Circuit substrate arrangement with improved electrical contact

Abstract

The present invention relates to a circuit substrate arrangement comprising a base layer (2) made from aluminium, a circuit layer (3) made from copper, a dielectric layer (4) arranged between the base layer (2) and the circuit layer (3), an opening (5) passing through the base layer (2), the circuit layer (3) and the dielectric layer (4) and an electrical contact (6) between the base layer (2) and the circuit layer (3), wherein the electrical contact (6) comprises a rivet (7), wherein a frictionally connected joint (8) is formed between the rivet (7) and the base layer (2) and wherein an integrally bonded joint (9) is formed between the rivet (7) and the circuit layer (3).

Claims

1. A circuit carrier arrangement, comprising: an insulated metal substrate including: a base layer (2) which comprises aluminum, a circuit layer (3) which comprises copper, and a dielectric layer (4) which is arranged between the base layer (2) and the circuit layer (3), an opening (5) which runs through the base layer (2), the circuit layer (3) and the dielectric layer (4) of the insulated metal substrate, and an electrical contact (6) between the base layer (2) and the circuit layer (3), wherein the electrical contact (6) comprises a rivet (7), wherein a force-fitting connection (8) is formed between the rivet (7) and the base layer (2), and wherein a cohesive connection (9) is formed between the rivet (7) and the circuit layer (3).

2. The circuit carrier arrangement as claimed in claim 1, wherein the opening (5) is a passage opening.

3. The circuit carrier arrangement as claimed in claim 1, wherein a first length (L1) of the rivet (7) is smaller than a second length (L2) of the opening (5).

4. The circuit carrier arrangement as claimed in claim 1, wherein the rivet (7) comprises a head (70).

5. The circuit carrier arrangement as claimed in claim 4, wherein the head (70) rests on a surface (30) of the circuit layer (3), and the cohesive connection (9) is formed between the head (70) and the circuit layer (3).

6. The circuit carrier arrangement as claimed in claim 1, wherein the rivet (7) has a cylindrical shape without a head.

7. The circuit carrier arrangement as claimed in claim 6, wherein the rivet (7) has a free end (72) which terminates flush with the surface (30) of the circuit layer (3), wherein the cohesive connection (9) covers the free end (72) of the rivet (7).

8. The circuit carrier arrangement as claimed in claim 6, wherein a free end (72) of the rivet (7) is arranged in the opening (5) of the circuit carrier arrangement in such a way that a region (51) which is filled with solder (10a) of the cohesive connection (9) is provided in the opening (5).

9. The circuit carrier arrangement as claimed in claim 8, wherein the solder (10) of the cohesive connection (9) goes beyond the opening (5) and establishes an electrical contact-connection on the surface (30) of the circuit layer (3).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Exemplary embodiments of the invention will be described in detail below with reference to the accompanying drawing, in which:

(2) FIG. 1 shows a schematic, perspective illustration of a circuit carrier arrangement according to a first exemplary embodiment of the invention,

(3) FIG. 2 shows a schematic sectional view of the circuit carrier arrangement from FIG. 1,

(4) FIG. 3 shows a schematic sectional view of a circuit carrier arrangement according to a second exemplary embodiment of the invention, and

(5) FIG. 4 shows a schematic sectional view of a circuit carrier arrangement according to a third exemplary embodiment of the invention.

DETAILED DESCRIPTION

(6) A circuit carrier arrangement 1 according to a first preferred exemplary embodiment of the invention will be described in detail below with reference to FIGS. 1 and 2.

(7) As is clear from FIG. 1, the circuit carrier arrangement 1 of this exemplary embodiment is a so-called IMS (insulated metal substrate) comprising a base layer 2, which comprises aluminum, a dielectric layer 4 and a circuit layer 3, which comprises copper.

(8) The dielectric layer 4 is arranged as an intermediate layer between the base layer 2 and the circuit layer 3 and electrically isolates these two layers. Here, the dielectric layer 4 is applied directly to the base layer 2, and the circuit layer 3 is applied directly to the dielectric layer 4.

