NANOPORE ARRAY WITH ELECTRODE CONNECTORS PROTECTED FROM ELECTROSTATIC DISCHARGE

Abstract

A component (8) adapted to engage with a receiver (6) has an array of contact pads (16) to removeably connect with a corresponding array of connectors (18) on the receiver (6). Each contact pad (16) of the array is electrically connected to the electrode (26) of a corresponding recess or well (28) that is part of a sensor, wherein a membrane is formable across each recess. A conductive grid (102) is configured between the contact pads (16) of the array, to inhibit an electrostatic discharge (ESD) conducting across the recesses or wells and/or direct an ESD away from the recesses or wells.

Claims

1. A component configured to removably engage with a receiver, the component having: an array of electrodes and configured to removably connect with a corresponding array of connectors on a receiver, wherein a plurality of electrodes of the array are electrically connected to a corresponding recess or well, each recess forming part of a sensor for receiving a fluid therein such that a membrane is formable across each recess that separates the fluid in a recess from a conductive fluid in a common chamber; a conductive structure configured across the array to enable an electrical connection between the array of electrodes and an array of connectors of a receiver, wherein the conductive structure is configured to inhibit an electrostatic discharge (ESD) conducting across the recess and/or direct an ESD away from the recess.

2. A component according to claim 1, further having a conductive fluid in the common chamber and fluid in the plurality of recesses, wherein a membrane is formed across a plurality of the recesses separating the fluid in the common chamber from the fluid in each of the plurality of recesses, and wherein the conductive structure is configured to inhibit an electrostatic discharge passing across a membrane via the recess and/or direct an electrostatic discharge away from a membrane.

3. A component according to claim 2, wherein the conductive structure is connected to the fluid in the common chamber to inhibit a potential difference occurring across the recess or membrane.

4. A component according to claim 2 further comprising a common electrode in contact with the fluid in the common chamber.

5. A component according to claim 4 wherein the conductive structure is electrically connected to the common electrode.

6. A component according to claim 2 wherein the membrane is an amphipathic bilayer.

7. A component according to any preceding claim, wherein the array of electrodes is arranged on a base substrate and the conductive structure is mounted on the substrate.

8. A component according to any preceding claim, wherein the conductive structure extends from a plane defined by the electrodes.

9. A component according to claim 7, wherein the array of electrodes is arranged on a base of substrate and wherein at least part of the substrate extends from the region between the electrodes to form a wall and the conductive structure is configured on top of the wall.

10. A component according to claim 7 or 8, wherein the conductive structure is formed from the deposition of a conductive material in the region between electrodes.

11. A component according to any preceding claim, wherein the conductive structure is configured as a grid and extends in a planar direction, defined by the base or substrate, between the electrodes.

12. A component according to any preceding claim, wherein the electrodes are arranged in an array having a rectilinear pattern.

13. A component according to any preceding claim, wherein the footprint of each electrode is quadrilateral.

14. A component according to any preceding claim, wherein the pitch of the electrodes of the array is between 100 um and 1500 um.

15. A component according to any preceding claim, wherein the thickness of the walls of the conductive structure, in cross-section, is between 20 um and 200 um.

16. A component according to any preceding claim, wherein the windows or apertures of the conductive structure through which the connectors extend have rounded corners.

17. A component according to any preceding claim, wherein the electrode array and conductive structure are covered, at least in part, with a removable protective film or protective layer.

18. A kit having a component according to any preceding claim and a receiver, wherein the array of connectors on the receiver are configured to extend through the conductive structure without contacting the conductive structure to form an electrical connection with the electrode on the component.

19. A kit according to claim 18, wherein the grid is connected to the conductive fluid in the sample chamber to inhibit a potential difference occurring across the recess or membrane formed between the fluid in the sample chamber and fluid in a recess, such that when a conductive fluid occupies the sample chamber an ESD is inhibited from conducting through, or in the region of, the recess and/or sensor by the conductive structure.

