Method of manufacturing a bendable substrate coated with a coating layer of adjacent heterogeneous coatings bonded along boundaries thereof useful for foldable displays
11130703 · 2021-09-28
Assignee
Inventors
Cpc classification
C08G77/14
CHEMISTRY; METALLURGY
C08L83/06
CHEMISTRY; METALLURGY
C08L83/06
CHEMISTRY; METALLURGY
C03C17/007
CHEMISTRY; METALLURGY
C08K5/0025
CHEMISTRY; METALLURGY
C09D183/06
CHEMISTRY; METALLURGY
C03C2217/78
CHEMISTRY; METALLURGY
International classification
Abstract
Disclosed herein are a method of manufacturing a heterogeneous coating solution bonded coating layer, and a coating layer and a cover window produced thereby. More particularly, there are provided a method of manufacturing a heterogeneous coating solution bonded coating layer, in which a step difference at the boundary between different types of coating solutions is controllable by controlling a difference in capillary number during discharge of the different types of coating solutions using a slot die coater, and a coating layer and a cover window produced thereby. Therefore, the method of manufacturing a heterogeneous coating solution bonded coating layer can produce a cover window that is excellent in all the properties including durability, optical characteristics, and flexibility.
Claims
1. A method of manufacturing a substrate which is a coated substrate that is bendable and that includes heterogeneous coatings disposed side-by-side on the substrate adjacent to one another that are bonded to one another along respective boundaries thereof, the method comprising: providing a substrate that is bendable; preparing a rigid coating solution and a flexible coating solution including respective diluents, having respective capillary numbers, and having a controlled difference in capillary numbers of 10% or less; simultaneously discharging the rigid coating solution and the flexible coating solution through respective outlets of a slot die coater to coat the discharged rigid coating solution and the discharged flexible coating solution onto respective adjacent regions of the substrate to form at least one rigid coating and at least one flexible coating; and curing to form said heterogeneous coatings that are disposed side-by-side on the substrate and that are bonded to one another along respective boundaries thereof to facilitate crack-free bendability of the coated substrate, wherein the controlled difference in capillary numbers of 10% or less provides respective coating thicknesses having minimal step differences between the heterogeneous coatings.
2. The method according to claim 1, wherein the rigid coating solution comprises: from 48 wt % to 94 wt % of an organic flexible compound and an inorganic rigid compound present in a weight ratio of the organic flexible compound to the inorganic rigid compound ranging from 90:10 to 50:50; from 1 wt % to 2 wt % of a photoinitiator; and from 5 wt % to 50 wt % of a diluent.
3. The method according to claim 1, wherein the flexible coating solution comprises: from 48 wt % to 94 wt % of an organic flexible compound and an inorganic rigid compound present in a weight ratio of the organic flexible compound to the inorganic rigid compound ranging from 100:0 to 60:40; from 1 wt % to 2 wt % of a photoinitiator; and from 5 wt % to 50 wt % of a diluent.
4. The method according to claim 2 or 3, wherein the organic flexible compound comprises a photocurable resin or a thermosetting resin.
5. The method according to claim 2 or 3, wherein the inorganic rigid compound comprises an epoxy-polyhedral oligomeric silsesquioxane (POSS) composite.
6. The method according to claim 2 or 3, wherein the photoinitiator comprises a photoacid generator (PAG) selected from the group consisting of a triphenylsulfonium triflate salt, a triarylsulfonium hexafluorophosphate salt, a diphenyliodonium nitrite salt, a diphenyliodonium hexafluorophosphate salt, a triphenylsulfonium fluoro-1-butanesulfonate salt, and combinations thereof.
7. The method according to claim 2 or 3, wherein the respective diluents comprise a hydrocarbon-based organic solvent, an alcohol-based organic solvent, an aldehyde-based organic solvent, a ketone-based organic solvent, an ether-based organic solvent, or an ester-based organic solvent.
