Layered waveguide system and method of forming a waveguide

Abstract

The disclosure relates to a waveguide system comprising a plurality of stacked layers. The system further comprises a waveguide in a direction across the layers by providing each layer with a predetermined metal pattern. The disclosure further relates to a method for forming a waveguide.

Claims

1. A waveguide system comprising a plurality of stacked layers, the system further comprising a waveguide extending from a first section to a second section in a direction across the layers by providing each layer with a predetermined metal pattern, wherein at least one of the predetermined metal patterns is configured to form a corrugation in the waveguide.

2. The waveguide system according to claim 1, wherein the layers are electronic circuit boards comprised of at least one of: printed circuit boards flexible circuit boards.

3. The waveguide system according to claim 1, wherein the waveguide forms a horn antenna.

4. The waveguide system according to claim 1, wherein the waveguide forms an inverted horn antenna.

5. The system according to claim 1, wherein the metal patterns of the layers correspond to the design of the waveguide at its respective sections.

6. The waveguide system according to claim 1, wherein the layers comprise cutouts inside the metal patterns.

7. The waveguide system according to claim 1, further comprising a wire and wherein the metal patterns are electrically connected by the wire.

8. The waveguide system according to claim 1, wherein at least two layers comprise electronic circuits coupled by electric coupling elements for forming a three-dimensional electronic circuit.

9. The waveguide system according to claim 1, wherein the layers are separated from each other by at least one of: spacers, dielectric, and isolating separation layers.

10. A method for forming a waveguide across a plurality of stacked layers by providing the layers with respective metal patterns, the method comprising the steps of: specifying for each layer a boundary condition where metallic surfaces are needed to achieve the waveguide, providing each layer with the metallic surfaces, stacking the layers so that the waveguide is formed, and forming a corrugation in the waveguide.

11. The method of the preceding claim 10, further comprising the steps of: before the step of stacking the layers, providing at least two layers with an electronic circuit and electric coupling elements, and stacking the layers so that the electronic circuits are coupled by the electric coupling elements, in order to form a three-dimensional electronic circuit.

12. The waveguide system according to claim 1, wherein a corrugation is formed at each layer in the second section of the waveguide.

13. The waveguide system according to claim 12, wherein the second section of the waveguide is comprised of at least the last three layers of the waveguide.

14. The waveguide system according to claim 12, wherein the first section of the waveguide contains no corrugation.

15. A waveguide system comprising a plurality of stacked layers, the system further comprising a waveguide extending from a first section to a second section in a direction across the layers by providing each layer with a predetermined metal pattern, and at least one of the layers including a cutout inside a corresponding predetermined metal pattern, wherein at least one of the cutouts is larger than the corresponding predetermined metal pattern.

16. The waveguide system according to claim 15, wherein each layer in the second section of the waveguide includes a cutout that is larger than the corresponding predetermined metal pattern.

17. The waveguide system according to claim 16, wherein the second section of the waveguide is comprised of at least the last three layers of the waveguide.

18. The waveguide system according to claim 16, wherein the first section of the waveguide contains no cutouts.

19. The waveguide system according to claim 18, wherein the first section of the waveguide is comprised of at least the first two layers of the waveguide.

20. The waveguide system according to claim 16, wherein the predetermined metal patterns in the second section of the waveguide protrude from the corresponding layer in a direction parallel to the layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a schematic representation of a wave guide system with a Waveguide transition from dielectric WG to corrugated WG according to an embodiment of the present disclosure;

(2) FIG. 2 shows a schematic representation of a wave guide system with a Waveguide transition to a horn antenna according to an embodiment of the present disclosure; and

(3) FIG. 3 shows a schematic representation of a wave guide system with a Waveguide transition to an inverted horn antenna according to an embodiment of the present disclosure.

DESCRIPTION OF THE EMBODIMENTS

(4) Reference will now be made in detail to exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

(5) FIG. 1 shows a schematic representation of a wave guide system with a Waveguide transition from dielectric WG to corrugated WG according to an embodiment of the present disclosure. The shown waveguide system 1 comprises a plurality of stacked layers 2, 6. The layers may be arranged in parallel to each other. The system further comprises a waveguide 3 in a direction across the layers by providing each layer with a predetermined metal pattern 4. The waveguide may extend in a direction perpendicular to the layers 2. The layers 2, 6 may be circuit boards 2, 6, e.g. PCBs. The metal pattern 2 may be printed on the board 6 or provided on its surface in other way. The layers 2, 6 may be separated from each other, in particular by spacers and/or by dielectric or isolating separation layers (not shown).

(6) The metal patterns 4 are desirably electrically connected by wires 7. In other words, two adjacent metal patterns 4 may be electrically connected by one or more wires 7. Desirably there are at least so many wires between two adjacent metal patterns that the distance between to wires is less than the wavelength of the waves, for which the waveguide may be configured (e.g. for 100 GHz or more). The wires may be arranged in a e.g. square form (e.g. 5*4 wires between two adjacent metal patterns) corresponding to the form of the metal patterns. The wires may be arranged in via holes inside the layers.

(7) Typical PCBs may comprise a dielectric coating on their surface (e.g. to protect the PCB against corrosion). This coating may be used in the system to have the effect of a small capacitor.

