INDUCTIVE COMPONENT AND METHOD FOR PRODUCING AN INDUCTIVE COMPONENT

Abstract

The present invention provides an inductive component (1a) in several illustrative embodiments and a method for producing such an inductive component. The inductive component (1a) comprises a bus bar (4a) and at least one magnetic core (6a) which is formed along a section of the bus bar (4a) and surrounds the bus bar (4a) in that section at least in part, wherein the at least one magnetic core (6a) is formed as a plastic-bonded magnetic core or a core made of magnetic cement.

Claims

1. Inductive component having a bus bar and at least one magnetic core formed along a section of said bus bar; and surrounding said bus bar in said section at least in part, wherein said at least one magnetic core is formed as a plastic-bonded magnetic core or a core made of magnetic cement.

2. Inductive component according to claim 1, wherein exposed end sections of said bus bar are formed as connecting contacts and at least one bus bar section exposed at least in part between said magnetic core and a terminal is further formed for electrically connecting to a capacitor.

3. Inductive component according to claim 1, further comprising a housing in which said bus bar is accommodated at least in part, wherein said magnetic core in said housing is formed as a plastic-bonded magnetic core by plastic injection-molding technology or plastic potting technology.

4. Inductive component according to claim 1, comprising at least one second magnetic core which is formed as a plastic-bonded magnetic core or a core of magnetic cement and which surrounds said bus bar at least in part, wherein said at least two magnetic cores are arranged along said bus bar in series and a bus bar section is formed between each two magnetic cores for electrically connecting to a capacitor.

5. Inductive component according to the claim 4, further comprises a housing in which said bus bar is accommodated at least in part, wherein said at least two magnetic cores are formed in said housing in separate housing sections.

6. Inductive component according to claim 1, wherein said at least one magnetic core is formed as a plastic-bonded magnetic core made of a plastic ferrite material or of a plastic material with magnetically conductive particles embedded therein.

7. High-current filter with at least one capacitor and said inductive component according to claim 1, wherein said at least one capacitor is electrically connected to said bus bar.

8. Method for producing an inductive component comprising: providing a bus bar; and forming at least one magnetic core formed along a section of said bus bar and surrounding said bus bar in said section at least in part, wherein said at least one magnetic core is formed as a plastic-bonded magnetic core or a core made of magnetic cement.

9. Method according to claim 8, wherein forming said at least one magnetic core comprises insert molding said bus bar with plastic ferrite material or plastic material with magnetically-conductive particles embedded therein, wherein a plastic-bonded magnetic core is formed.

10. Method according to claim 8, wherein said bus bar is arranged at least in part in a housing and forming said at least one magnetic core comprises potting said bus bar in said housing at least in sections with a plastic ferrite material or plastic material with magnetically-conductive particles embedded therein or a cement with magnetically-conductive particles embedded therein.

11. An inductive component comprising: a bent bus bar having a plurality of installation spaces between opposing ends, wherein a portion of said bent bus bar is U-shaped; a contact region placed at each of the opposing ends; a plastic-bonded magnetic core formed around a portion of said formed bus bar at one of the plurality of installation spaces.

12. An inductive component as in claim 11 further comprising: a housing holding said bent bus bar; a plurality of partition walls placed in said housing forming housing sections; and wherein one of the plurality of installation spaces is held within each of the housing sections, whereby said plastic-bonded magnetic core formed around a portion of said formed bus bar at one of the plurality of installation spaces is held within the housing sections.

Description

[0031] A circuit diagram of a high-current filter 1 according to some illustrative embodiments of the present invention shall now be described with reference to FIG. 1. High-current filter T comprises an input terminal E and an output terminal A, as well as terminals n1 and n2 which are electrically connected to a ground terminal M. This is no restriction of the invention and a connection to a fixed reference potential other than ground can be provided instead of ground terminal M.

[0032] Three inductances L1, L2 and L3 are connected in series between the input terminal and the output terminal. Interposed between input terminal E and inductance L1 is a capacitance C1, where one electrode of capacitance C1 is connected between input terminal E and inductance L1, while the other electrode of capacitance C1 is connected to ground M. Interposed between inductance L1 and inductance L2 is a capacitance C2, where one electrode of capacitance C2 is connected between inductances L1 and L2, and the other electrode of capacitance C2 is connected to ground M. Interposed between inductance L2 and inductance L3 is a capacitanceC3, where one electrode of capacitance C3 is connected between inductances L2 and L3, and the other electrode of capacitance C3 is connected to ground M. Interposed between inductance L3 and output terminal A is a capacitance C4, where one electrode of capacitance C4 is connected between inductance L4 and output terminal A, while the other electrode of capacitance C4 is connected to ground M.

