims

1. A coil electronic component comprising: a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil; and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern disposed on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform along the internal coil, and a line width and a thickness of the upper coil pattern increases in a direction from the center of the internal coil to the outermost portion of the internal coil.

2. The coil electronic component of claim 1, wherein a cross-section of the upper coil pattern and a cross-section of the lower coil pattern have a rectangular shape.

3. The coil electronic component of claim 1, wherein the lower coil pattern includes a seed layer and a plating layer.

4. The coil electronic component of claim 3, wherein a line width of the seed layer and a line width of the plating layer are equal.

5. The coil electronic component of claim 1, wherein an insulating layer is further disposed on a surface of the internal coil.

6. The coil electronic component of claim 1, wherein the line width of the upper coil pattern is narrower than or equal to the line width of the lower coil pattern disposed therebelow.

7. The coil electronic component of claim 1, wherein the support member includes a through-hole and a via hole spaced apart from the through-hole.

8. The coil electronic component of claim 7, wherein the through-hole is filled with the encapsulant.

9. The coil electronic component of claim 1, wherein the internal coil includes a first coil on one surface of the support member and a second coil on another surface of the support member.

10. The coil electronic component of claim 9, wherein the first coil and the second coil are symmetrical with respect to the support member.

11. A coil electronic component comprising: a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil; and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns each having a cross-section in a step shape, an upper portion of each of the plurality of coil patterns, which is in a farther side from the support member, has a line width different than a line width at a lower portion of each of the plurality of coil patterns, which is in a closer side from the support member, the line width at the upper portion of each of the plurality of coil patterns increases in a direction from the center of the internal coil to the outermost portion of the internal coil, and a thickness of each of the plurality of coil patterns increases in the direction from the center of the internal coil to the outermost portion of the internal coil.

12. The coil electronic component of claim 11, wherein the line width of at the lower portion of each of the plurality of coil patterns is uniform along the internal coil.

13. The coil electronic component of claim 11, wherein the line width at the upper portion of each of the plurality of coil patterns is narrower than the line width at the lower portion of each of the plurality of coil patterns.

14. The coil electronic component of claim 11, wherein an insulating layer is further disposed on a surface of the internal coil.

15. The coil electronic component of claim 11, wherein the support member includes a through-hole and a via hole spaced apart from the through-hole.

16. The coil electronic component of claim 15, wherein the through-hole is filled with the encapsulant.

17. The coil electronic component of claim 11, wherein the internal coil includes a first coil on one surface of the support member and a second coil on another surface of the support member.

18. The coil electronic component of claim 17, wherein the first coil and the second coil are symmetrical with respect to the support member.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

(2) FIG. 1 is a schematic perspective view of a coil electronic component according to an exemplary embodiment in the present disclosure;

(3) FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1; and

(4) FIGS. 3A through 3I illustrate an example of a process of manufacturing the coil electronic component of FIG. 1.

DETAILED DESCRIPTION

(5) Hereinafter, exemplary embodiments in the present disclosure will be described in detail with reference to the accompanying drawings.

(6) Hereinafter, a coil electronic component and a manufacturing method thereof according to an example of the present disclosure will be described, but the present disclosure is not limited thereto.

(7) FIG. 1 is a schematic perspective view of a coil electronic component 100 according to an example of the present disclosure, and FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

(8) Referring to FIGS. 1 and 2, a coil electronic component 100 includes a body 1 and external electrodes 2.

(9) The body 1 has an upper surface and a lower surface opposing each other in the thickness direction T, a first end surface and a second end surface opposing each other in the length direction L, and a first side surface and a second side surface opposing each other in the width direction W, having a hexagonal shape.

(10) An encapsulant 11 determining an appearance of the body includes a material having magnetic properties. Specifically, the material may be prepared by dispersing ferrite particles or metal magnetic particles in a resin. The metal magnetic particles may include nickel (Ni), aluminum (Al), iron (Fe), and the like, but is not limited thereto.

(11) A support member 13 and an internal coil 12 are sealed by the encapsulant 11. The support member 13 supports the internal coil 12 and serves to facilitate formation of the internal coil 12. The support member 13 may include a material having insulating properties. The support member 13 may be formed of a known copper clad laminate (CCL) substrate, or a PID resin, an ABF film, or the like, may be used by those skilled in the art if necessary.

