Pyroelectric sensor with improved abrasion-resistance coating

Abstract

A thermal pattern sensor including a plurality of pixels arranged on a substrate. Each pixel has a pyroelectric capacitance formed by at least one pyroelectric material portion arranged between a lower electrode and an upper electrode. The sensor has an abrasion-resistance coating, located on the side opposite the substrate and including pillars embedded in an abrasion-resistance layer, the pillars having a thermal conductivity strictly higher than that of the abrasion-resistance layer. A high thickness of the anti-abrasion protection coating can be achieved with a high rate of thermal transfer through the latter.

Claims

1. A thermal pattern sensor comprising a plurality of pixels arranged on a substrate, each pixel having at least one pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between at least one lower electrode and at least one upper electrode, with the lower electrode arranged between the substrate and the pyroelectric material portion, said sensor including an external anti-abrasion protection coating, located on the side opposite the substrate, characterized in that the anti-abrasion protection coating includes a abrasion-resistance layer, and a plurality of pillars distributed in the abrasion-resistance layer, the pillars having a thermal conductivity strictly greater than that of the abrasion-resistance layer.

2. The sensor according to claim 1, wherein the anti-abrasion protection coating has a thickness (h) greater than or equal to 5% of a pixel repetition pitch of the thermal pattern sensor.

3. The sensor according to claim 1, wherein the anti-abrasion protection coating has a thickness (h) greater than or equal to 3 μm.

4. The sensor according to claim 1, wherein the thickness of the anti-abrasion protection coating is greater than or equal to the height (h.sub.A) of the pillars, with said thickness and said height each defined according to an axis orthogonal to the plane of the substrate, and wherein a difference between the thickness (h) of the anti-abrasion protection coating and the height (h.sub.A) of the pillars is less than or equal to 5% of the height (h.sub.A) of the pillars.

5. The sensor according to claim 1, wherein each pixel of the sensor comprises a portion of the anti-abrasion protection coating, said portion comprising a single pillar.

6. The sensor according to claim 1, wherein the pillars of the anti-abrasion protection coating have a thermal conductivity at least ten times greater than that of the abrasion-resistance layer.

7. The sensor according to claim 1, wherein the pillars of the anti-abrasion protection coating include a metal or graphene.

8. The sensor according to claim 1, wherein the abrasion-resistance layer includes a benzocyclobutene-based material.

9. The sensor according to claim 1, wherein the abrasion-resistance layer is made of an electrically insulating material.

10. The sensor according to claim 1, wherein the pixels of the sensor are arranged in rows and columns, wherein each pixel also comprises a heating element capable of heating, by the Joule effect, the pyroelectric material portion of said pixel, and wherein: the heating elements of the same row of pixels are formed together in a single piece, in the same heating strip; in each pixel, one of the upper electrode and lower electrode forms a charge collection electrode, and the charge collection electrodes of the same pixel column are formed together in a single piece in a charge collection macroelectrode; and each pillar of the anti-abrasion protection coating extends through an intersection region between an orthogonal projection of a heating strip and an orthogonal projection of a charge collection macroelectrode, in a plane parallel to the plane of the substrate.

11. The sensor according to claim 1, wherein the pillars of the anti-abrasion protection coating are each constituted by a plurality of basic pillars, superimposed according to an axis orthogonal to the plane of the substrate.

12. A method for producing the anti-abrasion protection coating of a sensor according to claim 1, said method comprising a step of producing the pillars using an ink based on metal and/or graphene particles.

13. The method according to claim 12, wherein the step of producing the pillars includes one or more localized depositions of ink, with an inkjet printer.

14. The method according to claim 12, wherein the production of the anti-abrasion protection coating comprising the following steps: producing the abrasion-resistance layer, equipped with through-openings distributed according to a plane parallel to the plane of the substrate; and filling the through-openings with metal and/or graphene particle-based ink.