[0033] According to illustrative examples herein, it can be true that C1=C2=C3=C4. Alternatively, at least one capacitance of capacitances C1 to C4 can be different.

[0034] According to one illustrative example, it can be true that C1≈C2≈C3≈C4, wherein “≈” means a deviation of at most 30%, for example, at most 20%, preferably at most 15%, more preferably at most 10%, approximately at most 5%.

[0035] Circuit T shown schematically in FIG. 1 forms, for example, an LC low-pass filter of higher order, where several LC filters are connected in series between input terminal E and output terminal A. For example, it is true for a second-order LC filter that a potentiation of an attenuation/decade to the power of “2” is reached with a certain attenuation/decade (“attenuation per decade” or “attenuation edge”) per LC filter in a series connection of two LC filters. With an attenuation edge of, for example, X dB/decade per order assumed for a illustrative example, in general (X dB/decade).sup.n arises for an n.sup.th-order filter (a series connection of n LC filters) for the entire attenuation edge, in other words, an exponentiation to the power of “n”

[0036] The circuit diagram shown in FIG. 1 represents, for example, an LC low-pass filter of the third order, where capacitance C1 represents an input capacitance and the first order is formed by inductance L1 with capacitance C2 between inductance L1 and ground M, the second order by inductance L2 with capacitance C3 between inductance L2 and ground M, and the third order by inductance L3 with capacitance C4 between inductance L3 and ground M. It can be ensured by way of the input capacitance (presently capacitance C1), for example, that the series connection of the LC filters (L1, C2), (L2, C3) and (L3, C4) on the side of input terminal E and output terminal A receives a low impedance to Mass M, where the filtering effect on the side of input terminal E is increased (since also capacitance C1 to ground M is present in addition to further capacitances C2 to C4). Furthermore, capacitance C1 can provide a short circuit for possible inductances (not shown), which can be connected on the input side to the input terminal and can be connected upstream thereof (this avoids unwanted series impedance of inductances connected to the input terminal and inductance L1).

[0037] The circuit diagram shown in FIG. 1 is no restriction of the present invention and a general circuit topology can be provided where a number n1 (n1≥1) of inductances L1, L2, . . . , Ln1 and a number n2 (n2≥1) of capacitances C1, . . . , Cn2 is provided. For example, instead of the circuit in FIG. 1, a first-order LC filter can be provided by (n1, n2)=(1, 1) or (n1, n2)=(1, 2). For illustrative examples of general circuits it can be true that: (n1, n2)=(n1, n1), where n1=n2, or (n1, n2)=(n1, n1+1), where n2=n1+1.

[0038] Various illustrative embodiments of the invention shall be described in more detail below with reference to FIGS. 2a, 2b and 3.

[0039] FIG. 2a represents an inductive component according to some illustrative embodiments of the present invention. Inductive component 1a comprises a bus bar 4a and a plastic-bonded magnetic core 6a which is formed along a section of bus bar 4a and surrounds bus bar 4a in that section at least in part.

[0040] According to illustrative examples herein, plastic-bonded magnetic core 6a is formed from a plastic ferrite or comprises a plastic matrix into which magnetically-conductive particles are embedded. An example of a plastic matrix are thermoplastic materials. According to specific illustrative examples of the invention, polyamides, PPS or duroplastic material, such as epoxy resins, can be used as matrix material for plastic-bonded magnetic cores. The magnetically-conductive particles can be formed from a ferrite powder and/or a powder of magnetic rare earth materials, for example, NdFeB.

[0041] The term “bus bar” in this specification is to be understood as follows: The term “bus bar” designates an electrical conductor which is configured for operation with a current intensity of at least 5 A (depending on the application, bus bars can be configured for applications of more than 10 A, preferably more than 15 A, for example in a range of 20 A to 1000 A) and/or which is formed as a solid body which can deform only irreversibly (this is to be understood in comparison to a normal wire or power cable which can be deformed reversibly, for example, when wound, provided that it is not kinked. In one illustrative embodiment, the cross-section of a bus bar can be based on the maximum allowable current density determined by the cooling connection and adjoining components and, according to some illustrative examples, be more than 1 A/mm.sup.2, preferably more than 3 A/mm.sup.2, for example in a range of 4 A/mm.sup.2 to 20 A/mm.sup.2.