Description

[0041] The invention is discussed below, by way of example only, with reference to the following figures in which:

[0042] FIG. 1 is a perspective view of an apparatus having a removably detachable component;

[0043] FIG. 2 is a cross-sectional schematic view of the apparatus of FIG. 1, showing the component detached from the apparatus but ready for connection thereto;

[0044] FIG. 3 is a cross-sectional view of wells of having a known connection structure;

[0045] FIG. 4 is a cross-sectional view of wells of an apparatus provided with a layer of polar medium;

[0046] FIG. 5 is a cross-sectional view of another well of an apparatus showing ideal fluid behaviour;

[0047] FIG. 6 is a cross-sectional view of a well of a component having a via connected to an exposed pad located on an array of electrodes of a component;

[0048] FIG. 7 is a cross-sectional view of a schematic showing five wells of a component, each connected to a pad and aligned with a respective connector of a receiver;

[0049] FIG. 8 is a cross-sectional view of a schematic showing five wells of a component, two of which are connected to pads, of an array of an electrode at the end of the component;

[0050] FIG. 9 is a schematic view of an array of pads of electrodes having a grid interposed and surrounding the pads, Wherein the grid is connected to a grounding electrode;

[0051] FIG. 10 is a schematic end-elevation view of the grid in FIG. 9;

[0052] FIGS. 11a and 11b are schematic views of a portion of the grid positioned adjacent the pads of the electrode of the component and in the region of the wells;

[0053] FIG. 12 is detailed view of an embodiment of the invention in which a grid is positioned across an array of electrodes and connected to a grounding electrode;

[0054] FIG. 13 is a detailed view of one corner of the embodiment shown in FIG. 12;

[0055] FIG. 14 is a perspective view of an array of connectors configured to extend between the grid to contact the array of electrodes of a component;

[0056] FIG. 15 is a perspective view of individual contacts of the connectors shown in FIG. 15;

[0057] FIG. 15 is a perspective view of a section of the grid located upon a section of the array of electrodes; and

[0058] FIGS. 17a and 17b show two examples, respectively, of portions of alternative arrangements.

[0059] FIG. 1 shows an apparatus 2 having a removably detachable device 4 having a receiver 6 and a component 8. The device is removably detachable from a base 10 of the apparatus 2. The various parts of the apparatus can be provided as a kit. The component 8 can be disposable. The device 4 can be inserted and removed from the base 10. The component 8 can be inserted and removed frim the receiver 6.

[0060] In FIG. 2 the component 8 is shown positioned above the receiver 6 prior to insertion. When inserted, the component and receiver are mechanically connected and secured by a latch 12 and a recess 14, which are located at the ends of the receiver. Electrically, the component and receiver can connect via an array of electrodes 16 on the component 8 and a corresponding array of connectors 18 of the receiver 6. The body of the component 8 is typically made of a plastic material having a degree of elasticity. The plastic material may for example be polycarbonate.

[0061] The component 8 can be disposable and, by way of example, has a disposable flow-cell located therein. The flow cell can be equivalent to that discussed in WO 2014/064443, which is hereby incorporated in its entirety by reference, wherein the component is configured to be a removable low-cost component, which can be disposed of after a single use. This is achieved by configuring more expensive components of the device 4 within the receiver 6. The low-cost component makes it feasible to perform multiple experiments with different flow-cells relatively cheaply. The base component 10 can house the electronics and cooling configuration for the overall apparatus 2. The receiver 6 can house further electronics not included in the base 10 and functions as an adaptor to receive the component 8.

[0062] Electrical connections are known from WO2009/077734, which is hereby incorporated in its entirety by reference and provides an example of the usage of the ‘solder bump’ approach that provides an electrical connection to a layer of amphiphilic molecules. FIG. 3 shows such a ‘solder bump’ 20 connection, as disclosed in WO2009/077734, connecting to a via 22 that passes through a substrate 24 to reach a well electrode 26 located at the bottom of a well or recess 28. The solder bump 20 enables a permanent connection with a seat 30 that is connected to a microprocessor or similar controller (not shown).

[0063] The well 28 is formed in the substrate 24 of non-conductive material and can be used to form or support a layer of amphiphilic molecules. In use, an aqueous solution can be introduced to the well 28, and region therearound, such that a layer of amphiphilic molecules is formed across the well 28 separating the aqueous solution in the well 28 from the remaining volume of aqueous solution above the recess. The arrangement of the well or recess 28, the well electrode 26 and additional circuitry (not shown) enables measurement of electrical signals across a layer of amphiphilic molecules. The well electrode can make electrical contact with the aqueous solution in the recess 28.