8. The method according to claim 1, wherein the rigid coating solution and the flexible coating solution each have a capillary number which is defined by Equation 1 below:
9. The method according to claim 1, wherein coating the discharged rigid coating solution and the discharged flexible coating solution comprises: coating the discharged flexible coating solution on a first region, which is a center portion of the substrate; and coating the discharged rigid coating solution on a second region and on a third region, which are respective peripheries adjacent to both sides of the first region of the substrate.
10. The method according to claim 9, wherein the step difference at the boundary between the first region and the second region or between the first region and the third region is controlled.
11. A method of manufacturing a substrate which is a coated substrate that is bendable and that includes heterogeneous coatings disposed on the substrate adjacent to one another that are bonded to one another along respective boundaries thereof, the method comprising: providing a substrate that is bendable; preparing a rigid coating solution comprised of an inorganic rigid compound comprising an epoxy-polyhedral oligomeric silsesquioxane (POSS) composite, and a diluent; and a flexible coating solution comprised of an organic flexible compound comprising a photocurable resin and a photoinitiator or a thermosetting resin, and a diluent; controlling a difference in capillary numbers between the rigid coating solution and the flexible coating solution to 5% or less; simultaneously discharging the rigid coating solution and the flexible coating solution through respective outlets of a slot die coater to coat the discharged rigid coating solution and the discharged flexible coating solution onto respective adjacent regions of the substrate to form at least one rigid coating and at least one flexible coating; and curing the at least one rigid coating and the at least one flexible coating to remove respective diluents and either thermoset the thermosetting resin or irradiate the photocurable resin of the flexible coating to provide said heterogeneous coatings that are bonded to one another along respective boundaries thereof to facilitate crack-free bendability of the coated substrate, wherein the difference in capillary numbers of 5% or less provides respective coating thicknesses having minimal step differences between the heterogeneous coatings.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
(12) Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. For a clear explanation of the present invention, parts irrelevant to the description may be omitted in the drawings, and like reference numerals refer to like parts throughout the specification.
(13) In the whole specification, it will be understood that when an element is referred to as being “connected (joined, contacted, or coupled)” to another element, it can be “directly connected” to the other element or it can be “indirectly connected” to the other element with other elements being interposed therebetween. In addition, it will be understood that when a component is referred to as “comprising or including” any component, it does not exclude other components, but can further comprise or include the other components unless otherwise specified.
(14) The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in the disclosure and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless context clearly indicates otherwise. It will be further understood that the terms “comprises/includes” and/or “comprising/including” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
(15) Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
(16) Hereinafter, a method of manufacturing a heterogeneous coating solution bonded coating layer will be described.
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(18) First, in the heterogeneous coating solution preparation step of preparing a rigid coating solution and a flexible coating solution (S100), the coating solutions are different types of coating solutions and may be a rigid coating solution having rigid properties and a flexible coating solution having flexible properties in the present invention.
(19) In an embodiment of the present invention, the rigid coating solution may include 48 wt % to 94 wt % of organic flexible and inorganic rigid compounds, 1 wt % to 2 wt % of a photoinitiator, and 5 wt % to 50 wt % of a diluent.
(20) The inorganic rigid compound is a component for exhibiting rigid properties as a main property of the rigid coating solution, and specifically may be an epoxy-polyhedral oligomeric silsesquioxane (POSS) composite.
(21) The epoxy-POSS composite is a composite obtained by bonding an epoxy group to POSS, which is an inorganic silica compound having an organic substituent, and is known to exhibit various intermediate properties of polymeric materials and ceramics. Therefore, the epoxy-POSS composite can innovatively improve the required performance by mixing an epoxy compound with POSS through copolymerization or blending due to chemical properties with little or no change of existing mass production processes.
(22) The organic flexible compound may be composed of a photocurable resin or a thermosetting resin for curing the rigid coating solution. Specifically, the photocurable resin or thermosetting resin may be a phenol resin or an epoxy resin, but is not limited thereto.
(23) For example, the organic flexible compound may include 1,4-butanediol diglycidyl ether (BDGE).