[0042] Bus bar 4a at its ends comprises contact regions 8a and 10a, where plastic-bonded magnetic core 6a is arranged above bus bar 4a and along bus bar 4a between contact regions 8a and 10a.

[0043] According to illustrative embodiments, as shown schematically in FIG. 2a, bus bar 4a can be arranged on a carrier 2a, for example, a plastic carrier or directly on a printed circuit board. For this purpose, holding elements 12a, 14a can be provided for mounting bus bar 4a on carrier 2a. Holding elements 12a and 14a are provided at sections of bus bar 4a which are respectively not covered by plastic-bonded magnetic core 6a, and therefore represent exposed bus bar sections. Holding elements 12a, 14a are preferably arranged between plastic-bonded magnetic core 6a and contact regions 8a, 10a along bus bar 4a.

[0044] According to illustrative examples, holding elements 12a and 14a can further act as contact elements which are adapted to provide an electrical connection between bus bar 4a and a printed circuit board (corresponding to carrier 2a or in addition to carrier 2a). Additionally or alternatively, holding elements 12a and 14a can act as contact elements which electrically connect bus bar 4a to discrete electrical components, for example, to capacitors and/or additional inductances. For example, a parallel connection of further components to plastic-bonded magnetic core 6a can be effected by way of holding elements 12a and 14a acting as contact elements.

[0045] Contact regions 8a and 10a are generally configured to provide electrical contact between bus bar 4a and further bus bars (not shown) electrically connected upstream or downstream, respectively, and/or electric or electronic components (not shown) electrically connected upstream and/or downstream. In other words, contact regions 8a and 10a represent exposed end sections of bus bar 4a which are formed as connecting contacts and at least one bus bar section (described later) exposed at least in part between plastic-bonded magnetic core 6a and contact region 8a or 10a, which can further be adapted for the electrical connection to e.g. a capacitor (not shown).

[0046] In specific illustrative examples, as shown in FIG. 2a, contact regions 8a and 10a comprise through-holes which pass through bus bar 4a at least in part and are adapted to receive a screw member (not shown) to enable the mechanical and electrical coupling of contact regions 8a and 10a by way of the screw member to further bus bars and/or electrical and/or electronic components. Additionally or alternatively, contact regions 8a and 10a can comprise further elements (not shown), which are configured to connect bus bar 4a to further bus bars (not shown) and/or electrical and/or electronic components (not shown), for example by way of a plug connection, a crimp connection and the like.

[0047] Inductive component 1a shown schematically in FIG. 2a has a width dimension Ba, a length dimension La and a height dimension Ha According to illustrative examples, the length dimension La can be ≥1 cm, preferably be in a range between 3 and 6 cm, for example, in a range between 3.5 and 5 cm, for example, at 4 cm±0.5 cm. According to illustrative examples, the width dimension Ba can be 1 cm, preferably be in a range between 3 and 8 cm, for example, in a range between 3.5 and 5 cm, for example, at 4 cm ±0.5 cm. According to illustrative examples, the height dimension Ha is greater than or equal to 1 cm, and can fulfill the relationship: Ha<La+Ba. Furthermore according to specific examples herein, Ha<max (La; Ba) {“Ha is smaller than the larger of La and Ba”).

[0048] The inductive component 1 a, which is shown schematically in FIG. 2a, can be formed as follows. At the beginning, bus bar 4a is provided. According to illustrative examples, bus bar 4a can be selected corresponding to an installation space into which inductive component 1a is to be installed. Additionally or alternatively, bus bar 4a can be selected according to the inductive properties that inductive component 1a has to exhibit, for example, a length of bus bar 4a in a non-deformed state (a length parallel to the length dimension La) and/or a width dimension of bus bar 4a (a width parallel to the width dimension Ba in FIG. 2a) according to an available installation space and/or the inductive properties of inductive component 1a to be set.

