ELECTRONIC SHELF LABEL AND METHOD FOR ASSEMBLING THE SAME
20210225206 · 2021-07-22
Assignee
Inventors
Cpc classification
H05K5/0052
ELECTRICITY
H05K5/006
ELECTRICITY
H05K1/141
ELECTRICITY
H05K1/18
ELECTRICITY
International classification
Abstract
An electronic shelf label and a method for assembling the same. The electronic shelf label including: a housing (10), the housing including a front housing (12) and a rear housing (11), the front housing (12) and the rear housing (11) being coupled with each other, a chamber (13) being provided between the front housing (12) and the rear housing (11), the rear housing (11) including an opening (111); a motherboard (31), the motherboard (31) being located in the chamber; a back plate (32), the back plate (32) covering the opening (111), the motherboard (31) being detachably coupled to the back plate (32), the back plate (32) being detachably coupled to the rear housing (11), and an orthographic projection of the back plate (32) in a plane where the rear housing (11) is located being located in the rear housing (11). By reasonably setting the positions of the motherboard (31) and the back plate (32), the overall volume of the electronic shelf label is effectively reduced, and the beneficial effects of compact structure and easy installation are achieved.
Claims
1. An electronic shelf label, comprising: a housing, the housing comprising a front housing and a rear housing, the front housing and the rear housing being coupled with each other, a chamber being provided between the front housing and the rear housing, the rear housing comprising an opening; a motherboard, the motherboard being located in the chamber; a back plate, the back plate covering the opening, the motherboard being detachably coupled to the back plate, the back plate being detachably coupled to the rear housing, and an orthographic projection of the back plate in a plane where the rear housing is located is located in the rear housing.
2. The electronic shelf label according to claim 1, wherein the back plate together with the motherboard is detachably coupled to the rear housing.
3. The electronic shelf label according to claim 1, wherein the motherboard is configured to pass through the opening of the rear housing to reach the chamber.
4. The electronic shelf label according to claim 1, further comprising: a circuit board, wherein the circuit board is located on a side of the motherboard facing towards the back board, and the circuit board is fixed to the motherboard.
5. The electronic shelf label according to claim 4, wherein a gap is provided between the motherboard and the back plate, a height of the gap is greater than or equal to a height of the circuit board.
6. The electronic shelf label according to claim 4, wherein the motherboard comprises a communication interface, the back plate has a convex portion, the convex portion has a cavity for accommodating the communication interface.
7. The electronic shelf label according to claim 6, wherein the communication interface comprises a power interface, the power interface is located on a surface of the motherboard facing towards the back plate, the back plate is provided with a first convex portion at a position corresponding to the power interface, the first convex portion covers the power interface.
8. The electronic shelf label according to claim 7, wherein the first convex portion comprises a first via hole, an end of the power interface and the first via hole are connected with each other, an end of the first convex portion away from the back plate is flush with an end of the power interface away from the motherboard.
9. The electronic shelf label according to claim 7, wherein the communication interface further comprises a network interface, the network interface is located on the surface of the motherboard facing towards the back plate, the back plate is provided with a second convex portion at a position corresponding to the network interface, the second convex portion covers the network interface.
10. The electronic shelf label according to claim 9, wherein the second convex portion comprises a second via hole, an end of the network interface and the second via hole are connected with each other, an end of the second convex portion away from the back plate is flush with an end of the network interface away from the motherboard.
11. The electronic shelf label according to claim 10, wherein the network interface and the power interface are located on a same surface of the motherboard, and the network interface and the power interface are adjacent to each other, the second convex portion and the first convex portion are coupled to each other.
12. The electronic shelf label according to claim 11, wherein the second convex portion, the first convex portion, and the back plate are formed as an integral structure.
13. The electronic shelf label according to claim 11, wherein the motherboard is detachably coupled to the back plate by a first fastener, and the back plate is detachably coupled to the rear housing by a second fastener, the first fastener is closer to the circuit board than the second fastener.
14. The electronic shelf label according to claim 3, wherein the motherboard and the rear housing are located on a same side of the back plate, an area of the opening is larger than an area of the motherboard, so that the motherboard passes through the opening of the rear housing.