15. The method according to claim 14, for producing a sensor, comprising the following steps: depositing a photosensitive layer, on a stack including the substrate, the pyroelectric capacitances and the heating elements; illuminating the photosensitive layer from the side of the substrate, with an etching light beam the power of which is suitable for passing through said stack except where a heating strip and a charge collection macroelectrode are superimposed; and filling the openings etched in the photosensitive layer with the material of the abrasion-resistance layer.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The present invention will be easier to understand on reading the description of examples of embodiments provided purely as a non-limiting indication, with reference to the appended figures, in which:

(2) FIGS. 1A and 1B schematically show a first embodiment of a thermal pattern sensor according to the invention;

(3) FIG. 1C shows an alternative of the embodiment of FIGS. 1A and 1B;

(4) FIGS. 2A and 2B show a comparison of the thermal performances of a thermal pattern sensor according to the prior art or according to the invention;

(5) FIGS. 3A and 3B schematically show a second embodiment of a thermal pattern sensor according to the invention;

(6) FIG. 3C shows an alternative of the embodiment of FIGS. 3A and 3B; and

(7) FIGS. 4 to 6 schematically show different embodiments of a method for producing a thermal pattern sensor according to the invention.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

(8) For greater clarity, the axes (Ox), (Oy) and/or (Oz) of an orthonormal reference system are shown in the figures. The figures, and in particular the thicknesses of each of the layers and/or stages and/or coating, are not drawn to scale.

(9) FIGS. 1A and 1B schematically show a first embodiment of a thermal pattern sensor 100 according to the invention. FIG. 1A is a schematic top view, in a plane parallel to the plane (xOy). FIG. 1B is a cross-section view in a plane AA′ parallel to the plane (yOz).

(10) The thermal pattern sensor 100 comprises, superimposed on a substrate 110, according to the axis (Oz) orthogonal to an upper or lower face of said substrate: a stage 120 referred to as the lower electrode stage; a stage 130 including a pyroelectric material; an electromagnetic shielding stage 140, in this case also forming an upper electrode common to the pixels of the sensor 100; an electric insulation layer 160; a heating stage 170; and an anti-abrasion protection coating 180.

(11) This stack forms a pixel array in which each pixel comprises a pyroelectric capacitance, formed by a pyroelectric material portion arranged between a lower electrode, on the substrate side, and an upper electrode, on the side opposite the substrate. In this case, but in a non-limiting manner, the lower electrodes form charge collection electrodes as described in the introduction, and the at least one upper electrode forms a reference electrode as described in the introduction.

(12) The substrate 110 is, for example, made of glass, silicon, a plastic such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (film Kapton), etc. It is preferably a flexible substrate, for example a polyimide substrate with a thickness of 5 μm to 10 μm, or plastic, such as PET. It has an upper face and a lower face parallel to one another, and parallel to the plane (xOy). Below, the plane of the substrate refers to a plane parallel to said lower and upper faces.

(13) The lower electrode stage 120 in this case comprises a charge collection electrode array 121, arranged in rows and columns according to the axes (Ox) and (Oy). The charge collection electrodes consist of a metal such as gold or silver, or any other electrically conductive material. They are distributed according to the axes (Ox) and (Oy), according to a repetition pitch less than or equal to 150 μm. The repetition pitch is, for example, around 80 μm, or 90 μm, or 50.8 μm.

(14) The stage 130 including a pyroelectric material is in this case formed by a solid layer consisting of polyvinylidene fluoride (PVDF) or one of the derivatives thereof (in particular the copolymer PVDF-TrFE, TrFE for trifluoroethylene). Alternatively, the layer 130 includes aluminium nitride (AlN), barium titanate (BaTiO.sub.3), lead zirconate titanate (PZT), or any other pyroelectric material. The layer 130 extends in this case but in a non-limiting manner, in a single piece, and without an opening, covering all of the charge collection electrodes 121 of the stage 120.