[0049] Thereafter, selected bus bar 4a is subjected to deformation to define a shape of bus bar 4a that can depend on available installation space and/or inductive properties that inductive component la has to exhibit. For example, the bus bar can be bent, so that inductive component 1a can be fitted in an available installation space and/or special connection geometries can be produced. For example, a shape of the bus bar determined by an installation situation in a terminal can require that deformation of the non-deformed initial bus bar is to occur in accordance with the particular shape and that e.g. sections bent to a U-shape are to be formed, that connection conditions or connection geometries must be fulfilled and/or that the bus bar is to be fitted in a predetermined installation space. Although parasitic capacitances are generally undesirable and generally to be suppressed, it is nevertheless also conceivable to additionally or alternatively deform the bus bar in order to set a desired capacitance value of the bus bar, for example, by deforming the bus bar in sections such that e.g. sections of the bus bent to a U-shape are adapted to set a parasitic capacitance.

[0050] In an illustrative example, as shown in FIG. 2a, a U-shaped section is formed by sections Aa, Ab, and Ac. Sections Aa and Ab are arranged substantially parallel to each other (“substantially” means a deviation of sections Aa and Ab from a parallel orientation by at most 30° relative to each other), where the substantially parallel sections Aa and Ab are electrically and mechanically connected by a connecting section Ac extending transverse to sections Aa and Ab. Plastic-bonded magnetic core 6a is arranged according to the illustration in sections above connecting section Ac. By suitable selection of sections Aa, Ab and Ac with respect to their surface dimensions and length dimensions (“length dimensions” are to be understood to be dimensions along the width dimension Ba and the length dimension La), a desired connection geometry is realized and/or bus bar 4a is fitted into in a predetermined Installation space. Additionally or alternatively, a desired capacitance of bus bar 4a can be set based on the shape of bus bar 4a. Depending on a specific installation situation or connection geometry, respectively, it is also possible in further illustrative examples which are not shown that several U-shaped sections, for example in serpentine form, are formed between contact regions 8a and 10a of bus bar 4a. However, more complex shapes or geometries of bus bar 4a are also conceivable in order to adapt the bus bar to predetermined connections depending on the application, e.g. connect two terminals at a given length of the bus bar, and/or provide procedural manufacturability.

[0051] Due to these factors, complex bus bar shapes can arise that can be easily populated with plastic-bonded magnetic cores according to the present method, as shall be discussed below.

[0052] Thereafter, plastic-bonded magnetic core 6a is formed on bus bar 4a. For example, plastic-bonded magnetic core 6a can be formed by overmolding bus bar 4a with plastic ferrite material or generally material comprising a plastic matrix with magnetically-conductive particles embedded therein. Alternatively, plastic-bonded magnetic core 6a can be formed by potting bus bar 4a in sections with a potting material, where the potting material comprises a plastic matrix with magnetic particles embedded therein.

[0053] Thereafter, respectively obtained bus bar 4a with plastic-bonded magnetic core 8a can be attached to a carrier 2a (for example, a plastic carrier or a printed circuit board).

[0054] Additionally or alternatively, bus bar 4a with plastic-bonded magnetic core 6a can be accommodated in a housing, provided that bus bar 4a has not already been arranged in a housing for the production of plastic-bonded magnetic core 6a.

[0055] An inductive component 1b shall be described with reference to FIG. 2b according to some illustrative embodiments of the present invention which are alternatives to the embodiments described above with respect to FIG. 2a.

[0056] Inductive component 1b illustrated in FIG. 2b comprises a bus bar 4b and three plastic-bonded magnetic cores 5b, 6b and 7b which are each formed along a section of bus bar 4b and surround bus bar 4b at least in part in the respective section.

[0057] According to illustrative examples herein, each plastic-bonded magnetic core 5b, 6b and 7b is formed from a plastic ferrite or comprises a plastic matrix into which magnetically-conductive particles are embedded. An example of a plastic matrix are thermoplastic materials. According to specific illustrative examples of the invention, polyamides, PPS or duroplastic material, such as epoxy resins, can be used as matrix material for plastic-bonded magnetic cores. The magnetically-conductive particles can be formed from an iron powder, a powder of an iron alloy (e.g., FeSi, NiFe, FeSiAl, etc.), a ferrite powder and/or a powder of magnetic rare earth materials, e.g. NdFeB.

[0058] Bus bar 4a at its ends comprises contact regions 8b and 10b, where plastic-bonded magnetic cores 5b, 6b and 7b are arranged above bus bar 4a and along bus bar 4a between contact regions 8b and 10b.