(24) In an embodiment of the present invention, the weight ratio of the organic flexible compound to the inorganic rigid compound may be 90:10 to 50:50. If the amount of the inorganic rigid compound is less than 10 wt % based on the total weight of the compound, it is difficult to exhibit the rigid properties of the rigid coating solution. If the amount of the inorganic rigid compound is more than 50 wt % based on the total weight of the compound, it is not preferable since, due to an excess amount of inorganic rigid compound, the reaction rate is lowered and the curing is not progressed when the heterogeneous coating solution bonded coating layer is produced later.
(25) In an embodiment of the present invention, the amount of the organic flexible and inorganic rigid compounds is a remaining amount excluding the amount of the photoinitiator and the diluent, which will be described later, based on the total weight of the rigid coating solution, and the amount of the organic flexible and inorganic rigid compounds is preferably 48 wt % to 94 wt %.
(26) The photoinitiator in the rigid coating solution of the present invention functions to induce polymerization by absorbing ultraviolet rays or thermal energy to generate free radicals or cations in an ultraviolet or thermal curing process in the heterogeneous coating solution coating step S300 to be described later. The photoinitiator may include at least one selected from the group of photoacid generators (PAGs) consisting of triphenylsulfonium triflate salt, triarylsulfonium hexafluorophosphate salt, diphenyliodonium nitrite salt, diphenyliodonium hexafluorophosphate salt, and triphenylsulfonium fluoro-1-butanesulfonate salt, but the present invention is not limited thereto.
(27) For example, the photoinitiator in the rigid coating solution of the present invention may be IRGACURE PAG 103, IRGACURE PAG 121, IRGACURE PAG 203, IRGACURE PAG 290, IRGACURE 250, CGI 725, CGI1907, or GSID26-1.
(28) The amount of the photoinitiator in the rigid coating solution of the present invention may be 1 wt % to 2 wt %. If the amount of the photoinitiator is less than 1 wt %, it is difficult to exhibit sufficient hardness due to slow reaction. If the amount of the photoinitiator is more than 2 wt %, it is not preferable since the color of the heterogeneous coating solution bonded coating layer to be produced later is changed and the transparency thereof is lowered.
(29) The diluent in the rigid coating solution of the present invention may be used as a solvent for controlling the viscosity of the rigid coating solution in the process of mixing the organic flexible compound, the inorganic rigid compound, and the photoinitiator to produce the rigid coating solution. Besides, the diluent may enhance adhesion, reactivity, chemical resistance, and wear resistance, and impart functions such as antistatic properties to the heterogeneous coating solution bonded coating layer to be produced later. The diluent may be a solvent in a form of an organic solvent, and specifically may be a hydrocarbon-based organic solvent, an alcohol-based organic solvent, an aldehyde-based organic solvent, a ketone-based organic solvent, an ether-based organic solvent, or an ester-based organic solvent. More preferably, methyl ethyl ketone (MEK) or acetone, which has a low boiling point and somewhat low toxicity, may be suitable for the diluent.
(30) For example, the diluent in the rigid coating solution of the present invention may be methyl ethyl ketone, acetone, isopropyl alcohol, toluene, ethyl ether, or ethyl acetate.
(31) Preferably, the amount of the diluent in the rigid coating solution of the present invention is 5 wt % to 50 wt %. If the amount of the diluent is less than 5 wt %, it is not preferable since the viscosity of the rigid coating solution is excessively increased and the smoothness of the heterogeneous coating solution bonded coating layer to be produced later is lowered. If the amount of the diluent is more than 50 wt %, it is not preferable since the hardness of the coating layer is decreased.
(32) In an embodiment of the present invention, the flexible coating solution may include 48 wt % to 94 wt % of organic flexible and inorganic rigid compounds, 1 wt % to 2 wt % of a photoinitiator, and 5 wt % to 50 wt % of a diluent.
(33) The organic flexible compound is a main component of the flexible coating solution for exhibiting flexible properties as a main property of the flexible coating solution, and may be composed of a photocurable resin or a thermosetting resin for curing the heterogeneous coating solution bonded coating layer to be produced later. Specifically, the photocurable resin or thermosetting resin may be a phenol resin or an epoxy resin, but is not limited thereto.