(15) The electromagnetic shielding stage 140 forms an electrically conductive stage, capable of being connected to a constant potential source, for example the ground. It is constituted, for example, by a thin layer of an electrically and thermally conductive material, such as a mixture of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate, referred to as PEDOT: PSS. The electromagnetic shielding stage 140 forms a stage separate from the anti-abrasion protection stage 180. According to the circumstances, it may have a heterogeneous structure consisting of thermally conductive pads in an electrically conductive and thermally insulating layer.

(16) In this case, the stage 140 also forms a reference electrode, common to all of the pixels of the pixel array. The pixels are therefore laterally defined by the charge collection electrodes 121 alone. Each portion of the layer 130, located opposite a charge collection electrode 121, forms the pyroelectric material portion of a pixel. Similarly, each portion of the stage 140, located opposite a charge collection electrode 121, forms the reference electrode of a pixel.

(17) The electrical insulation layer 160 is constituted by a dielectric material, for example polyimide. It preferably has a thickness of less than 5 μm, for example equal to 1 μm.

(18) According to the embodiment of FIGS. 1A and 1B, each pixel of the pixel array also comprises a heating element 171. All of the heating elements 171 are located in the heating stage 170. The heating elements 171 are capable of receiving a heating current, in order to provide Joule heating so as to carry out an active detection. They are preferably constituted by a metal, for example gold or silver.

(19) The anti-abrasion protection coating 180, or the anti-abrasion protection stage, forms the outermost stage of the sensor. An upper face 181 of said coating, on the side opposite the substrate 110, forms a contact surface of the sensor. In operation, an object to be imaged is applied against said contact surface 181, so as to carry out thermal exchanges with the stage 130 including a pyroelectric material. The anti-abrasion protection coating 180 is intended to protect the lower layers (between the contact surface 181 and the substrate 110) from wear associated with repeated contacts with an object to be imaged, in particular the skin. According to the invention, the anti-abrasion protection coating 180 is constituted by: an abrasion-resistance layer 182 made of a material that is a poor thermal conductor; and a plurality of pillars 183 made of a material that is a good thermal conductor.

(20) The thermal conductivity of the pillars 183 is at least ten times greater than that of the abrasion-resistance layer 182, and even at least one hundred times, or even at least one thousand times greater. This ratio between the thermal conductivities is reflected in a ratio between the thermal transfer rates, via the pillars and via the abrasion-resistance layer, respectively.

(21) During operation, heat flows quickly through the anti-abrasion protection coating 180 according to the axis (Oz) orthogonal to the plane of the substrate 110, preferably passing through the pillars 183.

(22) However, heat does not flow easily from one pillar 183 to another, as it passes through the abrasion-resistance layer 182. Consequently, the heat flows slowly in the anti-abrasion protection coating 180, in a plane (Oxy) parallel to the plane of the substrate 110.

(23) The abrasion-resistance layer 182 must be both a poor thermal conductor and a poor electrical conductor to avoid short-circuiting the heating elements 171. This offers great freedom in the choice of the material constituting the abrasion-resistance layer 182. In addition, the latter may be constituted by a material that must have a high thickness in order to provide sufficient abrasion resistance, without affecting the rate of thermal transfers according to (Oz).

(24) In addition, and since the abrasion-resistance layer 182 is made of a material that is a poor thermal conductor, the heat remains confined in a pillar 183, and does not pass easily from one pillar 183 to the adjacent pillar, and therefore from one pixel to the adjacent pixel. Thus, a lateral diffusion of the heat in the anti-abrasion protection coating 180 is limited, as it would otherwise affect the quality of the image acquired at the pyroelectric capacitances.

(25) The pillars 183 are constituted, for example, by a material having a thermal conductivity greater than or equal to 50 W.Math.m.sup.−1K.sup.−1, and even greater than or equal to 100 W.Math.m.sup.−1K.sup.−1, for example between 100 W.Math.m.sup.−1K.sup.−1 and 500 W.Math.m.sup.−1K.sup.−1.

(26) The pillars 183 include, for example, a metal such as silver, gold, copper, aluminium, etc. They are, for example, produced by means of a metal-based ink, in particular a silver-based ink. When the pillars are produced by means of a metal-based ink, they are constituted by metal particles attached to one another, with a higher or lower percentage of volumetric occupancy by the metal. The pillars thus have a thermal conductivity below that of the pure metal. In its pure form, silver has a thermal conductivity of 429 W.Math.m.sup.−1K.sup.−1. Pillars produced with a silver-based ink have a thermal conductivity below 429 W.Math.m.sup.−1K.sup.−1 and greater than or equal to 69 W.Math.m.sup.−1K.sup.−1, or even greater than or equal to 100 W.Math.m.sup.−1K.sup.−1.

(27) Alternatively, the pillars 183 may include graphene (two-dimensional material, the stack of which forms graphite, graphite being a crystallized form of carbon). They may be constituted entirely by graphene.

(28) The abrasion-resistance layer 182 is preferably constituted by a material having a thermal conductivity less than or equal to 10 W.Math.m.sup.−1K.sup.−1, and even less than or equal to 1 W.Math.m.sup.−1K.sup.−1, for example between 0.1 W.Math.m.sup.−1K.sup.−1 and 1 W.Math.m.sup.−1K.sup.−1. It may be constituted by a resin, in particular a polymer resin including benzocyclobutene (BCB) or a polymer epoxide resin.

(29) It advantageously has a thickness greater than or equal to 3 μm, preferably greater than or equal to 10 μm (dimension according to the axis (Oz) orthogonal to the plane of the substrate). Owing to the pillars 183, this thickness may be greater than or equal to 30 μm, and even greater than or equal to 50 μm, or even greater than or equal to 100 μm. Preferably, a ratio between the thickness of the abrasion-resistance layer 182 and a pixel repetition pitch of the sensor is greater than or equal to 0.05 or even greater than or equal to 0.1 and even greater than or equal to 1.

(30) In this case, the pillars 183 are distributed regularly, in rows and columns, so that each pixel of the pixel array has a single pillar 183. Preferably, the geometric centre of a pillar 183 and the geometric centre of the associated pixel are aligned according to an axis parallel to the axis (Oz).

(31) The pillars 183 have, for example, a shape of a cylinder of revolution, having: a diameter D (dimension in a plane parallel to the plane of the substrate 110); and a height h (dimension according to the axis (Oz), orthogonal to the plane of the substrate 110).

(32) In this case, each pillar 183 extends, according to the axis (Oz), over the entire thickness of the abrasion-resistance layer 182, and without protruding above or below the latter. Each pillar 183 therefore has a height h equal to the thickness of the abrasion-resistance layer 182.

(33) The diameter D is less than the pixel pitch of the pixel array, so that two adjacent pillars 183 are physically insulated from one another, by a portion of the abrasion-resistance layer 182. Said diameter D is between, for example, 10 μm and 120 μm, and preferably between 40 μm and 60 μm.

(34) In alternatives in which the pillars have a non-circular cross-section in a plane parallel to the plane of the substrate, the diameter D is defined as being the greatest length measured on the pillar, according to a rectilinear axis located in a plane parallel to the plane of the substrate.

(35) FIG. 1C shows, according to a cross-section view in a plane parallel to the plane (yOz), an alternative 100′ of the embodiment of FIGS. 1A and 1B. This alternative 100′ differs from that of FIGS. 1A and 1B only in that the pillars 183′ do not extend over the entire thickness of the abrasion-resistance layer 182′. It is thus possible to distinguish two superimposed regions, in the anti-abrasion protection coating 180′: a lower stage 18A, on the substrate 110′ side, receiving the pillars 183′; and an upper stage 18B, on the side opposite the substrate 110′ side, without pillars.