[0064] FIGS. 4 and 5 are examples of a recess or well 28 forming part of a sensor array, as respectively disclosed in WO 2014/064443 and WO2013/121193, which are hereby incorporated in their entirety by reference and describes a well 28 is formed in a material 24 such as SU-8 forming a body, and many wells 28 may be formed in close proximity within the material to form an array of sensor wells. These wells 28 allow measurement of electrical signals across the layer 11 of amphiphilic molecules by connection of an electrical circuit 26 to the contacts 22 and 25. FIG. 4, known from WO2014/064443, shows a, layer 32 of polar medium forming a meniscus interface 34a on a membrane 34 that protrudes into the wells 28 to contact a polar medium. A common electrode 36 arranged above the material 24 to make electrical contact with the layer 32 of polar medium once it has been provided The ratio of the volume of fluid in a well 28 to the volume of the fluid in the layer above that forms the polar medium 32 can be between about 1:100 about 1:10000. FIG. 5, known from WO2013/121193, shows a schematic cross section through another microcavity or sensor well 28 of a sensor array. In practice, an array of such sensor wells 28 formed in a body will be provided in a component of an apparatus and further comprise a cover over the surface of the body, to define a cavity between the cover and the body. An electrode (not shown in FIG. 5) is arranged in the cavity for connection to the electrical circuit, and acts a common electrode for the wells in the array.

[0065] The recess or well 28 forms part of a sensor, and the sensing components must communicate with a reader or microprocessor. In the present invention these wells reside in the component 8 and must electrically communicate with a reader on the receiver 6 and/or base 10.

[0066] Removable connections, or non-permanent electrical connections are known, by way of example, from WO2016/059417, which is hereby incorporated in its entirety by reference and is suitable for an array of electrical connections in such a way that the component parts can be attached and detached, and optionally reattached thereafter, without requiring extreme conditions (whether chemical or environmental) to trigger the connection or disconnection.

[0067] While removably detachable electrical connections are known the inventor has realised that conventional connections for parts such as the component 8 and receiver 6 can be improved. In particular the interface can be improved to provide an additional layer of protection to the well or recess 28 and any sensor or sensing component residing or formed in such a recess 28. The interface that is connected to the wells on the component is sensitive to mechanical and/or electrical shock.

[0068] FIG. 6 shows, by way of example, one well 28 of a sensor array having an array of electrodes 16. Each well 28 is connected through one of the electrical connectors in the array 16. A pad 100 is provided to enable connection, via a via 22, to a well electrode 26. The pad 100 can be made from any conductive material, such as for example gold, copper or platinum. The substrate 24 functions as an insulator and is around 500 μm thick. The insulator can be made of silicon or glass, for example. The substrate in alternative examples of the invention can be conductive and provided with additional layers of insulating material or dielectric in order to configure pads, vias and other such components.

[0069] FIG. 7 and FIG. 8 show the receiver 6 adjacent the component 8 with a portion (five wells 28) of the electrode array 16 aligned with an array of connectors 18. When connected, and the component is configured for use, signals detected by the well electrode 26 in the well 28 can be read. Signals pass from the well 28 via the well electrode 26 through the via 22 to the respective pad 100 of the electrode array 16, which is configured to contact a connector on the array of connectors and provide a signal to a processer, typically an ASIC device. A common electrode 36 is electrically connectable through the polar medium 32 via a conductive diffusion layer 40 to each well 28 in order that a processor can control, though multiplexing, which of the well sensors is read or sensed.

[0070] FIG. 7 represents the configuration shown in FIG. 2, while FIG. 8 represents a configuration wherein an array is configured at the end of the component 8 for engagement with an array of connectors located, for example, in the recess 14 of the receiver 6.