(34) For example, the organic flexible compound may include 1,4-butanediol diglycidyl ether (BDGE).
(35) In addition, the inorganic rigid compound may be a material that improves dispersion of the organic flexible compound, and the inorganic rigid compound may include an epoxy-polyhedral oligomeric silsesquioxane (POSS) composite.
(36) In an embodiment of the present invention, the weight ratio of the organic flexible compound to the inorganic rigid compound may be 100:0 to 60:40. The inorganic rigid compound may be excluded from the flexible coating solution, as long as the organic flexible compound can be sufficiently dispersed in the flexible coating solution even when the inorganic rigid compound is excluded therefrom. If the amount of the organic flexible compound is less than 60 wt % based on the total weight of the compound, it is not preferable as it is difficult to exhibit the flexible properties of the flexible coating solution.
(37) In an embodiment of the present invention, the amount of the organic flexible and inorganic rigid compounds is a remaining amount excluding the amount of the photoinitiator and the diluent, which will be described later, based on the total weight of the flexible coating solution, and the amount of the organic flexible and inorganic rigid compounds is preferably 48 wt % to 94 wt %.
(38) The photoinitiator in the flexible coating solution of the present invention functions to induce polymerization by absorbing ultraviolet rays or thermal energy to generate cations in an ultraviolet or thermal curing process in the heterogeneous coating solution coating step S300 to be described later. The photoinitiator may include at least one selected from the group of photoacid generators (PAGs) consisting of triphenylsulfonium triflate salt, triarylsulfonium hexafluorophosphate salt, diphenyliodonium nitrite salt, diphenyliodonium hexafluorophosphate salt, and triphenylsulfonium fluoro-1-butanesulfonate salt, but the present invention is not limited thereto.
(39) For example, the photoinitiator in the flexible coating solution of the present invention may be IRGACURE PAG 103, IRGACURE PAG 121, IRGACURE PAG 203, IRGACURE PAG 290, IRGACURE 250, CGI 725, CGI1907, or GSID26-1.
(40) The amount of the photoinitiator in the flexible coating solution of the present invention may be 1 wt % to 2 wt %. If the amount of the photoinitiator is less than 1 wt %, it is difficult to exhibit sufficient hardness due to slow reaction. If the amount of the photoinitiator is more than 2 wt %, it is not preferable since the color of the heterogeneous coating solution bonded coating layer to be produced later is changed and the transparency thereof is lowered.
(41) The diluent in the flexible coating solution of the present invention may be used as a solvent for controlling the viscosity of the flexible coating solution in the process of mixing the organic flexible compound, the inorganic rigid compound, and the photoinitiator to produce the flexible coating solution. Besides, the diluent may enhance adhesion, reactivity, chemical resistance, and wear resistance, and impart functions such as antistatic properties to the heterogeneous coating solution bonded coating layer to be produced later. The diluent may be a solvent in a form of an organic solvent, and specifically may be a hydrocarbon-based organic solvent, an alcohol-based organic solvent, an aldehyde-based organic solvent, a ketone-based organic solvent, an ether-based organic solvent, or an ester-based organic solvent. More preferably, methyl ethyl ketone (MEK) or acetone, which has a low boiling point and somewhat low toxicity, may be suitable for the diluent.
(42) For example, the diluent in the flexible coating solution of the present invention may be methyl ethyl ketone, acetone, isopropyl alcohol, toluene, ethyl ether, or ethyl acetate.
(43) Preferably, the amount of the diluent in the flexible coating solution of the present invention is 5 wt % to 50 wt %. If the amount of the diluent is less than 5 wt %, it is not preferable since the viscosity of the flexible coating solution is excessively increased and the smoothness of the heterogeneous coating solution bonded coating layer to be produced later is lowered. If the amount of the diluent is more than 50 wt %, it is not preferable since the hardness of the coating layer is decreased.