[0059] According to illustrative embodiments, as shown schematically in FIG. 2a, bus bar 4b can be arranged on a carrier 2b, for example, a plastic carrier or directly on a printed circuit board. For this purpose, at least holding elements 12b, 14b can be provided to mount bus bar 4b on carrier 2b. Holding elements 12b and 14b can each be arranged between two plastic-bonded magnetic cores of plastic-bonded magnetic cores 5b, 6b and 7b.

[0060] Holding elements 12b and 14b are provided in an illustrative manner at sections of bus bar 4a which are respectively not covered by plastic-bonded magnetic core 5b, 6b and 7b, and therefore represent exposed bus bar sections. Holding element 12b is disposed between plastic-bonded magnetic cores 5b and 8b, whereas the holding element is disposed between plastic-bonded magnetic cores 6b and 7b. Further holding elements (not shown) can be provided. For example, another holding element (not shown) can be disposed between plastic-bonded magnetic core 5b and contact region 8b, and another holding element (not shown) can be disposed between plastic-bonded magnetic core 7b and contact region 10b.

[0061] According to illustrative examples, holding elements 12b and 14b (as well as the (optional) further holding elements not shown in FIG. 2b) can also act as contact elements which are adapted to establish an electrical connection between bus bar 4b and a printed circuit board (corresponding to carrier 2b or 2b or in addition to carrier 2b). Additionally or alternatively, holding elements 12b and 14b can act as contact elements electrically connecting bus bar 4a to discrete electrical components, for example, to capacitors and/or additional inductances. For example, a parallel connection of further components to plastic-bonded magnetic cores 5b, 6b and 7b can be effected by way of holding elements 12b and 14b acting as contact elements.

[0062] In a specific example, bus bar 4b can be almost completely surrounded by a material for plastic-bonded magnetic cores 5b, 6b, 7b, and only contact regions 8b, 10b and sections can be exposed on the bus bar that are in mechanical (and optionally electrical) contact with holding elements 12b and 14b. If, in this example, holding elements 12b and 14b further act as electrical contact elements by way of which bus bar 4b can be connected in parallel to e.g. discrete electrical components (e.g., a capacitor), then only the surface sections of bus bar 4b to be mechanically and electrically connected to holding elements 12b, 14b may not be covered with plastic-bonded magnetic cores 5b, 6b, 7b between contact regions 8b, 10b. Although in this case plastic-bonded magnetic cores 5b, 8b, 7b represent a contiguous amount of material, effective inductances along the bus bar between contact regions 8b, 10b are provided by holding elements 12b and 14b acting as contact elements, so that three plastic-bonded magnetic cores can effectively be spoken of in this case as well.

[0063] Contact regions 8b and 10b are generally configured to provide electrical contact between bus bar 4b and further bus bars (not shown) electrically connected upstream or downstream, respectively, and/or electric and/or electronic components (not shown) electrically connected upstream and/or downstream. In other words, contact regions 8b and 10b represent exposed end sections of bus bar 4b which are formed as connecting contacts and comprise at least one bus bar section (shall be described later), exposed at least in part between plastic-bonded magnetic cores 5b or 7b and a contact region 8b or 10b, which can further be adapted for the electrical connection to e.g. a capacitor (not shown).

[0064] In specific illustrative examples, as shown in FIG. 2b, contact regions 8b and 10b comprise through-holes which pass through bus bar 4b at least in part and are adapted to receive a screw member to enable the mechanical and electrical coupling of contact regions 8b and 10b by way of the screw member (not shown) to further bus bars and/or electrical and/or electronic components. Additionally or alternatively, contact regions 8b and 10b can comprise further elements (not shown) which are configured to connect bus bar 4b to further bus bars (not shown) and/or electrical and/or electronic components (not shown), for example by way of a plug connection, a crimp connection and the like.

[0065] Inductive component 1b shown schematically in FIG. 2b has a width dimension Bb, a length dimension Lb and a height dimension Hb. According to illustrative examples, the length dimension Lb can be 1 cm, preferably be in a range between 3 and 6 cm, for example, in a range between 3.5 and 5 cm, for example at 4 cm±0.5 cm. According to illustrative examples, the width dimension Bb can be ≥1 cm, preferably be in a range between 3 and 6 cm, for example in a range between 3.5 and 5 cm, for example at 4 cm±0.5 cm. According to illustrative examples, the height dimension Hb is greater than or equal to 1 cm, and can fulfill the relationship: Hb<Lb+Bb. According to specific examples herein, it can be true that Hb<max (Lb; Bb) (“Hb is less than the larger of Lb and Bb”).

