Method for producing decorative panels

Abstract

The present disclosure relates to a method for producing a decorative panel. The method comprises the following method steps in order to generate an especially realistic perceptive impression of a structuring, even with a lacquer-containing top layer: a) providing a carrier, b) applying a decoration onto at least a partial region of the carrier, c) applying a lacquer-containing top layer onto the decoration, wherein the method is characterized in that d) the lacquer-containing top layer is partially hardened, wherein d1) a partial hardening of the top layer is realized while forming a hardening gradient and wherein the hardening gradient is established in the direction of the thickness of the top layer such that a surface region of the top layer is hardened comparably stronger than a deeper-lying region of the top layer, and wherein e) subsequent to the only partial hardening of the top layer the latter it is provided with a structuring, wherein f) method step e) is realized at least partially by a negative structuring, and g) the lacquer-containing top layer is final hardened after method step e). The invention further relates to a decorative panel.

Claims

1. A decorative panel comprising a carrier, a decoration and an unstructured lacquer-containing top layer, wherein the unstructured top layer is partially hardened at an intermediate stage such that a crosslinking degree in a range from ≥50% to ≤90% is obtained, wherein the top layer is partially hardened such that a hardening gradient is obtained in the thickness direction of the top layer, and wherein a surface region of the top layer is hardened comparably stronger than a deeper-lying region of the top layer, wherein the surface region of the top layer is structured by embossing when the decorative panel is at the intermediate stage and exhibits stability to maintain the embossed structure until a complete hardening stage is reached, wherein the partially hardened surface region at the intermediate stage imparts a structure imitating a decorative template into the deeper-lying region of the top layer by negative patterning.

2. The decorative panel according to claim 1, wherein the lacquer-containing top layer comprises an acrylate-based lacquer.

3. The decorative panel according to claim 1, wherein the top layer at least partially has a pendulum hardness in a range from ≥65 to ≤80 seconds.

Description

DRAWINGS

(1) The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

(2) Hereinafter the disclosure is explained with reference to figures. In the figures:

(3) FIGS. 1A, 1B, 1C and 1D show a schematic process flow of an embodiment of the method according to the disclosure; and

(4) FIGS. 2A, 2B, 2C and 2D show a schematic process flow of a further embodiment of the method according to the disclosure.

(5) Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.

DETAILED DESCRIPTION

(6) Example embodiments will now be described more fully with reference to the accompanying drawings.

(7) FIGS. 1A, 1B, 1C and 1D depict an embodiment of a schematic process flow of a method according to the disclosure. FIG. 1A shows a carrier 10 which is provided with a decoration 12 or a decorative layer and a top layer 14 applied to the decorative layer 12. The top layer may for example have a thickness in a range between ≥1 μm and ≤5 mm, preferably between ≥1 μm and ≤20 μm. The top layer 14 is lacquer-based and may in particular comprise an acrylic lacquer, such as an acrylic/PU system. This assembly is hardened in a process step shown in FIG. 1B by a radiation source 18, wherein the top layer 14 is hardened such that the top layer 14 is partially hardened by forming a partially hardened region 14.sub.1 which in FIGS. 1A-1D corresponds to the entire top layer 14. Herein a partial hardening of the top layer 14 is realized by forming a hardening gradient and the hardening gradient is formed in the thickness direction of the top layer such that a surface region of the top layer is hardened more than a deeper-lying or deeper region of the top layer.

(8) Herein, certain parameters can be particularly advantageous for a partial hardening. For example, a partial hardening may be implemented by the radiation source 18 with a power in the range of ≤80 W, for example in a range from ≥5 W to ≤50 W, particularly preferably ≥30 W to ≤40 W. Alternatively or additionally, a radiation having a wavelength in a range from ≥200 nm to ≤380 nm, for example in a range from ≥240 nm to ≤280 nm, for example at 254 nm may be used. Accordingly, the radiation source 18 may be a gallium emitter. Subsequently to the partial hardening, the partially hardened region 14.sub.1, for example, may have a crosslinking degree in the range from ≥50% to ≤90%, for example, ≥65% to ≤85%, particularly preferably in a range from ≥70% to ≤80%, wherein said crosslinking degree can be determined in accordance with DIN ISO 10147. Additionally or alternatively it may be provided that the top layer 14 at least partially has a pendulum hardness in a range from ≥65 to ≤80 seconds, wherein the pendulum hardness can be determined in a known manner according to König or Persoz and thus by application of DIN EN ISO 1522 or DIN 53157.

(9) FIG. 1C further shows that by negative patterning by use of an embossing means 22, such as an embossing roller, a defined structure 16 can be introduced into the partially hardened top layer 14.sub.1.

(10) FIG. 1D further shows that the top layer 14 can be fully hardened by use of a radiation source 20, for example with a power of 80-100 W, for example a gallium mercury emitter as radiation source 20. Then, the carrier 10 may be separated into panels of a suitable size in the case that the dimensions of the carrier 10 exceed the size of the desired panels.

(11) FIGS. 2A, 2B, 2C and 2D show a further embodiment of the method according to the disclosure, wherein the method mostly corresponds to that described in connection with FIGS. 1A-1D, such that for a detailed description it is referred to the above statements with respect to FIGS. 1A-1D. In the embodiment according to FIGS. 2A-2D, the top layer 14 may be hardened, too, while forming a spatial hardening gradient. This can be seen in FIG. 2B, wherein a partially hardened region 14.sub.1 of the top layer 14 has been formed at a surface region of the top layer 14 downstream of a radiation source 18 or in the advancing direction past the radiation source 18, whereas in a deeper-lying region of the top layer 14 an unhardened region 14.sub.2 is present.

(12) The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.