(44) Next, in the heterogeneous coating solution discharge step of simultaneously discharging the rigid coating solution and the flexible coating solution through respective outlets of a slot die coater (S200), the difference in capillary number between the rigid coating solution and the flexible coating solution can be controlled.
(45) Slot die coating is a coating method of uniformly applying flowable coating solutions supplied between machined molds by flowing in a slot die by a non-pulsating pump or a piston pump, which may be used for the method of manufacturing a heterogeneous coating solution bonded coating layer in the present invention.
(46) When the different types of coating solutions are simultaneously discharged using the slot die coater, due to the difference in coating solution properties, a different discharge behavior occur at the boundary between the different types of coating solutions and thus a step difference occur at the boundary. Hence, it may be difficult to control the coating layer that is intended to be produced to a uniform thickness.
(47) Accordingly, the difference in capillary number between the rigid coating solution and the flexible coating solution is controlled to control the discharge behavior between the different types of coating solutions in the present invention. The capillary number may be defined by the following Equation 1:
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(49) where C.sub.a is the capillary number, μ is the viscosity of the coating solution, V is the flow rate of the coating solution, and σ is the surface tension of the coating solution.
(50) According to Equation 1, the capillary number may be controlled by the flow rate of the coating solution, the viscosity of the coating solution, or the surface tension of the coating solution, and the discharge behavior when the rigid and flexible coating solutions are discharged from the slot die coater may be defined in proportion to the capillary number. Therefore, the smaller the difference in capillary number between the rigid coating solution and the flexible coating solution, the smaller the difference in discharge behavior when the rigid and flexible coating solutions are discharged from the slot die coater, thereby enabling the step difference between the rigid coating solution and the flexible coating solution to be controlled.
(51) In an embodiment of the present invention, the difference in capillary number may be 10% or less, more preferably 5% or less. If the difference in capillary number between the rigid coating solution and the flexible coating solution is more than 5%, it is not preferable since a step difference may occur at the boundary between the rigid coating solution and the flexible coating solution.
(52) Finally, in the heterogeneous coating solution coating step of coating the discharged rigid and flexible coating solutions on respective regions on a substrate to form a heterogeneous coating solution bonded coating layer (S300), the step difference on the heterogeneous coating solution bonded coating layer due to the rigid and flexible coating solutions discharged from the slot die coater can be controlled by controlling the difference in capillary number.
(53) In an embodiment of the present invention, the substrate may be made of glass, tempered glass, polyethyleneterephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), or polyethersulfone (PES), but is not limited thereto.
(54) In an embodiment of the present invention, the heterogeneous coating solution coating step S300 may include a step of coating the discharged flexible coating solution on a first region, which is the center on the substrate, and coating the discharged rigid coating solution on second and third regions, which are the peripheries adjacent to both sides of the first region on the substrate.
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(57) Hereinafter, a heterogeneous coating solution bonded coating layer produced by the method of manufacturing a heterogeneous coating solution bonded coating layer will be described.
(58) The heterogeneous coating solution bonded coating layer is a coating layer formed by simultaneously coating rigid and flexible coating solutions on respective regions using a slot die coater, and the coated rigid coating solution region and flexible coating solution region may be bonded at the boundary therebetween. In this case, the step difference at the boundary can be controlled by controlling the discharge behavior between the rigid coating solution and the flexible coating solution due to coating solution properties when the rigid and flexible coating solutions are discharged from the slot die coater, and the coating solution properties may be a difference in capillary number.
(59) The discharge behavior when the rigid and flexible coating solutions are discharged from the slot die coater may be defined in proportion to the capillary number. Therefore, the smaller the difference in capillary number between the rigid coating solution and the flexible coating solution, the smaller the difference in discharge behavior when the rigid and flexible coating solutions are discharged from the slot die coater, thereby enabling the step difference at the boundary therebetween to be controlled.
(60) Hereinafter, a cover window produced by the method of manufacturing a heterogeneous coating solution bonded coating layer will be described.
