Microfluidic fan

Abstract

A device (1, 100) for controlling a flow of a gaseous fluid is disclosed. The device comprises a first electrode (10, 110) and a second electrode (20, 120) offset from the first electrode in a downstream direction of the flow. The electrodes are connectable to a voltage source. A thermally conducting flange (30) is arranged to extend in a plane parallel to a direction of the flow and adapted to dissipate heat from the gaseous fluid. At least a portion of the first electrode has a maximum height (h.sub.1) in a direction parallel to a direction of the flow and a maximum width (w.sub.1) in a direction orthogonal to the direction of the flow, wherein said maximum height is larger than said maximum width so as to improve the pumping efficiency of the device. A method for manufacturing the device, and a method for controlling a fluid flow by means of such device, is also disclosed.

Claims

1. A device for controlling a flow of a gaseous fluid, the device comprising: a first electrode, wherein at least a portion of the first electrode has a maximum height in a direction parallel to a direction of the flow and a maximum width in a direction orthogonal to the direction of the flow, wherein said maximum height is larger than said maximum width; a second electrode, wherein at least a portion of the second electrode is offset from at least a portion of the first electrode in a downstream direction of the flow, the first and second electrodes being connectable to a voltage source; and a plurality of thermally conducting flanges extending in a first plane oriented along a direction of the flow, and arranged around at least a portion of the first electrode, whereby the thermally conducting flanges define a volume receiving at least a portion of the first electrode, and the plurality of thermally conducting flanges being adapted to dissipate heat from the gaseous fluid.

2. The device according to claim 1, wherein the first electrode comprises bridges and joints forming a grid structure arranged to allow the gaseous fluid to pass through the first electrode, and wherein said portion of the first electrode forms part of at least one of the bridges.

3. The device according to claim 1, wherein the first electrode is formed as a rod having a height corresponding to the maximum height and a width corresponding to the maximum width.

4. The device according to claim 1, wherein the first electrode is formed as a rod having a circular or polygonal cross section in a plane intersecting the direction of the flow.

5. The device according to claim 3, wherein the rod comprises at least one pointed tip pointing in the direction of the flow.

6. The device according to claim 1, wherein the device comprises a plurality of mutually intersecting thermally conducting flanges.

7. The device according to claim 1, wherein the second electrode is electrically connected to the plurality of thermally conducting flanges.

8. The device according to claim 1, wherein the second electrode is integrally formed with the plurality of thermally conducting flanges.

9. The device according to claim 1, wherein a distance between the second electrode and the first electrode in the direction of the flow is between 0.4-2.0 mm.

10. A method for manufacturing a device for controlling a flow of a gaseous fluid, the method comprising: providing a first electrode, the first electrode comprising at least a portion having a maximum height in a direction parallel to the direction of the flow and a maximum width in a direction orthogonal to the direction of the flow, and wherein said maximum height is larger than said maximum width; providing a second electrode, the second electrode comprising a portion which is formed as a thermally conducting flange extending in a plane parallel to a direction of the flow and being adapted to dissipate heat from the gaseous fluid; providing, on at least one of the first electrode or the second electrode, a suspension structure, wherein the suspension structure is arranged in a plane orthogonal to the direction of the flow for absorbing thermally induced deformations in the first electrode or the second electrode; and arranging the second electrode offset from the first electrode in the direction of the flow.

11. The method according to claim 10, wherein first and/or second electrode(s) is/are provided by selectively depositing a metal.

12. The method according to claim 10, wherein first and/or second electrode(s) is/are provided by selectively removing material from a metal substrate.

13. A method for controlling a flow of a gaseous fluid, the method comprising: providing a first electrode of a device, the first electrode comprising at least a portion having a maximum height in a direction parallel to the direction of the flow and a maximum width in a direction orthogonal to the direction of the flow, and wherein said maximum height is larger than said maximum width; providing a second electrode of the device, the second electrode comprising a portion which is offset from at least a portion of the first electrode in a downstream direction of the flow and being adapted to dissipate heat from the gaseous fluid; providing a plurality of thermally conducting flanges extending in a first plane oriented along a direction of the flow, arranged around at least a portion of the first electrode, whereby the thermally conducting flanges define a volume receiving at least a portion of the first electrode, and the plurality of thermally conducting flanges being adapted to dissipate heat from the gaseous fluid; arranging the second electrode offset from the first electrode in the direction of the flow; providing the gaseous fluid that contacts the first electrode of the device; and applying an electric potential difference between the first electrode and the second electrode.

14. The method according to claim 13, further comprising the step of varying the electric potential difference as a function of time.

15. The method according to claim 13, wherein the applied electric potential difference is comprised in the range of 400-4000 V.

