ENCAPSULATING COMPOSITION

Abstract

An encapsulating composition and an organic electronic device comprising the same, and the encapsulating composition which is capable of effectively blocking moisture or oxygen penetrating into the organic electronic device from the outside to secure the lifetime of the organic electronic device, implementing a top-emitting organic electronic device, being applied in an inkjet method, and providing a thin display.

Claims

1. An encapsulating composition comprising an epoxy compound, a compound having an oxetane group included in an amount of 45 to 145 parts by weight relative to 100 parts by weight of the epoxy compound, and a moisture adsorbent.

2. The encapsulating composition according to claim 1, wherein the epoxy compound is at least bifunctional.

3. The encapsulating composition according to claim 1, wherein the epoxy compound comprises at least one of a compound having a cyclic structure in its molecular structure and a linear or branched aliphatic compound.

4. (canceled)

5. The encapsulating composition according to claim 3, wherein the linear or branched aliphatic compound is included an amount of 20 parts by weight or more and less than 205 parts by weight, relative to 100 parts by weight of the compound having a cyclic structure.

6. The encapsulating composition according to claim 1, wherein the compound having an oxetane group has a boiling point in a range of 90 to 300° C.

7. The encapsulating composition according to claim 1, wherein the compound having an oxetane group has a weight average molecular weight in a range of 150 to 1,000 g/mol.

8. The encapsulating composition according to claim 1, further comprising an ionic photoinitiator.

9. The encapsulating composition according to claim 8, wherein the ionic photoinitiator is a photoinitiator comprising a sulfonium salt.

10. The encapsulating composition according to claim 8, wherein the photoinitiator is included in an amount of 1 to 15 parts by weight relative to 100 parts by weight of the epoxy compound.

11. The encapsulating composition according to claim 1, further comprising a surfactant.

12. The encapsulating composition according to claim 11, wherein the surfactant comprises a polar functional group.

13. The encapsulating composition according to claim 11, wherein the surfactant comprises a fluorine-based compound.

14. The encapsulating composition according to claim 11, wherein the surfactant is included in an amount of 0.01 parts by weight to 10 parts by weight relative to 100 parts by weight of the epoxy compound.

15. The encapsulating composition according to claim 1, which is a solventless ink composition.

16. The encapsulating composition according to claim 1, having a viscosity of 50 cPs or less as measured by Brookfield's DV-3 at a temperature of 25° C., a torque of 90% and a shear rate of 100 rpm.

17. The encapsulating composition according to claim 1, wherein the moisture adsorbent is a chemically reactive adsorbent.

18. The encapsulating composition according to claim 1, wherein the moisture adsorbent is included in an amount of 5 to 150 parts by weight relative to 100 parts by weight of the epoxy compound.

19. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the entire surface of the organic electronic element and containing the encapsulating composition according to claim 1.

20. A method for manufacturing an organic electronic device comprising a step of forming an organic layer containing the encapsulating composition according to claim 1 on a substrate having an organic electronic element formed thereon, such that the encapsulating composition seals the entire surface of the organic electronic element.

21. The method for manufacturing an organic electronic device according to claim 20, wherein the step of forming the organic layer comprises inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0063] FIGS. 1 and 2 illustrate cross-sectional views of an organic electronic device according to an exemplary embodiment of the present invention.

DESCRIPTION OF REFERENCE NUMERALS

[0064] 3: organic electronic device [0065] 31: substrate [0066] 32: organic electronic element [0067] 33: organic layer [0068] 34: inorganic layer [0069] 35: protective layer [0070] 36: sealing structure [0071] 37: sealing film [0072] 38: cover substrate

BEST MODE

[0073] Hereinafter, the present disclosure will be described in more detail through Examples and Comparative Examples, but the scope of the present invention is not limited by the following examples.

Example 1

[0074] An alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 22.2:18.8:49.0:5.0:1.0 (Celloxide2021P: DE203: OXT-221: I290: F552) at room temperature. CaO (Aldrich, average particle diameter of about 150 nm) was introduced thereto so that the amount of the moisture adsorbent was 15 parts by weight relative to 100 parts by weight of the epoxy compounds.