(36) The lower stage 18A has the same height h.sub.A as the pillars (dimension according to (Oz)). The pillars 183′ extend into the lower stage 18A, over the entire thickness thereof, without protruding above or below the latter.

(37) The upper stage 18B has a height h.sub.B less than or equal to 5% of the height h.sub.A of the pillars (dimension according to (Oz)). In other words, a difference between the height of the pillars 183′ and the total height h of the abrasion-resistance layer 182′ is less than or equal to 5% of the height h.sub.A of the pillars. In practice, this difference is generally less than or equal to 1 μm. The upper stage encapsulates the pillars 183′. Owing to its thickness, or reduced height, the advantages mentioned above are preserved.

(38) According to other alternatives, which are not shown, the pillars have non-circular cross-sections in planes parallel to the plane of the substrate, for example square or rectangular cross-sections.

(39) FIGS. 2A and 2B show a comparison between: a thermal pattern sensor according to the invention, of the type shown in FIGS. 1A and 1B, with an anti-abrasion protection coating having a thickness of 10 μm, silver pillars; and a thermal pattern sensor according to the prior art, with a homogeneous PET (polyethylene terephthalate) protection layer having a thickness of 10 μm.

(40) In both cases, the pixels are distributed according to a square grid with a pitch equal to 80 μm.

(41) In FIG. 2A, the curves 11A and 11B, show, as a function of time, a quantity of charges generated (electrical capacity) at a pixel of the sensor according to the prior art, when the pixel is covered with water (material thermally equivalent to the skin, and therefore with a ridge of a papillary print), and air (equivalent to a valley of a papillary print), respectively.

(42) Curves 12A and 12B show, as a function of time, a quantity of charges generated at a pixel of the sensor according to the invention, when the pixel is covered with water and air, respectively.

(43) In these different simulations, the heating element associated with the pixel is activated for 1 ms.

(44) The difference between the curves associated respectively with air and with water is much greater in the case of the sensor according to the invention. The invention therefore makes it possible to improve the contrast of an image acquired by means of the thermal pattern sensor.

(45) In addition, the difference between the two curves associated respectively with air and with water reaches significant values from the start of the measurement (just 100 μs), while in the prior art it must reach around 1 millisecond before a satisfactory contrast is obtained. The invention therefore makes it possible to reduce (in this case by a factor of 10) a pixel readout rate of the thermal pattern sensor.

(46) FIG. 2B shows the difference, as a function of time, between the number of pyroelectric charges generated in a pixel covered by water or by air, in a thermal pattern sensor according to the prior art (curve 21) and in a thermal pattern sensor according to the invention (curve 22), respectively.

(47) The observations mentioned above are summarized as follows: increase in contrast (in this case by a factor of 5 after one millisecond), and increase in heating (and cooling) rate: the curve 22 quickly reaches high values (then quickly returns to low values).

(48) The effect on contrast enables the electric power supplied to the heating elements to be reduced, without affecting the contrast by comparison with the prior art.

(49) The increase in heating and cooling rates of the pixel makes it possible to reduce the time necessary for reading the pixels of a thermal pattern sensor.

(50) FIGS. 3A and 3B schematically show a second embodiment of a thermal pattern sensor 200 according to the invention. FIG. 3A is a schematic top view, in a plane parallel to the plane (xOy). FIG. 3B is a cross-section view in a plane BB′ parallel to the plane (xOz).

(51) In said second embodiment, each pixel has a heating element, and said heating elements are used to carry out a passive addressing of the pixels of the sensor.

(52) The heating elements of the same row of pixels are electrically connected to one another to form a heating strip 271. Each heating strip 271 is configured so as to be capable of being activated independently of the other heating strips. In other words, the heating elements of the pixels of the same row of pixels are capable of heating the pyroelectric material portions of the pixels of said row, independently of the heating elements of the pixels of the other rows. The heating strips 271 each have a first end, suitable for being connected to a non-zero electric potential, and a second end, preferably connected to the ground. In this case, the second ends of all of the heating strips are connected to one another by means of a conductive portion 273.