(61) The cover window is a protective window for protecting the inside of a foldable display. The cover window must have excellent flexibility at its folded portion since it should be transparent and excellent in durability and be foldable.
(62) The cover window of the present invention may have a hardness of 0.15 GPa to 0.9 GPa, a stiffness of 1.0 GPa to 2.8 GPa, and a pencil hardness of 1 F to 4 H, as illustrated in Experimental Examples 2 to 4 which will be described later. Therefore, the cover window is excellent in durability.
(63) In addition, the cover window of the present invention has a transmittance of about 84% to 87% when the cover window is irradiated with light of 550 nm, as illustrated in Experimental Example 5 which will be described later. Therefore, the transmittance of the cover window can be maintained while its durability is enhanced.
(64) In addition, the cover window of the present invention is excellent in flexibility since no cracks occur when the cover window is bent 50,000 times at a radius of curvature of 10 mm or less, and particularly no cracks occur even when the cover window is bent 50,000 times at a radius of curvature of 3 mm, as illustrated in Experimental Example 6 which will be described later.
(65) Hereinafter, production examples and experimental examples of the present invention will be described. However, these production examples and experimental examples are intended to explain the configuration and effect of the present invention in more detail, and the scope of the present invention is not limited thereto.
Production Example 1
(66) Production of Cover Window
(67) A rigid coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 5 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether and epoxy-POSS in a weight ratio of 90:10. A flexible coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 5 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether. The rigid and flexible coating solutions are injected into respective outlets of a slot die coater. The rigid and flexible coating solutions are discharged at a rate of 20 mm per second and simultaneously coated to a thickness of 50 μm on a polyethyleneterephthalate film having a thickness of 100 μm by operating the slot die coater at a coating rate of 15 mm per second. Then, a cover window is produced by exposing the coated film to a metal halide UV lamp (120 mW/cm.sup.2) for 15 minutes for photocuring to form a heterogeneous coating solution bonded coating layer.
Production Example 2
(68) A cover window is produced in the same manner as in Production Example 1, except that the methyl ethyl ketone content of the flexible coating solution is 6 wt %.
Production Example 3
(69) A cover window is produced in the same manner as in Production Example 1, except that the methyl ethyl ketone content of the flexible coating solution is 7 wt %.
Production Example 4
(70) A cover window is produced in the same manner as in Production Example 1, except that the methyl ethyl ketone content of the flexible coating solution is 8 wt %.
Production Example 5
(71) A cover window is produced in the same manner as in Production Example 1, except that the methyl ethyl ketone content of the flexible coating solution is 9 wt %.
Production Example 6
(72) A cover window is produced in the same manner as in Production Example 1, except that the methyl ethyl ketone content of the flexible coating solution is 10 wt %.
Production Example 7
(73) Production of Cover Window
(74) A rigid coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 25 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether and epoxy-POSS in a weight ratio of 70:30. A flexible coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 20 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether and epoxy-POSS in a weight ratio of 80:20. The rigid and flexible coating solutions are injected into respective outlets of a slot die coater. The rigid and flexible coating solutions are discharged at a rate of 20 mm per second and simultaneously coated to a thickness of 50 μm on a polyethyleneterephthalate film having a thickness of 100 μm by operating the slot die coater at a coating rate of 15 mm per second. Then, a cover window is produced by exposing the coated film to a metal halide UV lamp (120 mW/cm.sup.2) for 15 minutes for photocuring to form a heterogeneous coating solution bonded coating layer.
Production Example 8
(75) A cover window is produced in the same manner as in Production Example 7, except that the methyl ethyl ketone content of the flexible coating solution is 21 wt %.
Production Example 9
(76) A cover window is produced in the same manner as in Production Example 7, except that the methyl ethyl ketone content of the flexible coating solution is 22 wt %.
Production Example 10
(77) A cover window is produced in the same manner as in Production Example 7, except that the methyl ethyl ketone content of the flexible coating solution is 23 wt %.