(8) The metal patterns may have the form of a frame and/or a border with an opening inside. The may have a square and/or rectangular form (e.g. corresponding to the form of the layer (being e.g. a PCB)) or a round form. The resulting waveguide may have a corresponding square and/or rectangular or round form.

(9) As shown in FIG. 1, the layers may comprise cutouts 5 along the waveguide, desirably inside the metal patterns 4. These cutouts may form an opening of the waveguide system. The cutouts are configured such that transmission loss in the waveguide is reduced, what is in particular advantageous at frequencies of transmitted waves of more than 100 GHz.

(10) Said opening may desirably have a conus form (i.e. the waveguide system may form an inverted conus form). In other words the cutouts in the layers may be increasingly large along the waveguide.

(11) However, in a first section of the waveguide comprising a predetermined number of layers (in FIG. 1 e.g. the first two layers) no cutout may be present. At least in this section the waveguide is configured as dielectric waveguide.

(12) The cutouts may become larger than the metal patterns in at least a last section of the waveguide comprising a predetermined number of layers (in FIG. 1 e.g. the last three layers). Accordingly the metal patterns may protrude from the layers in a direction parallel to the layers. Accordingly, the waveguide may form a corrugated waveguide in this last section. Such a corrugated waveguide may be configured for to provide a minimum of reflexion of the transmitted waves.

(13) A waveguide system may comprise e.g. 25 to 30 layers, e.g. PCBs

(14) There may be arranged spacers in between the layers (not shown in the figures).

(15) The layers may be aligned and/or mechanically connected by predefined boreholes in the layers.

(16) Furthermore, also a system of an array of waveguide systems may be provided. In this case at least one of the used layers (e.g. PCBs) may be shared by the plurality of waveguides, desirably at least the first and/or last layer along the waveguides. In other words the shared layers may have a plurality of metal patterns and eventually cutouts, in order to form the array of waveguide systems.

(17) FIG. 2 shows a schematic representation of a wave guide system with a Waveguide transition to a horn antenna according to an embodiment of the present disclosure. The embodiment of FIG. 2 generally corresponds to that one of FIG. 1. However in at least a last section of the waveguide comprising a predetermined number of layers (in FIG. 1 e.g. the last 5 layers) the metal layers may form an increasingly large border along the waveguide, in order to form a horn antenna.

(18) FIG. 3 shows a schematic representation of a wave guide system with a Waveguide transition to an inverted horn antenna according to an embodiment of the present disclosure. In at least a last section of the waveguide comprising a predetermined number of layers (in FIG. 1 e.g. the last 5 layers) the metal layers may form an inverted horn antenna. This may be obtained by the Babinet's principle of a horn antenna. Such an inverted horn antenna has the advantage that effectively larger horns may be created with the same size of used layers.

(19) In the following a method of forming a waveguide (system) according to the disclosure is described.

(20) In a first step, the boundary conditions are specified where metallic surfaces are needed to achieve a certain horn, guide or other function (such as filters and couplers).

(21) In a second step, a direction is specified that will be normal to the layers that are to be created. This direction may be parallel to the direction of propagation of the field but is not limited to.

(22) In a third step, the boundary condition from the first step is sliced in a set of layers, each layer being orthogonal to the direction chosen in the second step. The layer thickness should correspond to the thickness of the printed circuit substrate (i.e. the layer) used below.

(23) In a fourth step, the boundary in each layer is converted into a metallic structure that is printed on the printed circuit board. Eventually via holes are used to connect front and back side of the printed circuit board. Eventually the circuit board substrate may be cut out to form air spaces.

(24) In a fifth step the layers of the printed circuit board are stacked so that the boundary condition from the first step is recreated as a stack of circuit boards.

(25) In creating the boundary condition, it is possible (contrary to conventional waveguide productions) to create boundary conditions that cannot be manufactured using a machining process in a metal block (c.f. inverted horn antenna in FIG. 3, obtained by Babinet's principle of a horn antenna).

(26) The designer may choose freely if the printed circuit board stack will be contacted through or not adding another degree of freedom.

(27) The designer may also choose where to connect the stacks electrically. Additional circuitry (e.g. bias lines) and components (mixers, amplifiers, MMICs) may be mounted on the circuit boards prior to stacking. With the waveguide system of the present disclosure, efficient three dimensional circuits can be created.

(28) Throughout the disclosure, including the claims, the term “comprising a” should be understood as being synonymous with “comprising at least one” unless otherwise stated. In addition, any range set forth in the description, including the claims should be understood as including its end value(s) unless otherwise stated. Specific values for described elements should be understood to be within accepted manufacturing or industry tolerances known to one of skill in the art, and any use of the terms “substantially” and/or “approximately” and/or “generally” should be understood to mean falling within such accepted tolerances.

(29) Furthermore the terms like “upper”, “upmost”, “lower” or “lowest” and suchlike are to be understood as functional terms which define the relation of the single elements to each other but not their absolute position.

(30) Where any standards of national, international, or other standards body are referenced (e.g., ISO, etc.), such references are intended to refer to the standard as defined by the national or international standards body as of the priority date of the present specification. Any subsequent substantive changes to such standards are not intended to modify the scope and/or definitions of the present disclosure and/or claims.

(31) Although the present disclosure herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present disclosure.

(32) It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims.