Multistage capacitive crosstalk compensation arrangement

Abstract

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Claims

1. A telecommunications jack for use in a twisted pair system, the jack comprising: a housing defining a port for receiving a plug; a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; a plurality of wire termination contacts for terminating wires to the jack; a circuit board including conductive tracks that electrically connect the contact springs to the wire termination contacts; and a crosstalk compensation arrangement that provides crosstalk compensation at the telecommunications jack, the crosstalk compensation arrangement including a capacitive coupling having first and second opposing capacitor plates, the first and second capacitor plates having different geometric shapes, wherein at least one of the first and second capacitor plates has a minor circular sector shape, and wherein the first capacitor plate is at a first conductive layer and the second capacitor plate is at a second conductive layer.

2. The telecommunications jack of claim 1, wherein at least one of the first and second capacitor plates has a circular arc shape.

3. The telecommunications jack of claim 2, wherein the circular arc shape has rounded ends.

4. The telecommunications jack of claim 1, wherein the first and second conductive layers are separated by a dielectric layer.

5. The telecommunications jack of claim 1, wherein the first capacitor plate has the minor circular sector shape and the second capacitor plate has a circular arc shape.

6. The telecommunications jack of claim 5, wherein the minor circular sector shape and the circular arc shape each include an inner edge and an outer edge that curve about a circle center line.

7. The telecommunications jack of claim 6, wherein a via of the circuit board is positioned at the circle center line.

8. The telecommunications jack of claim 7, wherein a stub of one of the contact springs is secured in the via.

9. The telecommunications jack of claim 7, wherein a stub of one of the contact springs is secured in the via.

10. The telecommunications jack of claim 5, wherein the circuit board includes first and second conductive layers separated by a dielectric layer, and wherein the first capacitor plate is at the first conductive layer and the second capacitor plate is at the second conductive layer.

11. The telecommunications jack of claim 1, wherein the first and second capacitor plates have different sizes.

12. A telecommunications jack for use in a twisted pair system, the jack comprising: a housing defining a port for receiving a plug; a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; a plurality of wire termination contacts for terminating wires to the jack; a circuit board including conductive tracks that electrically connect the contact springs to the wire termination contacts; and a crosstalk compensation arrangement that provides crosstalk compensation at the telecommunications jack, the crosstalk compensation arrangement including a capacitive coupling having first and second opposing capacitor plates, the first and second capacitor plates having different geometric shapes, wherein the first capacitor plate has a first geometric shape that is rectangular with a curved notch, and wherein the first capacitor plate is at a first conductive layer and the second capacitor plate is at a second conductive layer.

13. The telecommunications jack of claim 12, wherein the second capacitor plate has a second geometric shape that is rectangular without a curved notch.

14. The telecommunications jack of claim 13, wherein the circuit board includes a via that extends between conductive layers of the circuit board, and wherein an edge of the curved notch curves about the via.

15. A telecommunications jack for use in a twisted pair system, the jack comprising: a housing defining a port for receiving a plug; a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; a plurality of wire termination contacts for terminating wires to the jack; a circuit board including conductive tracks that electrically connect the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a dielectric laver, the circuit board also including via that extends between the first and second conductive layers; a crosstalk compensation arrangement that provides crosstalk compensation at the telecommunications jack, the crosstalk compensation arrangement including a capacitive coupling having first and second opposing capacitor plates, the first and second capacitor plates being respectively located at the first and second conductive layers, at least one of the first and second capacitor plates including an edge with a curved portion that curves about the via, wherein the curved portion does not surround the via and wherein the curved portion is spaced from the via.

16. The telecommunications jack of claim 15, wherein the first capacitor plate includes the curved portion of the edge, wherein the first capacitor plate is rectangular with a curved notch defined by the curved portion of the edge, and wherein the second capacitor plate is rectangular without a curved notch.

17. The telecommunications jack of claim 15, wherein the first capacitor plate includes the curved portion of the edge, and wherein the first capacitor plate has a minor circular sector shape with an arc about the via defined by the curved portion of the edge, the first capacitor plate having an inner edge port coupled to the via and an outer edge portion defined by the arc.