[0066] The inductive component 1 b, which is shown schematically in FIG. 2b, can be formed as follows. In the beginning, bus bar 4b is provided. According to illustrative examples, bus bar 4b can be selected corresponding to an installation space into which inductive component 1b is to be installed. Additionally or alternatively, bus bar 4b can be selected according to the inductive properties that inductive component 2b has to exhibit, for example, a length of bus bar 4b in a non-deformed state (a length parallel to the length dimension Lb and/or a width dimension of bus bar 4b (a width parallel to the width dimension Bb in FIG. 2b) according to an available installation space and/or the inductive properties of inductive component 1b to be set.

[0067] Thereafter, selected bus bar 4b is subjected to deformation to define a shape of bus bar 4b that can depend on available installation space and/or that can exhibit specific connection geometries. For example, a shape of the bus bar determined by an installation situation in a terminal can require that the deformation of the non-deformed initial bus bar is to occur in accordance with the particular shape and that e.g. sections bent to a U-shape are to be formed, that connection conditions or connection geometries must be fulfilled and/or that the bus bar is to be fitted in a predetermined installation space It is also conceivable that a deformation of the selected bus bar can depend on inductive properties that inductive component 1b has to exhibit. For example, the bus bar can be bent such that inductive component 1b can be fitted in an available installation space. For example, several U-shaped sections, for example in serpentine form, can be formed between contact regions 8b and 10b in bus bar 4b (not shown in FIG. 2b). But more complex shapes or geometries of bus bar 4b are also conceivable. Depending on a specific installation situation or connection geometry, it is also possible in further illustrative examples, which are not shown, that several U-shaped sections, for example in serpentine form, can be formed between contact regions 8b and 10b of bus bar 4b. However, more complex shapes or geometries of bus bar 4b are also conceivable in order to adapt the bus bar to predetermined connections depending on the application, e.g. connect two terminals at a given length of the bus bar, and/or provide procedural manufacturability. Due to these factors, complex bus bar shapes can arise that can be easily populated with plastic-bonded magnetic cores according to the present method, as shall be discussed below.

[0068] Thereafter, plastic-bonded magnetic cores 5b, 6b and 7b are formed on bus bar 4b. For example, plastic-bonded magnetic cores 5b, 6b and 7b can be formed by insert molding bus bar 4b with plastic ferrite material or generally material comprising a plastic matrix with magnetically-conductive particles embedded therein. Alternatively, plastic-bonded magnetic cores 5b, 6b and 7b can be formed by potting bus bar 4b in sections with a potting material, where the potting material comprises a plastic matrix with magnetically-conductive particles embedded therein. This is no restriction of the present invention, but some plastic-bonded magnetic cores can also be formed by insert molding, while other plastic-bonded magnetic cores are formed by potting.

[0069] Thereafter, respectively obtained bus bar 4b with the plastic-bonded magnetic cores 5b, 6b and 7b can be attached to a carrier 2b (for example, a plastic carrier or a printed circuit board).

[0070] Additionally or alternatively, bus bar 4b with plastic-bonded magnetic cores 5b, 6b and 7b can be accommodated in a housing, provided that bus bar 4b has not already been arranged in a housing for the production of plastic-bonded magnetic cores 5b, 6b and 7b.

[0071] Further illustrative embodiments of the present invention shall now be described with reference to FIG. 3.

[0072] FIG. 3 schematically illustrates a top view onto an inductive component 100 which comprises a housing 101 and a bus bar 104 arranged at least in part in the housing. As shown in FIG. 3, the bus bar can extend into the housing and contact ends 108 and 110 with suitably formed contact regions (not shown) can protrude out of housing 101 to form connecting contacts of bus bar 104.

[0073] This is no restriction of the present invention, and bus bar 104 can alternatively be completely accommodated in housing 101 (not shown)

[0074] Housing 101 comprises housing sections A1, A2, A3, A4 and A5 which are separate from one another. The number of separate housing sections is arbitrary and can be suitably selected according to an intended application. In the example of the embodiment illustrated in FIG. 4, five housing sections A1 to A5 are formed by partition walls TW1, TW2, TW3 and TW4 formed in the housing. This is no restriction and housing sections within housing 101 can be provided in any manner by way of suitable partition walls. Although partition walls TW1 to TW4 are shown as extending parallel to side walls of housing 101, this is no restriction of the invention and partition walls of any shape, in particular curved partition walls, can also be provided instead of planar partition walls.