(9) Owing to the use of an aluminum-based base layer, a particularly cost-effective circuit carrier arrangement 1 can be provided in comparison to other materials for the base layer, wherein, in particular, high thermal outputs can be reliably dissipated through the base layer 2 which comprises aluminum. This is highly advantageous particularly in conjunction with high-power electronic components, for example MOSFETs, IGBTs, transformers and/or coils. Therefore, a build-up of heat on the high-power electronic components can be avoided.

(10) The use of the aluminum-based base layer 2 has a significant price advantage in comparison to the use of copper-based base layers for example, wherein almost the same thermal conductivities of the base layers are achieved in practice.

(11) As shown in detail in FIG. 2, the circuit carrier arrangement 1 further comprises at least one opening, preferably a plurality of openings 5 which are provided as passage openings through the circuit carrier arrangement 1, wherein a center axis of the opening 5 is perpendicular to a surface of the circuit carrier arrangement 1.

(12) An electrical contact 6 which comprises a rivet 7 is provided in order to establish an electrical connection between the circuit layer 3 and the base layer 2. In this exemplary embodiment, the rivet 7 is a cylindrical rivet composed of a solid material which has a head 70. As shown in FIG. 2, the head 70 rests on a surface 30 of the circuit layer 3 in the assembled state.

(13) The electrical contact 6 is now connected to the base layer 2 and the circuit layer 3 by two different types of connection. Here, a force-fitting connection 8 is provided between the rivet 7 and the base layer 2, and a cohesive connection 9 is provided between the circuit layer 3 and the rivet 7. In this exemplary embodiment, the cohesive connection is formed at the head 70 of the rivet. In this case, the cohesive connection is established by means of a solder 10 which is arranged along the outer periphery of the head 70.

(14) As is further clear from FIG. 2, the rivet 7 has a first length L1, and the opening 5 in the circuit carrier arrangement 1 has a second length L2. The first length L1 is smaller than the second length L2 here. This produces a region 50, which is not filled by the rivet 7, in the opening 5 on a first end 71.

(15) In this case, the electrical contact-connection by means of the force-fitting connection 8 between the base layer 2 and the rivet 7 allows very good electromagnetic compatibility with reduced potential for interference.

(16) The rivet 7 is preferably produced from brass or copper and has a coated surface, preferably a gold or tin coating.

(17) The cohesive connection 9 by means of the solder 10 is particularly preferably made by means of a reflow soldering process.

(18) Therefore, in the circuit carrier arrangement 1, an electrical contact-connection is obtained by means of two different types of connection, specifically a force-fitting connection 8 for connection to the base layer 2 and a cohesive connection 9 for connection to the circuit layer 3, which electrical contact-connection achieves a particularly robust electrical contact-connection between layers which comprise different materials, specifically the base layer which is produced substantially from aluminum and the circuit layer 3 which is produced substantially from copper.

(19) FIG. 3 shows a circuit carrier arrangement 1 according to a second exemplary embodiment of the invention, wherein identical or functionally identical parts are identified by the same reference signs. As is clear from FIG. 3, the rivet 7 of the electrical contact 6 is exclusively a cylindrical rivet without a head. Here, the rivet 7 is recessed completely in the opening 5. Here, the first region 50 at the first end 71 of the rivet 7 in the opening remains free and also a second region 51 at the free or second end 72 of the rivet 7 remains free. In the final state, a solder region 10a of the solder 10 of the cohesive connection 9 is then present in the region 51 and fills this region 51, as is schematically shown in FIG. 3.

(20) FIG. 4 shows a circuit carrier arrangement 1 according to a third exemplary embodiment which substantially corresponds to the second exemplary embodiment. The rivet 7 likewise does not have a head and is provided with a cylindrical geometric shape. However, the second end 72 of the rivet 7 is arranged flush with a surface 30 of the circuit layer 3 here. In this case, the solder 10 of the cohesive connection 9 covers the second end of the rivet 7 and establishes the electrical contact to the circuit layer 3.

(21) Therefore, as shown in the preferred exemplary embodiments, a very cost-effective printed circuit board with an aluminum-based base layer 2 and a copper-based circuit layer 3 can be produced according to the invention. In this case, the electrical contact-connection between the base layer 2 and the circuit layer 3 is made by means of a rivet 7 which is connected in a force-fitting manner in one instance and in a cohesive manner in one instance.