18. The telecommunications jack of claim 15, wherein the first capacitor plate includes the curved portion of the edge, Wherein the curved portion is a first curved portion of the edge and wherein the edge also includes a second curved portion that curves about the via, wherein the first capacitor plate is arc shaped with the first curved portion defining a side of the of the first capacitor plate closest to the via and the second curved portion defines a side of the first capacitor plate furthest from the via.

19. The telecommunications jack of claim 15, wherein a stub of one of the contact springs is secured in the via.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a perspective view of a prior art telecommunications panel;

(2) FIG. 2 is a schematic illustration of a prior art jack;

(3) FIG. 3 is a schematic representation of a prior art telecommunications plug;

(4) FIG. 4 is a front, perspective view of a telecommunications jack having features that are examples of inventive aspects in accordance with the principles of the present disclosure;

(5) FIG. 5 is an exploded view of the jack of FIG. 4;

(6) FIG. 6 is a side view of the circuit board, insulation displacement connectors and contact springs of the telecommunications jack of FIG. 4;

(7) FIG. 7 is a front view of the circuit board, contact springs and insulation displacement connectors of FIG. 6;

(8) FIG. 8 is a top view of the circuit board and contact springs of FIG. 6;

(9) FIG. 9 is a cross-sectional view taken along section line 9-9 of FIG. 8;

(10) FIG. 10 is a schematic diagram showing a crosstalk compensation scheme incorporated into the telecommunications jack of FIG. 4;

(11) FIG. 11 is a schematic diagram showing a compensation arrangement used to provide crosstalk compensation between the 4-5 and 3-6 pairs of the telecommunications jack of FIG. 4;

(12) FIG. 12 is a schematic vector diagram showing a compensation arrangement used to provide crosstalk compensation between the 4-5 and 7-8 pairs of the telecommunications jack of FIG. 4;

(13) FIG. 13 is a tracing overlay view of the circuit board used in the telecommunications jack of FIG. 4;

(14) FIG. 14 shows a front conductive layer of the circuit board used in the telecommunications jack of FIG. 4;

(15) FIG. 15 shows a middle conductive layer of the circuit board used in the telecommunications jack of FIG. 4; and

(16) FIG. 16 is shows a back conductive layer of the circuit board used in the telecommunications jack of FIG. 4.

DETAILED DESCRIPTION

(17) Various embodiments of the present disclosure will be described in detail with reference to the drawings, wherein like reference numerals represent like parts and assemblies throughout the several views. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for how aspects of the disclosure may be practiced.

(18) In general, the present disclosure relates to methods and systems for improving far end crosstalk compensation without adversely affecting near end crosstalk compensation within a telecommunications jack. The present disclosure generally describes crosstalk compensation schemes in which near end and far end crosstalk are accounted for and compensated against. In certain aspects, the crosstalk compensation is achieved by use of at least two stages of capacitive compensation, in which the second stage is placed at an average time delay from the first stage such that near end crosstalk is optimized. The second stage has at least two capacitive elements spaced at different time delays from the first capacitive coupling to optimize far end crosstalk.

(19) The present disclosure also relates to methods and systems for compensating for alien crosstalk in a telecommunications jack. The present disclosure describes crosstalk compensation schemes in which alien crosstalk is compensated against, such as by selecting imbalanced capacitive arrangements across wire pairs to reduce the overall crosstalk experienced in a system, despite the potential for imbalanced compensation between wire pairs within a single jack.

(20) FIGS. 4 and 5 show a telecommunications jack 120 (i.e., a telecommunications connector) having features that are examples of inventive aspects in accordance with the principles of the present disclosure. The jack 120 includes a dielectric housing 122 having a front piece 124 and a rear piece 126. The front and rear pieces 124, 126 can be interconnected by a snap fit connection. The front piece 124 defines a front port 128 sized and shaped to receive a conventional telecommunications plug (e.g., an RJ style plug such as an RJ 45 plug). The rear piece 126 defines an insulation displacement connector interface and includes a plurality of towers 130 adapted to house insulation displacement connector blades/contacts. The jack 120 further includes a circuit board 132 that mounts between the front and rear pieces 124, 126 of the housing 122. A plurality of contact springs CS.sub.1-CS.sub.8 are terminated to a front side of the circuit board 132. A plurality of insulation displacement connector blades IDC.sub.1-IDC.sub.8 are terminated to a back side of the circuit board 132. The contact springs CS.sub.1-CS.sub.8 extend into the front port 128 and are adapted to be electrically connected to corresponding contacts provided on a plug when the plug is inserted into the front port 128. The insulation displacement connector blades IDC.sub.1-IDC.sub.8 fit within the towers 130 of the rear piece 126 of the housing 122. The circuit board 132 has tracks T.sub.1-T.sub.8 (e.g., tracings, see FIGS. 14-17) that respectively electrically connect the contact springs CS.sub.1-CS.sub.8 to the insulation displacement connector blades IDC.sub.1-IDC.sub.8.