16. The method according to claim 13, wherein the applied electric potential difference is comprised in the range of 100-400 V.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The above, as well as additional objects, features and advantages of the present invention, will be better understood through the following illustrative and non-limiting detailed description of embodiments of the present invention. Reference will be made to the appended drawings, on which:

(2) FIG. 1 is a schematic perspective view of a device according to an embodiment of the invention;

(3) FIGS. 2a-d show perspective views of the first electrode according to an embodiment of the invention;

(4) FIGS. 3a and b illustrate flange arrangement and a second electrode according to an embodiment of the invention;

(5) FIG. 4 shows a perspective view of a device according to an embodiment,

(6) FIGS. 5a and b are top views of an electrode provided with a suspension structure according to embodiments of the invention;

(7) FIG. 6 is a cross section of an assembly, such as a fan assembly, according to an embodiment of the invention; and

(8) FIGS. 7a and b graphically illustrate electric current pulses applied to the device in accordance with an embodiment of the invention.

(9) All the figures are schematic, generally not to scale, and generally only show parts which are necessary in order to elucidate the invention, whereas other parts may be omitted or merely suggested.

DETAILED DESCRIPTION OF EMBODIMENTS

(10) FIG. 1 shows a device 1 comprising a first electrode, or emitter 10, and a second electrode, or collector 20, having at least a portion arranged offset from a portion of the emitter 10 in a downstream direction of the flow (indicated by the arrow). According to the present embodiment, the collector 20 is integrated with a thermally conducting flange 30 that may be formed of three electrically conducting sheets of e.g. copper, each extending in a respective plane parallel to the direction of the flow.

(11) The emitter may be formed as a rod 10 having a vertical extension, or maximum height h1, in the direction of the flow and a lateral extension, or maximum width w1, in a direction perpendicular to, or at least intersecting, the direction of the flow. As shown in the present figure, the maximum height h1 is larger than the maximum width w2, hence providing the rod 10 with an elongated shape in the direction of the flow. The rod 10 may also be provided with one or several pointed tips 16 pointing in the direction of the flow, thereby increasing the number of possible emitting points of the emitter.

(12) During operation, the emitter 10 and the collector 20 may be connected to a voltage source (not shown) so as to induce an electric field between the emitter 10 and the collector 20 at least in a direction of the intended flow direction, thereby inducing a motion of the gaseous fluid along said direction. As the fluid passes through the device 1, heat energy carried by the fluid may, upon thermal contact with the flange 30, be transferred to the flange 30 and eventually dissipated to the surroundings of the device 1.

(13) FIGS. 2a-d show different examples of the first electrode or emitter 10 of a device similar to the device 1 shown in FIG. 1. In FIG. 2a, the emitter 10 may comprise bridges 11 and joints 12 forming a grid that allows a fluid to flow through the emitter 10. The emitter 10 has a lateral extension in a plane perpendicular to the intended flow direction (indicated by the arrow in FIG. 1), whereas at least a portion of at least one of the bridges 11 has a maximum height h1 that is larger than its corresponding width w2.

(14) FIG. 2b discloses another example, wherein the emitter 10 is formed as a rod or pillar with a rectangular cross section and a pointed tip. Further, the emitter 10 may be formed as a cylindrical rod having a plurality of tips, as shown in FIG. 2c, and/or comprise one or several needle shaped bodies as shown in FIG. 2d.

(15) FIGS. 3a and b disclose a device 1 similarly configured to the devices described with reference to FIGS. 1 and 2a-d. The device 1 may comprise a plurality of thermally conducting flanges 30, each of which extending in a respective plane which is parallel to the flow and originates from a common centre axis A of the device 10. Further, a cover or protecting plate 40 may be arranged in a plane intersecting the direction of the flow and at the top end of the flanges 30 (i.e., at a downstream end of the flanges). The cover 40 may be formed as a circular disc having a through-hole for letting the flow pass through the device 1. The collector 20 may be arranged at the top end of the flanges, preferably close to the through-hole, and may e.g. be formed of a net or grid structure similar to the structure of the emitter described with reference to FIG. 2a, or comprise a plurality of wires arranged to extend in a plane intersecting the direction of the flow. Further, the flanges 30 may be adapted to form a space or void extending along a length axis of the device 1 so as to accommodate an emitter 10, which e.g. may be formed as a rod (not shown) adapted to be at least partly inserted in the space or void defined by the flanges 30. FIG. 3a shows a perspective view of such a device 1, whereas FIG. 3b shows a view from below, as seen in the direction of the flow.