[0071] The invention is particularly suited to the protection of membranes formed over wells or recesses that are susceptible to damage or rupture by uncontrolled voltages, such as ESD, flowing through the well or sensor. The membrane may be a layer formed from amphiphilic molecules such as phospholipids, which have both hydrophilic and lipophilic properties. The amphiphilic layer may be a monolayer or a bilayer. The amphiphilic layer may be a co-block polymer such as disclosed in Gonzalez-Perez et al., Langmuir, 2009, 25, 10447-10450 or WO2014/064444, hereby incorporated by reference in its entirety.

[0072] The membrane may comprise an aperture formed in a solid state layer, which may be referred to as a solid state pore. The aperture may be a well, gap, channel, trench or slit provided in the solid state layer along or into which analyte may pass. Such a solid-state layer is not of biological origin. Solid state layers can be formed from both organic and inorganic materials including, but not limited to, insulating materials such as Si3N4, Al203, and SiO, organic and inorganic polymers such as polyamide, plastics such as Teflon® or elastomers such as two-component addition-cure silicone rubber, and glasses. The solid state layer may be formed from graphene. Suitable graphene layers are disclosed in WO-2009/035647, WO-2011/046706 or WO-2012/138357. Suitable methods to prepare an array of solid state pores is disclosed in WO-2016/187519.

[0073] A biological nanopore may be provided in one or more of the membranes providing a conduction pathway across each membrane which serves to fluidically connect fluid provided in a well of the well array with solution provided in an upper chamber. The nanopore may be a transmembrane protein pore derived from but not limited to alpha-hemolysin, anthrax toxin and leucocidins, outer membrane proteins/porins of bacteria, such as Mycobacterium smegmatis porin & lysenin. The pore may be derived from CsgG, such as disclosed in WO-2016/034591. The nanopore may be provided in the aperture of a solid state membrane. Such pores are known as hybrid pores. The nanopore may be formed from DNA origami.

[0074] The device of the invention is particularly suited for estimating the sequence of a polymer analyte. The analyte may be for example a polynucleotide, a polypeptide or a polysaccharide. Measurement of the polymer may take place during translocation of the polymer through the nanopore under a potential difference applied across the nanopore. The measurement may be a measurement of ion flow through the nanopore during translocation.

[0075] Ionic solution may be provided in the wells in contact with each respective membrane and the electrode provided in each of the respective wells of the array.

[0076] The component 8 can be supplied with a polar medium forming a meniscus or membrane over the well 28, having a nanopore located in the membrane of each well 28. The meniscus cooperates with the well to form part of the sensor. Alternatively, the component can be supplied ‘dry’ and without a polar medium, which is added to the component before installation to the device 6 and prior to testing or analysis of a sample. Further still, the component can be configured with a solid-state membrane and/or solid-state.

[0077] The meniscus and/or sensors of the well are sensitive to uncontrolled voltages, such as ESD. The wells, therefore, must be protected by inhibiting a voltage discharge passing across or through the well. In use, the pads 100 of the array of electrodes 16 are exposed in preparation for engagement with the array of connectors 18 on the device. Although the component 8 can be connected to a device 6 without the pads being touched, they remain susceptible to accidental touch by, for example, a finger tip. In the field, which is the antithesis of controlled laboratory conditions, a user would typically remove a component from its packaging and manually place it in the receiver. The invention mitigates any detrimental effects of a user contacting the array of electrodes 16 with, for example, their finger tip.

[0078] FIG. 9 shows, for illustration purposes, an array of pads 100 of an array of electrodes 16. A conductive structure 102, or grid, is configured across the array of electrodes 16. The conductive structure, or grid, includes a common pad 104 that is connected to the common electrode 36. The grid 102 can form a mesh, or web, that is connected to the common electrode. The grid 102 is connected to the common electrode 36 by way of example for electrically connecting the grid to the polar medium 32 in the chamber above the wells.

[0079] Additionally or alternatively the grid can be connected to the polar medium 32, or the chamber in which the polar medium resides—this connection can be by means of at least one of: a dedicated via; a wired or bonded connection to a portion of a substrate; an electrical connection through the body of the component 8; or an electrical connection to the structure forming the chamber holding the polar medium 32, which surrounds the wells 28 of the array 16. FIG. 10 shows a cross-sectional view of a section of the grid 102 positioned above the array 16, while FIG. 11a shows the relationship between the grid 102 and the polar medium 32 or sample 32. In the example shown, the grid extends from areas on the substrate between the pads, but does not contact the pads 100, and extends above the surface of the substrate. In the example shown the grid forms a net across the surface. The grid, however, can be formed from walls surrounding one or more pads 100. The grid 102 can be positioned across the array of electrodes shown in FIG. 7, in which the array of electrodes 16 can be arranged on a surface between the ends of the component 8 and can be positioned across the array of electrodes 16 shown in FIG. 8, wherein the array 16 is arranged at an end region or face of the component.