(21) In use, wires are electrically connected to the contact springs CS.sub.1-CS.sub.8 by inserting the wires between pairs of the insulation displacement connector blades IDC.sub.1-IDC.sub.8. When the wires are inserted between pairs of the insulation displacement connector blades IDC.sub.1-IDC.sub.8, the blades cut through the insulation of the wires and make electrical contact with the center conductors of the wires. In this way, the insulation displacement connector blades IDC.sub.1-IDC.sub.8, which are electrically connected to the contact springs CS.sub.1-CS.sub.8 by the tracks on the circuit board, provide an efficient means for electrically connecting a twisted pair of wires to the contact springs CS.sub.1-CS.sub.8 of the jack 120.

(22) The contact springs CS.sub.1-CS.sub.8 are shown more clearly in FIGS. 6-8. The relative positioning, shape and curvature of the contact springs CS.sub.1-CS.sub.8 is preferably adapted to provide some initial crosstalk compensation at the jack 120.

(23) The circuit board 132 of the jack 120 is preferably a multiple layer circuit board. For example, FIG. 9 shows the circuit board 132 including a first conductive layer 140, a second conductive layer 142 and a third conductive layer 144. The first and second conductive layers 140, 142 are separated by a first dielectric layer 146. The second and third conductive layers 142, 144 are separated by a second dielectric layer 148. The first conductive layer 140 is located at a front side of the circuit board 132 and the third conductive layer 144 is located at a back side of the circuit board 132. The contact springs CS.sub.1-CS.sub.8 are mounted at the front side of the circuit board 132, while the insulation displacement connector blades IDC.sub.1-IDC.sub.8 are mounted at the back side of the circuit board 132. Vias extend through the first and second dielectric layers 146, 148 to provide electrical connections between the conductive layers 140, 142 and 144. The conductive layers 140, 142 and 144 are defined by electrically the conductive tracks T.sub.1-T.sub.8 (see FIGS. 14-17). The tracks T.sub.1-T.sub.8 are formed (e.g., etched or otherwise provided) on the dielectric layers 146, 148.

(24) The circuit board 132 preferably includes structures for compensating for near end crosstalk that occurs at the jack/plug interface. In certain embodiments, the structures for compensating for near end crosstalk include capacitive couplings provided between the first and second conductive layers 140, 142. In preferred embodiments, the capacitive couplings are provided by sets of opposing, generally parallel capacitive plates located at the first and second conductive layers 140, 142. To increase the magnitude of the capacitive coupling provided between the capacitive plates of the first and second conductive layers 140, 142, it is desirable for the first dielectric layer 146 to be relatively thin. For example, in certain embodiments the first dielectric layer 146 can have a thickness t.sub.1 less than about 0.01 inches, or less than about 0.0075 inches, or less than about 0.005 inches, or less than 0.003 inches. In other embodiments, the thickness t.sub.1 can be in the range of 0.001 inches to 0.003 inches or in the range of 0.001 inches to 0.005 inches. In a preferred embodiment, the thickness t.sub.1 is about 0.002 inches.

(25) In certain embodiments, the first dielectric layer 146 can be made of a material having a relatively low dielectric constant. As used herein, dielectric constants are dielectric constants relative to air. In certain embodiments, the dielectric constant of the first dielectric layer 146 can be equal to or less than about 5. In other embodiments, the dielectric constant of the first dielectric layer 146 can be less than or equal to about 4 or less than or equal to about 3. An example material for manufacturing the first dielectric layer 146 is a flame resistant 4 (FR-4) circuit board material. FR-4 circuit board material is a composite of a resin epoxy reinforced with a woven fiberglass mat.