15. A method for assembling an electronic shelf label, the electronic shelf label, comprising: a housing, the housing comprising a front housing and a rear housing, the front housing and the rear housing being coupled with each other, a chamber being provided between the front housing and the rear housing, the rear housing comprising an opening; a motherboard, the motherboard being located in the chamber; a back plate, the back plate covering the opening, the motherboard being detachably coupled to the back plate, the back plate being detachably coupled to the rear housing, and an orthographic projection of the back plate in a plane where the rear housing is located is located in the rear housing; the method comprising: coupling the front housing with the rear housing to form the chamber; fixing the motherboard to the back plate; and fixing the back plate to the rear housing, wherein at a same time of fixing the back plate to the rear housing, the motherboard passes through the opening of the rear housing and reaches the chamber.
16. The electronic shelf label according to claim 2, wherein the motherboard is configured to pass through the opening of the rear housing to reach the chamber.
17. The electronic shelf label according to claim 2, further comprising: a circuit board, wherein the circuit board is located on a side of the motherboard facing towards the back board, and the circuit board is fixed to the motherboard.
18. The electronic shelf label according to claim 3, further comprising: a circuit board, wherein the circuit board is located on a side of the motherboard facing towards the back board, and the circuit board is fixed to the motherboard.
19. The electronic shelf label according to claim 8, wherein the communication interface further comprises a network interface, the network interface is located on the surface of the motherboard facing towards the back plate, the back plate is provided with a second convex portion at a position corresponding to the network interface, the second convex portion covers the network interface.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to clearly illustrate the technical solution of the embodiments of the disclosure, the drawings of the embodiments will be briefly described in the following; it is obvious that the described drawings are only related to some embodiments of the disclosure and thus are not limitative of the disclosure.
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[0022]
DETAILED DESCRIPTION
[0023] In order to make objects, technical details and advantages of the embodiments of the disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the disclosure. Apparently, the described embodiments are just a part but not all of the embodiments of the disclosure. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the disclosure.
[0024] Unless otherwise defined, all the technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms “first,” “second,” etc., which are used in the description and the claims of the present disclosure, are not intended to indicate any sequence, amount or importance, but distinguish various components. The terms “comprises,” “comprising,” “includes,” “including,” etc., are intended to specify that the elements or the objects stated before these terms encompass the elements or the objects and equivalents thereof listed after these terms, but do not preclude the other elements or objects. The phrases “connect”, “coupled”, etc., are not intended to define a physical connection or mechanical connection, but may include an electrical connection, directly or indirectly. “On,” “under,” “right,” “left” and the like are only used to indicate relative position relationship, and when the position of the object which is described is changed, the relative position relationship may be changed accordingly.
[0025] As shown in
[0026] According to an embodiment of the present disclosure, it is provided an electronic shelf label, including: a housing, the housing includes a front housing and a rear housing, the front housing and the rear housing are coupled with each other, a chamber is provided between the front housing and the rear housing, the rear housing includes an opening; a motherboard, the motherboard is located in the chamber; a back plate, the back plate covers the opening, the motherboard is detachably coupled to the back plate, the back plate is detachably coupled to the rear housing, and an orthographic projection of the back plate in a plane where the rear housing is located is in the rear housing.
[0027] In the electronic shelf label of the above embodiment, the connection components including the motherboard and the back plate are arranged in the chamber of the housing, which not only improves the aesthetics of the electronic shelf label, but also effectively reduces the volume of the overall equipment, which has the beneficial effects of compact structure and easy installation.
[0028]
[0029] For example, the connection component 30 includes: a motherboard 31, and a back plate 32 coupling to the motherboard 31. The motherboard 31 is located in the chamber 13. The back plate 32 is detachably coupled to the rear housing 11, and the back plate 32 covers the opening 111. The motherboard 31 is detachably coupled to the back plate 32, and an orthographic projection of the back plate 32 in a plane where the rear housing 11 is located is located in the rear housing 11, that is the orthographic projection of the back plate 32 in the plane where the rear housing 11 is located is completely located in the surface of the rear housing 11. In this way, both the motherboard 31 and the rear housing 11 are located on the side of the back plate 32 close to the front housing 12, so that the overall structure of the electronic shelf label is simple and aesthetic.