[0080] FIG. 11b shows an alternative example in which the substrate 24 is conductive and an insulating layer or dielectric surrounds the substrate in order that a well electrode 26, via 22 and pad 100 can be configured on the substrate. The grid 102 can be connected to a conductive coating surrounding or covering a portion of the substrate or the body of the component 8. In this way, charge passed to the grid is conducted and dissipated in to the dielectric between the grid and conductive surfaces formed on the dielectric, which can create a common field that affects both common and well electrodes.

[0081] The grid can also be connected to the ground plane of the component, and the device, once the component is installed in the device 6. In other words, if the substrate is conductive and coated in a dielectric or insulator, the grid can dissipate charge into this capacitance, whose field affects both common and well electrodes.

[0082] The dimension of the pads and the surrounding grid is such that either (i) objects, such as a finger, are inhibited from contacting the array 16 because the grid functions as a barrier or (ii) if the array 16 is contacted by an object it first contacts the grid. Therefore, any charge accumulated on a user's hand, or tool they are holding, is inhibited from passing through the well 28 or well electrode 26 region if it approaches or contacts the component 8 in the region of the array of electrodes 16 because it is directed through or via the grid 102 to the common electrode 36.

[0083] Because the grid 102 and polar medium 32 are electrically connected, energy transferred from an ESD to the grid and to the polar medium requires negligible work done such that the voltage across a well 28 is negligible. In use, the layer of polar medium 32, which can contain a sample to be analysed, is electrically connected to the common electrode 36 via the conductive diffusion layer 40. The grid 102, common pad 104, common electrode 36, conductive diffusion layer 40 and polar medium 32 or sample have, therefore, negligible difference in potential between them if an ESD was applied to the grid. This is because the charge is distributed across these components, which inhibits any charge passing between an electrode pad 100 and the well 28 to the sample of polar solution when the grid is contacted or both the grid and a pad are contacted. Sensors and/or membranes formed or forming part of the well 28 are protected from an ESD to the array 16. The grid 102 acts as a shield—mechanically and/or electrically—that is connectable to a substantially large volume of fluid i.e. the polar medium 32. These elements of the component 8 are significantly larger, by at least 2 orders of magnitude, than the size of the wells 28 or the volume of fluid held in the wells. As described above, the ratio of the volume of fluid in a well 28 to the volume of the fluid in the layer above that forms the polar medium 32 can be between about 1:100 about 1:10000. In the example, the common cell chamber, or sample chamber for holding a polar medium 32 and associated common mediator chamber, has a volume of about 135 ul. In the example, which has an array of 130 electrodes, 126 are occupied by fluid for forming a membrane between each well and the sample chamber above and the total volume of fluid in the wells is about 0.9 ul. The ratio in the example is about 1:150. In this way, the grid and/or the volume of polar medium (which is significantly larger than all of the wells together) function as a buffer or insulator protecting the sensing elements of the wells and sensor elements therein from an ESD or similar uncontrolled charge. In other words, any uncontrolled charge or ESD is inhibited from conducting from a pad 100 to a well 28 because the grid 102 inhibits contact with the pad and/or inhibits contact with the pad without also contacting the grid such that either (i) a charge, such as an ESD, passes to the polar medium or sample to distribute the charge with such low energy consumption that there is negligible potential difference between the pads 100 and the well 28 or (ii) if the array 16 is contacted an ESD charge is inhibited from flowing across the well 28 because the grid 102 has been contacted such that the well 28 region and the grid have the same potential difference—the charge is already balanced.

[0084] In use, the component is packaged in material that inhibits the build up of charge to minimise the risk of damage to a sensor or membrane within a well 28, which can occur if a pad 100 of the array of electrodes 16 is touched. In field use, outside of a controlled environment such as a laboratory, there are rarely facilities such as earth-points or earth straps to divert uncontrolled voltages or ESD away from the pads.