(26) The second dielectric layer 148 is preferably configured to isolate the third conductive layer 144 from the first and second conductive layers 140, 142. The second dielectric layer 148 can have a different thickness t.sub.2 than the thickness t.sub.1 of the first dielectric layer 146. In certain embodiments, the second dielectric layer 148 is at least 2.5 times thicker than the first dielectric layer 146 or at least five times thicker than the first dielectric layer 146. In still other embodiments, the second dielectric layer 148 is at least 10 times or at least 20 times thicker than the first dielectric layer 146. In one example embodiment, the thickness t.sub.2 of the second dielectric layer 148 is in the range of 0.050 inches to 0.055 inches. In another example embodiment, the thickness t.sub.2 of the second dielectric layer 148 is in the range of 0.040 inches to 0.050 inches.

(27) The second dielectric layer 148 can also be manufactured of a different material as compared to the first dielectric layer 146. In certain embodiments, the second dielectric layer can have different dielectric properties as compared to the first dielectric layer 146. For example, in certain embodiments the first dielectric layer 146 can have a dielectric constant that is greater (e.g., at least 1.5 times or at least 2 times greater) than the dielectric constant of the second dielectric layer 148. In one example, the second dielectric layer 148 can be manufactured of a material such as FR-4. Of course, it will be appreciated that other materials could also be used.

(28) The circuit board 132 includes a number of capacitive couplings having magnitudes and locations adapted to compensate for near end crosstalk and far end crosstalk. These forms of crosstalk are particularly problematic between the 4-5 and 3-6 pairs. To compensate for near end crosstalk between the 4-5 and 3-6 pairs, three interdependent zones of compensation are used between tracks T.sub.4-5 and tracks T.sub.3-6. As shown at FIG. 10, the three interdependent zones of compensation include a first zone of compensation Z.sub.A1, a second zone of compensation Z.sub.A2 and a third zone of compensation Z.sub.A3. The first zone of compensation Z.sub.A1 includes a capacitive coupling C1 between track T.sub.3 and track T.sub.5, and a capacitive coupling C2 between track T.sub.4 and track T.sub.6. The second zone of compensation Z.sub.A2 includes a capacitive coupling C3 between track T.sub.3 and track T.sub.4, and a capacitive coupling C4 between track T.sub.5 and track T.sub.6. The third zone of compensation Z.sub.A3 includes a capacitive coupling C5 between track T.sub.3 and track T.sub.5, and a capacitive coupling C6 between track T.sub.4 and track T.sub.6.

(29) To compensate for far end crosstalk, the capacitive couplings C3 and C4 are spaced apart, such that the average distance between the zones of compensation is as described below in FIG. 11, but the distances for the C3 and C4 couplings differ. As shown, coupling C3 is placed closer to the first zone of compensation Z.sub.A1 than coupling C4 while maintaining the average position of the zone Z.sub.A2 such that the distance between zones is as described below in FIG. 11.

(30) In the embodiments shown in the present disclosure, the capacitive couplings C1 and C2 are equal in magnitude and location, maintaining symmetry across the pairs. However, in certain embodiments, capacitive couplings C1 and C2 may be selected such that they differ in magnitude to compensate for alien crosstalk including the “excess” crosstalk previously mentioned, which is noted to be worst in the case of the 3-6 pair. Specifically, it was determined that changes to alien crosstalk can be made, both positively and negatively, by purposefully modifying the size of the compensating capacitors, causing them to become asymmetric in size and coupling. For example, in certain embodiments, the magnitude of capacitor C1 is greater than the magnitude of capacitor C2, which can reduce the alien crosstalk generated at the 3-6 pair. It is observed that, analogously to varying the magnitudes of C1 and C2, varying the relative magnitudes of the capacitive couplings within a zone of compensation in the compensation between the 4-5 and 3-6 pairs can improve the alien crosstalk observed. This is understood to have the effect of compensating for the overall plug and jack configuration, as opposed to typical crosstalk compensation schemes which generally only account for crosstalk generated in the jack. Additional details regarding methods and configurations for compensating for alien crosstalk are described below.