Production Example 11
(78) A cover window is produced in the same manner as in Production Example 7, except that the methyl ethyl ketone content of the flexible coating solution is 24 wt %.
Production Example 12
(79) A cover window is produced in the same manner as in Production Example 7, except that the methyl ethyl ketone content of the flexible coating solution is 25 wt %.
Production Example 13
(80) Production of Cover Window
(81) A rigid coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 50 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether and epoxy-POSS in a weight ratio of 50:50. A flexible coating solution is prepared that includes 2 wt % of triarylsulfonium hexafluorophosphate salt, 45 wt % of methyl ethyl ketone, and a balance of 1,4-butanediol diglycidyl ether and epoxy-POSS in a weight ratio of 60:40. The rigid and flexible coating solutions are injected into respective outlets of a slot die coater. The rigid and flexible coating solutions are discharged at a rate of 20 mm per second and simultaneously coated to a thickness of 50 μm on a polyethyleneterephthalate film having a thickness of 100 μm by operating the slot die coater at a coating rate of 15 mm per second. Then, a cover window is produced by exposing the coated film to a metal halide UV lamp (120 mW/cm.sup.2) for 15 minutes for photocuring to form a heterogeneous coating solution bonded coating layer.
Production Example 14
(82) A cover window is produced in the same manner as in Production Example 13, except that the methyl ethyl ketone content of the flexible coating solution is 46 wt %.
Production Example 15
(83) A cover window is produced in the same manner as in Production Example 13, except that the methyl ethyl ketone content of the flexible coating solution is 47 wt %.
Production Example 16
(84) A cover window is produced in the same manner as in Production Example 13, except that the methyl ethyl ketone content of the flexible coating solution is 48 wt %.
Production Example 17
(85) A cover window is produced in the same manner as in Production Example 13, except that the methyl ethyl ketone content of the flexible coating solution is 49 wt %.
Production Example 18
(86) A cover window is produced in the same manner as in Production Example 13, except that the methyl ethyl ketone content of the flexible coating solution is 50 wt %.
Experimental Example 1
(87) Analysis of Step Difference on Heterogeneous Coating Solution Bonded Coating Layer in Relation to Difference in Capillary Number Between Rigid Coating Solution and Flexible Coating Solution
(88) In order to analyze the step difference on the heterogeneous coating solution bonded coating layer in relation to the difference in capillary number between rigid and flexible coating solutions at the time of discharging the rigid and flexible coating solutions from the slot die coater, the capillary number of each of the rigid and flexible coating solutions used in Production Examples 1 to 18 is calculated from the coating solution viscosity value and the coating solution surface tension value measured by the viscometer and the surface tension meter, and the coating solution discharge flow rate in the coater. The step differences on the heterogeneous coating solution bonded coating layers in Production Examples 1 to 18 are measured at a distance of 5 mm using the micrometer.
(89)
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(91) Based on these results, it can be determined that when the cover window coated with the heterogeneous coating solution bonded coating layer is produced, the smaller the difference in capillary number between the rigid coating solution and the flexible coating solution at the time of discharge from the slot die coater, the smaller the step difference at the boundary between the rigid coating solution coating region and the flexible coating solution coating region on the heterogeneous coating solution bonded coating layer. In addition, it can be determined that the refractive visibility of the cover window is improved by virtue of the reduction of the step difference at the boundary. Furthermore, it can be determined that the durability of the rigid coating solution coating region and the flexibility of the flexible coating solution coating region in the cover window are improved at the same time by virtue of the reduction of the step difference at the boundary. Based on the above description, the meanings of the graphs of
Experimental Example 2
(92) Analysis of Hardness of Cover Window in Relation to Inorganic Rigid Compound Content of Rigid Coating Solution
(93) In order to analyze the hardness of the cover window in relation to the inorganic rigid compound content of the rigid coating solution, the hardness of the cover window in each of Production Examples 4, 10, and 13 is analyzed using the nanoindentation measurement mode of the atomic force microscope (AFM).