(53) In addition, the charge collection electrodes of the same column of pixels are electrically connected to one another to form a charge collection macroelectrode 221. Each charge collection macroelectrode 221 is formed by an electrically conductive strip, in contact with the pyroelectric material portions of the pixels of said column of pixels, and separate from the electrically conductive strips forming the charge collection macroelectrodes of the other columns of pixels.

(54) Each charge collection macroelectrode 221 makes it possible to measure the sum of the pyroelectric charges, generated in the same pixel column. If, in each instant, only one heating strip 271 is activated, in each column of pixels, there is only one pixel that generates pyroelectric charges. The pyroelectric charges collected by the charge collection macroelectrode 221 thus concern this single pixel. Thus, a passive addressing of the pixels of the sensor is carried out.

(55) The terms “row” and “column” may be used interchangeably, which would correspond to a simple 90° rotation of the sensor.

(56) In this case, the charge collection electrodes of the same column of pixels are distributed, according to the axis (Ox), according to a repetition pitch less than or equal to 150 μm, for example 90 μm, or 80 μm, or 50.8 μm.

(57) The heating strips 271 of the heating stage 270 are distributed in this case according to the axis (Oy), preferably according to a repetition pitch identical to the repetition pitch of the charge collection macroelectrodes 221.

(58) Each pixel of the pixel array is laterally defined by the intersection between a charge collection macroelectrode 221 and a heating strip 271. In particular, each pixel is defined laterally, in planes parallel to the plane of the substrate 220, by the intersection between the orthogonal projection of a charge collection macroelectrode 221 in such a plane, and the orthogonal projection of a heating strip 271 in said same plane.

(59) Each pixel receives a single pillar 283 of the anti-abrasion protection stage 280. This pillar therefore extends, in the anti-abrasion protection stage 280, within a defined region, in planes parallel to the plane of the substrate 220, by the intersection between the orthogonal projection of a charge collection macroelectrode 221 in such a plane and the orthogonal projection of a heating strip 271 in said same plane.

(60) FIG. 3C shows an alternative 200′ that differs from the embodiment of FIGS. 3A and 3B only by the order of stacking of the different layers, stages and coatings constituting the sensor. In particular, the thermal pattern sensor 200′ has, superimposed in this order on top of the substrate 210′: the stage 220′ of charge collection electrodes, distributed into macroelectrodes parallel to one another; the stage 230′ including a pyroelectric material; the heating stage 270′, comprising heating strips parallel to one another, each heating strip being capable also of forming a reference electrode common to all of the pixels of a row of pixels; the electric insulation layer 260′; the electromagnetic shielding 240′; and the anti-abrasion protection coating 280′.

(61) In these two alternatives, the heating stage extends between the stage including a pyroelectric material and the anti-abrasion protection coating, with, according to the circumstances, intermediate layers between the heating stage and the stage including a pyroelectric material, and between the heating stage and the anti-abrasion protection coating, respectively.

(62) The invention is not limited to the examples described above, and numerous alternatives may be implemented without going beyond the scope of the invention.

(63) In particular, the invention applies to any type of thermal sensor including pyroelectric capacitances, with or without heating elements, with or without heating elements, with heating elements that are separate or grouped into heating strips. In particular, the invention is not limited to an active detection, and also covers sensors suitable for passive detection, without a heating element for heating the pyroelectric material portions.

(64) The invention is not limited to an arrangement of the pixels so that the lower electrode forms the charge collection electrode either. The pyroelectric charge collection may be performed by the upper electrode.

(65) The invention applies more specifically to sensors in which a distance between the contact surface and the plane of the upper faces of the lower electrodes of the pyroelectric capacitances is greater than or equal to 25% of the pixel pitch of the sensor, or even 50% of said pixel pitch (thick anti-abrasion protection coating). Advantageously, however, this distance remains less than or equal to said pixel pitch.