(31) To address overall crosstalk between the 4-5 and 3-6 pairs, a relatively large amount of capacitance is used. This large amount of capacitance can cause the jack to have unacceptable levels of return loss. Methods for addressing this return loss are addressed in U.S. patent application Ser. No. 11/402,544, filed Apr. 11, 2006, now U.S. Pat. No. 7,381,098, and entitled “TELECOMMUNICATIONS JACK WITH CROSSTALK MULTI-ZONE CROSSTALK COMPENSATION AND METHOD FOR DESIGNING”, which is hereby incorporated by reference in its entirety.

(32) FIG. 11 is a schematic diagram representative of the compensation arrangement used to provide crosstalk compensation between the 4-5 and 3-6 pairs. As shown at FIG. 11, the compensation arrangement includes a first vector 100, a second vector 102, a third vector 104, and a fourth vector 106. The first vector 100 and the third vector 104 have positive polarities, while the second vector 102 and the fourth vector 106 have negative polarities. The first vector 100 has a magnitude of M and corresponds to crosstalk introduced at the plug. The second vector 102 has a magnitude of about −3M and corresponds to the overall crosstalk introduced at the first zone of crosstalk Z.sub.A1 generated by the board and springs. The third vector 104 has a magnitude of about 3M and corresponds to the overall crosstalk introduced at the second zone of compensation Z.sub.A2. The fourth vector 106 has a magnitude of about −M and corresponds to the overall crosstalk introduced at the third zone of compensation Z.sub.A3. It will be appreciated that each vector is a lump sum of the total crosstalk or crosstalk compensation provided at each respective compensation zone, with the vectors being placed at the centers or midpoints of the compensation zones.

(33) In designing the compensation scheme of FIG. 11, a number of factors are taken into consideration when determining the placement of the compensation zones. One factor includes the need to accommodate signal travel in both directions (i.e., in forward and reverse directions) through the tracks on the circuit board. To accommodate forward and reverse transmissions through the circuit board, the compensation scheme preferably has a configuration with forward and reverse symmetry. It is also desirable for the compensation scheme to provide optimized compensation over a relatively wide range of transmission frequencies. For example, in one embodiment, performance is optimized for frequencies ranging from 1 MHz to 500 MHz. It is further desirable for the compensation arrangement to take into consideration the phase shifts that occur as a result of the time delays that take place as signals travel between the zones of compensation.

(34) To minimize the effect of phase shift in the compensation arrangement, it is preferred for the second vector 102 to be positioned as close as possible to the first vector 100. In FIG. 11, the time delay between the first vector 100 and the second vector 102 is shown as x. In one example embodiment, x can be about 100 picoseconds for a signal having a transmission speed of 3×10.sup.8 meters per second.

(35) To maintain forward and reverse symmetry, it is preferred for the time delay between the third vector 104 and the fourth vector 106 to be approximately the same as the time delay between the first vector 100 and the second vector 102. As shown in FIG. 11, the time delay between the third and fourth vectors is depicted as x.

(36) The time delay y between the second vector 102 and the third vector 104 is preferably selected to optimize the overall compensation effect of the compensation scheme over a relatively wide range of frequencies. By varying the time delay y between the second vector 102 and the third vector 104, the phase angles of the first and second compensation zones are varied thereby altering the amount of compensation provided at different frequencies. In one example embodiment, to design the time delay y, the time delay y is initially set with a value generally equal to x (i.e., the time delay between the first vector 102 and the second vector 104). The system is then tested or simulated to determine if an acceptable level of compensation is provided across the entire signal frequency range intended to be used. If the system meets the near end crosstalk requirements with the value y set equal to x, then no further adjustment of the value y is needed. If the compensation scheme fails the near end crosstalk requirements at higher frequencies, the time delay y can be shortened to improve performance at higher frequencies. If the compensation scheme fails the near end crosstalk requirements at lower frequencies, the time delay y can be increased to improve crosstalk performance for lower frequencies. It will be appreciated that the time delay y can be varied without altering forward and reverse symmetry.

(37) It has been determined that when magnitudes of the second and third vectors 102, 104 are respectively about −3M and about 3M, the distance y is preferably greater than the distance x to provide optimized crosstalk compensation. However, if the magnitudes of the vectors 102, 104 are reduced below about −3M and about 3M (e.g., to approximately −2.7M and 2.7M), the distance y is preferably less than the distance x to provide optimized crosstalk compensation.