[0085] To illustrate the dimensions of the invention, by way of an example illustration, the tip of a finger 106 is shown adjacent the grid 102 in FIG. 11. Should an object, such as a finger of a user, approach a pad 100 then contact with the pad is inhibited and, even if contacted, the finger would touch the grid before, during and after contact was made with the pad 100.

[0086] After initial manufacture of the component 8 and before population with a conductive fluid, such as a polar medium 32, the grid 102 is configured to protect any sensor that will subsequently be formed in the well 28.

[0087] FIGS. 12 and 13 are snapshots of CAD images of embodiments of the grid 102 positioned between the pads 100 and connected to the common pad 104. The size of the array 16 is approximately 130 pads, equivalent to an array of about 13 pads by about 10 pads. The pitch between the pads is shown, by way of example, as 800 um. The pad is approximately square with sides about 710 um in length. The gap between the pad 100 and the grid is about 30 um. The thickness of the grid wall is approximately 30 um. The ratio of the thickness of the grid wall to the width of a pad is about 1:25. The ratio can be between about 1:10 and about 1:100. The distance between the walls of the grid, or sides of the opening can be sized to inhibit a finger time from being able to contact a pad without contacting the grid. By way of a guide, the maximum opening size can be about 2 mm from corner to corner of the pad.

[0088] FIG. 13 is a magnified view of the lower right-hand side of the array 16 in FIG. 12. It is to be noted that the shape of the grid 102 in the region surrounding an individual pad corresponds or matches the shape of the pad. The shape of the grid in the area adjacent a corner of a pad is curved. The shape of the grid is configured to minimise the inductance between the common pad 104 and any point on the grid 102.

[0089] A gap is provided between the pad 100 and the grid 102. The grid has been illustrated in other Figures as an extension of the substrate, preferably grown from the substrate, upon which the pad 100 is formed, which cannot be appreciated from the plan view of FIGS. 12 and 13. The upper-most surface of the grid has a conductive surface that is connected to the common pad 104.

[0090] Alternatively, the grid can lie flush with the surface of the array such that finger-contact with a pad is not inhibited but finger-contact with a pad 100 without touching the grid is inhibited.

[0091] The array 16 can additionally be covered by a protective antistatic tape (not shown) that can be removed from the array 16 on the component 8 prior to insertion and connection with the receiver 6. Without the grid 102 such tape could generate a triboelectric charge when peeled from the array 16 and damage the sensing function in a well 28. The tape, however, complements the function of the grid 102 because any triboelectric charge generated from its removal will not influence the sensing in the well because the tape is connected to the grid. The conductive structure is therefore covered, at least in part, with a removable protective conductive film or protective layer.

[0092] Mechanical connections, such as spring-leaf metal contacts located on the receiver 6 for engagement with the electrodes on the component 8 can be provided. FIGS. 14 and 15 illustrates an example of the first array of connectors 108 with a pitch of 800 um. FIG. 15 shows a close-up of the connectors 108 which are sprung loaded and provided in respective recesses 110. To increase their strength each connector tapers outwards towards its base. The connectors are 100 um thick and project to height of 800 um above the recess. The connectors are advantageously sprung loaded and project from the base to facilitate their connection to the array of electrodes 16 under an applied force.

[0093] FIG. 16 shows a perspective sketch view of a portion of a section of the grid 102. While FIG. 10 shows a cross-section indicating that the grid 102 is like a net resting upon legs or walls that extend from the substrate, FIG. 16 shows that the grid can have walls surrounding pads 100 of the electrodes. The examples shown herein have the grid surrounding every pad 100 on an array 16 but the grid can, alternatively surround groups of pads. Therefore, the grid can extend from areas on the substrate between the pads, but without contacting the pads 100, and form a wall. The top of the wall can be coated with a conductive material, such as gold or platinum to conduct ESD away from the pads. Alternatively the grid can have a non-raised profile and be approximately in the plane of the electrode array.