(66) When the dimensions of the pixel allow it, each pixel of the pixel array may include a plurality of pillars.

(67) The sensor may include at least one readout circuit, for measuring a quantity of charges collected by a charge collection electrode, and, as the case may be, at least one circuit for controlling the heating, for sending electrical signals making it possible to heat the pixels of the sensor by means of the heating elements. It may also include an electronic processing circuit capable of constructing an overall image of the thermal pattern, on the basis of measurements obtained at each of the pixels of the sensor.

(68) The thermal pattern capable of being imaged by the sensor may be a papillary print, or any other pattern associated with an object having a thermal capacity and a specific heat.

(69) The abrasion-resistance layer may be constituted by an electrically insulating material. The anti-abrasion protection coating then forms, as a whole, an electrically insulating coating since the electrically conductive pillars are insulated from one another by the electrically insulating material of the abrasion-resistance layer. Thus, a short-circuiting of the heating elements located directly below is avoided.

(70) Alternatively, the anti-abrasion protection coating may be electrically conductive, and, according to the circumstances, also provide protection against electrostatic discharges. Preferably, its electrical conductivity is low enough with respect to that of the heating elements that it does not disrupt their operation, but is sufficient for discharging an electrostatic discharge.

(71) Various advantageous embodiments for producing the anti-abrasion protection coating according to the description are described below.

(72) According to a first embodiment, schematically shown in FIG. 4, the pillars 483 of the anti-abrasion protection coating are formed by localized deposits of a metallic ink, for example by means of an inkjet printer.

(73) To produce high pillars greater than 15 μm, multiple series of basic pillars 483A, 483B, 483C, are successively deposited, each pillar being formed by superimposing, according to axis (Oz), multiple basic pillars. It is not necessary for the lateral and transverse alignment (in a plane parallel to the plane of the substrate 410) of the basic pillars 483A, 483B, 483C to be perfect.

(74) Then, an abrasion-resistant and thermally insulating material is deposited, which is inserted between the pillars and forms the abrasion-resistance layer.

(75) Alternatively, it is possible to first deposit the abrasion-resistance layer so that it extends without an opening over the substrate, then to transform it in the locations of the pillars. The transformation here refers to a local etching, or a local exposure that locally modifies the physical properties of the material, in particular its thermal conduction. According to the circumstances, the method then includes a step of producing pillars in the etched openings.

(76) To etch the abrasion-resistance layer in the desired locations, it is possible simply to use a mask with openings in the desired locations for the pillars.

(77) FIG. 5 shows an alternative, taking advantage of the arrangement shown in FIGS. 3A to 3C, in which the charge collection electrodes of the same column of pixels are formed together in a single piece in the same macroelectrode, the heating elements of the same row of pixels are formed together in a single piece in the same heating strip, and the pillars are located at the intersection between the orthogonal projection of a heating strip and the orthogonal projection of a charge collection macroelectrode.

(78) In the method of FIG. 5, a photosensitive material layer 585 is deposited on a stack 501 comprising the substrate 510, the pyroelectric capacitances and the heating elements.

(79) Then, the photosensitive material layer 585 is insulated from the rear, i.e. from the side of the substrate 510. The different elements comprising the stack 501 are substantially transparent to the wavelength of the exposure light beam 586, except for the charge collection macroelectrodes and the heating strips made of metal. The power of the exposure light beam 586 is adapted so that said beam passes through the stack 501, except in the locations where a charge collection macroelectrode and a heating strip are superimposed according to the axis (Oz). Thus, the photosensitive material layer 585 is etched throughout, except in these locations.

(80) The material of the abrasion-resistance layer is then deposited in the etched openings of the photosensitive material layer 585. Then, the remaining portions of said photosensitive material layer 585 are etched, and they are filled with the material of the pillars.

(81) A self-alignment of the pillars on the pixels of the pixel array is thus achieved.