(38) Crosstalk can also be an issue between the 1-2 and 3-6 pairs. Particularly, substantial crosstalk can be generated between track T.sub.2 and track T.sub.3. As shown at FIG. 10, a three-zone compensation arrangement is used to compensate for this crosstalk. The three-zone compensation arrangement includes a first zone of compensation Z.sub.B1, a second zone of compensation Z.sub.B2 and a third zone of compensation Z.sub.B3. The first zone of compensation Z.sub.B1 includes a capacitive coupling C7 between track T.sub.1 and track T.sub.3, and a capacitive coupling C8 between track T.sub.2 and track T.sub.6. The second zone of compensation Z.sub.B2 includes a capacitive coupling C9 between track T.sub.1 and track T.sub.6. The third zone of compensation Z.sub.B3 includes a capacitive coupling C10 between track T.sub.1 and track T.sub.3. The three zones of compensation between the 1-2 and 3-6 pairs can be placed at locations consistent with the vector diagram shown in FIG. 11, described above.

(39) In general, it has been determined that varying the relative compensation among the pairs at the primary zones of compensation for each pair can affect alien crosstalk. Regarding the zone of compensation Z.sub.B1, it has been determined that varying the relative magnitudes of the capacitive couplings C7 and C8, such that the capacitive couplings are non-equal, can improve overall alien crosstalk of the plug and jack system. In the embodiment shown, a larger capacitance is used for capacitance C7 than C8, with the overall capacitance relating to the capacitive coupling introduced at the plug, as described above in conjunction with FIG. 11.

(40) In general, it has been determined that in zone of compensation Z.sub.B2 performance is optimized without use of a capacitive coupling between track T.sub.2 and track T.sub.3. However, in certain embodiments, such a capacitive coupling can be included to preserve symmetry between the pairs. Likewise, in zone Z.sub.B3, no capacitive coupling is included between track T.sub.2 and track T.sub.6, although in symmetric systems such a coupling could be included. Furthermore, it will be appreciated that the magnitudes of the compensation between the 3-6 and 4-5 pairs are substantially greater in magnitude than those between the 1-2 and 3-6 pairs.

(41) Additional crosstalk exists between the 4-5 and 7-8 pairs. In the embodiment of the crosstalk compensation arrangement shown in FIG. 10, a two zone arrangement is used to compensate for crosstalk between those pairs. As shown, the compensation arrangement between the 4-5 and 7-8 pairs is a two zone compensation including a capacitive coupling C11 in a first zone Z.sub.C1 provided between track T.sub.5 and track T.sub.8, and capacitive coupling C12 in a second zone Z.sub.C2 provided between track T.sub.4 and track T.sub.8.

(42) FIG. 12 is a schematic vector diagram showing the compensation arrangement used between the 4-5 and 7-8 pairs. As shown at FIG. 12, three crosstalk vectors are taken into consideration. The first crosstalk vector 110 is representative of crosstalk generated at the plug. A second vector 112 is representative of crosstalk provided at the first compensation zone Z.sub.C1. The third vector 114 is representative of crosstalk generated at the second compensation zone Z.sub.C2. The first and third vectors 110, 114 have positive polarities and magnitudes of about N. The second vector 112 has a negative polarity and a magnitude about 2N. Although the disclosed compensation arrangement is asymmetric among the pairs, a symmetric arrangement could be provided as well. Furthermore, it will be appreciated that M (shown at FIG. 11) is typically substantially greater in magnitude than N (shown at FIG. 12).

(43) As described above, varying the capacitive values across the 4-5 and 7-8 wire pairs used in the first zone of compensation Z.sub.C1 can improve alien crosstalk values generated from the plug-jack system. In the embodiment shown, a completely unbalanced configuration is selected, such that Z.sub.C1 includes only compensation between track T.sub.5 and track T.sub.8, with no corresponding balanced compensation between tracks T.sub.4 and T.sub.7. In further embodiments, a different, unbalanced arrangement may be selected.

