RFID ELECTRONIC TAG AND PROCESSING METHOD

Abstract

Disclosed is an RFID electronic tag and a method for process the RFID electronic tag, the RFID electronic tag comprises a substrate, antennas and a RF module which are soldered on the substrate, wherein each end of the substrate is formed a U-shaped groove, welding pads where the antennas are soldered are respectively provided on the substrate adjacent to both sides of each U-shaped groove, the U-shaped grooves are used to clamp the antennas and the antennas are fixed on the substrate by welding. The beneficial effect of the invention is to reduce the overall thickness of the RFID electronic tag equivalent to the thickness of the diameter of the antenna and lower the risk of occurrence of bubble in package process.

Claims

1. An RFID electronic tag including: a substrate; an RF module and antennas which are soldered on the substrate, wherein, each end of the substrate is formed a U-shaped groove configured to arrange one of the antennas; welding pads where the antennas are soldered are respectively provided on the substrate adjacent to both sides of each U-shaped groove.

2. The RFID electronic tag of claim 1, wherein the width of the U-shaped groove is greater than or equal to the width of the antenna.

3. The RFID electronic tag of claim 1, wherein the pitch of a section of the antenna in the U-shaped groove is smaller than or equal to the pitch of a section of the antenna out of the U-shaped groove.

4. An RFID electronic tag processing method, comprising: 1) applying solder paste: applying solder paste on a printed substrate; 2) placing chip: mounting on a chip by SMT equipment, namely a RF module is being directly mounted on the surface of the substrate; 3) arranging antenna: placing an antenna above a U-shaped groove and pressing the antenna down to the U-shaped groove of the substrate; 4) soldering: welding the RF module and the antennas on the substrate by wave soldering or reflow soldering.

5. The RFID electronic tag processing method of claim 4, wherein in Step 3), an antenna is being placed at a side end of a U-shaped groove of the substrate and the antenna is being pushed into the U-shaped groove from the side end of the U-shaped groove.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1 is a plan view of an RFID electronic tag in accordance with one or more embodiments of the invention;

[0022] FIG. 2 is a front view of an RFID electronic tag in accordance with one or more embodiments of the invention;

[0023] FIG. 3 is a schematic structural diagram of an RFID electronic tag a prior art;

[0024] FIG. 4 is a schematic structural diagram of an RFID electronic tag before welding in accordance with one or more embodiments of the invention;

[0025] In those figures, 1: Substrate; 2: Radio frequency module; 3: Antenna; 5: Connection Area between Antenna and Radio Frequency Module; 6: U-shaped Groove.

DETAILED DESCRIPTION

[0026] FIG. 1 is a plan view of an RFID electronic tag in accordance with one or more embodiments of the invention. The RFID electronic tag includes a substrate 1, an RF module 2 and antennas 3 soldered on the substrate 1. Each end of the substrate 1 is formed a U-shaped groove 6 configured to arrange an antenna 3. Welding pads where the antennas 3 are soldered are respectively provided on the substrate 1 adjacent to both sides of each U-shaped groove 6. The width of the U-shaped groove 6 is greater than or equal to the width of the antenna 3. The pitch of a section of each antenna in the U-shaped groove is smaller than or equal to the pitch of a section of each antenna out of the U-shaped groove, which is shown in FIG. 2 and FIG. 4.

[0027] An RFID electronic tag processing method, comprising: [0028] 1) applying solder paste: applying solder paste on a printed substrate; [0029] 2) placing chip: mounting on a chip by SMT equipment, that is to say, a RF module is being directly mounted on the surface of the substrate; [0030] 3) arranging antenna: placing one antenna above a U-shaped groove and pressing the antenna down to the U-shaped groove of the substrate; [0031] 4) soldering: welding the RF module and the antennas on the substrate by wave soldering or reflow soldering

[0032] Additionally, in Step 3), an antenna could be placed in a U-shaped groove by pushing from one side; specifically, an antenna is being placed at a side end of a U-shaped groove of the substrate and the antenna is being pushed into the U-shaped groove from the side end of the U-shaped groove.

[0033] FIG. 2 shows the connection of an RFID electronic tag of the present invention and FIG. 3 shows the connection of an RFID electronic tag of the prior art. The two figures clearly indicate that the thickness of a connection area between an antenna and an RF module of the present invention, namely the thickness after welding, is significantly smaller than the thickness of a connection area between an antenna and an RF module of the prior art, the thickness reduced is equivalent to the thickness of a substrate.