Mould with a mould pattern, and device and method for producing same

Abstract

A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are coated at least partially with a coating. In addition, the invention relates to a corresponding structural die as well as a device for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the device has coating means for coating the die structures.

Claims

1. A soft die comprising: die structures for applying microstructures and/or nanostructures on a substrate, said die structures having a deformation behavior primarily based on entropy elasticity; an electrically conductive ground layer; and a coating material that at least partially coats the die structures, the coating material being: (i) transparent to UV-light, (ii) electrically conductive, and (iii) comprised of a metal selected from the group comprising: Cr, Be, Wi, Cd, Ga, In, Ir, Mg, Mn, Mo, Os, Pa, Rh, Ru, Ta, Ti, V, Zn, Sn, Zr, Cu, Ni, Co, Fe, Pt, Ag, Au, Pb, W and Al, wherein said coating material is electrically connected to the ground layer to provide an electrically neutral coating surface, said coating surface having a roughness value of less than 10 nm, the roughness value applying to at least one of mean roughness, quadratic roughness, and average depth of roughness, wherein the coating material forms a protective layer that prevents contamination of the soft die during use of the soft die, and wherein the soft die is demolded from the embossing material by bending the soft die.

2. A soft die according to claim 1, wherein the die structures are comprised of a hardened polymer.

3. The soft die according to claim 2, wherein the hardened polymer is selected from the group comprising: an elastomer, a siloxane, and a polydimethylsiloxane (PDMS).

4. The soft die according to claim 1, wherein the ground layer is located at a peripheral edge of the soft die.

5. The soft die according to claim 1, wherein the soft die further comprises a line that electrically connects the ground layer to ground.

6. The soft die according to claim 1, wherein the coating surface of said coating material adheres to a surface of a material embossed by the soft die with an adhesion of less than 2.5 J/m.sup.2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a diagrammatic cross-sectional depiction of a die in a first production step according to the invention,

(2) FIG. 2 is a diagrammatic cross-sectional depiction of a die in a second production step according to the invention, and

(3) FIG. 3 is a diagrammatic cross-sectional depiction of a die in a third production step according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

(4) In the further embodiments, the production of a die 1, provided with a ground 4 and coated with a layer 5 according to the invention, is disclosed.

(5) In a first production step according to FIG. 1, a die 1 is fastened to a die surface 1o and structures 2 to a backplane 3.

(6) In a second production step according to FIG. 2, deposition of an electrically conductive layer, a ground 4, lateral to the die 1, arranged in particular in a circle, preferably exclusively on the lateral peripheral edge, is carried out on the backplane surface 3o of the backplane 3.

(7) In a third production step according to FIG. 3, the coating of the die 1 is carried out with a coating 5 according to the invention such that the coating 5 also makes contact with the ground 4, and in particular at least predominantly, preferably completely, covers it, and thus a conducting contact between the coating surface 5o and the ground 4 is produced.

(8) The ground 4 preferably completely encompasses the die 2. The electrical charge can be removed, for example, on the side 4s of the ground 4 via a line L1. Alternatively or in addition, the production of a hole 6 through the backplane 3 would also be conceivable in order to remove the charge via a line L2.

(9) If a backplane 3 can be eliminated, it is in particular conceivable to deposit the ground 4 directly on the edge of the die 1.

REFERENCE SYMBOL LIST

(10) 1 Die

(11) 1o Die Surface

(12) 2 Structures

(13) 3 Backplane

(14) 3o Backplane Surface

(15) 4 Ground

(16) 5 Coating

(17) 5o Coating Surface

(18) 6 Hole

(19) L1, L2 Lines