(44) In addition to the multiple zone compensation arrangements described above, a number of single zone compensations can also be used. For example, zone Z.sub.D1 is a single zone compensation used to compensate for crosstalk generated between the 1-2 and 4-5 pairs, and includes a capacitive coupling C13 provided between track T.sub.2 and track T.sub.5. Another single zone compensation Z.sub.E1 compensates for crosstalk generated between the 3-6 and 7-8 pairs, and is provided by a capacitive coupling C14 formed between track T.sub.3 and track T.sub.7. Other capacitive couplings may be included which compensate for unintended crosstalk generated within the board itself.

(45) Again, each of the single zone compensations is illustrated as using an unbalanced arrangement to account for alien crosstalk generated by the plug and jack. It is observed that the “excess” alien crosstalk may be caused, at least in part, by an imbalance in connecting hardware contributing to excess crosstalk between the cables, particularly in short sections of cable between connectors. Therefore, imbalanced compensation across wire pairs can compensate for this excess crosstalk. In the embodiment shown, zone Z.sub.D1 includes only compensation C13 between track T.sub.2 and track T.sub.5, but no compensation between tracks track T.sub.1 and track T.sub.4. Similarly, zone Z.sub.E1 includes only compensation C14 between track T.sub.3 and track T.sub.7, but no compensation between tracks track T.sub.6 and track T.sub.8.

(46) The crosstalk compensation schemes illustrated herein generally are accomplished by first positioning a crosstalk compensation arrangement relating to crosstalk within the plug and jack, across a variety of wire pairs. In designing the multi-zone crosstalk compensation schemes in accordance with this disclosure, a designer will generally first locate a first zone of capacitive coupling a first time delay away from the capacitive coupling at the plug. The designer can then position a second capacitive coupling, i.e. a second zone of compensation, at a second time delay away from the first time delay. That second zone of compensation can be made up of more than one capacitive coupling, and can have capacitive couplings of differing magnitude. For example, two capacitors can make up a zone of compensation, and can be placed at differing distances from a first zone. An example of such a configuration is illustrated by zone Z.sub.A2 as described above.

(47) Once crosstalk for the plug and jack have been brought to an acceptable level using the techniques described above, the compensation arrangement can be altered to improve alien crosstalk. Altering the compensation arrangement is performed to accommodate one or more zones of crosstalk compensation having an asymmetric capacitive coupling between a wire pairs, such that alien crosstalk is reduced. This can be performed by changing the relative magnitudes of the capacitive couplings between wire pairs in one or more of the zones of compensation. In certain embodiments, a designer can start with a compensation arrangement having symmetric capacitive couplings across complementary wire pairs (e.g. from the 3-6 pair to the 4-5 pair, having equal couplings between T.sub.3 and T.sub.5 and between T.sub.4 and T.sub.6).

(48) The various capacitive couplings illustrated in the present disclosure provide an example design for which far end and alien crosstalk are addressed. Additional embodiments exist in which these types of crosstalk are compensated for. In the various embodiments, any amount of asymmetry in any zone of compensation can be introduced to compensate for alien crosstalk, from complete symmetry to complete asymmetry.

(49) In general, the various asymmetric capacitive coupling selections made to account for alien crosstalk are believed to, as a whole, compensate for crosstalk generated in an overall system including both a plug and a contact set of a modular jack, as described above in FIGS. 4-7. It is particularly notable that the crosstalk compensations selected in the present disclosure may not be symmetric in the sense that equal capacitive couplings are not applied across complementary tracks of a wire pair. Although this may have the effect of slightly worse performance with respect to connector balance and crosstalk within the pair, the net effect of a number of plug and jack systems in close proximity is an improved overall crosstalk compensation.