(82) Regardless of the method implemented in order to produce an abrasion-resistance layer having etched openings, different solutions may be implemented in order to fill said openings with the material of the pillars.

(83) According to a first alternative, the filling is performed by screen printing, with an ink based on a metal such as silver, which is deposited on the abrasion-resistance layer and scraped in order to bring it into the etched openings. The abrasion-resistance layer is advantageously constituted by a material to which the ink does not adhere, so that the ink binds only in the etched openings. For this, the abrasion-resistance layer may include or be constituted by benzocyclobutene, advantageously annealed at a temperature greater than or equal to 150° C. Vacuum annealing may be implemented in order to help the ink penetrate the etched openings, for example at a pressure less than or equal to 10 mbar.

(84) According to another alternative, it is possible to grow a metal from the bottom of the etched openings, from the metal of the heating strips flush with the bottom of said etched openings. This alternative uses a bath comprising metal particles mixed with a catalyst.

(85) In said two alternatives, an upper region of the etched openings may be reserved for a fine encapsulation layer covering and protecting the pillars located below.

(86) In each of the methods described above, the abrasion-resistance layer may be produced by a plurality of successive depositions of basic layers that are superimposed one on top of another according to the axis (Oz).

(87) FIG. 6 shows a third embodiment, using a buffer 687, the recesses and protuberances of which are adapted to the desired positions of the pillars.

(88) In this case, a solid layer 688 of a metallic ink is deposited on top of a stack 601 comprising the substrate 610, the pyroelectric capacitances and the heating elements. The buffer 687 having recesses 687A is then pressed at the desired locations of the pillars, so that the ink is preserved only in the locations of said recesses 687A.

(89) Numerous alternatives using a buffer may be implemented, in which: droplets of a metallic ink are deposited, instead of a solid layer of metallic ink, before the buffer is pressed; the recesses of the buffer are filled with a metallic ink, then the assembly is applied to the stack as defined above, so that the ink in the recesses of the buffer adheres to the stack and detaches from the buffer when the latter is removed; a droplet of a metallic ink is deposited at the inlet of each recess of the buffer, then the assembly is applied to the stack as defined above, so that the ink droplets adhere to the stack and detach from the buffer when the latter is removed; the metallic ink is applied instead on the protuberances of the buffer, then the assembly is applied to the stack as defined above, so that the ink on the protuberances of the buffer adheres to the stack and detaches from the buffer when the latter is removed (the position of the recesses and the protuberances of the buffer is adapted as a consequence); etc.

(90) Numerous other methods may be implemented, and may or may not use an ink to produce the pillars of the anti-abrasion protection coating, and which may use an ink based on metal particles and/or based on graphene particles.

(91) For example, it is possible to use an anisotropic adhesive comprising metallic beads, for example silver, of suitable sizes. A layer of said adhesive is deposited onto a stack as described in reference to FIG. 6, then pressure is applied on said adhesive layer so as to crush the metallic balls. Each metallic ball thus forms a pillar according to the invention. Preferably, the pressure is exerted at the same time that heat is applied, which makes it possible to polymerize the adhesive receiving the metallic beads, which then forms the thermally insulating layer of the anti-abrasion protection coating. According to the circumstances, a fine polyimide layer is inserted between the anisotropic adhesive layer and a pressure application surface, so as to prevent the adhesive from adhering to said application surface.

(92) According to another example, the metallic pillars may be produced by means of techniques derived from the so-called “flip chip” bonding technique. Such a bond is normally intended for the electrical connection between electrically conductive tracks superimposed according to the axis (Oz), and uses a metallic bead inserted between said two tracks, according to the axis (Oz). For example, an electric insulator is deposited onto a stack as described in reference to FIG. 6, then openings are etched in the locations intended for the pillars, and said openings are filled with copper. Finally, the pillars are formed on the copper deposits by techniques for depositing tin-lead on copper.