(12) An insulating layer 14 for preventing a short circuit between magnetic materials in the encapsulant 11 is formed on a surface of the internal coil 12, and here, an insulating resin having excellent insulating properties and moldability may be used without a limitation.

(13) A through-hole H is formed at the center of the support member 13 and the inside of the through-hole is filled with the encapsulant 11 to make flow of magnetic flux generated by the internal coil 12 smooth to improve magnetic permeability of the coil electronic component. A via hole V is spaced apart from the through-hole H. The via hole V is a space for a via connecting a first coil 121 disposed on one surface of the support member 13 and a second coil 122 disposed on the other surface of the support member 13. Thus, the via hole V is filled with a conductive material.

(14) The internal coil 12 includes a first coil 121 on one surface of the support member 13 and a second coil 122 on the other surface of the support member 13. The first coil 121 and the second coil 122 are symmetrical with respect to the support member 13. Therefore, since the contents of the first coil 121 may be applied to the second coil 122 as is, only the first coil 121 will be described for the purposes of description and a separate description of the second coil 122 will be omitted.

(15) The first coil 121 includes a plurality of coil patterns 1211 and 1212. The coil patterns 1211 and 1212 are connected to each other and have a spiral shape that is wound a plurality of times when viewed from an upper surface of the coil electronic component.

(16) The plurality of coil patterns 1211 and 1212 of the first coil 121 include lower coil patterns 1211a and 1212a and upper coil patterns 1211b and 1212b, respectively.

(17) The upper coil patterns 1211b and 1212b are disposed on the lower coil patterns 1211a and 1212a. Here, a line width and thickness of the lower coil patterns 1211a and 1212a are kept substantially uniform along the internal coil 12. In addition, the lower coil patterns 1211a and 1212a substantially have a rectangular shape. The lower coil patterns 1211a and 1212a are formed of at least two layers, and, among the two layers, seed layers 1211c and 1212c are in direct contact with the support member 13 and act as basic layers of the coil patterns 1211 and 1212. The seed layers 1211c and 1212c are thin conductive layers and may have a thickness ranging from about 2 μm to 10 μm. Plating layers 1211d and 1212d are disposed on the seed layers 1211c and 1212c, respectively, and a line width of the plating layers 1211d and 1212d is substantially equal to a line width of the seed layers 1211c and 1212c. In addition to the seed layers 1211c and 1212c and the plating layers 1211d and 1212d, the lower coil patterns 1211a and 1212a may further include a plating layer (not shown) , which may be appropriately designed and changed by those skilled in the art as necessary.

(18) An aspect ratio of the basic internal coil may be secured by the lower coil patterns 1211a and 1212a. Since the upper coil patterns 1211b and 1212b are further grown on upper surfaces of the lower coil patterns 1211a and 1212a, the thickness of the lower coil is generally smaller than a final thickness of the internal coil.

(19) Referring to a line width w1 and a thickness t1 of the upper coil patterns 1211b and 1212b formed on the lower coil patterns 1211a and 1212a, the line width w1 and the thickness t1 of the first upper coil pattern 1211b are different from a line width w2 and a thickness t2 of the second upper coil pattern 1212b. The first upper coil pattern 1211b is defined as a coil pattern closer to the center of a core of the coil, and the second upper coil is defined as a coil pattern adjacent to the first upper coil pattern 1211b and close to the body 1. Since the thickness t1 of the first upper coil pattern 1211b is smaller than the thickness t2 of the second upper coil pattern 1212b, a bottleneck phenomenon of magnetic flux occurring in the vicinity of the innermost coil pattern may be improved.

(20) Meanwhile, the line width w1 of the first upper coil pattern 1211b is smaller than the line width w2 of the second upper coil pattern 1212b. Since the line width of the first upper coil pattern 1211b is smaller than that of the second upper coil pattern 1212b, it is easy to differentiate between the thicknesses of the first and second upper coil patterns 1211b and 1212b.