(50) FIGS. 13-16 show an example circuit board layout for implementing the compensation arrangement of FIG. 10. FIGS. 14-16 respectively show the front, middle and back conductive layers 140, 142 and 144 of the circuit board 132. FIG. 13 is an overlay of the three conductive layers 140, 142 and 144. The circuit board 132 defines openings 301-308 that respectively receive posts of the contact springs CS.sub.1-CS.sub.8 so that the contact springs CS.sub.1-CS.sub.8 are terminated to the board 132. The circuit board also defines openings 401-408 for respectively receiving posts of the insulation displacement connector blades IDC.sub.1-IDC.sub.8 such that the insulation displacement connector blades IDC.sub.1-IDC.sub.8 are terminated to the circuit board. Vias extend through the circuit board for electrically interconnecting the tracks between the layers 140, 142 and 144, and to the various capacitive couplings C1-C13. For example, vias V.sub.4A and V.sub.4B interconnect the portions of the track T.sub.4 located at the different layers 140, 142 and 144 to the capacitive couplings C3 and C6. Also, via V.sub.5, interconnects the portions of the track T.sub.5 located at the different layers 140, 142 and 144 to capacitive coupling C5. Moreover, via V.sub.6 interconnects the portions of the track T.sub.6 located at the different layers 140, 142 and 144 with capacitive coupling C6. Likewise, via V.sub.3 interconnects the portions of the track T.sub.3 located at the different layers 140, 142 and 144 to capacitive coupling C5.

(51) Referring to FIGS. 14-16, the capacitive coupling C1 of the first zone of compensation Z.sub.A1 is provided by opposing capacitor plates C1.sub.5 and C1.sub.3 respectively provided at layers 142 and 144. The capacitive coupling C2 of the first zone of compensation Z.sub.A1 is provided by opposing capacitor plates C2.sub.4 and C2.sub.6 that are respectively provided at the layers 142 and 144. The capacitive coupling C3 of the second compensation zone Z.sub.A2 is provided by opposing capacitor plates C3.sub.4 and C3.sub.3 that are respectively provided at layers 142 and 144. The capacitive coupling C4 of the second compensation zone Z.sub.A2 is provided by opposing capacitor plates C4.sub.6 and C4.sub.5 that are respectively provided at layers 142 and 144. The capacitive coupling C5 of the third compensation zone Z.sub.A3 is provided by a capacitor plate C5.sub.5A that is provided at layer 142. The capacitive coupling C5 is also provided by inter-digitated capacitor fingers C5.sub.5B and C5.sub.3B that are provided at layer 140. The capacitive coupling C6 of the second compensation zone Z.sub.A3 is provided by capacitor plate C6.sub.6A provided at layer 142. The capacitive coupling C6 is also provided by inter-digitated capacitor fingers C6.sub.6B and C6.sub.4B provided at layer 140.

(52) The capacitive coupling C7 of the first compensation zone Z.sub.B1 is provided by opposing capacitor plates C7.sub.1 and C7.sub.3 that are respectively provided at layers 142 and 144 of the circuit board. The capacitive coupling C8 of the first compensation zone Z.sub.B1 is provided by opposing capacitor plates C8.sub.2 and C8.sub.6 that are respectively provided at the layers 142 and 144 of the circuit board. The capacitive coupling C9 of the second zone of compensation Z.sub.B2 is provided by opposing capacitor plates C9.sub.1 and C9.sub.6 that are respectively provided at layer 142 and 144 of the circuit board. The capacitive coupling C10 of the third zone of compensation Z.sub.B3 is provided by opposing capacitor plates C10.sub.1 and C10.sub.3 that are respectively provided at layers 142 and 144 of the circuit board.

(53) The capacitive coupling C11 of the first compensation zone Z.sub.C1 is provided by opposing capacitor plates C11.sub.5 and C11.sub.8 that are respectively provided at layers 142 and 144 of the circuit board. The capacitive coupling C12 of the second compensation zone ZC2 is provided by adjacent leads C124 and C128, respectively, located at layer 142. The capacitive coupling C13 of the zone of compensation Z.sub.D1 is provided by opposing capacitor plates C13.sub.2 and C13.sub.5 provided at layers 142 and 144 of the circuit board. The capacitive coupling C14 of the zone of compensation Z.sub.E1 is provided by opposing capacitor plates C14.sub.7 and C14.sub.3 respectively provided at layers 142 and 144 of the circuit board.

(54) Various manufacturing and routing techniques may be implemented in the placement of the tracks, vias, and capacitors described herein. Additional details regarding the routing and placement of circuit components are described in U.S. patent application Ser. No. 11/402,544, filed Apr. 11, 2006, now U.S. Pat. No. 7,381,098, which was previously incorporated by reference in its entirety.

(55) The above specification, examples and data provide a complete description of the manufacture and use of the composition of the invention. Since many embodiments of the invention can be made without departing from the spirit and scope of the invention, the invention resides in the claims hereinafter appended.