[0094] The height of a grid above the substrate—whether in net form, or whether in the form of walls as shown in FIG. 16, is determined by the height of the connectors 108. In FIGS. 14 and 15 the height of the contacts is about 800 um and would typically be reduced when compressed against a pad when the component 8 and device 6 were mated. For example, after mating the height could be reduced by compression by 25% to about 600 um. The height of the grid above the surface, therefore, can be around 500 um such that the grid was inhibited from contacting the array of connectors 18 on the device. During mating, the connectors 108 extend through the grid and between the net or between the walls to contact the pads 100. The gap between the pad 100 and the walls of the grid 102 insulate the array of electrodes from the grid 102.

[0095] As described above, the shape and formation of the grid is such that the inductance between the grid 102, common pad 104 and common electrode 32 is minimised.

[0096] The array of electrodes 16 and/or grid 102 have been described as formed on a substrate 24 with conductive surfaces for the pads 100 and for connection to, for example, the common electrode 36.

[0097] The purpose of the component is to provide a low cost single use device and in light of the teaching herein various low-cost manufacturing techniques are applicable to the examples. FIGS. 17a and 17b show two examples, respectively, of an array of electrodes 16 for connection to a device 6 having a multiple layer and single layer substrate. In the example shown in FIG. 13 the density of wells and electrodes is high, and has been fabricated on a substrate having coatings for electrodes and vias etc.

[0098] Alternatively, the pads 100 and grid 102 or tracks can be formed on, or by using:

[0099] silicon wafer fabrication, which can provide a grid minimum width as small as 5 um, with a gap between the pad and grid of 5 um;

[0100] glass wafer fabrication, which can provide a grid minimum width as small as 10 um, with a gap between the pad and grid of 10 um;

[0101] printed circuit boards, which can provide a grid minimum width as small as 50 um, with a gap between the pad and grid of 50 um;

[0102] high resolution printed circuit boards, which can provide a grid minimum width as small as 3 um, with a gap between the pad and grid of 5 um;

[0103] conductive ink, inkjet printed on card or polymers, which can provide a grid minimum width as small as 150 um, with a gap between the pad and grid of 50 um;

[0104] screen printing conductive ink on card or polymers, which can provide a grid minimum width as small as 20 um, with a gap between the pad and grid of 20 um; and

[0105] sputtering conductive material on card or polymers, which can provide a grid minimum width as small as 10 um, with a gap between the pad and grid of 10 um.

[0106] By way of example, an inkjet printed, roll-coated digital microfluidic device for inexpensive, miniaturized diagnostic assays is known from a paper in the name of Dixon et al [Lab Chip, 2016,16, 4560].

[0107] In FIG. 17a, an array of electrodes 16 are arranged at the side of a component. In this example the component is formed on a multi-layer printed circuit board. The pads are printed on an exposed layer and surrounded by a grid 102 that can be connected to a common electrode (not shown in this Figure). Tracks 112 are shown as dashed lines because they are provided on another layer and lead from vias 22, connected to the pads 100, to wells 28 located on the other side of the PCB. Reducing the number of wells 28 can reduce the complexity of the structure required to package said wells and simplify the circuits required to connect the wells to a device 6 via the array 16.

[0108] FIG. 17b shows a further simplified arrangement in which connections to pads 100 are arranged on single layer of substrate. The grid 102 continues to substantially surround the pads to inhibit damage caused by an ESD. In this particular configuration the single layer substrate and printed tracks enables the component to be formed on a device.

[0109] Like numerals in the Figures represent like features. The present invention has been described above purely by way of example, and modifications can be made within the spirit and scope of the invention, which extends to equivalents of the features described and combinations of one or more features described herein. The invention also consists in any individual features described or implicit herein.

TABLE-US-00001 List of features:  2 Apparatus  4 Device  6 Receiver  8 Component 10 Base 12 Latch 14 Recess 16 Array of electrodes 18 Array of connectors 20 Solder bump 22 Via 24 Substrate 26 Well electrode 28 Well/Recess 30 Seat 32 Layer of polar medium 34 Meniscus/membrane  34a Membrane 36 Common electrode 40 Conductive diffusion layer 100  Pad 102  Grid/conductive structure 104  Common pad 106  Finger tip 108  Connectors 110  Recess 112  Track