(16) FIG. 4 discloses a device according to another embodiment, which may be similarly configured as any one of the devices discussed with reference to the previous figures. The device 1 comprises a collector that may be formed as a lamellar structure of flanges 30 oriented in the direction of the flow (indicated by the arrow). The flanges may e.g. be formed from a planar sheet of a heat conducting and electrically conducting material, such as copper, which may be bent to form a lamellar structure. By the upstream end of the flanges 30, an emitter 10 may be arranged, spaced apart from the flanges by a distance d. The emitter 10 may e.g. form a grid structure as previously discussed, or be formed of one or several wires. The emitter 10 and the collector 20 may be arranged spaced apart from each other in the flow direction by a positive distance d. The spacing may e.g. be maintained by a support structure, or grid spacer being arranged between the emitter 10 and the collector 20. A relatively narrow gap d may be desirable since such gap may provide a relatively high electric field and thus enhance the electrohydrodynamic effect affecting the flow rate.

(17) The emitter 10 and the collector 20 may be attached to a heat transferring element 50 which may be arranged to transfer or dissipate heat from at least one of the emitter 10 and the collector 20. As shown in FIG. 4, the heat transferring element 50 may be formed of a sheet of e.g. metal and may be press-fitted or reflow-soldered into receiving structures in a printed circuit board (not shown). During operation, heat from the passing gaseous fluid may be dissipated from e.g. the collector 20 to the printed circuit board via the heat transferring element 50.

(18) According to some embodiments, the device may comprise a suspension structure adapted to absorb, or prevent, thermally induced deformations of the first electrode and/or the second electrode. The suspension structure, which also may be referred to as a deformation structure, may e.g. be adapted to apply a tensile stress to a length direction of any one of the electrodes, at least a portion of the electrode(s), or a structure formed by the electrode(s). FIG. 5a shows one example of a deformation structure, or suspension structure 115, of a grid acting as e.g. an emitter 110 in a device 100 according to embodiments of the present invention. In this example, the grid may comprise bridges 111 and joints 112 in accordance with the previously described embodiments. As indicated in FIG. 5a, the suspension structure 115 may be composed of bridges 111 that are curved in a plane normal to the flow direction. The curved shape may e.g. be formed during manufacturing of the bridges 111, or induced by e.g. thermal stresses occurring during use of the device 100. The curved shape may also comprise a weakened portion, e.g. a portion having a reduced width, so as to make it easier to deform upon heat induced stresses.

(19) As the material of the grid may expand with an increasing temperature, the bridges 111 of the deformation structure 126 may be compressed by compressive forces acting in the length direction of the bridges 111. By length direction should be understood the direction of extension between a first joint and a second joint. Thereby the lateral expansion of the grid may be absorbed by the deformation structure 115 and thermally induced stresses reduced so that the emitter 110 other than the deformation structure 115 may keep its original shape despite thermal expansion. It should however be understood that the forces acting on the bridges 111 of the deformation structure 115 also, or alternatively, may be caused by e.g. a torsional moment, or torque, acting on the structure.

(20) FIG. 5b shows a similar deformation structure 115 as described with reference to FIG. 5a, wherein the suspension structure 115 is adapted to apply a tensile stress to the emitter 110. It will however be understood that the device 100 may be provided with deformation structures 115 arranged in any one, or several, of the emitter 110, the collector 120, and a support structure (not shown).

(21) FIG. 6 shows a cross section of an assembly, such as a fan assembly 200, comprising a stack of three devices 100 according to any one of the previously described embodiments. The cross section is taken along the direction of the flow (indicated by an arrow in FIG. 6). Each device comprises an electron emitting electrode (emitter) 110, an electron collecting electrode (collector) 120, a heat conducting flange (not shown), and a grid spacer 130 arranged to separate the emitter 110 and the collector 120 in the direction of the flow. According to this embodiment, the emitters 110 and collectors 120 may comprise e.g. Pt, Au, or stainless steel forming e.g. the bulk material or a surface coating.

(22) The grid spacer 130 may e.g. be formed as a grid supporting the emitter 110 and the collector 120. As illustrated in FIG. 6, the grid spacer 130 may comprise a peripheral frame to which the edge portions of the emitter 110 and the collector 120 are attached by e.g. welding, soldering or gluing. Alternatively, or additionally, the grid spacer 130 may comprise other spacing structures such as pillars or spacers, etc. The grid spacer 130 may also comprise one or several spacing members, such as e.g. additional bridges or pillars, supporting the centre portions of the emitter and collector. The grid spacer 130 may also comprise a deformation structure 115 (not shown) similar to the deformation structure described with reference to FIGS. 5a and b. The support structure 130 may have a coefficient of thermal expansion (CTE) that differs from the CTE(s) of the emitter 110 and/or collector 120. In case the emitter 110 and/or collector 120 is/are rigidly attached to the support structure 130, the risk for deformations, such as e.g. bending and flexures, and damages such as fractures, disconnected or loosening joints etc. may be reduced by the deformation structure 115. Thereby, reliability and useful life of the device 100 may be increased.