(94)
Experimental Example 3
(95) Analysis of Stiffness of Cover Window in Relation to Inorganic Rigid Compound Content of Rigid Coating Solution
(96) In order to analyze the stiffness of the cover window in relation to the inorganic rigid compound content of the rigid coating solution, the stiffness of the cover window in each of Production Examples 4, 10, and 13 is analyzed using the nanoindentation measurement mode of the atomic force microscope (AFM).
(97)
Experimental Example 4
(98) Analysis of Pencil Hardness of Cover Window in Relation to Inorganic Rigid Compound Content of Rigid Coating Solution
(99) In order to analyze the pencil hardness of the cover window in relation to the inorganic rigid compound content of the rigid coating solution, the pencil hardness of the cover window in each of Production Examples 4, 10, and 13 is marked with hardness when the cover window is evaluated five times and then not scratched four times or more by pencils having hardness of their own after each pencil is fixed in a direction of 45° under a load of 500 g and the coating film is fixed on the glass such that the coating surface is directed toward the pencil.
(100)
Experimental Example 5
(101) Analysis of Transmittance of Cover Window in Relation to Inorganic Rigid Compound Content of Rigid Coating Solution
(102) In order to analyze the transmittance of the cover window in relation to the inorganic rigid compound content of the rigid coating solution, the transmittance of the cover window in a wavelength band of 405 nm or 550 nm in each of Production Examples 4, 10, and 13 is analyzed from the transmission spectrum through the UV spectrometer.
(103)
Experimental Example 6
(104) Analysis of Flexibility of Cover Window in Relation to Inorganic Rigid Compound Content of Rigid Coating Solution
(105) In order to analyze the flexibility of the cover window in relation to the inorganic rigid compound content of the rigid coating solution, after the radius of curvature of the cover window in each of Production Examples 4, 10, and 13 is set to 10 mm, 5 mm, or 3 mm, the cover window is repeatedly folded in half 50,000 times. The result is illustrated in the following Table 1.
(106) TABLE-US-00001 TABLE 1 Radius of Number of Production Production Production Curvature Repetitions Example 4 Example 10 Example 13 10 mm 50,000 No Cracks No Cracks No Cracks 5 mm 50,000 No Cracks No Cracks No Cracks 3 mm 50,000 No Cracks No Cracks No Cracks
(107) Referring to Table 1, when each cover window is repeatedly folded in half 50,000 times, it is seen that no cracks occur at the cover windows irrespective of all radii of curvature thereof in Production Examples 4, 10, and 13.
(108) Accordingly, in the cover window produced by the method of manufacturing a heterogeneous coating solution bonded coating layer according to the present invention, it can be determined that the smaller the difference in capillary number between the rigid coating solution and the flexible coating solution at the time of discharge from the slot die coater, the smaller the step difference at the boundary between the rigid coating solution and the flexible coating solution on the heterogeneous coating solution bonded coating layer. In addition, the method of manufacturing a heterogeneous coating solution bonded coating layer according to the present invention can be suitable to produce the cover window exhibiting excellent physical properties since the durability of the cover window increases but the optical characteristics and flexibility thereof are not deteriorated as the inorganic rigid compound content of the rigid coating solution increases.
(109) The above-mentioned embodiments of the present invention are merely examples, and it will be understood by those skilled in the art that various modifications may be made without departing from the spirit and scope or essential features of the invention. Therefore, it should be understood that the embodiments described above are for purposes of illustration only in all aspects and are not intended to limit the scope of the present invention. For example, each component described in a single form may be implemented in a distributed form, and similarly, components described in the distributed form may be implemented in a combined form.
(110) The scope of the present invention is defined by the appended claims, and it should be construed that all modifications or variations derived from the meaning, scope, and equivalent concept of the claims fall within the scope of the invention.
REFERENCE SIGNS LIST
(111) 10: slot die coater nozzle 20: flexible coating solution region of slot die coater nozzle 30: rigid coating solution region of slot die coater nozzle 40: first region 50: second region 60: third region 70: substrate 80: heterogeneous coating solution bonded coating layer