[0075] In the mixing vessel, a uniform encapsulating composition was prepared using a planetary mixer (Kurabo, KK-250s).

Example 2

[0076] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) as an epoxy compound, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator containing a sulfonium salt (1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 37.5:52.5:5.0:1.0 (Celloxide2021P: OXT-221: I290: F552) at room temperature.

Example 3

[0077] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 37.5:7.0:45.5:5.0:1.0 (Celloxide2021P: DE203: OXT-221: I290: F552) at room temperature.

Example 4

[0078] An encapsulating composition was prepared in the same method as in Example 1, except that Irgacure 250 (active contents 75 wt %, solvent (propylene carbonate) 25 wt %) from BASF as a iodonim photoinitiator was used instead of 1290 as the photoinitiator.

Example 5

[0079] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290), a fluorine-based surfactant (F552 from DIC) and diethylene glycol monobutyl ether acetate were each introduced into a mixing vessel at a weight ratio of 17.2:18.8:44.0:5.0:1.0:10.0 (Celloxide2021P: DE203: OXT-221: I290: F552: diethylene glycol monobutyl ether acetate) at room temperature.

Example 6

[0080] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 5:26:48:5:1 (Celloxide2021P: DE203: OXT-221: I290: F552) at room temperature.

Comparative Example 1

[0081] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 2.3:23.4:64.3:5.0:1.0 (Celloxide2021P: DE203: OXT-221: I290: F552) at room temperature.

Comparative Example 2

[0082] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) and an aliphatic epoxy compound (DE203, HAJIN CHEM TECH) as epoxy compounds, an oxetane group-containing compound (OXT-221 from TOAGOSEI), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 10:10:59:5:1 (Celloxide2021P: DE203: OXT-221: I290: F552) at room temperature.

Comparative Example 3

[0083] An encapsulating composition was prepared in the same method as in Example 1, except that an alicyclic epoxy compound (Celloxide 2021P from Daicel) as an epoxy compound, an oxetane group-containing compound (3-allyloxy oxetane from TCI), tri(ethylene glycol) divinyl ether (TEGDVE), a photoinitiator (Irgacure PAG 290 from BASF, hereinafter, 1290) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 20:50:30:5:1 (Celloxide2021P: 3-allyloxy oxetane: TEGDVE: I290: F552) at room temperature.

[0084] Physical properties in Examples and Comparative Examples were evaluated in the following manner.

[0085] 1. SiNx Deposited Film Experiment

[0086] On a glass base material on which a SiNx deposited film was formed, the encapsulating compositions prepared in Examples and Comparative Examples were each inkjet-coated to form an organic layer having a thickness of 5 μm.

[0087] The sample was observed under constant temperature and humidity conditions of 85° C. and 85% RH for a lifting phenomenon of the deposited film. It was classified as X when the lifting occurred 50% or more relative to the total area by observation for 1000 hours, as Δ when the lifting occurred less than 50% relative to the total area and as O when no lifting occurred at all.

[0088] 2. Determination of Discharge Possibility and Ink-Jetting Suitability

[0089] Ink-jetting was attempted using Unijet UJ-200 (Inkjet head-Dimatix 10Pl 256) for the encapsulating compositions prepared in Examples and Comparative Examples. Discharge tests were performed at intervals of 5 minutes, and it was classified as O when dischargeable duration was 3 hours or more, as A when it was 1 hour or more and less than 3 hours and as X when it was less than 1 hour.

TABLE-US-00001 TABLE 1 Determination of SiNx deposited discharge possibility and film experiment ink-jetting suitability Example 1 ◯ ◯ Example 2 ◯ Δ Example 3 ◯ Δ Example 4 Δ ◯ Example 5 Δ ◯ Example 6 Δ ◯ Comparative Example 1 X ◯ Comparative Example 2 X ◯ Comparative Example 3 X X