[0075] Provided in partition walls TW1 to TW4 are recesses (not shown) for receiving bus bar 104 which extends through these recesses (not shown), so that bus bar 104 passes through the various housing sections Al to A5. The recesses (not shown) in partition walls TW1 to TW4 can be formed in partition walls TW1 to TW4 according to a shape of bus bar 104 (obtained after a deforming process, as previously described with respect to FIGS. 2a and 2b). Preferably, the recesses and bus bar 104 can be matched to one another in such a way that adjacent housing sections are sealed, despite the recesses, against a potting material by way of bus bar 104 extending in the recesses. This means that when filling potting material into a housing section, preferably no potting material exits through the recess when bus bar 104 is inserted into the recess. A polyamide, PPS or duroplastic material, such as epoxy resin, can be used as the potting material, which can be mixed with an iron powder, a powder of an iron alloy (e.g., FeSi, NiFe, FeStAl, etc.), a ferrite powder and/or a powder of magnetic rare earth materials, e.g. NdFeB, which provides magnetic particles in the potting material.

[0076] By potting individual housing sections, housing sections A2 and A4 in the example in the illustration in FIG. 3 are potted by way of a potting material comprising a plastic matrix with magnetic particles embedded therein, plastic-bonded magnetic cores can be provided in sections over bus bar 104, such as plastic-bonded magnetic cores 106a and 106b in the illustration of FIG. 3. In order to provide a desired inductance of plastic-bonded magnetic cores 106a and 106b, a suitable shape of bus bar 104 can be provided in housing sections A2 and A4, for example, for setting a certain length of bus bar 104 extending in housing sections A2 and A4 which affects the inductance of plastic-bonded magnetic core 106a for housing section A2 and of plastic-bonded magnetic core 106b for the housing section A4. It is also additionally or alternatively conceivable, to set a desired capacitance value, for example according to a U-shaped section, such as is illustrated e.g. for housing section A4 in FIG. 3, and/or, depending on the application, to adapt bus bar 104 to predetermined terminals, e.g. to connect two terminals at a given length of bus bar 104, and/or to provide process engineering manufacturability. Due to these factors, complex shapes of bus bar 104 can arise which can be easily populated with plastic-bonded magnetic cores, as shall be discussed below.

[0077] According to some illustrative embodiments, bus bar 104 in housing section A1 is electrically connected between contact end 108 and plastic-bonded magnetic core 106a by way of a contact point 112a to a capacitance 113a that can be accommodated in housing section A1. Capacitance 113a, e.g. a capacitor, accommodated in housing section A1 can further be connected by way of a contact point Ma to a ground line outside housing 101. This is no restriction of the present invention, and capacitance 113a can instead also be provided outside housing 101.

[0078] According to some illustrative embodiments, bus bar 104 in housing section A3 is electrically connected between contact end 106a and plastic-bonded magnetic core 106b by way of a contact point 112b to a capacitance 113b, e.g. a capacitor that can be accommodated in housing section A3. Capacitance 113b accommodated in housing section A3 can further be connected by way of a contact point Mb to a ground line outside housing 101. This is no restriction of the present invention, and capacitance 113b can instead also be provided outside housing 101.

[0079] According to some illustrative embodiments, bus bar 104 in housing section A5 is electrically connected between contact end 110 and plastic-bonded magnetic core 106b by way of a contact point 112c to a capacitance 113a that can be accommodated in housing section A5. Capacitance 113c, e.g. a capacitor, accommodated in housing section A5 can further be connected by way of a contact point Mc to a ground line outside housing 101. This is no restriction of the present invention, and capacitance 113c can instead also be provided outside housing 101.

[0080] According to illustrative embodiments, capacitances 113a, 113b, and 113c can be provided as discrete electrical components respectively accommodated in housing sections A1, A3, and A5. Alternatively, capacitances 113a, 113b and 113c can be provided in a printed circuit board (not shown) or connected to a printed circuit board (not shown), where the printed circuit board (not shown) can represent a base C of housing 101 (not shown) or be arranged on the base (not shown) of housing 101, respectively.