(23) The spacing d of the emitter and collector may be determined by the height of the bridges of the grid spacer 130, which may hence determine the magnitude of the electric field induced between the emitter 110 and the collector 120. The distanced between the emitter 110 and the collector 120 may e.g. be within the range of 0.4 mm and 2 mm.

(24) Further, the grid spacer 130 may comprise an alignment structure for facilitating alignment of the emitter 110 and the collector 120, and/or alignment of the devices 100 of the stack.

(25) The fan assembly 200 may also comprise a stacked structure with stage spacers 140 arranged to maintain a distance between the emitter 110 of a first device and the collector 120 of a second device. The stacking structure 140 may also comprise an alignment structure 142 (not shown in FIG. 6) for facilitating alignment and assemblage of the stacked devices 100, and possibly a deformation structure 115, 125 as described with reference to FIGS. 5a and b in order to reduce any mechanical stresses between the components of the assembly 200.

(26) The grid spacer 130 and/or the stacking structure 140 may e.g. comprise a ceramic material, such as Al.sub.2O.sub.3 or Macor™, a plastic material or any suitable electrically insulating material.

(27) As shown in FIG. 6, the emitters 110 and the collectors 120 may be connected to an external voltage supply (not shown) by an electric connector or terminal 150. In this manner, an electric potential difference may be applied between the emitter 110 and collector 120 of the respective devices 100. The electric potential difference may induce an electric field which may promote the electron emission and impart movement of the fluid between and through each of the emitter 110 and collector 120. Further, the electric connection 150 between the emitters 110 and/or collectors 120 and the external power supply may be provided by mechanical features of the stacking structure and/or by electric contact portions 129 (not shown in FIG. 6). The mechanical features may e.g. be adapted so as to enable the electric connection to be formed by e.g. dispensing or screen printing, followed by e.g. sintering or welding. Advantageously, several or all of the emitters 110 and/or collectors 120 of the stack can be connected in the same manufacturing step.

(28) FIGS. 7a and b shows, as a function of time t, an electric current i provided to the emitter 110 of a device 100 according to the invention. In FIG. 7a, a positive current is applied and maintained for a first time period, and then removed. After a second time period the current supply is switched on again, thus forming a second pulse. Repeating this procedure can reduce the space charges that may be present in the fluid and may also allow any ionized particles to recombine.

(29) To further improve relaxation, a pulse-reverse current may be introduced between the pulses described with reference to FIG. 7a. An example of such process is shown in FIG. 7b, wherein the positive pulses are separated by negative pulses. As shown in FIG. 7b, the negative pulses may have a larger absolute value than the positive pulses, but last for a shorter period of time so as to enable an overall positive flow. This procedure of separating the positive pulses by reverse pulses may advantageously improve relaxation, possibly to remove contaminants of the emitter 110 and/or collector 120.

(30) The applied electrical potential difference may e.g. depend on the mode of operation of the device. In case of e.g. an injection type mode, the applied electrical potential difference may be comprised in the range of 250-5000 V, depending on the actual distance between the emitter and the collector. In case of e.g. a conduction type mode, the applied potential difference may, for the same actual distance between emitter and the collector, be in the range of 10-500 V.

(31) The injection type mode, or ion drag mode, may be understood as an operational mode of the device wherein a relatively high electric field at the emitter causes electrons to be injected into the gaseous fluid at the interface of the emitter and the gaseous fluid, thus creating a corona of free ions in the gaseous fluid. The conduction mode, on the other hand, can be understood as a mode wherein the electric field is too low to create a substantial corona. Instead, the gaseous flow is caused by impurities or particles in the gaseous fluid, entraining a flow of the fluid.

(32) In one example, the external voltage supply may be controlled in a manner reducing formation of ozone. This may e.g. be achieved by limiting a maximum electric potential difference or electrical charge, and thereby reducing the risk for electrical break-through or sparks. Additionally, or alternatively, a housing, the collector and/or the flange may be adapted to decompose ozone, e.g. by means of a catalytic surface.

(33) As outlined above, the method for controlling the flow of a fluid as illustrated by FIGS. 7a and 7b may be embodied as computer-executable instructions distributed and used in the form of a computer-program product including a computer-readable medium storing such instructions. By way of example, computer-readable media may comprise computer storage media and communication media. As is well known to a person skilled in the art, computer storage media includes both volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media (or non-transitory media) includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices. Further, it is known to the skilled person that communication media (or transitory media) typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.