Method of manufacturing a polymer printed circuit board

Abstract

A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.

Claims

1. A method of manufacturing a polymer printed circuit board comprising in a sequential order steps of: A) providing a material layer consisting of polymer; B) forming circuit pattern on the material layer, wherein the circuit pattern is comprised of laser induced graphene, and the laser induced graphene is porous; C) depositing metal nanoparticles on laser induced graphene (LIG) of the circuit pattern so as to use as a metal seed; D) forming a metal layer on the nanoparticles deposited and the LIG of the circuit pattern; and E) pressing the circuit pattern, the material layer, the metal nanoparticles, and the metal layer in a laminating manner to obtain the polymer printed circuit board.

2. The method as claimed in claim 1, wherein the material layer is a polymer film or a substrate on which the polymer is coated.

3. The method as claimed in claim 1, wherein the polymer is selected from the group of polyimide (PI) and polyetherimide (PEI).

4. The method as claimed in claim 1, wherein the LIG is formed on the material layer in a laser induction reacting process which is controlled by a computer.

5. The method as claimed in claim 4, wherein a predetermined area of the material layer is irradiated by laser beams in the laser induction reacting process, and a temperature of the predetermined area of the material layer rises up to at least 1500° C.

6. The method as claimed in claim 1, wherein the metal seed is selected from the group of platinum, gold, palladium, silver, copper, nickel, and zinc.

7. The method as claimed in claim 1, wherein in the step E), the circuit pattern is pressed in a rolling manner or in a laminating manner.

8. The method as claimed in claim 7, wherein the circuit pattern is pressed and is heated within a room temperature to a temperature of 500° C.

9. The method as claimed in claim 1, wherein the metal layer is formed on the LIG of the circuit pattern in any one of electroplating, electroless plating, and sputtering manners.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a flow chart of a method of manufacturing a polymer printed circuit board according to a first embodiment of the present invention comprise.

(2) FIG. 2 is a schematic view showing the polymer printed circuit board is manufactured by the method of the first embodiment of the present invention comprise.

(3) FIG. 3 is a schematic view showing a polymer printed circuit board is manufactured by a method of a second embodiment of the present invention comprise.

(4) FIG. 4 is a flow chart of a method of manufacturing the polymer printed circuit board according to the second embodiment of the present invention comprise.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(5) With reference to FIG. 1, a method of manufacturing a polymer printed circuit board according to a first embodiment of the present invention comprises steps of:

(6) A. providing a material layer 10 consisting of polymer;

(7) B. forming circuit pattern on the material layer 10, wherein the circuit pattern is comprised of laser induced graphene (LIG) 20, as shown in FIG. 2;

(8) C. depositing metal nanoparticles on the LIG 20 of the circuit pattern so as to use as a metal seed;

(9) D. pressing the circuit pattern; and

(10) E. forming a metal layer 30 on the LIG 20 of the circuit pattern, as illustrated in FIG. 3.

(11) The material layer 10 is a polymer film or a substrate on which the polymer is coated. Preferably, the polymer is selected from the group of polyimide (PI) and polyetherimide (PEI).

(12) The LIG 20 is formed on the material layer 10 in a laser induction reacting process which is controlled by a computer.

(13) Preferably, the material layer 10 is a smooth surface, and the computer controls laser beams to heat a predetermined area of the material layer 10 on which the circuit pattern is formed, and the laser beams burn the polymer of the material layer 10 so as to carbonize or graphitize the polymer, thus producing conductive carbon or porous graphene on the circuit pattern 10, as shown in FIG. 2. Preferably, the predetermined area of the material layer 10 is irradiated by the laser beams and its temperature rises up to at least 1500° C., hence the polymer is carbonized or is graphitized to produce the conductive carbon or the porous graphene.

(14) Preferably, the metal seed is selected from the group of platinum, gold, palladium, silver, copper, nickel, and zinc. And nanoparticles are used as the metal seed in the step E, hence the metal layer 30 connects with the LIG 20 quickly and has electric conductivity, as shown in FIG. 3. The metal layer 30 is formed on the LIG 20 of the circuit pattern in any one of electroplating, electroless plating, and sputtering manners so as to produce the polymer printed circuit board.

(15) In the step D, the circuit pattern is pressed in a rolling manner or in a laminating manner by using a machine so that the circuit pattern is adhered on the material layer 10 securely and has outstanding electric conductivity. Preferably, the circuit pattern is pressed in a hot pressing manner in the step D and is heated within a room temperature to a temperature of 500° C.

(16) Referring to FIG. 4, a method of manufacturing a polymer printed circuit board according to a second embodiment of the present invention comprises steps of:

(17) A. providing a material layer 10 consisting of polymer;

(18) B. forming circuit pattern on the material layer 10, wherein the circuit pattern is comprised of laser induced graphene (LIG) 20;

(19) C. depositing metal nanoparticles on the LIG 20 of the circuit pattern so as to use as a metal seed;

(20) D. forming a metal layer 30 on the LIG 20 of the circuit pattern; and

(21) E. pressing the circuit pattern on which the metal layer 30 is formed.

(22) Thereby, the circuit pattern is adhered on the material layer 10 securely and has outstanding electric conductivity after being pressed in the step E.

(23) While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.