[0081] An illustrative method for producing an inductive component according to the present invention shall now be described with reference to FIG. 4. In a step S1, a bus bar is provided. The bus bar can be provided in step S1 as explained, for example, with respect to FIG. 2a above. The bus bar provided in step S1 has preferably been subjected to deformation prior to step S1 so that the bus bar provided in step S1 has a desired shape (e.g. for adaptation to an installation space in which the bus bar is to be provided, and/or for setting desired electrical properties).

[0082] Thereafter, in a step S2, at least one plastic-bonded magnetic core can be formed which is formed according to illustrative embodiments along a section of the bus bar and surrounds the bus bar at least in part in that section.

[0083] According to specific illustrative examples herein, the at least one plastic-bonded magnetic core can be formed in step S2 by insert molding the bus bar with a plastic ferrite material, or generally by insert molding the bus bar with a plastic material having magnetically-conductive particles embedded therein.

[0084] According to alternative examples herein, the bus bar can be arranged at least in part in a housing between step S1 and step S2. In step S2, the at least one plastic-bonded magnetic core can then be formed by potting the bus bar in the housing at least in sections with a plastic ferrite material or generally a plastic material with magnetically-conductive particles embedded therein. An example of a plastic matrix is thermoplastic materials. According to specific illustrative examples of the invention, polyamides, PPS or duroplastic material, such as epoxy resins, can be used as matrix material for plastic-bonded magnetic cores. The magnetically-conductive particles can be formed from an iron powder, a powder of an iron alloy (e.g., FeSi, NiFe, FeSiAl, etc.), a ferrite powder and/or a powder of magnetic rare earth materials, e.g. NdFeB.

[0085] Alternatively, a magnetic core can be formed from magnetic cement in that housing sections are potted with the magnetic cement and the magnetic cement cures.

[0086] The bus bar with the at least one plastic-bonded magnetic core is subsequently attached and/or electrically connected to a carrier material, such as a plastic carrier or a printed circuit board.

[0087] In specific illustrative embodiments of the present invention, as explained above with reference to FIGS. 2a, 2b, 3 and 4, a high-current filter can be provided by coupling the inductive component to capacitances, as has been explained above according to the circuit diagram of FIG. 1. A correspondingly formed high-current filter can represent a first-order or higher-order filter, as generally illustrated with respect to FIG. 1.

[0088] The inductive component can be provided, for example, in a filter module to filter differential mode noise. According to a suitable deformation of the provided bus bar, also complex bus bar geometries can there be used, since the plastic-bonded magnetic cores provide no restriction of the bus bar shape as compared to known solutions with magnetic cores, which are provided for example by folding ferrites that are folded around or snapped around bus bars, a plastic-bonded magnetic core, as described above with respect to the illustrative embodiments, can better utilize a given space than discrete cores. Filter modules can therefore be manufactured also for compact installation spaces. Manufacturing processes can there be automated or can comprise automated injection-molding processes or potting processes. In processes, in which plastic-bonded magnetic cores are produced by potting, additional fixation of the bus bar by additional components is dispensed with.

[0089] the industrial production is improved in this regard due to the foregoing advantages and the great freedom in the design of the bus bar, since there are no restrictions on the design of the bus bar by the requirements in terms of the installability of inductive components.

[0090] In specific illustrative embodiments of the present invention, almost entire insert molding of a bus bar can take place for high-current filters with very large cross-sections, where only regions can be excluded to which further components, for example, capacitances, are connected. Alternatively, the almost entire potting of the bus bar can take place instead of the almost entire plastic ferrite insert molding, where an additional mechanical protection of the assembly can be provided by the potting.

[0091] inductances of the plastic-bonded magnetic cores are easily adjustable in a large inductance range by way of the plastic-bonded magnetic cores, for example in a range from 10 nH to 200 nH, preferably in the range from 40 nH to 90 nH or in a range from 150 nH to 300 nH.

[0092] Plastic-bonded magnetic cores have been describe above with reference to FIGS. 1 to 3 in which magnetically-conductive particles are embedded in a plastic matrix. This is no restriction of the present invention and magnetically conductive particles can instead also be provided embedded in a cement matrix (so-called magnetic cement or “magment”). The term “plastic-bonded core” in the description for FIGS. 1 to 3 should therefore alternatively also comprise magnetic cement, where dimensions of magnetic cores are in a range greater than 0.5 m, in particular in the range of at least 1 m.