[0030] For example, the electronic shelf label further includes: the circuit board 40, the circuit board 40 is located on the side of the motherboard 31 facing towards the back board 32, and the circuit board 40 is fixed to the motherboard 31. As shown in
[0031] In at least several embodiments, the motherboard includes a communication interface. The back plate has a convex portion, the convex portion has a cavity for accommodating the communication interface. For example, a surface of the motherboard 31 facing towards the back board 32 is provided with a power interface 50. The back plate 32 is provided with a first convex portion 321 at a position corresponding to the power interface 50. The first convex portion 321 is provided with a first via hole 3211, and the first convex portion 321 covers the power interface 50. The end of the power interface 50 is connected with the first via hole 3211. Further, in at least one example, the end of the first convex portion 321 away from the back plate 32 is flush with the end of the power interface 50 away from the motherboard 31. In this way, the thickness and overall volume of the electronic shelf label are reduced as much as possible through the corresponding arrangement of the first convex portion 321 and the power interface 50.
[0032] For another example, a surface of the motherboard 31 facing towards the back board 32 is further provided with a network interface 60. The back plate 32 is provided with a second convex portion 322 at a position corresponding to the network interface 60. The second convex portion 322 is provided with a second via hole 3221, and the second convex portion 322 covers the network interface 60. The end of the network interface 60 is connected with the second via hole 3221. Further, in at least one example, the end of the second convex portion 322 away from the back plate 32 is flush with the end of the network interface 60 away from the motherboard 31. In this way, the thickness and overall volume of the electronic shelf label are reduced as much as possible through the corresponding arrangement of the second convex portion 322 and the network interface 60.
[0033] In this embodiment, the network interface 60 and the power interface 50 are located on the same surface of the motherboard 31, and the network interface 60 and the power interface 50 are adjacent to each other. The second convex portion 322 and the first convex portion 321 are coupled to each other. For example, as shown in
[0034] For example, the second convex portion 322, the first convex portion 321 and the back plate 32 are integrally formed to form an integral structure for closing the rear housing 11.
[0035] For example, the back plate 32 together with the motherboard 31 is detachably coupled to the rear housing 11. In this way, the assembly process can be simplified and the disassembly is also convenient. For example, the motherboard 31 and the back plate 32 are firstly coupled to each other, and then the back plate 32 is coupled to the rear housing 11. The motherboard 31 is detachably coupled to the back plate 32 by a first fastener, and the back plate 32 is detachably coupled to the rear housing 11 by a second fastener. That is to say, the motherboard 31 is fixed to the housing through the back plate 32, which achieves the beneficial effect of simple installation process, and facilitates assembly and the disassembly work during maintenance.
[0036] For example, as shown in
[0037] For example, the motherboard 31 and the rear housing 11 are located on the same side of the back plate 32, which facilitates the removal of the back plate 32. In this embodiment, the area of the opening 111 is larger than the area of the motherboard 31, so that the motherboard 31 is easier to pass through the opening 111 of the rear housing 11 and reach the chamber 13.
[0038] For example, as shown in
[0039] According to an embodiment of the present disclosure, it is further provided a method for assembling the electronic shelf label according to the previous embodiments, as shown in
[0040] coupling the front housing with the rear housing to form the chamber;
[0041] fixing the motherboard to the back plate; and
[0042] fixing the back plate to the rear housing,
[0043] wherein at a same time of the fixing the back plate to the rear housing, the motherboard passes through the opening of the rear housing and reaches the chamber.
[0044] In this embodiment, before the back plate is fixed to the rear housing, the motherboard is fixed to the back plate first, which facilitates the disassembly and assembly of the back plate and the internal structure.
[0045] In the electronic shelf label and the method for assembling the electronic shelf label provided by the above embodiments, the volume of the overall device is effectively reduced and the beneficial effects of compact structure and easy installation are achieved by c the positions of the motherboard and the back plate.
[0046] In the disclosure, the following should be noted:
[0047] (1) The accompanying drawings involve only the structure(s) in connection with the embodiment(s) of the present disclosure, and other structure(s) can be referred to common design(s).
[0048] (2) For the purpose of clarity only, in accompanying drawings for illustrating the embodiment(s) of the present disclosure, the thickness and a size of a layer or area may be enlarged or narrowed, that is, the drawings are not drawn in a real scale.
[0049] (3) In case of no conflict, features in one embodiment or in different embodiments can be combined as a new embodiment.
[0050] What is described above is related to the illustrative embodiments of the disclosure only and not limitative to the scope of the disclosure; the scopes of the disclosure are defined by the accompanying claims.