(21) According to the structure of the internal coil, since the line widths and the thicknesses of the coil are differentiated along the internal coil through the upper coil patterns, while the aspect ratio of the internal coil is stably significantly increased through the lower coil patterns, the occurrence of a bottleneck phenomenon of magnetic flux may be prevented. As a result, the coil electronic component may have improved impedance characteristics and the DC-bias characteristics as compared with a coil electronic component having the same size condition.

(22) FIG. 3 illustrates a manufacturing process for manufacturing the coil component 100 described in FIGS. 1 and 2, and here, the coil component 100 is not necessarily manufactured only by the manufacturing process described in FIG. 3.

(23) Referring to FIG. 3A, the support member 13 on which a via hole V is processed is prepared. A thickness of the support member 13 may be appropriately adjusted within a range of 5 μm to 60 μm by those skilled in the art as necessary.

(24) Referring to FIG. 3B, the seed layers 1211c and 1212c covering even all the side surfaces of the via hole V are formed. A method of forming the seed layers is not limited and a method of forming the seed layers appropriate for a design of those skilled in the art, such as sputtering, chemical copper plating, or the like, may be selected.

(25) Referring to FIG. 3C, the patterned first dry film 31 is stacked. The patterned first dry film 31 includes a plurality of openings h, and line widths of the openings are substantially equal.

(26) Thereafter, referring to FIG. 3D, the inside of the openings h of the first dry film 31 are filled with plating layers 1211d and 1212d among the lower coil patterns. Here, general electroplating or electroless plating may be utilized without a limitation, and since the plating layers 1211d and 1212d fill the previously prepared openings, the plating layers 1211d and 1212d have a rectangular cross-sectional shape and maintained in uniform line width and thickness.

(27) Referring to FIG. 3E, an additional second dry film 32 is stacked on the first dry film 31. The second dry film 32 is also patterned to include openings h1 and h2, and here, line widths of the openings h1 and h2 are different from each other. Specifically, a line width of the opening h1 forming the innermost coil pattern is narrower than a line width of the opening h2 forming a coil pattern adjacent thereto. In this manner, the line width of the upper coil pattern is gradually increased in the winding direction from the center of the internal coil 12 to the outermost portion of the internal coil 12.

(28) Referring to FIG. 3F, an upper coil pattern filling the inside of the openings h1 and h2 of the second dry film is formed. Since the line widths of the openings h1 and h2 increase along the winding direction of the internal coil 12, a line width of the upper coil patterns filling the inside also increases along the winding direction of the internal coil 12.

(29) Thereafter, referring to FIG. 3G, the first and second dry films 31 and 32 and the seed layers 1211c and 1212c disposed under the first dry film are removed, and a through-hole H is formed in a portion corresponding to the center of the support member 13.

(30) Here, a method of removing the first and second dry films 31 and 32 is not limited and a chemical removing method using a chemical solution capable of easily etching the corresponding dry film or a mechanical removing method may be utilized without a limitation.

(31) The removal of the seed layers disposed under the first dry film is intended to prevent a short circuit between the adjacent coil patterns. The method of removing the seed layer maybe appropriately set according to a material constituting the seed layer. For example, the seed layers may be removed through a laser or chemical etching.

(32) In addition, a drill or a laser may be used to form the through-hole H of the support member 13, but the present disclosure is not limited thereto.

(33) Next, FIG. 3H illustrates a process of forming an insulating layer 14 on a surface of the formed internal coil 12, and a short circuit may occur between the internal coil 12 and an encapsulant 11 to be applied thereafter due to the insulating layer 14. The forming of the insulating layer 14 may be performed by known chemical vapor deposition (CVD) but is not limited thereto.

(34) Finally, FIG. 3I illustrates a finishing process of forming a coil electronic component, during which an encapsulant 11 is applied, body insulation is formed, and external electrodes connected to lead portions of the internal coil 12 are formed.

(35) Except for the above description, a repeated description of features of the coil electronic component according to an exemplary embodiment of the present disclosure described above will be omitted here.

(36) As set forth above, according to an exemplary embodiment in the present disclosure, the coil electronic component which meets the demand for high inductance and low DC resistance by increasing the aspect ratio of the coil and making flow of magnetic flux generated by the coil smooth is provided.

(37) While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims.